China FPC Industry Report, 2006-2007
Being more flexible, much lighter and thinner than Rigid Printed Circuit (RPC), Flexible Printed Circuit (FPC) is usually applied to the products like cell phone, laptop, display screen, consumer electronics, and contactable panel and IC integration, etc.
Texturally, RPC is a product that presses the FCCL and PI together by adhesive. And it can be attached with some accessories such as reinforced board or linker to expand business scope or provide clients with all-round services. Therefore, the RPC manufacturing flow starts with the purchase of raw materials like CCL and FCCL, and then ends with assembly.
In Oct 2006, the global shipment of FPC increased by 26.4% over the same period of 2005, while its global order quantity decreased by 6.5% compared to 2005. Until the end of Oct 2006, the global shipment of FPC rose 8.3% over the year earlier, while its global order quantity dropped 6.5% from last year. From the view of growth of RPC and FPC during Jan-Oct 2006, FPC growth experienced a dramatic decrease in Feb-Jul but maintained a rate of around 25% in Aug-Oct. However, correspondingly, RPC market keeps more steadily.
In 2005, the global PCB market scale achieved approximately USD 42 billion, among which, Japan accounted for USD 11.3 billion, still ranking first in the world. China PCB industry has been keeping a high-speed growth with its production value of USD 6 billion in 2003, USD 8.15 billion in 2004 and as high as USD 10.83 billion in 2005 only next to Japan. And the PCB production value in China is expected to exceed USD 12 billion in the year of 2006. There are about 2800 PCB enterprises in the world and around 1200 PCB enterprises in mainland China. Most of the world well-known PCB manufacturers have established facilities and are making expansions. It is estimated that China will still be the important bases for investment and transfer of the PCB manufacturers. In 2005, the PCB output of China broke 11 million m2, half of which was from multilayer board. The PCB product structure of China is developing rapidly toward such high-grade products as high-multilayer products and HDI. The total import & export value of PCB products in China reached USD 6 billion in 2003, USD 8.9 billion in 2004 and rocketed to USD 11.9 billion with a year-on-year growth of 34% in 2005.
Driven by the strong demands from 3G handset, smart phone, digital camera and display screen, global FPC can keep a growth rate of 8%-10% during 2006-2008. As for the FPC for handset, it will develop towards polarization. One will be inclined to multilayer FPC or rigid-flex PCB design, which aims to realize max data volume and upgrade the assembly quality; another is single-/double-layer FPC at a lower cost which is mainly applied to low-grade cell phone. Therefore, it will be helpful for upgrading the market of single-/double-layer FPC if handset manufacturers can effectively enter into market with medium-and-low-end handsets.
FPC industry has seen three development orientations:
Firstly is FPC that uses the material of 2L FCCL. Price is now the obstacle over the large-scale development of 2L FCCL as 2L FCCL is short of supply and manufacturers enjoy a high gross profit. But once the price war starts up, the shipment will be further expanded, so the price will rapidly slip. Some believe 3L FCCL will still take the mainstream though, yet, ResearchInChina thinks the market always develops far beyond what we can be expected.
Secondly is rigid-flex PCB. Due to the emergence of slip and twisty cell-phones, rigid-flex PCB has become the favors of Korean manufacturers. But most of domestic FPC enterprises are not experienced in RPC, so they have to challenge the technology in rigid-flex PCB.
Thirdly comes to the high-density FPC. As the 3G era is coming, the traditional-density FPC is far enough to use, so the wiring density for cell phone has to be further enhanced, which is also why most of 3G cell phones are still the straight ones.
This report first analyzes the status quo of PCB industry, and then the development history and market scale of FPC industry across the world and China's mainland & Taiwan. Following are some information about raw materials of FPC like PI and FCCL and related manufacturers. Besides, it also probes into the development trends regarding FPC manufacturers' competition status, latest news, regional distribution, product structure, output & production value, competitive strategies, development orientation and key raw materials supply, etc.
Texturally, RPC is a product that presses the FCCL and PI together by adhesive. And it can be attached with some accessories such as reinforced board or linker to expand business scope or provide clients with all-round services. Therefore, the RPC manufacturing flow starts with the purchase of raw materials like CCL and FCCL, and then ends with assembly.
In Oct 2006, the global shipment of FPC increased by 26.4% over the same period of 2005, while its global order quantity decreased by 6.5% compared to 2005. Until the end of Oct 2006, the global shipment of FPC rose 8.3% over the year earlier, while its global order quantity dropped 6.5% from last year. From the view of growth of RPC and FPC during Jan-Oct 2006, FPC growth experienced a dramatic decrease in Feb-Jul but maintained a rate of around 25% in Aug-Oct. However, correspondingly, RPC market keeps more steadily.
In 2005, the global PCB market scale achieved approximately USD 42 billion, among which, Japan accounted for USD 11.3 billion, still ranking first in the world. China PCB industry has been keeping a high-speed growth with its production value of USD 6 billion in 2003, USD 8.15 billion in 2004 and as high as USD 10.83 billion in 2005 only next to Japan. And the PCB production value in China is expected to exceed USD 12 billion in the year of 2006. There are about 2800 PCB enterprises in the world and around 1200 PCB enterprises in mainland China. Most of the world well-known PCB manufacturers have established facilities and are making expansions. It is estimated that China will still be the important bases for investment and transfer of the PCB manufacturers. In 2005, the PCB output of China broke 11 million m2, half of which was from multilayer board. The PCB product structure of China is developing rapidly toward such high-grade products as high-multilayer products and HDI. The total import & export value of PCB products in China reached USD 6 billion in 2003, USD 8.9 billion in 2004 and rocketed to USD 11.9 billion with a year-on-year growth of 34% in 2005.
Driven by the strong demands from 3G handset, smart phone, digital camera and display screen, global FPC can keep a growth rate of 8%-10% during 2006-2008. As for the FPC for handset, it will develop towards polarization. One will be inclined to multilayer FPC or rigid-flex PCB design, which aims to realize max data volume and upgrade the assembly quality; another is single-/double-layer FPC at a lower cost which is mainly applied to low-grade cell phone. Therefore, it will be helpful for upgrading the market of single-/double-layer FPC if handset manufacturers can effectively enter into market with medium-and-low-end handsets.
FPC industry has seen three development orientations:
Firstly is FPC that uses the material of 2L FCCL. Price is now the obstacle over the large-scale development of 2L FCCL as 2L FCCL is short of supply and manufacturers enjoy a high gross profit. But once the price war starts up, the shipment will be further expanded, so the price will rapidly slip. Some believe 3L FCCL will still take the mainstream though, yet, ResearchInChina thinks the market always develops far beyond what we can be expected.
Secondly is rigid-flex PCB. Due to the emergence of slip and twisty cell-phones, rigid-flex PCB has become the favors of Korean manufacturers. But most of domestic FPC enterprises are not experienced in RPC, so they have to challenge the technology in rigid-flex PCB.
Thirdly comes to the high-density FPC. As the 3G era is coming, the traditional-density FPC is far enough to use, so the wiring density for cell phone has to be further enhanced, which is also why most of 3G cell phones are still the straight ones.
This report first analyzes the status quo of PCB industry, and then the development history and market scale of FPC industry across the world and China's mainland & Taiwan. Following are some information about raw materials of FPC like PI and FCCL and related manufacturers. Besides, it also probes into the development trends regarding FPC manufacturers' competition status, latest news, regional distribution, product structure, output & production value, competitive strategies, development orientation and key raw materials supply, etc.
1. Overview of global PCB industry
1.1 Global PCB industry pattern
1.2 Overview of China PCB industry
1.3 Global traditional PCB (RPC) industry pattern
1.4 Global FPC industry pattern
2. Brief introduction of FPC
2.1 Categories and development status
2.2 Recent situation about global FPC industry
2.3 Overview of downstream markets of global FPC industry
2.4 Brief introduction to rigid-flex PCB
2.5 Application fields and market research of rigid-flex PCB
2.6 High-density FPC and its application fields
2.7 Development trend and technical requirements of high-density FPC
3. Research on the upstream industries of FPC
3.1 FCCL industry
3.1.1 FCCL structure
3.1.2 2L FCCL vs. 3L FCCL
3.2 FCCL manufacturers
3.2.1 Arisawa
3.2.2 Taiflex Scientific co., Ltd.
3.2.3 Thinflex Corp.
3.2.4 Guangzhou Grace Electron Corp.
3.2.5 Asian Electronic Material Co., Ltd.
3.2.6 Kunshan Aplus Tec. Corparation
3.2.7 Jiujiang Flex Co., Ltd.
3.2.8 Zhongshan Yongyi Electronic Material Co., Ltd
3.2.9 Haiso Electronic Chemical Co., Ltd
3.2.10 Shenzhen Danbang Flexibel PCB Co., Ltd
3.2.11 Du Pont Wirex Ltd
3.2.12 Rogers Changchun Technology Co., Ltd
3.2.13 Microcosm Technology Co., Ltd
4. FPC manufacturers
4.1 Nippon Mektron
4.2 Zhuhai Zixiang Electronic Technology Co., Ltd
4.3 Mektec Corpartion
4.4 Fujikura
4.5 Sony Chemical
4.6 Sony KMG Electronics (Suzhou) Co., Ltd
4.7 Nitto Denko
4.8 Nitto Denko (Suzhou) Co., Ltd
4.9 Sumitomo Denko
4.10 Parlex
4.11 Parlex (Shanghai) Circuit Co., Ltd
4.12 M-Flex
4.13 M-Flex (Shuzhou) Co., Ltd
4.14 AMCT Shengyang
4.15 ICHIA Technologies Inc.
4.16 YaHsin
4.17 Unimicron Technology
4.18 Mutual-Tek Industries Co., Ltd
4.19 Xiamen New Flex Electronics Co., Ltd
4.20 Yangtek Electronics Co., Ltd
4.21 Flexium Interconnect Inc.
4.22 Shenzhen Jiazhihong Electronic Co., Ltd
4.23 Shanghai World Circuit Technology Co., Ltd
4.24 Kinwong Electronic (Shenzhen) Co., Ltd
4.25 Career Technology Co., Ltd
4.26 Pucka Technology (Suzhou) Co., Ltd
4.27 Global Flex
4.28 Vertex Precision Electronics Inc
4.29 Compeq
4.30AKM Electronics Industrial (Panyu) Ltd
4.31 Danbond Technology
4.32 Zhongshan Topsun Electronic Technology Co., Ltd
4.33 Zhuhai Hongguang Electronic Co.,Ltd
4.34 Guangzhou Amphenol Sincere Flex Circuits Co., Ltd
4.35 Zhenzhen Compass Technology Co., Ltd
4.36 Kingtech PCB Limited
4.37 Onpress Printed Circuits Limited
4.38 Wirestar Precise Circuit Technology
4.39 Shenzhen DSN Technology Co., Ltd
4.40 Shenzhen TOPCON
4.41 Shenzhen NineSky FPC-PCN Co., Ltd
4.42 Young Poong
4.43 Interflex
4.44 SI Flex
Tables/Figures
Production value, product structure and forecast of PCB manufacturers in Mainland China, 2000-2010
Statistics on PCB manufacturers' investors by region in China
Income distribution of traditional PCB industry worldwide
Monthly global shipment growth rate of FPC and traditional PCB, Jan 2003-Aug 2006
Monthly Book/Bill ratio of FPC industry, Jan 2004-Aug 2006
Statistical and forecasted production value of global FPC industry, 2002-2006
Regional production value ratio of global FPC industry, 2002-2007
Statistics and forecast of applications of downstream industries of FPC, 2004-2008
Market scale statistics of rigid-flex PCB, 2003-2007
Shipment of 3 kinds of 2L FCCL by process worldwide
Sales revenue of Arisawa in fiscal years
Operating revenue of Taiflex, Jan-Oct 2006
Thinflex-H 2L FCCL product structure of Thinflex
Thinflex-X 2L FCCL product structure of Thinflex
Thinflex-A 2L FCCL product structure of Thinflex
Thinflex-T FCCL product structure of Thinflex
Thinflex-J FCCL product structure of Thinflex
ThinFlex-I Coverlay product structure of Thinflex
Thinflex-F adhesive product structure of Thinflex
Thinflex-N bond ply product structure of Thinflex
Production capacity plan on FCCL products of Thinflex
Performance of Thinflex, 2002-2006
Operating revenue of Microcosm, 2005-2006Q3
Operating revenue and gross margin of Fujikura, 2002-2006
Sales revenue of four segments of Fujikura, 2002-2006
Statistics and forecast of Sales value and gross profit of electronic and automobile departments of Fujikura, 2003-2007
Capital value of Fujikura, 2001-2006
Spending on R & D of Fujikura, 2001-2006
Proportion of PCB of Fujikura in the total Operating revenue
Sales value of Sumitomo Denko
Operating revenue of Sumitomo Denko by product, 2006H1
Operating revenue of electronic products including FPC of Sumitomo Denko
Employee proportion of Sumitomo Denko by department
Financial results of Parlex
Quarterly sales value of Multi-Fineline Electronix, 2002-2006
Quarterly sales value and profit of Multi-Fineline Electronix, 2002-2006
Operating revenue and growth rate of ICHIA, Jan-Nov 2006
Sales results of YaHsin, 2000-2006
Sales revenue distribution of YaHsin, Jan-Oct 2006
Regional distribution of sales revenue of YaHsin, 2005
World ranking change of Unimicron
Layer structure of PCB of Unimicron, 2006Q1
Application structure of PCB of Unimicron, 2006Q1
Production capacity and cycle of New Flex
Technology index of product of New Flex
Product proportion of Flexium Interconnect
Regional distribution of sales revenue of Flexium Interconnect
Product classification of Kinwong by layer
Product application of Kinwong
Sales results of Career, 2002-2006Q3
Revenue distribution of Career, Jan-Oct 2006
Product application of Career
Sales Results of Compeq, 2001-2006Q3
Sales revenue change of AKM, 2001-2006
Production capacity of Young Poong
Clients of Young Poong by product
Raw material change of Interflex
Sales revenue of Inferflex, 2002-2005
Regional distribution of global PCB industry, 2005
Application fields of FPC by via-hole density
Statistics of layer and piece of FPC applied to electronic products
Performance contrast between 2L FCCL and 2L FCCL
Technology levels of major FCCL manufactories in Taiwan
Product structure of Arisawa
Product list of Taiflex
Contact information of Taiflex in different regions
Major product application fields of Thinflex
Products statistics of Thinflex, Nippon Steel, Du Pont and Taiflex
Overview of Kunshan Aplus
Overview of Jiujiang Flex
PCCL product list of Microcosm
Overview of Sumitomo Denko
Address of Sumitoma China
Manufacturing process capacity of Parlex (Shanghai) Circuit Co., Ltd
Overview of AMCT Shenyang
Main Clients of ICHIA
Process capability of related RPB products of YaHsin
Process capability of related FPB products of YaHsin
Production capacity of some factories of YaHsin
PCB products of YaHsin
Companies of YaHsin in Mainland China
Process capability of Unimicron in traditional PCB
Process capability of Unimicron in high-density interconnection
Pb-free surface treatment characteristics of Unimicron
Technology capability in BGA/CSP of Unimicron
Material source of Unimicron
Status quo of Unimicron
Sales volume trend of Unimicron
Returns trend of Unimicron
Technology capability of Yangtek
Product history of Yangtek
Products of Flexium in different factories
Raw material structure of FPC products of Flexium
Technology capability of FPC products of Flexium
FPC products tolerance of Flexium
Products researched & developed by Flexium
Production capacity of Flexium
Main clients of Flexium
Production capacity of Shenzhen Jiazhihong
Technical parameter of Shenzhen Jiazhihong
Manufacturing equipments of Shenzhen Jiazhihong
Product applications of Shanghai World Circuit Technology Co., Ltd
Technology capability in RPC of Kinwong Electronic (Shenzhen) Co., Ltd
Technology capability in FPC of Konwong Electronic (Shenzhen) Co., Ltd
Technology capability in FPC of Career
FPC tolerance of Career
FPC trust degree of Career
Production capacity of PCB of Career
Manufactories of Career in mainland China
Clients of Career
Products and applications of Global Flex
Major client of Global Flex
Major clients and products of Vertex Precision Electronics Inc
Production capacity of Compeq in different factories
Major manufacturing equipments and R & D equipments of AKM
FPC equipments of Shenzhen Danbond
Production capacity of Shenzhen Danbond
Product list of Topsun Electronic
Major manufacturing equipments and numbers of Topsun Electronic
Major clients of Topsun Electronic
Major product list of Zhuhai Hongguang
Overview of Kingtech (Shenzhen) PCB Limited
Major manufacturing equipments of Shenzhen Wirestar
FPC product list of Shenzhen DSN Technology
FPC products applications of Shenzhen DSN Technology
Manufacture bases of DSN Technology
Major clients of Shenzhen DSN Technology
Major product list of Shenzhen Topcon
Major manufacturing equipments of Shenzhen Topcon
Manufacturing capability of PCB of Shenzhen Topcon
Major clients of Shenzhen Topcon
Major products list of Shenzhen NineSky
Major manufacturing equipments of Shenzhen NineSky
FPC products of Young Poong
Technology innovation in FPC products of Young Poong
Brief introduction to joint venture of Inferflex in China
Products of Interflex
Products classification of FI Flex
Product technologies of SI Flex
1.1 Global PCB industry pattern
1.2 Overview of China PCB industry
1.3 Global traditional PCB (RPC) industry pattern
1.4 Global FPC industry pattern
2. Brief introduction of FPC
2.1 Categories and development status
2.2 Recent situation about global FPC industry
2.3 Overview of downstream markets of global FPC industry
2.4 Brief introduction to rigid-flex PCB
2.5 Application fields and market research of rigid-flex PCB
2.6 High-density FPC and its application fields
2.7 Development trend and technical requirements of high-density FPC
3. Research on the upstream industries of FPC
3.1 FCCL industry
3.1.1 FCCL structure
3.1.2 2L FCCL vs. 3L FCCL
3.2 FCCL manufacturers
3.2.1 Arisawa
3.2.2 Taiflex Scientific co., Ltd.
3.2.3 Thinflex Corp.
3.2.4 Guangzhou Grace Electron Corp.
3.2.5 Asian Electronic Material Co., Ltd.
3.2.6 Kunshan Aplus Tec. Corparation
3.2.7 Jiujiang Flex Co., Ltd.
3.2.8 Zhongshan Yongyi Electronic Material Co., Ltd
3.2.9 Haiso Electronic Chemical Co., Ltd
3.2.10 Shenzhen Danbang Flexibel PCB Co., Ltd
3.2.11 Du Pont Wirex Ltd
3.2.12 Rogers Changchun Technology Co., Ltd
3.2.13 Microcosm Technology Co., Ltd
4. FPC manufacturers
4.1 Nippon Mektron
4.2 Zhuhai Zixiang Electronic Technology Co., Ltd
4.3 Mektec Corpartion
4.4 Fujikura
4.5 Sony Chemical
4.6 Sony KMG Electronics (Suzhou) Co., Ltd
4.7 Nitto Denko
4.8 Nitto Denko (Suzhou) Co., Ltd
4.9 Sumitomo Denko
4.10 Parlex
4.11 Parlex (Shanghai) Circuit Co., Ltd
4.12 M-Flex
4.13 M-Flex (Shuzhou) Co., Ltd
4.14 AMCT Shengyang
4.15 ICHIA Technologies Inc.
4.16 YaHsin
4.17 Unimicron Technology
4.18 Mutual-Tek Industries Co., Ltd
4.19 Xiamen New Flex Electronics Co., Ltd
4.20 Yangtek Electronics Co., Ltd
4.21 Flexium Interconnect Inc.
4.22 Shenzhen Jiazhihong Electronic Co., Ltd
4.23 Shanghai World Circuit Technology Co., Ltd
4.24 Kinwong Electronic (Shenzhen) Co., Ltd
4.25 Career Technology Co., Ltd
4.26 Pucka Technology (Suzhou) Co., Ltd
4.27 Global Flex
4.28 Vertex Precision Electronics Inc
4.29 Compeq
4.30AKM Electronics Industrial (Panyu) Ltd
4.31 Danbond Technology
4.32 Zhongshan Topsun Electronic Technology Co., Ltd
4.33 Zhuhai Hongguang Electronic Co.,Ltd
4.34 Guangzhou Amphenol Sincere Flex Circuits Co., Ltd
4.35 Zhenzhen Compass Technology Co., Ltd
4.36 Kingtech PCB Limited
4.37 Onpress Printed Circuits Limited
4.38 Wirestar Precise Circuit Technology
4.39 Shenzhen DSN Technology Co., Ltd
4.40 Shenzhen TOPCON
4.41 Shenzhen NineSky FPC-PCN Co., Ltd
4.42 Young Poong
4.43 Interflex
4.44 SI Flex
Tables/Figures
Production value, product structure and forecast of PCB manufacturers in Mainland China, 2000-2010
Statistics on PCB manufacturers' investors by region in China
Income distribution of traditional PCB industry worldwide
Monthly global shipment growth rate of FPC and traditional PCB, Jan 2003-Aug 2006
Monthly Book/Bill ratio of FPC industry, Jan 2004-Aug 2006
Statistical and forecasted production value of global FPC industry, 2002-2006
Regional production value ratio of global FPC industry, 2002-2007
Statistics and forecast of applications of downstream industries of FPC, 2004-2008
Market scale statistics of rigid-flex PCB, 2003-2007
Shipment of 3 kinds of 2L FCCL by process worldwide
Sales revenue of Arisawa in fiscal years
Operating revenue of Taiflex, Jan-Oct 2006
Thinflex-H 2L FCCL product structure of Thinflex
Thinflex-X 2L FCCL product structure of Thinflex
Thinflex-A 2L FCCL product structure of Thinflex
Thinflex-T FCCL product structure of Thinflex
Thinflex-J FCCL product structure of Thinflex
ThinFlex-I Coverlay product structure of Thinflex
Thinflex-F adhesive product structure of Thinflex
Thinflex-N bond ply product structure of Thinflex
Production capacity plan on FCCL products of Thinflex
Performance of Thinflex, 2002-2006
Operating revenue of Microcosm, 2005-2006Q3
Operating revenue and gross margin of Fujikura, 2002-2006
Sales revenue of four segments of Fujikura, 2002-2006
Statistics and forecast of Sales value and gross profit of electronic and automobile departments of Fujikura, 2003-2007
Capital value of Fujikura, 2001-2006
Spending on R & D of Fujikura, 2001-2006
Proportion of PCB of Fujikura in the total Operating revenue
Sales value of Sumitomo Denko
Operating revenue of Sumitomo Denko by product, 2006H1
Operating revenue of electronic products including FPC of Sumitomo Denko
Employee proportion of Sumitomo Denko by department
Financial results of Parlex
Quarterly sales value of Multi-Fineline Electronix, 2002-2006
Quarterly sales value and profit of Multi-Fineline Electronix, 2002-2006
Operating revenue and growth rate of ICHIA, Jan-Nov 2006
Sales results of YaHsin, 2000-2006
Sales revenue distribution of YaHsin, Jan-Oct 2006
Regional distribution of sales revenue of YaHsin, 2005
World ranking change of Unimicron
Layer structure of PCB of Unimicron, 2006Q1
Application structure of PCB of Unimicron, 2006Q1
Production capacity and cycle of New Flex
Technology index of product of New Flex
Product proportion of Flexium Interconnect
Regional distribution of sales revenue of Flexium Interconnect
Product classification of Kinwong by layer
Product application of Kinwong
Sales results of Career, 2002-2006Q3
Revenue distribution of Career, Jan-Oct 2006
Product application of Career
Sales Results of Compeq, 2001-2006Q3
Sales revenue change of AKM, 2001-2006
Production capacity of Young Poong
Clients of Young Poong by product
Raw material change of Interflex
Sales revenue of Inferflex, 2002-2005
Regional distribution of global PCB industry, 2005
Application fields of FPC by via-hole density
Statistics of layer and piece of FPC applied to electronic products
Performance contrast between 2L FCCL and 2L FCCL
Technology levels of major FCCL manufactories in Taiwan
Product structure of Arisawa
Product list of Taiflex
Contact information of Taiflex in different regions
Major product application fields of Thinflex
Products statistics of Thinflex, Nippon Steel, Du Pont and Taiflex
Overview of Kunshan Aplus
Overview of Jiujiang Flex
PCCL product list of Microcosm
Overview of Sumitomo Denko
Address of Sumitoma China
Manufacturing process capacity of Parlex (Shanghai) Circuit Co., Ltd
Overview of AMCT Shenyang
Main Clients of ICHIA
Process capability of related RPB products of YaHsin
Process capability of related FPB products of YaHsin
Production capacity of some factories of YaHsin
PCB products of YaHsin
Companies of YaHsin in Mainland China
Process capability of Unimicron in traditional PCB
Process capability of Unimicron in high-density interconnection
Pb-free surface treatment characteristics of Unimicron
Technology capability in BGA/CSP of Unimicron
Material source of Unimicron
Status quo of Unimicron
Sales volume trend of Unimicron
Returns trend of Unimicron
Technology capability of Yangtek
Product history of Yangtek
Products of Flexium in different factories
Raw material structure of FPC products of Flexium
Technology capability of FPC products of Flexium
FPC products tolerance of Flexium
Products researched & developed by Flexium
Production capacity of Flexium
Main clients of Flexium
Production capacity of Shenzhen Jiazhihong
Technical parameter of Shenzhen Jiazhihong
Manufacturing equipments of Shenzhen Jiazhihong
Product applications of Shanghai World Circuit Technology Co., Ltd
Technology capability in RPC of Kinwong Electronic (Shenzhen) Co., Ltd
Technology capability in FPC of Konwong Electronic (Shenzhen) Co., Ltd
Technology capability in FPC of Career
FPC tolerance of Career
FPC trust degree of Career
Production capacity of PCB of Career
Manufactories of Career in mainland China
Clients of Career
Products and applications of Global Flex
Major client of Global Flex
Major clients and products of Vertex Precision Electronics Inc
Production capacity of Compeq in different factories
Major manufacturing equipments and R & D equipments of AKM
FPC equipments of Shenzhen Danbond
Production capacity of Shenzhen Danbond
Product list of Topsun Electronic
Major manufacturing equipments and numbers of Topsun Electronic
Major clients of Topsun Electronic
Major product list of Zhuhai Hongguang
Overview of Kingtech (Shenzhen) PCB Limited
Major manufacturing equipments of Shenzhen Wirestar
FPC product list of Shenzhen DSN Technology
FPC products applications of Shenzhen DSN Technology
Manufacture bases of DSN Technology
Major clients of Shenzhen DSN Technology
Major product list of Shenzhen Topcon
Major manufacturing equipments of Shenzhen Topcon
Manufacturing capability of PCB of Shenzhen Topcon
Major clients of Shenzhen Topcon
Major products list of Shenzhen NineSky
Major manufacturing equipments of Shenzhen NineSky
FPC products of Young Poong
Technology innovation in FPC products of Young Poong
Brief introduction to joint venture of Inferflex in China
Products of Interflex
Products classification of FI Flex
Product technologies of SI Flex
