Development of JCET and Its Deployment Strategies (pre-order)
Since its acquisition of Singaporean STATS ChipPac in 2015, Chinese JCET (Jiangsu Changjiang Electronics Technology) has become the world’s third largest OSAT (Outsourced Semiconductor Assembly and Test) service provider. Over the years, JCET has continued to conduct M&A and joint venture projects with the government’s support to rapidly expand its technology competencies and business as the Chinese government has put in place a series of polices and provided funds to achieve semiconductor self-sufficiency. This report looks into JCET’s current status and strategies, sheds lights on major opportunities and challenges facing the company, and explores the future development of the industry.
List of Topics
ADI
AMD
Amkor
ASE
Chipbond Technology
ChipMOS Technology
Google
HiSilicon
Innosilicon
JECT
King Yuan Electronics
MediaTek
Nantong Fujitsu Microelectronics
NCAP China
Powertech Technology
Qualcomm
Samsung
Shennan Circuit Company
SMIC
SMICS
STATS ChipPAC
Tianshui Huatian
UTA
List of Topics
- Development of JCET, touching on its revenue performance, research and development, and joint ventures with STATS ChipPAC, ADI, and SMIC.
- JCET’s global deployment strategies and includes its regional factories in China, Singapore, and Korea
- Opportunities and challenges facing the company
ADI
AMD
Amkor
ASE
Chipbond Technology
ChipMOS Technology
HiSilicon
Innosilicon
JECT
King Yuan Electronics
MediaTek
Nantong Fujitsu Microelectronics
NCAP China
Powertech Technology
Qualcomm
Samsung
Shennan Circuit Company
SMIC
SMICS
STATS ChipPAC
Tianshui Huatian
UTA
1.COMPANY HISTORY
1.1 Origin
1.2 Revenue
1.3 Research and Development
2. JOINT VENTURE AND M&A
2.1 Enhancing OSAT Capabilities via Horizontal Acquisition
2.1.1 STATS ChipPAC
2.1.2 ADI’s Singaporean Facility
2.2 One-stop Service Provision via Vertical Cooperation
2.2.1 SMICS
3.GLOBAL DEPLOYMENT
3.1 Distribution of Factories Worldwide
3.2 Development of JCET’s Regional Factories
3.2.1 China
3.2.2 Singapore
3.2.3 Korea
4. OPPORTUNITIES AND CHALLENGES
4.1 Opportunities
4.1.1 Domestic Market
4.1.2 Government Funding and Policy
4.2 Challenges
4.2.1 Overexpansion Results in Financial Problems
4.2.2 Low Technology Competencies and Product Quality
4.2.3 US Toughens Ban on Huawei
5. CONCLUSION
Appendix
List of Companies
1.1 Origin
1.2 Revenue
1.3 Research and Development
2. JOINT VENTURE AND M&A
2.1 Enhancing OSAT Capabilities via Horizontal Acquisition
2.1.1 STATS ChipPAC
2.1.2 ADI’s Singaporean Facility
2.2 One-stop Service Provision via Vertical Cooperation
2.2.1 SMICS
3.GLOBAL DEPLOYMENT
3.1 Distribution of Factories Worldwide
3.2 Development of JCET’s Regional Factories
3.2.1 China
3.2.2 Singapore
3.2.3 Korea
4. OPPORTUNITIES AND CHALLENGES
4.1 Opportunities
4.1.1 Domestic Market
4.1.2 Government Funding and Policy
4.2 Challenges
4.2.1 Overexpansion Results in Financial Problems
4.2.2 Low Technology Competencies and Product Quality
4.2.3 US Toughens Ban on Huawei
5. CONCLUSION
Appendix
List of Companies
LIST OF TABLES
Table 1 Services Provided by JCET’s Regional Factories
Table 1 Services Provided by JCET’s Regional Factories
LIST OF FIGURES
Figure 1 JCET’s Shareholder Structure
Figure 2 JCET’s Revenue between 2010 and 2019
Figure 3 Top 10 OSAT Service Providers Worldwide by Revenue and Ranking in 2019
Figure 4 JCET’s R&D Spending between 2010 and 2019
Figure 5 Distribution of JCET’s Factories Worldwide
Figure 1 JCET’s Shareholder Structure
Figure 2 JCET’s Revenue between 2010 and 2019
Figure 3 Top 10 OSAT Service Providers Worldwide by Revenue and Ranking in 2019
Figure 4 JCET’s R&D Spending between 2010 and 2019
Figure 5 Distribution of JCET’s Factories Worldwide
