[email protected] +44 20 8123 2220 (UK) +1 732 587 5005 (US) Contact Us | FAQ |

Three Major Cellular Baseband IC Vendors' Development in the RF Market and Their Patent Portfolios

September 2020 | 19 pages | ID: T69B7C8C2F81EN
Market Intelligence & Consulting Institute (MIC)

US$ 1,200.00 US$ 1,500.00 -20 %
Offer valid until December 31, 2021!

E-mail Delivery (PDF)

Download PDF Leaflet

Wire Transfer
Checkout Later
Need Help? Ask a Question
An RF (Radio Frequency) module is a key component used to receive and transmit radio signals. The unique design and manufacturing processes of RF modules have resulted in an oligopolistic market. However, an increasing number of leading baseband processor vendors has made inroads into the RF market. This report analyzes the market strategies of the top three vendors: Qualcomm, Huawei, and Samsung and explores their recent developments and their patent portfolios.
1. DEVELOPMENT OF THE GLOBAL RF MARKET

1.2 Potential Threats to Traditional RF Vendors

2. CURRENT RF MARKET STATUS AND LEADING BASEBAND IC VENDORS' DEVELOPMENT

2.1 Market Development and Entry Motivation
  2.1.1 Increase Sales with a Comprehensive Communications System Solutions
  2.1.2 High Levels of RF Modularity to Enlarge Market Size
  2.1.3 International Politics Forces Vendors to Expand Reach to the RF Market
2.2 Development of Leading Baseband IC Vendors
  2.2.1 Qualcomm: Gains a Foothold with Early Entry
  2.2.2 Huawei: US Ban Forces the Company to Focus on In-house Development
  2.2.3 Samsung: Cuts into the Market from Base Stations

3. LEADING BASEBAND IC VENDORS' PATENT PORTFOLIOS

3.1 Distribution of Patents Published by Top Three Vendors
  3.1.1 Samsung and Huawei Have Similar Deployment Strategies
  3.1.2 Qualcomm Holds More PA Patents While Huawei Focuses on High-frequency Waveguide
  3.1.3 Huawei has Highly Concentrated Patent Portfolios Compared to Qualcomm and Samsung

4. MIC PERSPECTIVE

Appendix
List of Companies

LIST OF TABLES

Table 1. Milestones of Qualcomm, Huawei, and Samsung in RF Front-end Solutions

LIST OF FIGURES

Figure 1. III-V Compound Semiconductor Industry Chain
Figure 2. Division of Work across Wireless Communications System Industry Chain
Figure 3. Integration of Front-end Modules
Figure 4. Number of Patens Published by Qualcomm, Huawei, and Samsung between 2017 and 2019
Figure 5. Distribution of Patents Published by Qualcomm, Huawei, and Samsung by Class


More Publications