Printed Electronics Version 3.0: A Market Forecast
The report quantifies these opportunities in terms of revenues generated by PE V3.0 at three levels of the value chain. In addition, to an eight-year forecast of PE-enabled products, the report also contains projections of PE components and specialist inks. The components covered are thin-film transistors, memories, batteries, sensors, displays and lighting. The organizations discussed include: Agilent, Bank of America, Bemis, DuPont Teijin, eBay, E Ink, Enfucell, Esquire Magazine, Fujifilm Dimatix, GE, Gemalto, HelioVolt, Holst Centre, ISET, Jenn Feng, Kovio, MasterCard, Merck, Mitsubishi, Panasonic, Nanosolar, Oxford Photovoltaics, PARC, Pioneer, PolyIC, PragmaticIC, Pragmatic Printing, Plastic Logic, Printed Electronics Limited, Qolpac, Samsung, Seiko Epson, SolarPrint, Sumitomo, Thin Film Electronics, Tokyo Electron, and UDC.
CHAPTER ONE: PRINTED ELECTRONICS V3.0: A SUMMARY OF OPPORTUNITIES
1.1 Printing as Strategy and Printing as Tactics: An Approach to Market Segmentation
1.2 Objectives and Coverage of this Report
1.3 Printed Electronics: The First Two Phases and their Consequences
1.3.1 Printed Electronics Phase I: Printed Electronics is Thick-Film Electronics
1.3.2 Printed Electronics Phase II: Printed Electronics as a New Industry
1.4 Printed Electronics V3.0: The New PE
1.5 Short-to-Medium Term Applications for Printed Electronics
1.5.1 Smart Packaging: Pharma, Food and Brand Enhancement
1.5.2 PE and Security Printing
1.5.3 Smart Cards: Adding Printed Batteries and Displays for Enhanced Security
1.5.4 Medical Devices: Patches, Bandages and Diagnostics
1.5.5 PE and Biochips
1.5.6 Interactive Media and Disposable Electronics
1.6 Longer-Term Opportunities for PE V3.0
1.6.1 Displays for Mobile Devices and Televisions
1.6.2 Printed Lighting
1.6.3 Printed Solar Panels
1.7 Supply Chain and Ecosystem Opportunities
1.8 Opportunities for the Printing/Printing Equipment Industry: Printing Electronics Isn't As Easy as it Looks!
1.9 Eight-Year Forecasts of Products Enabled by PE V3.0
CHAPTER TWO: TECHNOLOGY ENABLERS AND COMPONENTS FOR THE "NEW" PRINTED ELECTRONICS
2.1 Printed Electronic Components: Mostly Still Evolving
2.1.1 Processors and Memories: Organic or Silicon
2.1.2 Printed Displays: Technology Options
2.1.3 Printed Lighting: Current Projects
2.1.4 Printed Sensors
2.1.5 RFID and Lesser Tagging
2.1.6 Printed Batteries
2.1.7 Evolution of Printed Photovoltaics Technology
2.2 Printed Electronics in Packaging: Why Packaging Must Become Smart
2.2.1 The Limitations of Smart Packaging as a Target Market for PE
2.2.2 Food and Personal Care Smart Packaging Applications
2.2.3 Pharmaceutical and Healthcare-Related Smart Packaging: Compliance Packaging
2.2.4 Brand Security
2.2.5 Eight-Year Market Forecast of PE-Enabled Smart Packaging
2.3 A Growing Need for Powered Smart Cards
2.3.1 Smart Card Chips
2.3.2 Printed Batteries and Displays in Powered Smart Cards
2.3.3 Eight-Year Market Forecast of PE-Enabled Smart Cards
2.4 PE Innovations for Medical Devices and Disposables
2.4.1 Medical and Cosmetic Patches
2.4.2 Smart Bandages
2.4.3 CPR Cards
2.4.4 Eight-Year Market Forecast of PE-Enabled Medical Devices
2.5 Interactive Printed Media and Disposable Electronics
2.5.1 Some Skeptical Thoughts on This Sector
2.5.2 Eight-Year Market Forecast of PE-Enabled Disposable Electronics and Interactive Printed Media
2.6 Printed Displays for Mobile Devices and Televisions
2.6.1 Eight-Year Market Forecast of PE-Enabled Mobile and TV Displays
2.7 Printed OLED Lighting
2.8 Printed Solar Cells
2.9 Summary of PE V3.0 Components Forecasts
CHAPTER THREE: OPPORTUNITIES FOR INKS AND OTHER KEY MATERIALS FOR THE NEW PRINTED ELECTRONICS
3.1 Electronic Inks: Current and Future Materials
3.1.1 The Future of PE Inks
3.1.2 Printing Processes That Are Being Used in the PE V3.0 Era
3.2 Conductive Inks and Pastes for PE V3.0
3.2.1 Silver and Nano-Silver Inks
3.2.2 Gold Inks
3.2.3 Copper Inks
3.2.4 Other Metallic Inks and Polymer Electrodes
3.2.5 Transparent Conductor Inks
3.3 Semiconductor Inks for PE V3.0
3.3.1 Organic Semiconductors and Printing
3.3.2 Silicon Inks and Electronics
3.3.3 Other Semiconductor Inks and Materials Sets: Is PE V3.0 CMOS Possible?
3.4 Some Thoughts on Printed Carbon Nanotubes and Graphene in the Future of Printed Electronics
3.5 Substrate and Encapsulants for PE V3.0 Applications
3.5.1 The Future of PE Substrates
3.5.2 Some Notes on Encapsulation for PE V3.0
3.6 Eight-Year Forecasts of PE 3.0 Inks
Acronyms and Abbreviations Used In this Report
About the Author
1.1 Printing as Strategy and Printing as Tactics: An Approach to Market Segmentation
1.2 Objectives and Coverage of this Report
1.3 Printed Electronics: The First Two Phases and their Consequences
1.3.1 Printed Electronics Phase I: Printed Electronics is Thick-Film Electronics
1.3.2 Printed Electronics Phase II: Printed Electronics as a New Industry
1.4 Printed Electronics V3.0: The New PE
1.5 Short-to-Medium Term Applications for Printed Electronics
1.5.1 Smart Packaging: Pharma, Food and Brand Enhancement
1.5.2 PE and Security Printing
1.5.3 Smart Cards: Adding Printed Batteries and Displays for Enhanced Security
1.5.4 Medical Devices: Patches, Bandages and Diagnostics
1.5.5 PE and Biochips
1.5.6 Interactive Media and Disposable Electronics
1.6 Longer-Term Opportunities for PE V3.0
1.6.1 Displays for Mobile Devices and Televisions
1.6.2 Printed Lighting
1.6.3 Printed Solar Panels
1.7 Supply Chain and Ecosystem Opportunities
1.8 Opportunities for the Printing/Printing Equipment Industry: Printing Electronics Isn't As Easy as it Looks!
1.9 Eight-Year Forecasts of Products Enabled by PE V3.0
CHAPTER TWO: TECHNOLOGY ENABLERS AND COMPONENTS FOR THE "NEW" PRINTED ELECTRONICS
2.1 Printed Electronic Components: Mostly Still Evolving
2.1.1 Processors and Memories: Organic or Silicon
2.1.2 Printed Displays: Technology Options
2.1.3 Printed Lighting: Current Projects
2.1.4 Printed Sensors
2.1.5 RFID and Lesser Tagging
2.1.6 Printed Batteries
2.1.7 Evolution of Printed Photovoltaics Technology
2.2 Printed Electronics in Packaging: Why Packaging Must Become Smart
2.2.1 The Limitations of Smart Packaging as a Target Market for PE
2.2.2 Food and Personal Care Smart Packaging Applications
2.2.3 Pharmaceutical and Healthcare-Related Smart Packaging: Compliance Packaging
2.2.4 Brand Security
2.2.5 Eight-Year Market Forecast of PE-Enabled Smart Packaging
2.3 A Growing Need for Powered Smart Cards
2.3.1 Smart Card Chips
2.3.2 Printed Batteries and Displays in Powered Smart Cards
2.3.3 Eight-Year Market Forecast of PE-Enabled Smart Cards
2.4 PE Innovations for Medical Devices and Disposables
2.4.1 Medical and Cosmetic Patches
2.4.2 Smart Bandages
2.4.3 CPR Cards
2.4.4 Eight-Year Market Forecast of PE-Enabled Medical Devices
2.5 Interactive Printed Media and Disposable Electronics
2.5.1 Some Skeptical Thoughts on This Sector
2.5.2 Eight-Year Market Forecast of PE-Enabled Disposable Electronics and Interactive Printed Media
2.6 Printed Displays for Mobile Devices and Televisions
2.6.1 Eight-Year Market Forecast of PE-Enabled Mobile and TV Displays
2.7 Printed OLED Lighting
2.8 Printed Solar Cells
2.9 Summary of PE V3.0 Components Forecasts
CHAPTER THREE: OPPORTUNITIES FOR INKS AND OTHER KEY MATERIALS FOR THE NEW PRINTED ELECTRONICS
3.1 Electronic Inks: Current and Future Materials
3.1.1 The Future of PE Inks
3.1.2 Printing Processes That Are Being Used in the PE V3.0 Era
3.2 Conductive Inks and Pastes for PE V3.0
3.2.1 Silver and Nano-Silver Inks
3.2.2 Gold Inks
3.2.3 Copper Inks
3.2.4 Other Metallic Inks and Polymer Electrodes
3.2.5 Transparent Conductor Inks
3.3 Semiconductor Inks for PE V3.0
3.3.1 Organic Semiconductors and Printing
3.3.2 Silicon Inks and Electronics
3.3.3 Other Semiconductor Inks and Materials Sets: Is PE V3.0 CMOS Possible?
3.4 Some Thoughts on Printed Carbon Nanotubes and Graphene in the Future of Printed Electronics
3.5 Substrate and Encapsulants for PE V3.0 Applications
3.5.1 The Future of PE Substrates
3.5.2 Some Notes on Encapsulation for PE V3.0
3.6 Eight-Year Forecasts of PE 3.0 Inks
Acronyms and Abbreviations Used In this Report
About the Author
LIST OF EXHIBITS
Exhibit 1-1: The Three Phases of Printed Electronics Development
Exhibit 1-2: Market Segmentation
Exhibit 1-3: Summary of Final Market Value of PE 3.0 Enabled Products with a High PE V3.0 Content
Exhibit 2-1: Printed Components Used in Next-Generation Low-Cost Printed Electronics Applications
Exhibit 2-2: OTFT/OFET Device Performance Trends
Exhibit 2-3: Overview of Prospects for Low-Performance Applications for Organic/Printed Logic and Memory
Exhibit 2-4: Survey of Printed Sensor Research Devices
Exhibit 2-5: Advantages of Printing for Fabricating Large-Area Sensors
Exhibit 2-6: Printed CIGS Firms
Exhibit 2-7: Eight-Year Market Forecast of Component-Level Revenues Generated by PE-Enabled Smart Packaging ($ Millions)
Exhibit 2-8: Eight-Year Market Forecast of Component-Level Revenues Generated by PE-Enabled Smart Cards ($ Millions)
Exhibit 2-9: Eight-Year Market Forecast of Component-Level Revenues Generated by PE-Enabled Medical Devices ($ Millions)
Exhibit 2-10: Eight-Year Market Forecast of Component-Level Revenues Generated by Disposable Electronics/Interactive Printed Media ($ Millions)
Exhibit 2-11: Eight-Year Market Forecast of PE Revenues Generated by Mobile Devices and Televisions Display Modules ($ Millions)
Exhibit 2-12: Eight-Year Market Forecast of Printed OLED Lighting Panels ($ Millions)
Exhibit 2-13: Eight-Year Market Forecast of PE Revenues Generated by PV Panels ($ Millions)
Exhibit 2-14: Summary of Market Value of PE V3.0 Components by Application ($ Millions)
Exhibit 2-15: Summary of Market Value of PE V3.0 Components and Materials by Type
Exhibit 3-1: Comparison of Common Printing Processes Used In Printed Electronics
Exhibit 3-2: Major Conductors: Rankings of Main Characteristics
Exhibit 3-3: Summary of Market Value of Selected PE V3.0 Inks by Type ($ Millions)
Exhibit 1-1: The Three Phases of Printed Electronics Development
Exhibit 1-2: Market Segmentation
Exhibit 1-3: Summary of Final Market Value of PE 3.0 Enabled Products with a High PE V3.0 Content
Exhibit 2-1: Printed Components Used in Next-Generation Low-Cost Printed Electronics Applications
Exhibit 2-2: OTFT/OFET Device Performance Trends
Exhibit 2-3: Overview of Prospects for Low-Performance Applications for Organic/Printed Logic and Memory
Exhibit 2-4: Survey of Printed Sensor Research Devices
Exhibit 2-5: Advantages of Printing for Fabricating Large-Area Sensors
Exhibit 2-6: Printed CIGS Firms
Exhibit 2-7: Eight-Year Market Forecast of Component-Level Revenues Generated by PE-Enabled Smart Packaging ($ Millions)
Exhibit 2-8: Eight-Year Market Forecast of Component-Level Revenues Generated by PE-Enabled Smart Cards ($ Millions)
Exhibit 2-9: Eight-Year Market Forecast of Component-Level Revenues Generated by PE-Enabled Medical Devices ($ Millions)
Exhibit 2-10: Eight-Year Market Forecast of Component-Level Revenues Generated by Disposable Electronics/Interactive Printed Media ($ Millions)
Exhibit 2-11: Eight-Year Market Forecast of PE Revenues Generated by Mobile Devices and Televisions Display Modules ($ Millions)
Exhibit 2-12: Eight-Year Market Forecast of Printed OLED Lighting Panels ($ Millions)
Exhibit 2-13: Eight-Year Market Forecast of PE Revenues Generated by PV Panels ($ Millions)
Exhibit 2-14: Summary of Market Value of PE V3.0 Components by Application ($ Millions)
Exhibit 2-15: Summary of Market Value of PE V3.0 Components and Materials by Type
Exhibit 3-1: Comparison of Common Printing Processes Used In Printed Electronics
Exhibit 3-2: Major Conductors: Rankings of Main Characteristics
Exhibit 3-3: Summary of Market Value of Selected PE V3.0 Inks by Type ($ Millions)
