Global and China Wafer Foundry Industry Report, 2013-2014

Date: September 10, 2014
Pages: 95
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US$ 2,150.00
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Publisher: ResearchInChina
Report type: Strategic Report
Delivery: E-mail Delivery (PDF)
ID: G843510E458EN
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Global and China Wafer Foundry Industry Report, 2013-2014
Global and China Wafer Foundry Industry Report, 2013-2014 is all about the followings:

1. Overview of Global Semiconductor Industry
2. Downstream Market of Wafer Foundry Industry
3. Wafer Foundry Industry
4. Semiconductor Industry in China
5. 13 Key Wafer Foundry Vendors

The wafer foundry market experienced a wavy development, jumping by 39.4% in 2010 following a 7.9% decline in 2009. And the growth rate first shrank to 8.7% in 2011, then expanded to 21.7% in 2012, and fell back to 6.8% in 2013. It is projected that the growth rate will stand at 15.6% in 2014 and 6.0% in 2015. The fluctuation in the wafer foundry market will begin to present an increasingly small growth rate, which is mainly because of the differentiation in wafer foundry industry.

In terms of product type, foundry can be divided into two categories: Logic IC Foundry and specifically Foundry. The former is mainly comprised of high-shipment Logic IC, including CPU, GPU, Baseband, Application Processor, FPGA, APU, PLD, Networking Processor, and DTV MPU, etc. And the latter primarily consists of analog IC, mixed signals, Power IC, NVM, RF/HPA, CIS, MEMS, DDI (Display Driver). For the former, it is necessary to continuously improve manufacturing process and constantly narrow the line width, which could not only improve performance and reduce power consumption, but also reduce costs. These products update quickly, with the life cycle typically no more than three years, which requires a massive fund for developing next-generation technologies. As for the latter, however, its products have a long life cycle, with the life cycle for analog IC generally exceeding 5-10 years. And even a more than 20-year life cycle is not rare. These products can narrow line width but fail to reduce costs, and could increase costs instead. The specifically Foundry has a small market size and stable sales volume, but with low costs and high returns. In contrast, Logic IC Foundry has a large market size, but with a considerable fluctuation. Most important, only the leading player in the Logic IC Foundry industry can make profit, otherwise it is easy to make a loss. Take TSMC for example, which has taken the lead in the global market since its establishment in 1987, with its market share never less than 50%. Besides, TSMC is also the wafer foundry vendor that earns the highest profit around the globe, with the gross margin never lower than 40% even close to 50% in 2014 (exceeding Apple and Qualcomm). The No.2, No.3 and No. 4 players have ever suffered losses for many years, with SMIC, for example, making profit only in 2010 during the 12 years from 2000 to 2011. And the third player, Global Foundries, has suffered losses for years, with the revenue in 2013 showing a slight growth but the operating loss expanding from AED2.217 billion to AED3.217 billion.

According to the nature of the vendors, the foundry businesses can be divided into two segments, namely, IDMs offering their excess capacity to third parties and pure-play (or dedicated) foundries, with the former including Samsung, Intel, and IBM. Global Foundries can be barely included in IDMs, for it originated from AMD. These vendors have long product lines, which makes it possible to cause competition with their customers. And IDMs, in reality, are not involved in foundry businesses and could conduct foundry business only when they have excess capacity. These IDMs will not become the first choice of the customers unless special reasons.

Money and technology do not always help do well in wafer foundry industry, which has been best illustrated by IBM. Recently, IBM was willing to pay USD1 billion for the sale of its wafer foundry business to Global Foundries. And Global Foundries suggested that the payment was very small and should be expanded to USD2 billion due to the fact that the business, which generates revenue of less than USD500 million annually, caused IBM to suffer approximately USD1.5 billion loss a year. Except TSMC, most foundries have more or less bought IBM's technology, especially Samsung, STMicroelectronics, and Global Foundries, which are all technologically brought up by IBM.

Over the years, the four giants—Samsung, STMicroelectronics, Global Foundries, and IBM have formed an alliance in a vain attempt to compete against TSMC. Instead, TSMC has grown stronger and stronger. After years of efforts, Samsung has won a client in wafer foundry business—Apple. Unfortunately, the order of Apple’s main products A8 was gained by TSMC in 2014, thus leading to the first loss of Samsung System LSI Division over the years.

Although Samsung’s 14nm technology seems to take the lead, this is not approved by Apple. This is mainly because the four companies—Samsung, STMicroelectronics, Global Foundries, and IBM all developed from IDM. And Samsung has a long product line and therefore could compete with any electronic company in the world. Previously, Apple did not choose TSMC because the company suffered capacity constraints, and as TSMC’s capacity was expanded and met Apple’s requirements, Apple lost no time in making a shift from Samsung to TSMC.

Unlike IDMs such as Samsung, TSMC is pure-play foundry and will not compete with clients, which makes it easier for the company to get orders. And Samsung, STMicroelectronics, Global Foundries, IBM and Intel are the second choices for the clients.

The investment of Chinese enterprises in the field of semiconductors is totally dependent on the government, resulting in a lower efficiency. In 2010, Shanghai Huali Microelectronics Corporation was established with an investment of RMB14.5 billion. Although it had been into operation for 3 years, the company's revenue was less than RMB1.2 billion in 2013. SMIC’s major clients include Spreadtrum, RDA, Hisilicon, GalaxyCore Inc., Rockchip, Allwinner Technology, GigaDevice, HED, Fudan Microelectronics, TMC, and DMT. The last few enterprises, which are mainly relied on the government orders, are the major design houses of chips for a variety of smart cards, including social security cards, ID cards, SIM cards, Union Pay cards. Therefore, 40% of SMIC’s revenue came from the low-end 0.15/0.18μm technology while TSMC’s revenue from lower than 65 nm technology accounted for 71% of the total.
1 GLOBAL SEMICONDUCTOR INDUSTRY

1.1 Overview of Semiconductor Market
1.2 Semiconductor Industry Suppy Chain
1.3 Overview of Semiconductor Industry
1.4 Semiconductor Industry Expenditure Trend

2 FOUNDRY DOWNSTREAM MARKET

2.1 Mobile Phone Market
2.2 Mobile Phone Industry
2.3 PC Market
2.4 Tablet PC Market
2.5 Baseband IC and AP industries

3 FOUNDRY INDUSTRY

3.1 Industry Size
3.2 Industry Competition
3.3 Industry Ranking
3.4 Foundry Development Trends
3.5 Overview of Semiconductor Industry in China
3.6 Overview of Semiconductor Market in China
3.7 Ranking of China’s Semiconductor Market
3.8 Wafer Foundry Trends in China

4 FOUNDRY VENDORS

4.1 TSMC
4.2 UMC
4.3 SMIC
4.4 VIS
4.5 POWERCHIP
4.6 HHGRACE
4.7 DONGBU HITEK
4.8 TOWER
4.9 X-FAB
4.10 ASMC
4.11 SAMSUNG
4.12MAGNACHIP
4.13 GLOBALFOUNDRIES

SELECTED CHARTS

Semiconductor Industry Growth versus Worldwide GDP Growth, 1990-2014
Quarterly Revenue of Global Semiconductor Industry, 2012-2014
Global Semiconductor Market Breakdown by Product, 2012-2017E
Market Size Growth of Various Semiconductor Products, 2012-2017E
Semiconductor Outsourced Supply Chain
Semiconductor Company Systems
Semiconductor Outsourced Supply Chain Example
Top 25 Semiconductor Sales Leaders, 1Q2014
Worldwide IC Sales by Company Headquarters Location, 1990-2013
Fabless IC Sales Market Share by Company Headquarters Location, 2013
Top 10 IC Vendors in China, 2008-2013
Top 10 Spenders Capital Spending Outlook, 2011-2014F
Top 5 Share of Total Semiconductor Capital Spending, 1994-2013
Proportion of Global Semiconductor Capital Spending in Full-Year Budget, 1Q2014
Average IC Costs Per Mobile Phone, 2008-2016E
Global Mobile Phone Shipments, 2007-2015E
Worldwide Mobile Phone Sales to End Users by Vendor, 2006- 2013
Worldwide Smartphone Sales to End Users by Vendor, 2006-2013
Worldwide Smartphone Sales to End Users by Operating System, 2013
Shipments of Major Mobile Phone Vendors, 1Q2013-1Q2014
Shipments of Global CPU and Discrete GPU for PCs, 2008-2015E
Notebook PCs Shipments, 2008-2015E
Shipments of Major Global Notebook PC ODM Vendors, 2010-2013
Global Tablet PCs Shipments, 2011-2016E
Market Share of Major Tablet PC Brands, 2013
Output of Global Tablet PC Vendors, 2012-2013
Market Share of Major Baseband Companies by Revenue, 2014
Market Share of Major AP Companies by Revenue, 2014
Market Share of Major Baseband Companies by Unit, 2014
Market Size of Global Foundry, 2008-2015E
Foundry Revenue of Advanced Node, 2012-2017E
Global Foundry Capacity by Node, 2012-2018E
Global Foundry Revenue by Node, 2012-2018E
Global Ranking by Foundry, 2005-2014
Semiconductor Market Size in China, 2003-2014
Output of Main Electronic Products in China, 2008-2014
Top 10 Semiconductor Suppliers to the Chinese market, 2012–2013
Ranking of Semiconductor Companies in China, 2013
Ranking of Top 10 IC Design Houses in China by Sales, 2013
Organization Structure of TSMC
Revenue, Gross Margin and Operating Margin of TSMC, 2005-2014
TSMC’s Wafers Shipments and Utilization, 2004-2013
TSMC’s Market Capitalization, 2009-2013
TSMC’s Assets and Shareholders’ Equity, 2009-2013
TSMC’s R&D Expenses, 2009-2014
TSMC’s Capital Investment, 2009-2014
TSMC’s Quarterly Revenues, Gross Profit, Operation Income and Net Income, 2012Q1-2014Q2
TSMC’s Quarterly Revenues and Wafers Shipments, 2012Q1-2014Q2
TSMC’s Quarterly Revenues by Node, 2012Q1-2014Q2
TSMC’s Quarterly Revenues by Application, 2012Q1-2014Q2
TSMC’s Quarterly Revenues by Region, 2012Q1-2014Q2
TSMC’s Quarterly Wafer Shipments and ASP, 2013Q1-2014Q4
TSMC’s Quarterly Wafer Shipments and Utilization, 2013Q1-2014Q4
TSMC’s Fab List
Financial Figures of TSMC's Shanghai Factory, 2013
UMC’s Revenue and Operating Margin, 2004-2014
UMC’s Shipments and Capacity Utilization, 2004-2013
UMC’s Quarterly Revenue and Gross Margin, 2012Q3-2014Q2
UMC’s Quarterly Revenue by Node, 2012Q3-2014Q2
UMC’s Quarterly Revenue by Region, 2012Q3-2014Q2
UMC’s Quarterly Revenue by Application, 2012Q3-2014Q2
UMC’s Quarterly Capacity, 2006Q1-2014Q2
UMC’s Operating Revenue by Client Location, 2012-2013
Revenue and Operating Margin of SMIC, 2003-2014
SMIC’s Capacity, 2008-2014
SMIC’s Gross Margin, 2008-2014
SMIC Quarterly Gross Margin, 2009Q1-2014Q1
SMIC’s Quarterly Net Margin, 2009Q1-2014Q1
Revenue Breakdown of SMIC by Region, 2010-2013
SMIC’s Quarterly Revenue Breakdown by Geography, 2013Q2-2014Q2
Revenue Breakdown of SMIC by Application, 2010-2013
SMIC’s Quarterly Revenue Breakdown by Application, 2013Q2-2014Q2
SMIC’s Revenue Breakdown by Node, 2010-2013
SMIC’s Quarterly Revenue Breakdown by Node, 2013Q2-2014Q2
SMIC’s Quarterly Capacity, 2013Q2-2014Q2
SMIC’s Quarterly Utilization (%), 2009Q1-2014Q1

ORGANIZATION OF VIS

VIS’s Revenue and Operating Margin, 2005-2014
VIS’S Quarterly Revenue and Gross Margin1, 1Q2012-2Q2014
VIS’S Quarterly Revenue and UTIL Rate, 1Q2012-2Q2014
VIS’S Quarterly Revenue Breakdown by Node, 1Q2012-2Q2014
VIS’S Quarterly Revenue Breakdown by Application, 1Q2012-2Q2014
VIS’S Quarterly Revenue Breakdown by Product, 1Q2012-2Q2014
Organization Structure of Powerchip
Monthly Revenue of Powerchip, 7/2012-7/2014
Revenue, Gross Profit, and Operating Income of HHGRACE, 2011-2013
Revenue, Net Income, Asset-liability Ratio of HHGRACE, 2011-2014
Revenue Breakdown of HHGRACE by Product, 2011-2013
Revenue Breakdown of HHGRACE by Node, 2011-2013
Capacity Utilization of HHGRACE, 2011-2013
Revenue Breakdown of HHGRACE by Client, 2011-2013
Revenue Breakdown of HHGRACE by Region, 2011-2013
Revenue Breakdown of HHGRACE by Application, 2011-2013
Revenue and Operating Margin of Dongbu HiTek, 2005-2014
Profile of Dongbu Hitek
Revenue and Gross Margin of TowerSemi, 2003-2014
Tower Semiconductor Shareholders Structure
Revenue and Gross Margin of ASMC, 2003-2014
ASMC’s Revenue Breakdown by Applications, 2Q13-2Q14
ASMC’s Revenue Breakdown by Region, 2Q13-2Q14
ASMC’s Revenue Breakdown by Client, 2Q13-2Q14
ASMC’s Revenue by Fab, 2Q13-2Q14
ASMC’s UTIL Rate (%), 2Q13-2Q14
Revenue and Operating Margin of Samsung’s System LSI Division, 2009-2015
MagnaChip’s Revenue and Gross Margin, 2005-2014
MagnaChip’s Revenue and Operating Margin, 2005-2014
MagnaChip’s Revenue Breakdown by Product, 2004-2013
MagnaChip’s Revenue Breakdown by Region, 2004-2013
Wafer Fabs of MAGNACHIP
Financial Figures for Global Foundries, 2012/2013
Global Foundries Milestone
Global Foundries Global Footprints
Globalfoundries Corporate Headquarters
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