[email protected] +44 20 8123 2220 (UK) +1 732 587 5005 (US) Contact Us | FAQ |

IC Packaging-Global Market Status & Trend Report 2013-2023 Top 20 Countries Data

August 2019 | 158 pages | ID: I4B5E6AC6F3EN
MIReports Co., Limited

US$ 3,680.00

E-mail Delivery (PDF)

Download PDF Leaflet

Accepted cards
Wire Transfer
Checkout Later
Need Help? Ask a Question
Report Summary

IC Packaging-Global Market Status & Trend Report 2013-2023 Top 20 Countries Data offers a comprehensive analysis on IC Packaging industry, standing on the readers’ perspective, delivering detailed market data in Global major 20 countries and penetrating insights. No matter the client is industry insider, potential entrant or investor, the report will provides useful data and information. Key questions answered by this report include:

Worldwide and Top 20 Countries Market Size of IC Packaging 2013-2017, and development forecast 2018-2023
Main manufacturers/suppliers of IC Packaging worldwide and market share by regions, with company and product introduction, position in the IC Packaging market
Market status and development trend of IC Packaging by types and applications
Cost and profit status of IC Packaging, and marketing status
Market growth drivers and challenges

The report segments the global IC Packaging market as:

Global IC Packaging Market: Regional Segment Analysis (Regional Production Volume, Consumption Volume, Revenue and Growth Rate 2013-2023):
North America (United States, Canada and Mexico)
Europe (Germany, UK, France, Italy, Russia, Spain and Benelux)
Asia Pacific (China, Japan, India, Southeast Asia and Australia)
Latin America (Brazil, Argentina and Colombia)
Middle East and Africa

Global IC Packaging Market: Type Segment Analysis (Consumption Volume, Average Price, Revenue, Market Share and Trend 2013-2023):
Pin-grid Array
Quad Flat Pack
Quad Flat No-Lead
Others

Global IC Packaging Market: Application Segment Analysis (Consumption Volume and Market Share 2013-2023; Downstream Customers and Market Analysis)
Communication
Computing & Networking
Consumer Electronics
Others

Global IC Packaging Market: Manufacturers Segment Analysis (Company and Product introduction, IC Packaging Sales Volume, Revenue, Price and Gross Margin):
TFME
UTAC
SPIL
Amkor
ASE Group
JECT
ChipMOS
TSHT
Powertech Technology Inc
Chipbond
Hana Micron
KYEC
Signetics
Unisem
Walton Advanced Engineering

In a word, the report provides detailed statistics and analysis on the state of the industry; and is a valuable source of guidance and direction for companies and individuals interested in the market.
CHAPTER 1 OVERVIEW OF IC PACKAGING

1.1 Definition of IC Packaging in This Report
1.2 Commercial Types of IC Packaging
  1.2.1 Pin-grid Array
  1.2.2 Quad Flat Pack
  1.2.3 Quad Flat No-Lead
  1.2.4 Others
1.3 Downstream Application of IC Packaging
  1.3.1 Communication
  1.3.2 Computing & Networking
  1.3.3 Consumer Electronics
  1.3.4 Others
1.4 Development History of IC Packaging
1.5 Market Status and Trend of IC Packaging 2013-2023
  1.5.1 Global IC Packaging Market Status and Trend 2013-2023
  1.5.2 Regional IC Packaging Market Status and Trend 2013-2023

CHAPTER 2 GLOBAL MARKET STATUS AND FORECAST BY REGIONS

2.1 Market Development of IC Packaging 2013-2017
2.2 Sales Market of IC Packaging by Regions
  2.2.1 Sales Volume of IC Packaging by Regions
  2.2.2 Sales Value of IC Packaging by Regions
2.3 Production Market of IC Packaging by Regions
2.4 Global Market Forecast of IC Packaging 2018-2023
  2.4.1 Global Market Forecast of IC Packaging 2018-2023
  2.4.2 Market Forecast of IC Packaging by Regions 2018-2023

CHAPTER 3 GLOBAL MARKET STATUS AND FORECAST BY TYPES

3.1 Sales Volume of IC Packaging by Types
3.2 Sales Value of IC Packaging by Types
3.3 Market Forecast of IC Packaging by Types

CHAPTER 4 GLOBAL MARKET STATUS AND FORECAST BY DOWNSTREAM INDUSTRY

4.1 Global Sales Volume of IC Packaging by Downstream Industry
4.2 Global Market Forecast of IC Packaging by Downstream Industry

CHAPTER 5 NORTH AMERICA MARKET STATUS BY COUNTRIES, TYPE, MANUFACTURERS AND DOWNSTREAM INDUSTRY

5.1 North America IC Packaging Market Status by Countries
  5.1.1 North America IC Packaging Sales by Countries (2013-2017)
  5.1.2 North America IC Packaging Revenue by Countries (2013-2017)
  5.1.3 United States IC Packaging Market Status (2013-2017)
  5.1.4 Canada IC Packaging Market Status (2013-2017)
  5.1.5 Mexico IC Packaging Market Status (2013-2017)
5.2 North America IC Packaging Market Status by Manufacturers
5.3 North America IC Packaging Market Status by Type (2013-2017)
  5.3.1 North America IC Packaging Sales by Type (2013-2017)
  5.3.2 North America IC Packaging Revenue by Type (2013-2017)
5.4 North America IC Packaging Market Status by Downstream Industry (2013-2017)

CHAPTER 6 EUROPE MARKET STATUS BY COUNTRIES, TYPE, MANUFACTURERS AND DOWNSTREAM INDUSTRY

6.1 Europe IC Packaging Market Status by Countries
  6.1.1 Europe IC Packaging Sales by Countries (2013-2017)
  6.1.2 Europe IC Packaging Revenue by Countries (2013-2017)
  6.1.3 Germany IC Packaging Market Status (2013-2017)
  6.1.4 UK IC Packaging Market Status (2013-2017)
  6.1.5 France IC Packaging Market Status (2013-2017)
  6.1.6 Italy IC Packaging Market Status (2013-2017)
  6.1.7 Russia IC Packaging Market Status (2013-2017)
  6.1.8 Spain IC Packaging Market Status (2013-2017)
  6.1.9 Benelux IC Packaging Market Status (2013-2017)
6.2 Europe IC Packaging Market Status by Manufacturers
6.3 Europe IC Packaging Market Status by Type (2013-2017)
  6.3.1 Europe IC Packaging Sales by Type (2013-2017)
  6.3.2 Europe IC Packaging Revenue by Type (2013-2017)
6.4 Europe IC Packaging Market Status by Downstream Industry (2013-2017)

CHAPTER 7 ASIA PACIFIC MARKET STATUS BY COUNTRIES, TYPE, MANUFACTURERS AND DOWNSTREAM INDUSTRY

7.1 Asia Pacific IC Packaging Market Status by Countries
  7.1.1 Asia Pacific IC Packaging Sales by Countries (2013-2017)
  7.1.2 Asia Pacific IC Packaging Revenue by Countries (2013-2017)
  7.1.3 China IC Packaging Market Status (2013-2017)
  7.1.4 Japan IC Packaging Market Status (2013-2017)
  7.1.5 India IC Packaging Market Status (2013-2017)
  7.1.6 Southeast Asia IC Packaging Market Status (2013-2017)
  7.1.7 Australia IC Packaging Market Status (2013-2017)
7.2 Asia Pacific IC Packaging Market Status by Manufacturers
7.3 Asia Pacific IC Packaging Market Status by Type (2013-2017)
  7.3.1 Asia Pacific IC Packaging Sales by Type (2013-2017)
  7.3.2 Asia Pacific IC Packaging Revenue by Type (2013-2017)
7.4 Asia Pacific IC Packaging Market Status by Downstream Industry (2013-2017)

CHAPTER 8 LATIN AMERICA MARKET STATUS BY COUNTRIES, TYPE, MANUFACTURERS AND DOWNSTREAM INDUSTRY

8.1 Latin America IC Packaging Market Status by Countries
  8.1.1 Latin America IC Packaging Sales by Countries (2013-2017)
  8.1.2 Latin America IC Packaging Revenue by Countries (2013-2017)
  8.1.3 Brazil IC Packaging Market Status (2013-2017)
  8.1.4 Argentina IC Packaging Market Status (2013-2017)
  8.1.5 Colombia IC Packaging Market Status (2013-2017)
8.2 Latin America IC Packaging Market Status by Manufacturers
8.3 Latin America IC Packaging Market Status by Type (2013-2017)
  8.3.1 Latin America IC Packaging Sales by Type (2013-2017)
  8.3.2 Latin America IC Packaging Revenue by Type (2013-2017)
8.4 Latin America IC Packaging Market Status by Downstream Industry (2013-2017)

CHAPTER 9 MIDDLE EAST AND AFRICA MARKET STATUS BY COUNTRIES, TYPE, MANUFACTURERS AND DOWNSTREAM INDUSTRY

9.1 Middle East and Africa IC Packaging Market Status by Countries
  9.1.1 Middle East and Africa IC Packaging Sales by Countries (2013-2017)
  9.1.2 Middle East and Africa IC Packaging Revenue by Countries (2013-2017)
  9.1.3 Middle East IC Packaging Market Status (2013-2017)
  9.1.4 Africa IC Packaging Market Status (2013-2017)
9.2 Middle East and Africa IC Packaging Market Status by Manufacturers
9.3 Middle East and Africa IC Packaging Market Status by Type (2013-2017)
  9.3.1 Middle East and Africa IC Packaging Sales by Type (2013-2017)
  9.3.2 Middle East and Africa IC Packaging Revenue by Type (2013-2017)
9.4 Middle East and Africa IC Packaging Market Status by Downstream Industry (2013-2017)

CHAPTER 10 MARKET DRIVING FACTOR ANALYSIS OF IC PACKAGING

10.1 Global Economy Situation and Trend Overview
10.2 IC Packaging Downstream Industry Situation and Trend Overview

CHAPTER 11 IC PACKAGING MARKET COMPETITION STATUS BY MAJOR MANUFACTURERS

11.1 Production Volume of IC Packaging by Major Manufacturers
11.2 Production Value of IC Packaging by Major Manufacturers
11.3 Basic Information of IC Packaging by Major Manufacturers
  11.3.1 Headquarters Location and Established Time of IC Packaging Major Manufacturer
  11.3.2 Employees and Revenue Level of IC Packaging Major Manufacturer
11.4 Market Competition News and Trend
  11.4.1 Merger, Consolidation or Acquisition News
  11.4.2 Investment or Disinvestment News
  11.4.3 New Product Development and Launch

CHAPTER 12 IC PACKAGING MAJOR MANUFACTURERS INTRODUCTION AND MARKET DATA

12.1 TFME
  12.1.1 Company profile
  12.1.2 Representative IC Packaging Product
  12.1.3 IC Packaging Sales, Revenue, Price and Gross Margin of TFME
12.2 UTAC
  12.2.1 Company profile
  12.2.2 Representative IC Packaging Product
  12.2.3 IC Packaging Sales, Revenue, Price and Gross Margin of UTAC
12.3 SPIL
  12.3.1 Company profile
  12.3.2 Representative IC Packaging Product
  12.3.3 IC Packaging Sales, Revenue, Price and Gross Margin of SPIL
12.4 Amkor
  12.4.1 Company profile
  12.4.2 Representative IC Packaging Product
  12.4.3 IC Packaging Sales, Revenue, Price and Gross Margin of Amkor
12.5 ASE Group
  12.5.1 Company profile
  12.5.2 Representative IC Packaging Product
  12.5.3 IC Packaging Sales, Revenue, Price and Gross Margin of ASE Group
12.6 JECT
  12.6.1 Company profile
  12.6.2 Representative IC Packaging Product
  12.6.3 IC Packaging Sales, Revenue, Price and Gross Margin of JECT
12.7 ChipMOS
  12.7.1 Company profile
  12.7.2 Representative IC Packaging Product
  12.7.3 IC Packaging Sales, Revenue, Price and Gross Margin of ChipMOS
12.8 TSHT
  12.8.1 Company profile
  12.8.2 Representative IC Packaging Product
  12.8.3 IC Packaging Sales, Revenue, Price and Gross Margin of TSHT
12.9 Powertech Technology Inc
  12.9.1 Company profile
  12.9.2 Representative IC Packaging Product
  12.9.3 IC Packaging Sales, Revenue, Price and Gross Margin of Powertech Technology Inc
12.10 Chipbond
  12.10.1 Company profile
  12.10.2 Representative IC Packaging Product
  12.10.3 IC Packaging Sales, Revenue, Price and Gross Margin of Chipbond
12.11 Hana Micron
  12.11.1 Company profile
  12.11.2 Representative IC Packaging Product
  12.11.3 IC Packaging Sales, Revenue, Price and Gross Margin of Hana Micron
12.12 KYEC
  12.12.1 Company profile
  12.12.2 Representative IC Packaging Product
  12.12.3 IC Packaging Sales, Revenue, Price and Gross Margin of KYEC
12.13 Signetics
  12.13.1 Company profile
  12.13.2 Representative IC Packaging Product
  12.13.3 IC Packaging Sales, Revenue, Price and Gross Margin of Signetics
12.14 Unisem
  12.14.1 Company profile
  12.14.2 Representative IC Packaging Product
  12.14.3 IC Packaging Sales, Revenue, Price and Gross Margin of Unisem
12.15 Walton Advanced Engineering
  12.15.1 Company profile
  12.15.2 Representative IC Packaging Product
  12.15.3 IC Packaging Sales, Revenue, Price and Gross Margin of Walton Advanced Engineering

CHAPTER 13 UPSTREAM AND DOWNSTREAM MARKET ANALYSIS OF IC PACKAGING

13.1 Industry Chain of IC Packaging
13.2 Upstream Market and Representative Companies Analysis
13.3 Downstream Market and Representative Companies Analysis

CHAPTER 14 COST AND GROSS MARGIN ANALYSIS OF IC PACKAGING

14.1 Cost Structure Analysis of IC Packaging
14.2 Raw Materials Cost Analysis of IC Packaging
14.3 Labor Cost Analysis of IC Packaging
14.4 Manufacturing Expenses Analysis of IC Packaging

CHAPTER 15 REPORT CONCLUSION

CHAPTER 16 RESEARCH METHODOLOGY AND REFERENCE

16.1 Methodology/Research Approach
  16.1.1 Research Programs/Design
  16.1.2 Market Size Estimation
  16.1.3 Market Breakdown and Data Triangulation
16.2 Data Source
  16.2.1 Secondary Sources
  16.2.2 Primary Sources
16.3 Reference


More Publications