The Global Market for Thermal Interface Materials 2024-2035
The effective transfer/removal of heat from a semiconductor device is crucial to ensure reliable operation and to enhance the lifetime of these components. The development of high-power and high-frequency electronic devices has greatly increased issues with excessive heat accumulation. There is therefore a significant requirement for effective thermal management materials to remove excess heat from electronic devices to ambient environment.
Thermal interface materials (TIMs) play a critical role in managing heat and ensuring optimal performance in a wide range of applications. As electronic devices become more compact and powerful, effective thermal management solutions are essential. Thermal interface materials (TIMs) offer efficient heat dissipation to maintain proper functions and lifetime for these devices. TIMs are materials that are applied between the interfaces of two components (typically a heat generating device such as microprocessors, photonic integrated circuits, etc. and a heat dissipating device e.g. heat sink) to enhance the thermal coupling between these devices. The TIM market is poised for significant growth, driven by the increasing demand for effective thermal management solutions in various end-use industries. As electronic devices continue to evolve, the development of advanced, high-performance TIMs will be critical for ensuring reliability, safety, and user satisfaction.
This market report explores the latest trends, innovations, and growth opportunities in the TIM industry, focusing on key sectors such as consumer electronics, electric vehicles (EVs), data centers, and 5G technology. Report contents include:
Thermal interface materials (TIMs) play a critical role in managing heat and ensuring optimal performance in a wide range of applications. As electronic devices become more compact and powerful, effective thermal management solutions are essential. Thermal interface materials (TIMs) offer efficient heat dissipation to maintain proper functions and lifetime for these devices. TIMs are materials that are applied between the interfaces of two components (typically a heat generating device such as microprocessors, photonic integrated circuits, etc. and a heat dissipating device e.g. heat sink) to enhance the thermal coupling between these devices. The TIM market is poised for significant growth, driven by the increasing demand for effective thermal management solutions in various end-use industries. As electronic devices continue to evolve, the development of advanced, high-performance TIMs will be critical for ensuring reliability, safety, and user satisfaction.
This market report explores the latest trends, innovations, and growth opportunities in the TIM industry, focusing on key sectors such as consumer electronics, electric vehicles (EVs), data centers, and 5G technology. Report contents include:
- Analysis of the various materials and technologies used in TIMs, including:
- Advanced and multi-functional TIMs
- TIM fillers (alumina, boron nitride, etc.)
- Thermal greases, pastes, and gap fillers
- Phase change materials (organic, inorganic, eutectic mixtures)
- Metal-based TIMs (solders, liquid metals, sintered materials)
- Carbon-based TIMs (CNTs, graphene, nanodiamond)
- Metamaterials and self-healing TIMs
- Market trends and drivers.
- Market map.
- Analysis of thermal interface materials (TIMs) including:
- Thermal Pads/Insulators.
- Thermally Conductive Adhesives.
- Thermal Compounds or Greases.
- Thermally Conductive Epoxy/Adhesives.
- Phase Change Materials.
- Metal-based TIMs.
- Carbon-based TIMs.
- Market analysis. Markets covered include:
- Consumer Electronics: Smartphones, tablets, wearables
- Electric Vehicles: Batteries, power electronics, charging stations
- Data Centers: Servers, routers, switches, power supplies
- ADAS Sensors: Cameras, radar, LiDAR, ECUs
- 5G: EMI shielding, antennas, base band units, power supplies
- Global market revenues for thermal interface materials (TIMs), segmented by type and market, historical and forecast to 2035.
- Profiles of 104 producers in the TIM industry. Companies profiled include 3M, Arieca, BNNT, Carbice Corporation, CondAlign, Fujipoly, Henkel, Indium Corporation, KULR Technology Group, Inc., Parker-Hannifin Corporation, Shin-Etsu Chemical Co., Ltd, and SHT Smart High-Tech AB.
1 INTRODUCTION
1.1 Thermal management-active and passive
1.2 What are thermal interface materials (TIMs)?
1.2.1 Types
1.2.2 Thermal conductivity
1.3 Comparative properties of TIMs
1.4 Differences between thermal pads and grease
1.5 Advantages and disadvantages of TIMs, by type
1.6 Performance
1.7 Prices
2 MATERIALS
2.1 Advanced and Multi-Functional TIMs
2.2 TIM fillers
2.2.1 Trends
2.2.2 Pros and Cons
2.2.3 Thermal Conductivity
2.2.4 Spherical Alumina
2.2.5 Alumina Fillers
2.2.6 Boron nitride (BN)
2.2.7 Filler and polymer TIMs
2.2.8 Filler Sizes
2.3 Thermal greases and pastes
2.3.1 Overview and properties
2.3.2 SWOT analysis
2.4 Thermal gap pads
2.4.1 Overview and properties
2.4.2 SWOT analysis
2.5 Thermal gap fillers
2.5.1 Overview and properties
2.5.2 SWOT analysis
2.6 Potting compounds/encapsulants
2.6.1 Overview and properties
2.6.2 SWOT analysis
2.7 Adhesive Tapes
2.7.1 Overview and properties
2.7.2 SWOT analysis
2.8 Phase Change Materials
2.8.1 Overview and properties
2.8.2 Types
2.8.2.1 Organic/biobased phase change materials
2.8.2.1.1 Advantages and disadvantages
2.8.2.1.2 Paraffin wax
2.8.2.1.3 Non-Paraffins/Bio-based
2.8.2.2 Inorganic phase change materials
2.8.2.2.1 Salt hydrates
2.8.2.2.1.1 Advantages and disadvantages
2.8.2.2.2 Metal and metal alloy PCMs (High-temperature)
2.8.2.3 Eutectic mixtures
2.8.2.4 Encapsulation of PCMs
2.8.2.4.1 Macroencapsulation
2.8.2.4.2 Micro/nanoencapsulation
2.8.2.5 Nanomaterial phase change materials
2.8.3 Thermal energy storage (TES)
2.8.3.1 Sensible heat storage
2.8.3.2 Latent heat storage
2.8.4 Application in TIMs
2.8.4.1 Thermal pads
2.8.4.2 Low Melting Alloys (LMAs)
2.8.5 SWOT analysis
2.9 Metal-based TIMs
2.9.1 Overview
2.9.2 Solders and low melting temperature alloy TIMs
2.9.2.1 Solder TIM1
2.9.2.2 Sintering
2.9.3 Liquid metals
2.9.4 Solid liquid hybrid (SLH) metals
2.9.4.1 Hybrid liquid metal pastes
2.9.4.2 SLH created during chip assembly (m2TIMs)
2.9.4.3 Die-attach materials
2.9.4.3.1 Solder Alloys and Conductive Adhesives
2.9.4.3.2 Silver-Sintered Paste
2.9.4.3.3 Copper (Cu) sintered TIMs
2.9.4.3.4 Sintered Copper Die-Bonding Paste
2.9.5 SWOT analysis
2.10 Carbon-based TIMs
2.10.1 Carbon nanotube (CNT) TIM Fabrication
2.10.2 Multi-walled nanotubes (MWCNT)
2.10.2.1 Properties
2.10.2.2 Application as thermal interface materials
2.10.3 Single-walled carbon nanotubes (SWCNTs)
2.10.3.1 Properties
2.10.3.2 Application as thermal interface materials
2.10.4 Vertically aligned CNTs (VACNTs)
2.10.4.1 Properties
2.10.4.2 Applications
2.10.4.3 Application as thermal interface materials
2.10.5 BN nanotubes (BNNT) and nanosheets (BNNS)
2.10.5.1 Properties
2.10.5.2 Application as thermal interface materials
2.10.6 Graphene
2.10.6.1 Properties
2.10.6.2 Application as thermal interface materials
2.10.6.2.1 Graphene fillers
2.10.6.2.2 Graphene foam
2.10.6.2.3 Graphene aerogel
2.10.6.2.4 Graphene Heat Spreaders
2.10.6.2.5 Graphene in Thermal Interface Pads
2.10.7 Nanodiamonds
2.10.7.1 Properties
2.10.7.2 Application as thermal interface materials
2.10.8 Graphite
2.10.8.1 Properties
2.10.8.2 Natural graphite
2.10.8.2.1 Classification
2.10.8.2.2 Processing
2.10.8.2.3 Flake
2.10.8.2.3.1 Grades
2.10.8.2.3.2 Applications
2.10.8.3 Synthetic graphite
2.10.8.3.1 Classification
2.10.8.3.1.1 Primary synthetic graphite
2.10.8.3.1.2 Secondary synthetic graphite
2.10.8.3.1.3 Processing
2.10.8.4 Applications as thermal interface materials
2.10.8.4.1 Graphite Sheets
2.10.8.4.2 Vertical graphite
2.10.8.4.3 Graphite pastes
2.10.9 Hexagonal Boron Nitride
2.10.9.1 Properties
2.10.9.2 Application as thermal interface materials
2.10.10 SWOT analysis
2.11 Metamaterials
2.11.1 Types and properties
2.11.1.1 Electromagnetic metamaterials
2.11.1.1.1 Double negative (DNG) metamaterials
2.11.1.1.2 Single negative metamaterials
2.11.1.1.3 Electromagnetic bandgap metamaterials (EBG)
2.11.1.1.4 Bi-isotropic and bianisotropic metamaterials
2.11.1.1.5 Chiral metamaterials
2.11.1.1.6 Electromagnetic “Invisibility” cloak
2.11.1.2 Terahertz metamaterials
2.11.1.3 Photonic metamaterials
2.11.1.4 Tunable metamaterials
2.11.1.5 Frequency selective surface (FSS) based metamaterials
2.11.1.6 Nonlinear metamaterials
2.11.1.7 Acoustic metamaterials
2.11.2 Application as thermal interface materials
2.12 Self-healing thermal interface materials
2.12.1 Extrinsic self-healing
2.12.2 Capsule-based
2.12.3 Vascular self-healing
2.12.4 Intrinsic self-healing
2.12.5 Healing volume
2.12.6 Types of self-healing materials, polymers and coatings
2.12.7 Applications in thermal interface materials
2.13 TIM Dispensing
2.13.1 Low-volume Dispensing Methods
2.13.2 High-volume Dispensing Methods
2.13.3 Meter, Mix, Dispense (MMD) Systems
2.13.4 TIM Dispensing Equipment Suppliers
3 MARKETS FOR THERMAL INTERFACE MATERIALS (TIMS)
3.1 Consumer electronics
3.1.1 Market overview
3.1.1.1 Market drivers
3.1.1.2 Applications
3.1.1.2.1 Smartphones and tablets
3.1.1.2.2 Wearable electronics
3.1.2 Global market 2022-2035, by TIM type
3.2 Electric Vehicles (EV)
3.2.1 Market overview
3.2.1.1 Market drivers
3.2.1.2 Applications
3.2.1.2.1 Lithium-ion batteries
3.2.1.2.1.1 Cell-to-pack designs
3.2.1.2.1.2 Cell-to-chassis/body
3.2.1.2.2 Power electronics
3.2.1.2.2.1 Types
3.2.1.2.2.2 Properties for EV power electronics
3.2.1.2.2.3 TIM2 in SiC MOSFET
3.2.1.2.3 Charging stations
3.2.2 Global market 2022-2035, by TIM type
3.3 Data Centers
3.3.1 Market overview
3.3.1.1 Market drivers
3.3.1.2 Applications
3.3.1.2.1 Router, switches and line cards
3.3.1.2.1.1 Transceivers
3.3.1.2.1.2 Server Boards
3.3.1.2.1.3 Switches and Routers
3.3.1.2.2 Servers
3.3.1.2.3 Power supply converters
3.3.2 Global market 2022-2035, by TIM type
3.4 ADAS Sensors
3.4.1 Market overview
3.4.1.1 Market drivers
3.4.1.2 Applications
3.4.1.2.1 ADAS Cameras
3.4.1.2.1.1 Commercial examples
3.4.1.2.2 ADAS Radar
3.4.1.2.2.1 Radar technology
3.4.1.2.2.2 Radar boards
3.4.1.2.2.3 Commercial examples
3.4.1.2.3 ADAS LiDAR
3.4.1.2.3.1 Role of TIMs
3.4.1.2.3.2 Commercial examples
3.4.1.2.4 Electronic control units (ECUs) and computers
3.4.1.2.4.1 Commercial examples
3.4.1.2.5 Die attach materials
3.4.1.2.6 Commercial examples
3.4.2 Global market 2022-2035, by TIM type
3.5 EMI shielding
3.5.1 Market overview
3.5.1.1 Market drivers
3.5.1.2 Applications
3.5.1.2.1 Dielectric Constant
3.5.1.2.2 ADAS
3.5.1.2.2.1 Radar
3.5.1.2.2.2 5G
3.5.1.2.3 Commercial examples
3.6 5G
3.6.1 Market overview
3.6.1.1 Market drivers
3.6.1.2 Applications
3.6.1.2.1 EMI shielding and EMI gaskets
3.6.1.2.2 Antenna
3.6.1.2.3 Base Band Unit (BBU)
3.6.1.2.4 Liquid TIMs
3.6.1.2.5 Power supplies
3.6.1.2.5.1 Increased power consumption in 5G
3.6.2 Market players
3.6.3 Global market 2022-2035, by TIM type
4 COMPANY PROFILES 198 (104 COMPANY PROFILES)
5 RESEARCH METHODOLOGY
6 REFERENCES
List of Tables
Table 1. Thermal conductivities (?) of common metallic, carbon, and ceramic fillers employed in TIMs.
Table 2. Commercial TIMs and their properties.
Table 3. Advantages and disadvantages of TIMs, by type.
Table 4. Key Factors in System Level Performance for TIMs.
Table 5. Thermal interface materials prices.
Table 6. Comparisons of Price and Thermal Conductivity for TIMs.
Table 7. Price Comparison of TIM Fillers.
Table 8. Characteristics of some typical TIMs.
Table 9. Trends on TIM Fillers.
Table 10. Pros and Cons of TIM Fillers.
Table 11. Types of Potting Compounds/Encapsulants.
Table 12. TIM adhesives tapes.
Table 13. Properties of PCMs.
Table 14. PCM Types and properties.
Table 15. Advantages and disadvantages of organic PCMs.
Table 16. Advantages and disadvantages of organic PCM Fatty Acids.
Table 17. Advantages and disadvantages of salt hydrates
Table 18. Advantages and disadvantages of low melting point metals.
Table 19. Advantages and disadvantages of eutectics.
Table 20. Benefits and drawbacks of PCMs in TIMs.
Table 21. Comparison of Carbon-based TIMs.
Table 22. Properties of CNTs and comparable materials.
Table 23. Typical properties of SWCNT and MWCNT.
Table 24. Comparison of carbon-based additives in terms of the main parameters influencing their value proposition as a conductive additive.
Table 25. Thermal conductivity of CNT-based polymer composites.
Table 26. Comparative properties of BNNTs and CNTs.
Table 27. Properties of graphene, properties of competing materials, applications thereof.
Table 28. Properties of nanodiamonds.
Table 29. Comparison between Natural and Synthetic Graphite.
Table 30. Classification of natural graphite with its characteristics.
Table 31. Characteristics of synthetic graphite.
Table 32. Thermal Conductivity Comparison of Graphite TIMs.
Table 33. Properties of hexagonal boron nitride (h-BN).
Table 34. Comparison of self-healing systems.
Table 35. Types of self-healing coatings and materials.
Table 36. Comparative properties of self-healing materials.
Table 37. Challenges for Dispensing TIM.
Table 38. Thermal Management Application Areas in Consumer Electronics.
Table 39. Trends in Smartphone Thermal Materials.
Table 40. Thermal Management approaches in commercial Smartphones.
Table 41. Global market in consumer electronics 2022-2035, by TIM type (millions USD).
Table 42. Global market in electric vehicles 2022-2035, by TIM type (millions USD).
Table 43. TIM Trends in Data Centers.
Table 44. TIM Area Forecast in Server Boards: 2022-2035 (m2).
Table 45. Global market in data centers 2022-2035, by TIM type (millions USD).
Table 46. TIM Players in ADAS.
Table 47. Die Attach for ADAS Sensors.
Table 48. Die Attach Area Forecast for Key Components Within ADAS Sensors: 2022-2035 (m2).
Table 49. Global market in ADAS sensors 2022-2035, by TIM type (millions USD).
Table 50. TIM Area Forecast for 5G Antennas by Station Size: 2022-2035 (m2).
Table 51. TIM Area Forecast for 5G Antennas by Station Frequency: 2022-2035 (m2).
Table 52. TIMS in BBU.
Table 53. 5G BBY models.
Table 54. TIM Area Forecast for 5G BBU: 2022-2035 (m2).
Table 55. Power Consumption Forecast for 5G: 2022-2035 (GW).
Table 56. TIM Area Forecast for Power Supplies: 2022-2035 (m2).
Table 57. TIM market players in 5G.
Table 58. Global market in 5G 2022-2035, by TIM type (millions USD).
List of Figures
Figure 1. (L-R) Surface of a commercial heatsink surface at progressively higher magnifications, showing tool marks that create a rough surface and a need for a thermal interface material.
Figure 2. Schematic of thermal interface materials used in a flip chip package.
Figure 3. Thermal grease.
Figure 4. Dispensing a bead of silicone-based gap filler onto the heat sink of a power electronics module.
Figure 5. Application of thermal silicone grease.
Figure 6. A range of thermal grease products.
Figure 7. SWOT analysis for thermal greases and pastes.
Figure 8. Thermal Pad.
Figure 9. SWOT analysis for thermal gap pads.
Figure 10. Dispensing a bead of silicone-based gap filler onto the heat sink of a power electronics module.
Figure 11. SWOT analysis for thermal gap fillers.
Figure 12. SWOT analysis for Potting compounds/encapsulants.
Figure 13. Thermal adhesive products.
Figure 14. SWOT analysis for TIM adhesives tapes.
Figure 15. Phase-change TIM products.
Figure 16. PCM mode of operation.
Figure 17. Classification of PCMs.
Figure 18. Phase-change materials in their original states.
Figure 19. Thermal energy storage materials.
Figure 20. Phase Change Material transient behaviour.
Figure 21. PCM TIMs.
Figure 22. Phase Change Material - die cut pads ready for assembly.
Figure 23. SWOT analysis for phase change materials.
Figure 24. Typical IC package construction identifying TIM1 and TIM2
Figure 25. Liquid metal TIM product.
Figure 26. Pre-mixed SLH.
Figure 27. HLM paste and Liquid Metal Before and After Thermal Cycling.
Figure 28. SLH with Solid Solder Preform.
Figure 29. Automated process for SLH with solid solder preforms and liquid metal.
Figure 30. SWOT analysis for metal-based TIMs.
Figure 31. Schematic diagram of a multi-walled carbon nanotube (MWCNT).
Figure 32. Schematic of single-walled carbon nanotube.
Figure 33. Types of single-walled carbon nanotubes.
Figure 34. Schematic of a vertically aligned carbon nanotube (VACNT) membrane used for water treatment.
Figure 35. Schematic of Boron Nitride nanotubes (BNNTs). Alternating B and N atoms are shown in blue and red.
Figure 36. Graphene layer structure schematic.
Figure 37. Illustrative procedure of the Scotch-tape based micromechanical cleavage of HOPG.
Figure 38. Graphene and its descendants: top right: graphene; top left: graphite = stacked graphene; bottom right: nanotube=rolled graphene; bottom left: fullerene=wrapped graphene.
Figure 39. Flake graphite.
Figure 40. Applications of flake graphite.
Figure 41. Graphite-based TIM products.
Figure 42. Structure of hexagonal boron nitride.
Figure 43. SWOT analysis for carbon-based TIMs.
Figure 44. Classification of metamaterials based on functionalities.
Figure 45. Electromagnetic metamaterial.
Figure 46. Schematic of Electromagnetic Band Gap (EBG) structure.
Figure 47. Schematic of chiral metamaterials.
Figure 48. Nonlinear metamaterials- 400-nm thick nonlinear mirror that reflects frequency-doubled output using input light intensity as small as that of a laser pointer.
Figure 49. Schematic of self-healing polymers. Capsule based (a), vascular (b), and intrinsic (c) schemes for self-healing materials. Red and blue colours indicate chemical species which react (purple) to heal damage.
Figure 50. Stages of self-healing mechanism.
Figure 51. Self-healing mechanism in vascular self-healing systems.
Figure 52. Schematic of TIM operation in electronic devices.
Figure 53. Schematic of Thermal Management Materials in smartphone.
Figure 54. Wearable technology inventions.
Figure 55. Global market in consumer electronics 2022-2035, by TIM type (millions USD).
Figure 56. Application of thermal interface materials in automobiles.
Figure 57. EV battery components including TIMs.
Figure 58. Battery pack with a cell-to-pack design and prismatic cells.
Figure 59. Cell-to-chassis battery pack.
Figure 60. TIMS in EV charging station.
Figure 61. Global market in electric vehicles 2022-2035, by TIM type (millions USD).
Figure 62. Image of data center layout.
Figure 63. Application of TIMs in line card.
Figure 64. Global market in data centers 2022-2035, by TIM type (millions USD).
Figure 65. ADAS radar unit incorporating TIMs.
Figure 66. Global market in ADAS sensors 2022-2035, by TIM type (millions USD).
Figure 67. Coolzorb 5G.
Figure 68. TIMs in Base Band Unit (BBU).
Figure 69. Global market in 5G 2022-2035, by TIM type (millions USD).
Figure 70. Boron Nitride Nanotubes products.
Figure 71. Transtherm® PCMs.
Figure 72. Carbice carbon nanotubes.
Figure 73. Internal structure of carbon nanotube adhesive sheet.
Figure 74. Carbon nanotube adhesive sheet.
Figure 75. HI-FLOW Phase Change Materials.
Figure 76. Thermoelectric foil, consists of a sequence of semiconductor elements connected with conductive metal. At the top (in red) is the thermal interface.
Figure 77. Parker Chomerics THERM-A-GAP GEL.
Figure 78. Metamaterial structure used to control thermal emission.
Figure 79. Shinko Carbon Nanotube TIM product.
Figure 80. The Sixth Element graphene products.
Figure 81. Thermal conductive graphene film.
Figure 82. VB Series of TIMS from Zeon.
1.1 Thermal management-active and passive
1.2 What are thermal interface materials (TIMs)?
1.2.1 Types
1.2.2 Thermal conductivity
1.3 Comparative properties of TIMs
1.4 Differences between thermal pads and grease
1.5 Advantages and disadvantages of TIMs, by type
1.6 Performance
1.7 Prices
2 MATERIALS
2.1 Advanced and Multi-Functional TIMs
2.2 TIM fillers
2.2.1 Trends
2.2.2 Pros and Cons
2.2.3 Thermal Conductivity
2.2.4 Spherical Alumina
2.2.5 Alumina Fillers
2.2.6 Boron nitride (BN)
2.2.7 Filler and polymer TIMs
2.2.8 Filler Sizes
2.3 Thermal greases and pastes
2.3.1 Overview and properties
2.3.2 SWOT analysis
2.4 Thermal gap pads
2.4.1 Overview and properties
2.4.2 SWOT analysis
2.5 Thermal gap fillers
2.5.1 Overview and properties
2.5.2 SWOT analysis
2.6 Potting compounds/encapsulants
2.6.1 Overview and properties
2.6.2 SWOT analysis
2.7 Adhesive Tapes
2.7.1 Overview and properties
2.7.2 SWOT analysis
2.8 Phase Change Materials
2.8.1 Overview and properties
2.8.2 Types
2.8.2.1 Organic/biobased phase change materials
2.8.2.1.1 Advantages and disadvantages
2.8.2.1.2 Paraffin wax
2.8.2.1.3 Non-Paraffins/Bio-based
2.8.2.2 Inorganic phase change materials
2.8.2.2.1 Salt hydrates
2.8.2.2.1.1 Advantages and disadvantages
2.8.2.2.2 Metal and metal alloy PCMs (High-temperature)
2.8.2.3 Eutectic mixtures
2.8.2.4 Encapsulation of PCMs
2.8.2.4.1 Macroencapsulation
2.8.2.4.2 Micro/nanoencapsulation
2.8.2.5 Nanomaterial phase change materials
2.8.3 Thermal energy storage (TES)
2.8.3.1 Sensible heat storage
2.8.3.2 Latent heat storage
2.8.4 Application in TIMs
2.8.4.1 Thermal pads
2.8.4.2 Low Melting Alloys (LMAs)
2.8.5 SWOT analysis
2.9 Metal-based TIMs
2.9.1 Overview
2.9.2 Solders and low melting temperature alloy TIMs
2.9.2.1 Solder TIM1
2.9.2.2 Sintering
2.9.3 Liquid metals
2.9.4 Solid liquid hybrid (SLH) metals
2.9.4.1 Hybrid liquid metal pastes
2.9.4.2 SLH created during chip assembly (m2TIMs)
2.9.4.3 Die-attach materials
2.9.4.3.1 Solder Alloys and Conductive Adhesives
2.9.4.3.2 Silver-Sintered Paste
2.9.4.3.3 Copper (Cu) sintered TIMs
2.9.4.3.4 Sintered Copper Die-Bonding Paste
2.9.5 SWOT analysis
2.10 Carbon-based TIMs
2.10.1 Carbon nanotube (CNT) TIM Fabrication
2.10.2 Multi-walled nanotubes (MWCNT)
2.10.2.1 Properties
2.10.2.2 Application as thermal interface materials
2.10.3 Single-walled carbon nanotubes (SWCNTs)
2.10.3.1 Properties
2.10.3.2 Application as thermal interface materials
2.10.4 Vertically aligned CNTs (VACNTs)
2.10.4.1 Properties
2.10.4.2 Applications
2.10.4.3 Application as thermal interface materials
2.10.5 BN nanotubes (BNNT) and nanosheets (BNNS)
2.10.5.1 Properties
2.10.5.2 Application as thermal interface materials
2.10.6 Graphene
2.10.6.1 Properties
2.10.6.2 Application as thermal interface materials
2.10.6.2.1 Graphene fillers
2.10.6.2.2 Graphene foam
2.10.6.2.3 Graphene aerogel
2.10.6.2.4 Graphene Heat Spreaders
2.10.6.2.5 Graphene in Thermal Interface Pads
2.10.7 Nanodiamonds
2.10.7.1 Properties
2.10.7.2 Application as thermal interface materials
2.10.8 Graphite
2.10.8.1 Properties
2.10.8.2 Natural graphite
2.10.8.2.1 Classification
2.10.8.2.2 Processing
2.10.8.2.3 Flake
2.10.8.2.3.1 Grades
2.10.8.2.3.2 Applications
2.10.8.3 Synthetic graphite
2.10.8.3.1 Classification
2.10.8.3.1.1 Primary synthetic graphite
2.10.8.3.1.2 Secondary synthetic graphite
2.10.8.3.1.3 Processing
2.10.8.4 Applications as thermal interface materials
2.10.8.4.1 Graphite Sheets
2.10.8.4.2 Vertical graphite
2.10.8.4.3 Graphite pastes
2.10.9 Hexagonal Boron Nitride
2.10.9.1 Properties
2.10.9.2 Application as thermal interface materials
2.10.10 SWOT analysis
2.11 Metamaterials
2.11.1 Types and properties
2.11.1.1 Electromagnetic metamaterials
2.11.1.1.1 Double negative (DNG) metamaterials
2.11.1.1.2 Single negative metamaterials
2.11.1.1.3 Electromagnetic bandgap metamaterials (EBG)
2.11.1.1.4 Bi-isotropic and bianisotropic metamaterials
2.11.1.1.5 Chiral metamaterials
2.11.1.1.6 Electromagnetic “Invisibility” cloak
2.11.1.2 Terahertz metamaterials
2.11.1.3 Photonic metamaterials
2.11.1.4 Tunable metamaterials
2.11.1.5 Frequency selective surface (FSS) based metamaterials
2.11.1.6 Nonlinear metamaterials
2.11.1.7 Acoustic metamaterials
2.11.2 Application as thermal interface materials
2.12 Self-healing thermal interface materials
2.12.1 Extrinsic self-healing
2.12.2 Capsule-based
2.12.3 Vascular self-healing
2.12.4 Intrinsic self-healing
2.12.5 Healing volume
2.12.6 Types of self-healing materials, polymers and coatings
2.12.7 Applications in thermal interface materials
2.13 TIM Dispensing
2.13.1 Low-volume Dispensing Methods
2.13.2 High-volume Dispensing Methods
2.13.3 Meter, Mix, Dispense (MMD) Systems
2.13.4 TIM Dispensing Equipment Suppliers
3 MARKETS FOR THERMAL INTERFACE MATERIALS (TIMS)
3.1 Consumer electronics
3.1.1 Market overview
3.1.1.1 Market drivers
3.1.1.2 Applications
3.1.1.2.1 Smartphones and tablets
3.1.1.2.2 Wearable electronics
3.1.2 Global market 2022-2035, by TIM type
3.2 Electric Vehicles (EV)
3.2.1 Market overview
3.2.1.1 Market drivers
3.2.1.2 Applications
3.2.1.2.1 Lithium-ion batteries
3.2.1.2.1.1 Cell-to-pack designs
3.2.1.2.1.2 Cell-to-chassis/body
3.2.1.2.2 Power electronics
3.2.1.2.2.1 Types
3.2.1.2.2.2 Properties for EV power electronics
3.2.1.2.2.3 TIM2 in SiC MOSFET
3.2.1.2.3 Charging stations
3.2.2 Global market 2022-2035, by TIM type
3.3 Data Centers
3.3.1 Market overview
3.3.1.1 Market drivers
3.3.1.2 Applications
3.3.1.2.1 Router, switches and line cards
3.3.1.2.1.1 Transceivers
3.3.1.2.1.2 Server Boards
3.3.1.2.1.3 Switches and Routers
3.3.1.2.2 Servers
3.3.1.2.3 Power supply converters
3.3.2 Global market 2022-2035, by TIM type
3.4 ADAS Sensors
3.4.1 Market overview
3.4.1.1 Market drivers
3.4.1.2 Applications
3.4.1.2.1 ADAS Cameras
3.4.1.2.1.1 Commercial examples
3.4.1.2.2 ADAS Radar
3.4.1.2.2.1 Radar technology
3.4.1.2.2.2 Radar boards
3.4.1.2.2.3 Commercial examples
3.4.1.2.3 ADAS LiDAR
3.4.1.2.3.1 Role of TIMs
3.4.1.2.3.2 Commercial examples
3.4.1.2.4 Electronic control units (ECUs) and computers
3.4.1.2.4.1 Commercial examples
3.4.1.2.5 Die attach materials
3.4.1.2.6 Commercial examples
3.4.2 Global market 2022-2035, by TIM type
3.5 EMI shielding
3.5.1 Market overview
3.5.1.1 Market drivers
3.5.1.2 Applications
3.5.1.2.1 Dielectric Constant
3.5.1.2.2 ADAS
3.5.1.2.2.1 Radar
3.5.1.2.2.2 5G
3.5.1.2.3 Commercial examples
3.6 5G
3.6.1 Market overview
3.6.1.1 Market drivers
3.6.1.2 Applications
3.6.1.2.1 EMI shielding and EMI gaskets
3.6.1.2.2 Antenna
3.6.1.2.3 Base Band Unit (BBU)
3.6.1.2.4 Liquid TIMs
3.6.1.2.5 Power supplies
3.6.1.2.5.1 Increased power consumption in 5G
3.6.2 Market players
3.6.3 Global market 2022-2035, by TIM type
4 COMPANY PROFILES 198 (104 COMPANY PROFILES)
5 RESEARCH METHODOLOGY
6 REFERENCES
List of Tables
Table 1. Thermal conductivities (?) of common metallic, carbon, and ceramic fillers employed in TIMs.
Table 2. Commercial TIMs and their properties.
Table 3. Advantages and disadvantages of TIMs, by type.
Table 4. Key Factors in System Level Performance for TIMs.
Table 5. Thermal interface materials prices.
Table 6. Comparisons of Price and Thermal Conductivity for TIMs.
Table 7. Price Comparison of TIM Fillers.
Table 8. Characteristics of some typical TIMs.
Table 9. Trends on TIM Fillers.
Table 10. Pros and Cons of TIM Fillers.
Table 11. Types of Potting Compounds/Encapsulants.
Table 12. TIM adhesives tapes.
Table 13. Properties of PCMs.
Table 14. PCM Types and properties.
Table 15. Advantages and disadvantages of organic PCMs.
Table 16. Advantages and disadvantages of organic PCM Fatty Acids.
Table 17. Advantages and disadvantages of salt hydrates
Table 18. Advantages and disadvantages of low melting point metals.
Table 19. Advantages and disadvantages of eutectics.
Table 20. Benefits and drawbacks of PCMs in TIMs.
Table 21. Comparison of Carbon-based TIMs.
Table 22. Properties of CNTs and comparable materials.
Table 23. Typical properties of SWCNT and MWCNT.
Table 24. Comparison of carbon-based additives in terms of the main parameters influencing their value proposition as a conductive additive.
Table 25. Thermal conductivity of CNT-based polymer composites.
Table 26. Comparative properties of BNNTs and CNTs.
Table 27. Properties of graphene, properties of competing materials, applications thereof.
Table 28. Properties of nanodiamonds.
Table 29. Comparison between Natural and Synthetic Graphite.
Table 30. Classification of natural graphite with its characteristics.
Table 31. Characteristics of synthetic graphite.
Table 32. Thermal Conductivity Comparison of Graphite TIMs.
Table 33. Properties of hexagonal boron nitride (h-BN).
Table 34. Comparison of self-healing systems.
Table 35. Types of self-healing coatings and materials.
Table 36. Comparative properties of self-healing materials.
Table 37. Challenges for Dispensing TIM.
Table 38. Thermal Management Application Areas in Consumer Electronics.
Table 39. Trends in Smartphone Thermal Materials.
Table 40. Thermal Management approaches in commercial Smartphones.
Table 41. Global market in consumer electronics 2022-2035, by TIM type (millions USD).
Table 42. Global market in electric vehicles 2022-2035, by TIM type (millions USD).
Table 43. TIM Trends in Data Centers.
Table 44. TIM Area Forecast in Server Boards: 2022-2035 (m2).
Table 45. Global market in data centers 2022-2035, by TIM type (millions USD).
Table 46. TIM Players in ADAS.
Table 47. Die Attach for ADAS Sensors.
Table 48. Die Attach Area Forecast for Key Components Within ADAS Sensors: 2022-2035 (m2).
Table 49. Global market in ADAS sensors 2022-2035, by TIM type (millions USD).
Table 50. TIM Area Forecast for 5G Antennas by Station Size: 2022-2035 (m2).
Table 51. TIM Area Forecast for 5G Antennas by Station Frequency: 2022-2035 (m2).
Table 52. TIMS in BBU.
Table 53. 5G BBY models.
Table 54. TIM Area Forecast for 5G BBU: 2022-2035 (m2).
Table 55. Power Consumption Forecast for 5G: 2022-2035 (GW).
Table 56. TIM Area Forecast for Power Supplies: 2022-2035 (m2).
Table 57. TIM market players in 5G.
Table 58. Global market in 5G 2022-2035, by TIM type (millions USD).
List of Figures
Figure 1. (L-R) Surface of a commercial heatsink surface at progressively higher magnifications, showing tool marks that create a rough surface and a need for a thermal interface material.
Figure 2. Schematic of thermal interface materials used in a flip chip package.
Figure 3. Thermal grease.
Figure 4. Dispensing a bead of silicone-based gap filler onto the heat sink of a power electronics module.
Figure 5. Application of thermal silicone grease.
Figure 6. A range of thermal grease products.
Figure 7. SWOT analysis for thermal greases and pastes.
Figure 8. Thermal Pad.
Figure 9. SWOT analysis for thermal gap pads.
Figure 10. Dispensing a bead of silicone-based gap filler onto the heat sink of a power electronics module.
Figure 11. SWOT analysis for thermal gap fillers.
Figure 12. SWOT analysis for Potting compounds/encapsulants.
Figure 13. Thermal adhesive products.
Figure 14. SWOT analysis for TIM adhesives tapes.
Figure 15. Phase-change TIM products.
Figure 16. PCM mode of operation.
Figure 17. Classification of PCMs.
Figure 18. Phase-change materials in their original states.
Figure 19. Thermal energy storage materials.
Figure 20. Phase Change Material transient behaviour.
Figure 21. PCM TIMs.
Figure 22. Phase Change Material - die cut pads ready for assembly.
Figure 23. SWOT analysis for phase change materials.
Figure 24. Typical IC package construction identifying TIM1 and TIM2
Figure 25. Liquid metal TIM product.
Figure 26. Pre-mixed SLH.
Figure 27. HLM paste and Liquid Metal Before and After Thermal Cycling.
Figure 28. SLH with Solid Solder Preform.
Figure 29. Automated process for SLH with solid solder preforms and liquid metal.
Figure 30. SWOT analysis for metal-based TIMs.
Figure 31. Schematic diagram of a multi-walled carbon nanotube (MWCNT).
Figure 32. Schematic of single-walled carbon nanotube.
Figure 33. Types of single-walled carbon nanotubes.
Figure 34. Schematic of a vertically aligned carbon nanotube (VACNT) membrane used for water treatment.
Figure 35. Schematic of Boron Nitride nanotubes (BNNTs). Alternating B and N atoms are shown in blue and red.
Figure 36. Graphene layer structure schematic.
Figure 37. Illustrative procedure of the Scotch-tape based micromechanical cleavage of HOPG.
Figure 38. Graphene and its descendants: top right: graphene; top left: graphite = stacked graphene; bottom right: nanotube=rolled graphene; bottom left: fullerene=wrapped graphene.
Figure 39. Flake graphite.
Figure 40. Applications of flake graphite.
Figure 41. Graphite-based TIM products.
Figure 42. Structure of hexagonal boron nitride.
Figure 43. SWOT analysis for carbon-based TIMs.
Figure 44. Classification of metamaterials based on functionalities.
Figure 45. Electromagnetic metamaterial.
Figure 46. Schematic of Electromagnetic Band Gap (EBG) structure.
Figure 47. Schematic of chiral metamaterials.
Figure 48. Nonlinear metamaterials- 400-nm thick nonlinear mirror that reflects frequency-doubled output using input light intensity as small as that of a laser pointer.
Figure 49. Schematic of self-healing polymers. Capsule based (a), vascular (b), and intrinsic (c) schemes for self-healing materials. Red and blue colours indicate chemical species which react (purple) to heal damage.
Figure 50. Stages of self-healing mechanism.
Figure 51. Self-healing mechanism in vascular self-healing systems.
Figure 52. Schematic of TIM operation in electronic devices.
Figure 53. Schematic of Thermal Management Materials in smartphone.
Figure 54. Wearable technology inventions.
Figure 55. Global market in consumer electronics 2022-2035, by TIM type (millions USD).
Figure 56. Application of thermal interface materials in automobiles.
Figure 57. EV battery components including TIMs.
Figure 58. Battery pack with a cell-to-pack design and prismatic cells.
Figure 59. Cell-to-chassis battery pack.
Figure 60. TIMS in EV charging station.
Figure 61. Global market in electric vehicles 2022-2035, by TIM type (millions USD).
Figure 62. Image of data center layout.
Figure 63. Application of TIMs in line card.
Figure 64. Global market in data centers 2022-2035, by TIM type (millions USD).
Figure 65. ADAS radar unit incorporating TIMs.
Figure 66. Global market in ADAS sensors 2022-2035, by TIM type (millions USD).
Figure 67. Coolzorb 5G.
Figure 68. TIMs in Base Band Unit (BBU).
Figure 69. Global market in 5G 2022-2035, by TIM type (millions USD).
Figure 70. Boron Nitride Nanotubes products.
Figure 71. Transtherm® PCMs.
Figure 72. Carbice carbon nanotubes.
Figure 73. Internal structure of carbon nanotube adhesive sheet.
Figure 74. Carbon nanotube adhesive sheet.
Figure 75. HI-FLOW Phase Change Materials.
Figure 76. Thermoelectric foil, consists of a sequence of semiconductor elements connected with conductive metal. At the top (in red) is the thermal interface.
Figure 77. Parker Chomerics THERM-A-GAP GEL.
Figure 78. Metamaterial structure used to control thermal emission.
Figure 79. Shinko Carbon Nanotube TIM product.
Figure 80. The Sixth Element graphene products.
Figure 81. Thermal conductive graphene film.
Figure 82. VB Series of TIMS from Zeon.
