Global and China Wafer Foundry Industry Report, 2010
Price:
Hard Copy: US$ 2,200.00
PDF for Single User: US$ 2,300.00
PDF for Enterprisewide: US$ 3,300.00
The year of 2010 has been the best year for wafer foundry industry since 2000. It is expected that the output value of wafer foundry industry will reach USD27.6 billion, up 37.8% year-on-year. In addition, the output value of the entire semiconductor industry is projected to achieve USD274.5 billion, rising 21.5% year-on-year.
The wafer foundry industry witnessed a prosperous development in 2010, as a result of the economic recovery and the fab-lite strategy adopted by many large semiconductor companies. Most of the companies have continued to use existing fabs or produce analog products in their own fabs instead of investing in new fabs, while outsourcing the advanced digital CMOS process to wafer foundries because the R&D of processes at 65-nm and below that requires a huge amount of capital and labor force is unaffordable even to large semiconductor companies. For example, TI announced to outsource the production of the products at 32-nm and below to TSMC. Renesas, Japan’s biggest semiconductor manufacturer, also announced to outsource the production of its future top-class products to TSMC in July 2010. Thus, the wafer foundry industry will see a higher average growth margin than that of the semiconductor industry in the future. In the meantime, the wafer foundry industry also substantially increased the capital expenditure to improve technology and capacity in 2010. The capital expenditure of TSMC, UMC and Global Foundries will be as high as USD5.9 billion, USD1.9 billion and around USD2.5 billion respectively in 2010, all tripling the figures in 2009.
In 2010, there were some big changes in the wafer foundry industry. Global Foundries (GF), the wafer foundry originated from AMD, became increasingly strong after acquiring Chartered Semiconductor. The emergence of GF ended the competitive structure formed by TSMC, UMC, Chartered Semiconductor and SMIC. SMIC had been lagged far behind, and the operating income was only half of GF’s, and its technology was much inferior to GF’s as well. As a result, the wafer foundry industry is being dominated by GF, UMC and TMSC. UMC is facing the powerful challenge from GF, and even TMSC dare not underestimate GF.
Nevertheless, it is not easy for GF to surpass UMC as well. Firstly, Chartered Semiconductor acquired by GF had delivered poor performance all the while, and suffered net losses of USD288 million in 2009, while UMC achieved an operating profit margin of 5.1% in 2009. In 2009Q3, the capacity utilization of Chartered Semiconductor was 75%, while UMC’s was 89%. Originally led by Temasek, a sovereign wealth fund of the Singapore government, Chartered Semiconductor has been operating with low efficiency and suffered losses since its establishment. SMIC has suffered losses for main businesses for 13 consecutive quarters and five years. Chartered Semiconductor has not done better than SMIC. UMC has operated much better, and gained profit for five consecutive years. It will take GF a long time to transform Chartered Semiconductor into an efficient enterprise.
Secondly, GF cannot compete with UMC in terms of technology and capacity. UMC is capable of producing 4.8 million wafers annually, GF’s Chartered Semiconductor has an annual capacity of around 1.9 million wafers, plus the capacity of the former AMD, GF’s capacity is estimated to be 3.5-3.8 million wafers in total. Although backed up by Abu Dhabi, GF still needs time to increase capacity, since its new plant under construction in the United States since 2009 won’t be put into production until 2012.
Finally, GF has a narrower range of clients, because it should give priority to AMD, its parent company and also its biggest client, which may make other clients discontented. Chartered Semiconductor is a member of IBM technology alliance, so the majority of its big clients are from the alliance as well. UMC is the world’s first wafer foundry, treating all clients equally regardless of size and background.
During its 23 years of development, TSMC has never got an operating profit margin below 20% and a gross margin below 30%, and it has topped the market all the time. Its leadership has remained unshakable so far. Its annual capacity of 11 million wafers alone will take its rivals 3-5 years to catch up, and it will not stand still as well. In 2010, TSMC topped the market by virtue of USD5.9 billion of expenditure, and is likely to remain unparalleled for the next 15 years.
The wafer foundry industry in mainland China has continued to expand regardless of SMIC’s loss for 13 consecutive quarters. In 2010Q2, SMIC turned loss into profit relying on non-operating income of over USD100 million, and its operating income suffered losses of around USD10 million. Despite of the five-year successive losses, SMIC still plans to build a 12-inch wafer production line. Grace Semiconductor Manufacturing Corporation (Grace) and HHNEC invested RMB14.5 billion to build a 12-inch wafer production line in 2010. In 2009, the revenue of the 12-inch wafer production line completed by Wuhan Xinxin Semiconductor Manufacturing Corporation in 2008 was less than 12.5% of that of TSMC’s 8-inch plant in Shanghai. Meanwhile, Shenzhen also has built 8-inch and 12-inch wafer production lines.
Hard Copy: US$ 2,200.00
PDF for Single User: US$ 2,300.00
PDF for Enterprisewide: US$ 3,300.00
The year of 2010 has been the best year for wafer foundry industry since 2000. It is expected that the output value of wafer foundry industry will reach USD27.6 billion, up 37.8% year-on-year. In addition, the output value of the entire semiconductor industry is projected to achieve USD274.5 billion, rising 21.5% year-on-year.
The wafer foundry industry witnessed a prosperous development in 2010, as a result of the economic recovery and the fab-lite strategy adopted by many large semiconductor companies. Most of the companies have continued to use existing fabs or produce analog products in their own fabs instead of investing in new fabs, while outsourcing the advanced digital CMOS process to wafer foundries because the R&D of processes at 65-nm and below that requires a huge amount of capital and labor force is unaffordable even to large semiconductor companies. For example, TI announced to outsource the production of the products at 32-nm and below to TSMC. Renesas, Japan’s biggest semiconductor manufacturer, also announced to outsource the production of its future top-class products to TSMC in July 2010. Thus, the wafer foundry industry will see a higher average growth margin than that of the semiconductor industry in the future. In the meantime, the wafer foundry industry also substantially increased the capital expenditure to improve technology and capacity in 2010. The capital expenditure of TSMC, UMC and Global Foundries will be as high as USD5.9 billion, USD1.9 billion and around USD2.5 billion respectively in 2010, all tripling the figures in 2009.
In 2010, there were some big changes in the wafer foundry industry. Global Foundries (GF), the wafer foundry originated from AMD, became increasingly strong after acquiring Chartered Semiconductor. The emergence of GF ended the competitive structure formed by TSMC, UMC, Chartered Semiconductor and SMIC. SMIC had been lagged far behind, and the operating income was only half of GF’s, and its technology was much inferior to GF’s as well. As a result, the wafer foundry industry is being dominated by GF, UMC and TMSC. UMC is facing the powerful challenge from GF, and even TMSC dare not underestimate GF.
Nevertheless, it is not easy for GF to surpass UMC as well. Firstly, Chartered Semiconductor acquired by GF had delivered poor performance all the while, and suffered net losses of USD288 million in 2009, while UMC achieved an operating profit margin of 5.1% in 2009. In 2009Q3, the capacity utilization of Chartered Semiconductor was 75%, while UMC’s was 89%. Originally led by Temasek, a sovereign wealth fund of the Singapore government, Chartered Semiconductor has been operating with low efficiency and suffered losses since its establishment. SMIC has suffered losses for main businesses for 13 consecutive quarters and five years. Chartered Semiconductor has not done better than SMIC. UMC has operated much better, and gained profit for five consecutive years. It will take GF a long time to transform Chartered Semiconductor into an efficient enterprise.
Secondly, GF cannot compete with UMC in terms of technology and capacity. UMC is capable of producing 4.8 million wafers annually, GF’s Chartered Semiconductor has an annual capacity of around 1.9 million wafers, plus the capacity of the former AMD, GF’s capacity is estimated to be 3.5-3.8 million wafers in total. Although backed up by Abu Dhabi, GF still needs time to increase capacity, since its new plant under construction in the United States since 2009 won’t be put into production until 2012.
Finally, GF has a narrower range of clients, because it should give priority to AMD, its parent company and also its biggest client, which may make other clients discontented. Chartered Semiconductor is a member of IBM technology alliance, so the majority of its big clients are from the alliance as well. UMC is the world’s first wafer foundry, treating all clients equally regardless of size and background.
During its 23 years of development, TSMC has never got an operating profit margin below 20% and a gross margin below 30%, and it has topped the market all the time. Its leadership has remained unshakable so far. Its annual capacity of 11 million wafers alone will take its rivals 3-5 years to catch up, and it will not stand still as well. In 2010, TSMC topped the market by virtue of USD5.9 billion of expenditure, and is likely to remain unparalleled for the next 15 years.
The wafer foundry industry in mainland China has continued to expand regardless of SMIC’s loss for 13 consecutive quarters. In 2010Q2, SMIC turned loss into profit relying on non-operating income of over USD100 million, and its operating income suffered losses of around USD10 million. Despite of the five-year successive losses, SMIC still plans to build a 12-inch wafer production line. Grace Semiconductor Manufacturing Corporation (Grace) and HHNEC invested RMB14.5 billion to build a 12-inch wafer production line in 2010. In 2009, the revenue of the 12-inch wafer production line completed by Wuhan Xinxin Semiconductor Manufacturing Corporation in 2008 was less than 12.5% of that of TSMC’s 8-inch plant in Shanghai. Meanwhile, Shenzhen also has built 8-inch and 12-inch wafer production lines.
1. SEMICONDUCTOR INDUSTRY CHAIN
1.1 Overview
1.2 Wafer Manufacturing
1.3 Wafer Cost
2. SEMICONDUCTOR DOWNSTREAM MARKET STATUS QUO & FUTURE
2.1 Cell Phone
2.2 PC & Flat Panel TV
3. SEMICONDUCTOR INDUSTRY STATUS QUO & FUTURE
3.1 Overview
3.2 Global Semiconductor Layout by Region
3.3 Wafer Foundry
3.4 Horizontal Comparison of Global Wafer Foundries
3.5 Semiconductor Equipment & Materials
4. CHINA’S SEMICONDUCTOR MARKET & INDUSTRY
4.1 Semiconductor Market
4.2 Semiconductor Industry
4.3 Wafer Foundry & IC Design Industry
5. KEY COMPANIES
5.1 TSMC
5.2 UMC
5.3 GLOBAL FOUNDRIES
5.4 SMIC
5.5 DONGBU HITEK
5.6 VIS
5.7 MAGNACHIP
5.8 GRACE
5.9 HHNEC
5.10 ASMC
5.11 TOWERJAZZ
5.12 X-FAB
5.13 CRM
5.14 Samsung Electronics
1.1 Overview
1.2 Wafer Manufacturing
1.3 Wafer Cost
2. SEMICONDUCTOR DOWNSTREAM MARKET STATUS QUO & FUTURE
2.1 Cell Phone
2.2 PC & Flat Panel TV
3. SEMICONDUCTOR INDUSTRY STATUS QUO & FUTURE
3.1 Overview
3.2 Global Semiconductor Layout by Region
3.3 Wafer Foundry
3.4 Horizontal Comparison of Global Wafer Foundries
3.5 Semiconductor Equipment & Materials
4. CHINA’S SEMICONDUCTOR MARKET & INDUSTRY
4.1 Semiconductor Market
4.2 Semiconductor Industry
4.3 Wafer Foundry & IC Design Industry
5. KEY COMPANIES
5.1 TSMC
5.2 UMC
5.3 GLOBAL FOUNDRIES
5.4 SMIC
5.5 DONGBU HITEK
5.6 VIS
5.7 MAGNACHIP
5.8 GRACE
5.9 HHNEC
5.10 ASMC
5.11 TOWERJAZZ
5.12 X-FAB
5.13 CRM
5.14 Samsung Electronics
SELECTED CHARTS
Taiwan’s Semiconductor Industry Chain
Wafer Implanted Circuit Diagram
8-inch Wafer Cost Structure
Global Cell Phone Shipment, 2007-2014E
World’s Quarterly Cell Phone Shipment & Annual Growth Rate, 2007Q1-2010Q2
World’s Quarterly Cell Phone Shipment by Region, 2007Q1-2010Q2
World’s Quarterly Cell Phone Shipment by Technology, 2007Q1-2010Q2
World’s CDMA/WCDMA Cell Phone Shipment by Region, 2006-2010
Shipment of World’s Key Cell Phone Manufacturers, Q1-Q2, 2010
World’s Flat Panel TV Shipment, 2003-2014E
Output Value of World’s Semiconductor Industry, 2003-2011E
World’s IC Shipment and Average Price, 1999Q1-2010Q1
World’s Semiconductor Market Income by Region, 2010Q2
World’s Foundry Industry Output Value and Growth Rate, 2005-2014E
Average Capacity Utilization of Advanced Process of World’s Foundries, 2005Q1-2010Q3
World’s Wafer Industry Client Structure, 2006-2013E
World’s Wafer Shipment by Size, 2004-2014E
Capacity Utilization of World’s Foundry, 2008Q1-2011Q4E
World’s Wafer Fab Construction Project Expenditure by Region, 1997-2011E
World’s Wafer Fab Equipment Expenditure by Region, 1997-2011E
World’s Wafer Fab Equipment Expenditure by Size, 1997-2011E
World’s Semiconductor Equipment Market by Region, 2007-2011E
World’s Semiconductor Equipment Market by Type, 2007-2011E
Ratio of World’s Semiconductor Equipment Expenditure, 1991-2011E
Semiconductor Equipment and Materials Expenditure, 1987-2011E
China’s IC Market Sales Scale & Growth Rate, 2005-2009
China’s IC Market Product Structure, 2009
China’s IC Market Application Structure, 2009
China’s IC Market Scale & Growth Rate, 2010-2012E
China’s IC Industry Sales Scale & Growth, 2008Q1-2010Q2
TSMC Organization
TSMC Income & Operating Margin, 2004-2010
TSMC Wafer Shipment & Capacity Utilization, 2004-2010
TSMC Quarterly Income & Operating Margin, 2008Q1-2010Q2
TSMC Products Application, 2009Q1-2010Q2
TSMC Income by Node, 2008Q3-2010Q2
TSMC 28nm Technology Roadmap
TSMC 28nm Technique Features
UMC Income & Operating Margin, 2001-2010
UMC Shipment & Capacity Utilization, 2001-2010
UMC Quarterly Income & Gross Profit Margin, 2008Q1-2010Q2
UMC Quarterly Income by Region, 2008Q1-2010Q2
UMC Quarterly Income by Node, 2008Q1-2010Q2
UMC Quarterly Income by Application, 2008Q1-2010Q2
UMC Quarterly Shipment & Capacity Utilization, 2008Q1-2010Q2
Chartered Semiconductor’s Income & Net Profit Margin, 2000-2009
Chartered Semiconductor’s Income by Application, 2008Q3-2009Q3
Chartered Semiconductor’s Income by Region, 2008Q3-2009Q3
Chartered Semiconductor’s Income by Node, 2008Q3-2009Q3
Global Foundries’ Wafer Plants Worldwide
Global Foundries’ Technology Roadmap
SMIC Income & Operating Margin, 2003-2010
SMIC Income, 2010H1
SMIC Income & Gross Profit Margin, 2008Q1-2010Q2
SMIC Quarterly Income by Application, 2008Q1-2010Q2
SMIC Quarterly Income by Type, 2008Q1-2010Q2
SMIC Quarterly Income by Client, 2008Q1-2010Q2
SMIC Quarterly Income by Region, 2008Q1-2010Q2
SMIC Quarterly Income by Node, 2008Q1-2010Q2
SMIC Shipment & Capacity Utilization, 2008Q1-2010Q2
SMIC Plant Layout
SMIC Technology Capability
SMIC Key Clients
Dongbu HiTek Income & Operating Profit, 2006-2010
Dongbu HiTek Shipment & Capacity Utilization, 2004-2011E
Dongbu HiTek Wafer ASP & EBITDA, 2007Q2-2010Q2
Dongbu Overview
Dongbu Hitek Wafer Fabs
Capacity of Dongbu Hitek Wafer Fabs, 2007-2010
Dongbu Hitek Technology Roadmap
Dongbu Hitek Technique Features
VIS Income & Operating Profit Margin, 2005-2010
VIS Income & Gross Profit Margin, 2008Q2-2010Q2
VIS Income by Node, 2008Q2-2010Q2
VIS Income by Application, 2008Q2-2010Q2
VIS Income by Product, 2009Q1-2010Q2
VIS Shipment & Capacity Utilization, 2008Q2-2010Q2
VIS Technique Features
VIS Technology Roadmap
MagnaChip Income & Gross Profit Margin, 2001-2010
MagnaChip Income & Operating Profit Margin, 2005-2010
MagnaChip Income by Product, 2004-2010
MagnaChip Income by Region, 2004-2010
Grace Semiconductor’s Technology Roadmap
Hua Hong NEC’s Roadmap
ASMC Income & Gross Profit Margin, 2003-2010
ASMC Income & EBITDA, 2003-2010
ASMC Quarterly Capacity Utilization, 2006Q1-2010Q2
ASMC Income by Region, 2008Q3-2010Q2
ASMC Income by Client Type, 2008Q3-2010Q2
ASMC Income by Application, 2008Q3-2010Q2
ASMC Income by Wafer Fab, 2008Q3-2010Q2
TowerJazz Income & Gross Profit Margin, 2003-2010
X-Fab Income & Operating Profit, 2004-2009
CRM Income by Region, 2008-2009
CRM Income by Product, 2008-2009
CRM Income by Division, 2008-2009
Income of World’s 15 Foundries, 2007-2010E
Operating Profit Margin, Capacity and Output of World’s Key Foundries, 2009-2010
TSMC Capacity by Plant, 2008-2010
UMC Capacity by Plant, 2006Q1, 2007Q1, 2009Q4 & 2010Q3
Chartered Semiconductor’s Wafer Shipment & Capacity Utilization, 2008Q3-2009Q3
Chartered Semiconductor’s Capacity by Plant, 2008Q3-2009Q3
SMIC Capacity
MAGNACHIP Wafer Fabs
HHNEC Income, 2003-2009
ASMC Capacity by Production Line, 2010Q2
Taiwan’s Semiconductor Industry Chain
Wafer Implanted Circuit Diagram
8-inch Wafer Cost Structure
Global Cell Phone Shipment, 2007-2014E
World’s Quarterly Cell Phone Shipment & Annual Growth Rate, 2007Q1-2010Q2
World’s Quarterly Cell Phone Shipment by Region, 2007Q1-2010Q2
World’s Quarterly Cell Phone Shipment by Technology, 2007Q1-2010Q2
World’s CDMA/WCDMA Cell Phone Shipment by Region, 2006-2010
Shipment of World’s Key Cell Phone Manufacturers, Q1-Q2, 2010
World’s Flat Panel TV Shipment, 2003-2014E
Output Value of World’s Semiconductor Industry, 2003-2011E
World’s IC Shipment and Average Price, 1999Q1-2010Q1
World’s Semiconductor Market Income by Region, 2010Q2
World’s Foundry Industry Output Value and Growth Rate, 2005-2014E
Average Capacity Utilization of Advanced Process of World’s Foundries, 2005Q1-2010Q3
World’s Wafer Industry Client Structure, 2006-2013E
World’s Wafer Shipment by Size, 2004-2014E
Capacity Utilization of World’s Foundry, 2008Q1-2011Q4E
World’s Wafer Fab Construction Project Expenditure by Region, 1997-2011E
World’s Wafer Fab Equipment Expenditure by Region, 1997-2011E
World’s Wafer Fab Equipment Expenditure by Size, 1997-2011E
World’s Semiconductor Equipment Market by Region, 2007-2011E
World’s Semiconductor Equipment Market by Type, 2007-2011E
Ratio of World’s Semiconductor Equipment Expenditure, 1991-2011E
Semiconductor Equipment and Materials Expenditure, 1987-2011E
China’s IC Market Sales Scale & Growth Rate, 2005-2009
China’s IC Market Product Structure, 2009
China’s IC Market Application Structure, 2009
China’s IC Market Scale & Growth Rate, 2010-2012E
China’s IC Industry Sales Scale & Growth, 2008Q1-2010Q2
TSMC Organization
TSMC Income & Operating Margin, 2004-2010
TSMC Wafer Shipment & Capacity Utilization, 2004-2010
TSMC Quarterly Income & Operating Margin, 2008Q1-2010Q2
TSMC Products Application, 2009Q1-2010Q2
TSMC Income by Node, 2008Q3-2010Q2
TSMC 28nm Technology Roadmap
TSMC 28nm Technique Features
UMC Income & Operating Margin, 2001-2010
UMC Shipment & Capacity Utilization, 2001-2010
UMC Quarterly Income & Gross Profit Margin, 2008Q1-2010Q2
UMC Quarterly Income by Region, 2008Q1-2010Q2
UMC Quarterly Income by Node, 2008Q1-2010Q2
UMC Quarterly Income by Application, 2008Q1-2010Q2
UMC Quarterly Shipment & Capacity Utilization, 2008Q1-2010Q2
Chartered Semiconductor’s Income & Net Profit Margin, 2000-2009
Chartered Semiconductor’s Income by Application, 2008Q3-2009Q3
Chartered Semiconductor’s Income by Region, 2008Q3-2009Q3
Chartered Semiconductor’s Income by Node, 2008Q3-2009Q3
Global Foundries’ Wafer Plants Worldwide
Global Foundries’ Technology Roadmap
SMIC Income & Operating Margin, 2003-2010
SMIC Income, 2010H1
SMIC Income & Gross Profit Margin, 2008Q1-2010Q2
SMIC Quarterly Income by Application, 2008Q1-2010Q2
SMIC Quarterly Income by Type, 2008Q1-2010Q2
SMIC Quarterly Income by Client, 2008Q1-2010Q2
SMIC Quarterly Income by Region, 2008Q1-2010Q2
SMIC Quarterly Income by Node, 2008Q1-2010Q2
SMIC Shipment & Capacity Utilization, 2008Q1-2010Q2
SMIC Plant Layout
SMIC Technology Capability
SMIC Key Clients
Dongbu HiTek Income & Operating Profit, 2006-2010
Dongbu HiTek Shipment & Capacity Utilization, 2004-2011E
Dongbu HiTek Wafer ASP & EBITDA, 2007Q2-2010Q2
Dongbu Overview
Dongbu Hitek Wafer Fabs
Capacity of Dongbu Hitek Wafer Fabs, 2007-2010
Dongbu Hitek Technology Roadmap
Dongbu Hitek Technique Features
VIS Income & Operating Profit Margin, 2005-2010
VIS Income & Gross Profit Margin, 2008Q2-2010Q2
VIS Income by Node, 2008Q2-2010Q2
VIS Income by Application, 2008Q2-2010Q2
VIS Income by Product, 2009Q1-2010Q2
VIS Shipment & Capacity Utilization, 2008Q2-2010Q2
VIS Technique Features
VIS Technology Roadmap
MagnaChip Income & Gross Profit Margin, 2001-2010
MagnaChip Income & Operating Profit Margin, 2005-2010
MagnaChip Income by Product, 2004-2010
MagnaChip Income by Region, 2004-2010
Grace Semiconductor’s Technology Roadmap
Hua Hong NEC’s Roadmap
ASMC Income & Gross Profit Margin, 2003-2010
ASMC Income & EBITDA, 2003-2010
ASMC Quarterly Capacity Utilization, 2006Q1-2010Q2
ASMC Income by Region, 2008Q3-2010Q2
ASMC Income by Client Type, 2008Q3-2010Q2
ASMC Income by Application, 2008Q3-2010Q2
ASMC Income by Wafer Fab, 2008Q3-2010Q2
TowerJazz Income & Gross Profit Margin, 2003-2010
X-Fab Income & Operating Profit, 2004-2009
CRM Income by Region, 2008-2009
CRM Income by Product, 2008-2009
CRM Income by Division, 2008-2009
Income of World’s 15 Foundries, 2007-2010E
Operating Profit Margin, Capacity and Output of World’s Key Foundries, 2009-2010
TSMC Capacity by Plant, 2008-2010
UMC Capacity by Plant, 2006Q1, 2007Q1, 2009Q4 & 2010Q3
Chartered Semiconductor’s Wafer Shipment & Capacity Utilization, 2008Q3-2009Q3
Chartered Semiconductor’s Capacity by Plant, 2008Q3-2009Q3
SMIC Capacity
MAGNACHIP Wafer Fabs
HHNEC Income, 2003-2009
ASMC Capacity by Production Line, 2010Q2
