Global and China Semiconductor Package and Test Industry Report, 2011-2012
The report revolves around the following aspects:
Independent package & test vendors are generally known as OSAT or ASAT. In 1997, the OSAT industry scale was no more than USD5.1 billion or so, making up 19.6% of the semiconductor industry, as opposed to the market size of USD23.6 billion in 2011. Owning to the fact that TSV technology advances slowly and that foundries are designed to assume partial package business, the OSAT market scale may see little change but slim growth, with the estimated revenue in 2012 registering USD24.4 billion. In the package & test market, the proportions by revenue of package and test are roughly 78% and 22% respectively. It is estimated that the IC test and wafer test will be more time-consuming, further propelling cost proportion up.
Package & test companies are heavily reliant on foundries and IDMs, especially on foundries. Only count on large foundries can package & test companies capture bigger market share. A case in point is ASE, the world’s first largest package & test vendor, which closely collaborates with TSMC, the world’s largest foundry. ASE undertakes nearly all the package & test business of TSMC, the market occupancy of which reaches roughly 48% in global foundry market, while the market share of ASE in global package & test market approximates 18%. In addition, the world’s second largest package & test company Amkor carries cooperation with Global Foundries; the third largest one SPIL teams up with UMC; the world’s fourth largest player, cooperates with INTEL? and Singapore-based Chartered.
The global package & test industry features high concentration, with the combined market share of the top four reaping 46%. This is mainly because of great support from large foundries. The foundry industry in Taiwan is highly developed with the global market occupancy exceeding 60%, which fuels the package & test industry, with a global market share of 56%.
Driven by Singapore-based Chartered and Japan-based IDM, enterprises in Southeast Asia occupy the second place with the market share of 15%. However, since it was merged by Global foundries, business performance of Chartered was bogged down. Inasmuch as most products made by Southeast Asia-based companies are analog IC package & test, there is a great possibility that the business performance of these enterprises will set back due to limited potential.
America-based counterparts are mainly engaged in package & test of high-end products, and there are a host of foundries and IDMs in America, which makes it the third position with the market occupancy of 13%. As for South Korea, the package & test enterprises rely on Samsung and SK Hynix. In the future, Samsung is expected to embrace positive growth in terms of memory business and System LSI business. Therefore, South Korea-based package & test enterprises enjoy bright prospect.
Although there are many foundries in Chinese Mainland, the technology falls far behind. Subsequently, package & test enterprises feature small scale and poor business performance. In 2011, the operating profit of JCET, China’s largest package & test enterprise, slumped by 97.3%; while Nantong Fujitsu Microelectronics, the second largest player, sharply dropped by 89.5%. On average, the operating profit of the world’s top 4 package & test vendors fell by 18%, approximately.
- Overview of global semiconductor industry;
- Status quo of analog semiconductor, MCU, DRAM, NAND and compound semiconductor market;
- Status quo of IC manufacturing industry;
- Package & test industry;
- 24 major package & test vendors
Independent package & test vendors are generally known as OSAT or ASAT. In 1997, the OSAT industry scale was no more than USD5.1 billion or so, making up 19.6% of the semiconductor industry, as opposed to the market size of USD23.6 billion in 2011. Owning to the fact that TSV technology advances slowly and that foundries are designed to assume partial package business, the OSAT market scale may see little change but slim growth, with the estimated revenue in 2012 registering USD24.4 billion. In the package & test market, the proportions by revenue of package and test are roughly 78% and 22% respectively. It is estimated that the IC test and wafer test will be more time-consuming, further propelling cost proportion up.
Package & test companies are heavily reliant on foundries and IDMs, especially on foundries. Only count on large foundries can package & test companies capture bigger market share. A case in point is ASE, the world’s first largest package & test vendor, which closely collaborates with TSMC, the world’s largest foundry. ASE undertakes nearly all the package & test business of TSMC, the market occupancy of which reaches roughly 48% in global foundry market, while the market share of ASE in global package & test market approximates 18%. In addition, the world’s second largest package & test company Amkor carries cooperation with Global Foundries; the third largest one SPIL teams up with UMC; the world’s fourth largest player, cooperates with INTEL? and Singapore-based Chartered.
The global package & test industry features high concentration, with the combined market share of the top four reaping 46%. This is mainly because of great support from large foundries. The foundry industry in Taiwan is highly developed with the global market occupancy exceeding 60%, which fuels the package & test industry, with a global market share of 56%.
Driven by Singapore-based Chartered and Japan-based IDM, enterprises in Southeast Asia occupy the second place with the market share of 15%. However, since it was merged by Global foundries, business performance of Chartered was bogged down. Inasmuch as most products made by Southeast Asia-based companies are analog IC package & test, there is a great possibility that the business performance of these enterprises will set back due to limited potential.
America-based counterparts are mainly engaged in package & test of high-end products, and there are a host of foundries and IDMs in America, which makes it the third position with the market occupancy of 13%. As for South Korea, the package & test enterprises rely on Samsung and SK Hynix. In the future, Samsung is expected to embrace positive growth in terms of memory business and System LSI business. Therefore, South Korea-based package & test enterprises enjoy bright prospect.
Although there are many foundries in Chinese Mainland, the technology falls far behind. Subsequently, package & test enterprises feature small scale and poor business performance. In 2011, the operating profit of JCET, China’s largest package & test enterprise, slumped by 97.3%; while Nantong Fujitsu Microelectronics, the second largest player, sharply dropped by 89.5%. On average, the operating profit of the world’s top 4 package & test vendors fell by 18%, approximately.
1. GLOBAL SEMICONDUCTOR INDUSTRY
1.1 Overview
1.2 IC Design Industry
1.3 IC Package and Test Industry
1.4 Chinese IC Market
2. SEMICONDUCTOR INDUSTRY PATTERN
2.1 Analog Semiconductor
2.2 MCU
2.3 DRAM Industry
2.3.1 Status Quo
2.3.2 Market Share of DRAM Manufacturers
2.3.3 Market Share of Mobile DRAM Manufacturers
2.4 NAND
2.5 Compound Semiconductor Industry
3. IC MANUFACTURING INDUSTRY
3.1 Capacity
3.2 Foundry
3.3 MEMS Foundry
3.4 China Foundry Industry
3.5 Foundry Market
3.5.1 Global Mobile Phone Market Size
3.5.2 Market Share of Mobile Phone Brands
3.5.3 Smartphone Market
3.5.4 PC Market
3.6 Semiconductor Equipment Market
3.7 Semiconductor Material Market
4. PACKAGE & TEST INDUSTRY
4.1 Market Size
4.2 Industry Pattern
4.3 WLCSP Market
4.4 TSV Package
4.5 Semiconductor Test
4.5.1 Teradyne
4.5.2 Advantest
4.6 Ranking of Package & Test Companies Worldwide
5. PACKAGE & TEST COMPANIES
5.1 ASE
5.2 Amkor
5.3 SPIL
5.4 STATS ChipPAC
5.5 PTI
5.6 Greatek
5.7 ChipMOS
5.8 KYEC
5.9 Unisem
5.10 FATC
5.11 JCET
5.12 UTAC
5.13 Lingsen Precision.
5.14 Nantong Fujitsu Microelectronics
5.15 Walton Advanced Engineering
5.16 Chipbond
5.17 J-DEVICES
5.18 MPI
5.19 STS Semiconductor
5.20 Signetics
5.21 Hana Micron
5.22 Nepes
5.23 Tianshui Huatian Technology
5.24 Shinko
1.1 Overview
1.2 IC Design Industry
1.3 IC Package and Test Industry
1.4 Chinese IC Market
2. SEMICONDUCTOR INDUSTRY PATTERN
2.1 Analog Semiconductor
2.2 MCU
2.3 DRAM Industry
2.3.1 Status Quo
2.3.2 Market Share of DRAM Manufacturers
2.3.3 Market Share of Mobile DRAM Manufacturers
2.4 NAND
2.5 Compound Semiconductor Industry
3. IC MANUFACTURING INDUSTRY
3.1 Capacity
3.2 Foundry
3.3 MEMS Foundry
3.4 China Foundry Industry
3.5 Foundry Market
3.5.1 Global Mobile Phone Market Size
3.5.2 Market Share of Mobile Phone Brands
3.5.3 Smartphone Market
3.5.4 PC Market
3.6 Semiconductor Equipment Market
3.7 Semiconductor Material Market
4. PACKAGE & TEST INDUSTRY
4.1 Market Size
4.2 Industry Pattern
4.3 WLCSP Market
4.4 TSV Package
4.5 Semiconductor Test
4.5.1 Teradyne
4.5.2 Advantest
4.6 Ranking of Package & Test Companies Worldwide
5. PACKAGE & TEST COMPANIES
5.1 ASE
5.2 Amkor
5.3 SPIL
5.4 STATS ChipPAC
5.5 PTI
5.6 Greatek
5.7 ChipMOS
5.8 KYEC
5.9 Unisem
5.10 FATC
5.11 JCET
5.12 UTAC
5.13 Lingsen Precision.
5.14 Nantong Fujitsu Microelectronics
5.15 Walton Advanced Engineering
5.16 Chipbond
5.17 J-DEVICES
5.18 MPI
5.19 STS Semiconductor
5.20 Signetics
5.21 Hana Micron
5.22 Nepes
5.23 Tianshui Huatian Technology
5.24 Shinko
SELECTED CHARTS
Revenue of Semiconductor Packaging Material Manufacturers Worldwide, 2010-2013
Chinese IC Market Size, 2007-2011
Product Distribution of Chinese IC Market, 2011
Chinese IC Market by Application, 2011
Market Share of Major IC Companies in China, 2011
Market Share of Major Analog Semiconductor Companies, 2011
Market Share of Catalog Analog Semiconductor Companies, 2011
Ranking of Top 10 Analog Semiconductor Companies, 2011
Ranking of MCU Companies, 2011
CAPEX of DRAM Industry, 2000-2012
Global DRAM Shipment, 2000-2013
DRAM Contract Price Fluctuations, Oct. 2009-Jan. 2012
Revenue of DRAM Companies Worldwide, Q1 2005-Q4 2012
Global Shipment of DRAM Wafer, Q1 2010-Q4 2012
RAM Demand, 2001-2013
Ranking of DRAM Brands by Revenue, Q4 2011
Market Share of Mobile DRAM, 2009-2011
GaAs-based Device Industry Chain
Major Manufacturers in GaAs-based Device Industry Chain
Ranking of GaAs-based Device Companies Worldwide, 2011-2012
Global 12-inch Fabs Capacity, 2011
Capacity of 12-inch Fabs by Region Worldwide, 1999-2012
Expenditure of Major Fabs by Product type, Q4 2011-Q4 2012
Global Wafer Installed Capacity by Product, Q1 2010-Q4 2013
Global Wafer Equipment Expenditure by Region, 2010-2012
Ranking of Global Foundries by Sales, 2005-2011
Operating Margins of World’s Major Foundries, 2005-2011
Ranking of World’s Top 30 MEMS Companies by Revenue, 2011
Ranking of World’s Top 20 MEMS Foundries, 2011
Sales of Chinese Foundries, 2011
Ranking of World’s Top 25 IC Design Houses, 2011
Global Shipment of Mobile Phones, 2007-2014
Global Mobile Phone Shipment and Growth Rate, Q1 2009-Q4 2011
3G/4G Mobile Phone Shipment by Region, 2010-2012
Quarterly Shipment of Major Mobile Phone Brands Worldwide, 2010-2011
Shipment of Major Mobile Phone Vendors Worldwide, 2010-2011
Smartphone Shipment of Major Mobile Phone Vendors Worldwide, 2010-2011
Market Share of Smartphone OS, 2011
Global Shipment of CPU and GPU for PC, 2008-2013
Shipment of Net book, iPad and Tablet PC, 2008-2012
Global Investment in Wafer Equipment, 2007-2016
CAPEX of Global Semiconductor Companies, 2011-2016
WLP Equipment Expenditure Worldwide, 2011-2016
Die Packaging Equipment Expenditure Worldwide, 2011-2016
Automatic Test Equipment Expenditure Worldwide, 2011-2016
CAPEX of Global Top 10 Semiconductor Companies, 2011-2012
Global Semiconductor Materials Market by Region, 2010-2013
Semiconductor Back-end Equipment Expenditure by Region Worldwide, 2010-2012
OSAT Market Size, 2006-2014
Global IC Packaging Types by Shipment, 2007
Global IC Packaging Types by Shipment, 2010
Global Package & Test Market by Technology, 2007, 2011, 2015
Global OSAT Output Value by Region, 2012
Revenue of Taiwanese IC Package & Test Industry, 2007-2011
WLCSP Market Size, 2010-2016
WLCSP’s Shipment by Application, 2010-2016
Fan-in WLCSP 2010-2016 unit CAGR by Device Type
Mobile Phone CPU / GPU Packaging Roadmap
Revenue and Operating Margin of Teradyne, Q1 2010-Q4 2011
New Orders of SOC Products of Teradyne, Q1 2005-Q4 2011
Sales and Backlog Orders of Teradyne by Region, Q4 2011
Orders of Advantest by Segment and Region, FY2010-FY2011
Revenue of Advantest by Segment and Region, FY2010-FY2011
Orders of Advantest by Segment, Q1 2010-Q4 2011
Orders of Advantest by Region, Q1 2010-Q4 2011
Revenue of Advantest by Segment, Q1 2010-Q4 2011
Revenue of Advantest by Region, Q1 2010-Q4 2011
Sales of Advantest’s Semiconductor Test Division by Application, 2000-2011
Global Presence of Advantest
Revenue of Top 24 Global IC Package & Test Companies, 2008-2012
Organizational Structure of ASE
Revenue and Gross Margin of ASE, 2001-2012
Revenue Breakdown of ASE by Business, 2010-2011
Copper Wire Bonding Revenue of ASE, Q1 2010-Q4 2011
Copper Wire Bonding Conversion Rate of ASE, Q1 2010-Q4 2011
ASE’s Copper Wire Bonding Revenue by Region, Q1 2010-Q4 2011
ASE’s Copper Wire Bonding Revenue by Client, Q1 2010-Q4 2011
Revenue and Gross Margin of ASE’s Package Segment, Q1 2010-Q1 2012
Revenue of ASE’s Package Segment by Type, Q1 2010-Q1 2012
Revenue and Gross Margin of ASE’s Test Segment, Q1 2010-Q1 2012
Revenue of ASE’s Test Segment by Business, Q1 2010-Q1 2012
Revenue, Gross Margin and Operating Margin of ASE’s Materials Segment, Q1 2010-Q1 2012
CAPEX and EBITDA of ASE, Q1 2010-Q1 2012
Top 10 Clients of ASE, Q1 2012
Revenue of ASE by Application, Q1 2012
ASE Presence in China
Package Types of ASE Shanghai
Revenue of ASE Shanghai, 2004-2011
Revenue, Gross Margin and Operating Margin of Amkor, 2005-2011
Amkor’s Revenue by Package Type, 2007-2011
Amkor’s Revenue by Package Type, Q4 2008-Q1 2012
Amkor’s Shipment by Package Type, Q4 2008-Q1 2012
Amkor’s CSP Packaging Revenue and Shipment, 2005-Q3 2011
Amkor’s CSP Packaging Revenue by Application, 2011
Amkor’s BGA Packaging Revenue and Shipment, 2005-Q3 2011
Amkor’s BGA Packaging Revenue by Application, 2011
Amkor’s Leadframe Packaging Revenue and Shipment, 2005-Q3 2011
Amkor’s Leadframe Packaging Revenue by Application, Q3 2011
Amkor’s Packaging Capacity Utilization, Q1 2008-Q4 2011
Revenue, Gross Margin and Operating Margin of SPIL, 2003-2011
Revenue of SPIL by Region, 2005-Q1 2012
Revenue of SPIL by Application, 2005-Q1 2012
Revenue of SPIL by Business, 2005-Q1 2012
SPIL’s Capacity Statistics in Q1 2006, Q2-Q3 2007 and Q3-Q4 2011
Revenue and Gross Margin of STATS ChipPAC Ltd., 2004-2011
Revenue of STATS ChipPAC Ltd. by Package Type, 2006-Q1 2012
Revenue of STATS ChipPAC Ltd. by Application, 2006-Q1 2012
Revenue of STATS ChipPAC Ltd. by Region, 2006-2011
Revenue and Operating Margin of PTI, 2006-2012
PTI’s Factories
PTI’s TSV Solutions
PTI’s Revenue by Business, Q1 2012
PTI’s Revenue by Product, Q1 2012
Revenue, Gross Margin and Operating Margin of Greatek, 2002-2011
Revenue of Greatek by Technology Type, 2007-2010
Revenue and Gross Margin of ChipMOS, 2003-2011
Revenue of ChipMOS by Business, 2010-2011
Revenue of ChipMOS by Product, 2010-2011
Revenue of ChipMOS by Client, 2011
Revenue of ChipMOS by Region, 2006-2011
Revenue and Gross Margin of KYEC, 2002-2012
Monthly Revenue of KYEC, Apr. 2010-Apr. 2012
KYEC’s Factories
KYEC’s Testing Platforms
Unisem’s Revenue and EBITDA, 2006-2011
Organizational Structure of Formosa Plastic Group
Revenue and Operating Margin of FATC, 2006-2012
Monthly Revenue of FATC, Apr. 2010-Apr. 2012
Revenue and Operating Margin of JCET, 2006-2012
JCET’s Roadmap
JCET’s Revenue by Region, 2011
Revenue and Operating Margin of Lingsen Precision Industries, Ltd., 2007-2012
Monthly Revenue of Lingsen Precision Industries, Ltd., Apr. 2010-Apr. 2012
Revenue and Growth Rate of Nantong Fujitsu Microelectronics, 2006-2011
Net Income and Growth Rate of Nantong Fujitsu Microelectronics, 2006-2011
Quarterly Revenue and Growth Rate of Nantong Fujitsu Microelectronics, 2006-2011
Quarterly Net Income and Growth Rate of Nantong Fujitsu Microelectronics, 2006-2011
Quarterly Gross Margin of Nantong Fujitsu Microelectronics, 2006-2011
Quarterly Selling, Administrative and R&D Expenses of Nantong Fujitsu Microelectronics, 2006-2011
Revenue and Operating Margin of WALTON, 2007-2012
Monthly Revenue and Growth Rate of WALTON, Apr.2010-Apr.2012
Revenue and Operating Margin of Chipbond, 2006-2012
Monthly Revenue and Growth Rate of Chipbond, Apr.2010-Apr.2012
Revenue of Chipbond by Product, Apr.2009-Apr.2012
Revenue and EBIT of MPI, FY2007-FY2012
Revenue of MPI by Region
Revenue of Carsem by Product, Q1 2011-Q1 2012
Revenue and Operating Margin of STS Semiconductor, 2006-2012
Equity Structure of Signetics
Revenue and Operating Margin of Signetics, 2007-2012
Capacity Utilization and Operating Margin of Signetics, Q1 2010-Q4 2012
Revenue of Signetics by Product, 2011
Revenue of Signetics by Customer, 2011
Revenue and Operating Margin of Hana Micron, 2006-2012
Revenue of Hana Micron by Customer, 2011
Revenue and Operating Margin of Nepes, 2007-2012
Quarterly Revenue and Operating Margin of Nepes, 2006-2012
Quarterly Revenue of Nepes by Division, 2006-2012
Quarterly Operating Income of Nepes by Division, 2006-2012
Revenue and Operating Margin of Tianshui Huatian Technology, 2006-2012
Revenue and Net Income of Shinko, FY2007-FY2012
Revenue of Shinko by Business, FY2011-FY2012
Revenue of Semiconductor Packaging Material Manufacturers Worldwide, 2010-2013
Chinese IC Market Size, 2007-2011
Product Distribution of Chinese IC Market, 2011
Chinese IC Market by Application, 2011
Market Share of Major IC Companies in China, 2011
Market Share of Major Analog Semiconductor Companies, 2011
Market Share of Catalog Analog Semiconductor Companies, 2011
Ranking of Top 10 Analog Semiconductor Companies, 2011
Ranking of MCU Companies, 2011
CAPEX of DRAM Industry, 2000-2012
Global DRAM Shipment, 2000-2013
DRAM Contract Price Fluctuations, Oct. 2009-Jan. 2012
Revenue of DRAM Companies Worldwide, Q1 2005-Q4 2012
Global Shipment of DRAM Wafer, Q1 2010-Q4 2012
RAM Demand, 2001-2013
Ranking of DRAM Brands by Revenue, Q4 2011
Market Share of Mobile DRAM, 2009-2011
GaAs-based Device Industry Chain
Major Manufacturers in GaAs-based Device Industry Chain
Ranking of GaAs-based Device Companies Worldwide, 2011-2012
Global 12-inch Fabs Capacity, 2011
Capacity of 12-inch Fabs by Region Worldwide, 1999-2012
Expenditure of Major Fabs by Product type, Q4 2011-Q4 2012
Global Wafer Installed Capacity by Product, Q1 2010-Q4 2013
Global Wafer Equipment Expenditure by Region, 2010-2012
Ranking of Global Foundries by Sales, 2005-2011
Operating Margins of World’s Major Foundries, 2005-2011
Ranking of World’s Top 30 MEMS Companies by Revenue, 2011
Ranking of World’s Top 20 MEMS Foundries, 2011
Sales of Chinese Foundries, 2011
Ranking of World’s Top 25 IC Design Houses, 2011
Global Shipment of Mobile Phones, 2007-2014
Global Mobile Phone Shipment and Growth Rate, Q1 2009-Q4 2011
3G/4G Mobile Phone Shipment by Region, 2010-2012
Quarterly Shipment of Major Mobile Phone Brands Worldwide, 2010-2011
Shipment of Major Mobile Phone Vendors Worldwide, 2010-2011
Smartphone Shipment of Major Mobile Phone Vendors Worldwide, 2010-2011
Market Share of Smartphone OS, 2011
Global Shipment of CPU and GPU for PC, 2008-2013
Shipment of Net book, iPad and Tablet PC, 2008-2012
Global Investment in Wafer Equipment, 2007-2016
CAPEX of Global Semiconductor Companies, 2011-2016
WLP Equipment Expenditure Worldwide, 2011-2016
Die Packaging Equipment Expenditure Worldwide, 2011-2016
Automatic Test Equipment Expenditure Worldwide, 2011-2016
CAPEX of Global Top 10 Semiconductor Companies, 2011-2012
Global Semiconductor Materials Market by Region, 2010-2013
Semiconductor Back-end Equipment Expenditure by Region Worldwide, 2010-2012
OSAT Market Size, 2006-2014
Global IC Packaging Types by Shipment, 2007
Global IC Packaging Types by Shipment, 2010
Global Package & Test Market by Technology, 2007, 2011, 2015
Global OSAT Output Value by Region, 2012
Revenue of Taiwanese IC Package & Test Industry, 2007-2011
WLCSP Market Size, 2010-2016
WLCSP’s Shipment by Application, 2010-2016
Fan-in WLCSP 2010-2016 unit CAGR by Device Type
Mobile Phone CPU / GPU Packaging Roadmap
Revenue and Operating Margin of Teradyne, Q1 2010-Q4 2011
New Orders of SOC Products of Teradyne, Q1 2005-Q4 2011
Sales and Backlog Orders of Teradyne by Region, Q4 2011
Orders of Advantest by Segment and Region, FY2010-FY2011
Revenue of Advantest by Segment and Region, FY2010-FY2011
Orders of Advantest by Segment, Q1 2010-Q4 2011
Orders of Advantest by Region, Q1 2010-Q4 2011
Revenue of Advantest by Segment, Q1 2010-Q4 2011
Revenue of Advantest by Region, Q1 2010-Q4 2011
Sales of Advantest’s Semiconductor Test Division by Application, 2000-2011
Global Presence of Advantest
Revenue of Top 24 Global IC Package & Test Companies, 2008-2012
Organizational Structure of ASE
Revenue and Gross Margin of ASE, 2001-2012
Revenue Breakdown of ASE by Business, 2010-2011
Copper Wire Bonding Revenue of ASE, Q1 2010-Q4 2011
Copper Wire Bonding Conversion Rate of ASE, Q1 2010-Q4 2011
ASE’s Copper Wire Bonding Revenue by Region, Q1 2010-Q4 2011
ASE’s Copper Wire Bonding Revenue by Client, Q1 2010-Q4 2011
Revenue and Gross Margin of ASE’s Package Segment, Q1 2010-Q1 2012
Revenue of ASE’s Package Segment by Type, Q1 2010-Q1 2012
Revenue and Gross Margin of ASE’s Test Segment, Q1 2010-Q1 2012
Revenue of ASE’s Test Segment by Business, Q1 2010-Q1 2012
Revenue, Gross Margin and Operating Margin of ASE’s Materials Segment, Q1 2010-Q1 2012
CAPEX and EBITDA of ASE, Q1 2010-Q1 2012
Top 10 Clients of ASE, Q1 2012
Revenue of ASE by Application, Q1 2012
ASE Presence in China
Package Types of ASE Shanghai
Revenue of ASE Shanghai, 2004-2011
Revenue, Gross Margin and Operating Margin of Amkor, 2005-2011
Amkor’s Revenue by Package Type, 2007-2011
Amkor’s Revenue by Package Type, Q4 2008-Q1 2012
Amkor’s Shipment by Package Type, Q4 2008-Q1 2012
Amkor’s CSP Packaging Revenue and Shipment, 2005-Q3 2011
Amkor’s CSP Packaging Revenue by Application, 2011
Amkor’s BGA Packaging Revenue and Shipment, 2005-Q3 2011
Amkor’s BGA Packaging Revenue by Application, 2011
Amkor’s Leadframe Packaging Revenue and Shipment, 2005-Q3 2011
Amkor’s Leadframe Packaging Revenue by Application, Q3 2011
Amkor’s Packaging Capacity Utilization, Q1 2008-Q4 2011
Revenue, Gross Margin and Operating Margin of SPIL, 2003-2011
Revenue of SPIL by Region, 2005-Q1 2012
Revenue of SPIL by Application, 2005-Q1 2012
Revenue of SPIL by Business, 2005-Q1 2012
SPIL’s Capacity Statistics in Q1 2006, Q2-Q3 2007 and Q3-Q4 2011
Revenue and Gross Margin of STATS ChipPAC Ltd., 2004-2011
Revenue of STATS ChipPAC Ltd. by Package Type, 2006-Q1 2012
Revenue of STATS ChipPAC Ltd. by Application, 2006-Q1 2012
Revenue of STATS ChipPAC Ltd. by Region, 2006-2011
Revenue and Operating Margin of PTI, 2006-2012
PTI’s Factories
PTI’s TSV Solutions
PTI’s Revenue by Business, Q1 2012
PTI’s Revenue by Product, Q1 2012
Revenue, Gross Margin and Operating Margin of Greatek, 2002-2011
Revenue of Greatek by Technology Type, 2007-2010
Revenue and Gross Margin of ChipMOS, 2003-2011
Revenue of ChipMOS by Business, 2010-2011
Revenue of ChipMOS by Product, 2010-2011
Revenue of ChipMOS by Client, 2011
Revenue of ChipMOS by Region, 2006-2011
Revenue and Gross Margin of KYEC, 2002-2012
Monthly Revenue of KYEC, Apr. 2010-Apr. 2012
KYEC’s Factories
KYEC’s Testing Platforms
Unisem’s Revenue and EBITDA, 2006-2011
Organizational Structure of Formosa Plastic Group
Revenue and Operating Margin of FATC, 2006-2012
Monthly Revenue of FATC, Apr. 2010-Apr. 2012
Revenue and Operating Margin of JCET, 2006-2012
JCET’s Roadmap
JCET’s Revenue by Region, 2011
Revenue and Operating Margin of Lingsen Precision Industries, Ltd., 2007-2012
Monthly Revenue of Lingsen Precision Industries, Ltd., Apr. 2010-Apr. 2012
Revenue and Growth Rate of Nantong Fujitsu Microelectronics, 2006-2011
Net Income and Growth Rate of Nantong Fujitsu Microelectronics, 2006-2011
Quarterly Revenue and Growth Rate of Nantong Fujitsu Microelectronics, 2006-2011
Quarterly Net Income and Growth Rate of Nantong Fujitsu Microelectronics, 2006-2011
Quarterly Gross Margin of Nantong Fujitsu Microelectronics, 2006-2011
Quarterly Selling, Administrative and R&D Expenses of Nantong Fujitsu Microelectronics, 2006-2011
Revenue and Operating Margin of WALTON, 2007-2012
Monthly Revenue and Growth Rate of WALTON, Apr.2010-Apr.2012
Revenue and Operating Margin of Chipbond, 2006-2012
Monthly Revenue and Growth Rate of Chipbond, Apr.2010-Apr.2012
Revenue of Chipbond by Product, Apr.2009-Apr.2012
Revenue and EBIT of MPI, FY2007-FY2012
Revenue of MPI by Region
Revenue of Carsem by Product, Q1 2011-Q1 2012
Revenue and Operating Margin of STS Semiconductor, 2006-2012
Equity Structure of Signetics
Revenue and Operating Margin of Signetics, 2007-2012
Capacity Utilization and Operating Margin of Signetics, Q1 2010-Q4 2012
Revenue of Signetics by Product, 2011
Revenue of Signetics by Customer, 2011
Revenue and Operating Margin of Hana Micron, 2006-2012
Revenue of Hana Micron by Customer, 2011
Revenue and Operating Margin of Nepes, 2007-2012
Quarterly Revenue and Operating Margin of Nepes, 2006-2012
Quarterly Revenue of Nepes by Division, 2006-2012
Quarterly Operating Income of Nepes by Division, 2006-2012
Revenue and Operating Margin of Tianshui Huatian Technology, 2006-2012
Revenue and Net Income of Shinko, FY2007-FY2012
Revenue of Shinko by Business, FY2011-FY2012
