Global and China Advanced Packaging Industry Report, 2014-2015

Date: July 6, 2015
Pages: 170
Price:
US$ 2,500.00
License [?]:
Publisher: ResearchInChina
Report type: Strategic Report
Delivery: E-mail Delivery (PDF)
ID: G50DCE884B9EN
Leaflet:

Download PDF Leaflet

Global and China Advanced Packaging Industry Report, 2014-2015
Global and China Advanced Packaging Industry Report, 2014-2015 focuses on the followings:

1 Analysis of Global Semiconductor Market and Industry
2 Analysis of Chinese Semiconductor Market and Industry
3 Technical Trends of Advanced Packaging
4 Analysis of Global and China Advanced Packaging Industry
5 Study of 24 Advanced Packaging Vendors

Global outsourced semiconductor assembly and test (OSAT) market was valued at about USD27.1 billion in 2014, expanding by 7.9% from 2013, is expected to swell by 7.0% to USD29 billion in 2015, and will further slow down to 3.8% in 2016, but start to accelerate with growth rate of 6.0% in 2017. Memory packaging and test is the largest single-product packaging and test in OSAT field, HMC and HBM are expected to spring up after 2017, accelerating the expansion of OSAT. It is predicted that SiP and ePoP will be main drivers behind OSAT growth in 2015 and 2016.

New technologies have mushroomed in OSAT field, but few of them were commercialized and used on a massive basis in recent years. The most popular new technologies now include FOWLP, 2.5D and TSV, which are afraid to be put into large-scale application after 2017. On the one hand, these new technologies are not sufficiently mature and small in scale, leading to higher cost, like FOWLP attempting to replace FC-CSP. On the other hand, the reason lies in business model. Wafer-level packaging (WLP) has become more and more common, but the business model in which whether Foundry or OSAT dominates WLP still needs to be explored. As business model has not been fully shaped, downstream vendors will adopt a wait-and-see attitude. For future 2.5D and 3D packaging, most of silicon interposer layers may be completed by OSAT companies and part by Foundries. There may be also companies that specialize in silicon interposer layers.

Two pronounced trends of OSAT industry are: 1) Revenue growth of large companies far exceeds that of small ones, as the former has more funding for R&D than the latter, and OSAT industry hungers for new technologies. Long-term development of the companies cannot be realized without adequate technology accumulation. 2) Chinese OAST companies grow at the fastest rate, largely due to strong liquidity and hot stock market, which provide strong financial backing for OSAT companies, thus giving them adequate funds for R&D and capacity expansion. Chinese OSAT companies, by virtue of powerful weapon of capital, enter the stage of rapid development, and will boost its scale and technical competence via more acquisitions.
1 GLOBAL SEMICONDUCTOR INDUSTRY

1.1 Market Overview
1.2 Supply Chain
1.3 Industry Overview

2 DOWNSTREAM MARKETS OF IC PACKAGING INDUSTRY

2.1 Global Memory Market
2.2 Supply and Demand of DRAM
2.3 Supply and Demand of NAND
2.4 Global Mobile Phone Market
2.5 Global Mobile Phone Industry
2.6 Chinese Mobile Phone Marekt
2.7 Laptop Computer Market
2.8 Tablet PC Market
2.9 Server Market

3 TRENDS OF PACKAGING & TEST TECHNOLOGY

3.1 HBM/HMC Memory
3.2 Embedded Component Substrate
3.3 Embedded Trace Substrate
3.4 POP Packaging
3.5 FOWLP
3.6 Introduction of SiP Packaging
3.7 SiP Packaging Industy and Market
  3.7.1 Murata
  3.7.2 USI
3.8 2.5D Packaging (SI/GLASS/ORGANIC INTERPOSER)
  3.8.1 Introduction of 2.5D Packaging
  3.8.2 Applications of 2.5D Packaging
  3.8.3 Business Model of 2.5D Packaging
  3.8.4 2.5D Interposer Market Size
  3.8.5 Suppliers of 2.5D Packaging
3.9 TSV (3D) Packaging
  3.9.1 TSV Packaging Equipment
3.10 SENSOR/MEMS/CIS Packaging
  3.10.1 MEMS Market Size
  3.10.2 Trends of Sensor/MEMS/CIS Packaging

4 PACKAGING & TEST INDUSTRY

4.1 Packaging & Test Industry Size
4.2 Middle-end Packaging & Test Industy
4.3 China Semiconductor Packaging & Test Industy
4.4 Ranking of Chinese Semiconductor Packaging & Test Vendors
4.5 Semiconductor Test
4.6 Ranking of Global Packaging & Test Vendors
4.7 Foundry Industry Size
4.8 Chinese IC Market
4.9 China Semiconductor Industry
4.10 Chinese Government’s Supportive Policies for Semiconductor Industry
4.11 Recent M&As in China’s Semiconductor Field
4.12 Forecast of China IC Industry Development
4.13 Development Goals of China Foundry Industry

5 PACKAGING & TEST VENDORS

5.1 ASE
5.2 Amkor
5.3 SPIL
5.4 STATS ChipPAC
5.5 PTI
5.6 Greatek
5.7 ChipMOS
5.8 KYEC
5.9 Unisem
5.10 FATC
5.11 JECT
5.12 UTAC
5.13 Lingsen Precision
5.14 Nantong Fujitsu Microelectronics
5.15 Walton Advanced Engineering
5.16 Chipbond
5.17 J-DEVICES
5.18 MPI
5.19 STS Semiconductor
5.20 Signetics
5.21 Hana Micron
5.22 NEPES
5.23 Tianshui Huatian Technology
5.24 China Wafer Level CSP

SELECTED CHARTS

Global Semiconductor Market Size, 2013-2019E
Global Semiconductor Market Breakdown by Product, 2012-2016E
Market Size Growth of Various Semiconductor Products, 2012-2016E
Semiconductor Outsourced Supply Chain
Semiconductor Company Systems
Semiconductor Outsourced Supply Chain Example
Food Chain IC CAD Design Industry
Top25 Semiconductor Sales Leaders, 2014Q1
Top25 Semiconductor Sales Leaders, 2015Q1
Worldwide IC Sales by Company Headquarters Location, 1990-2013
Fabless IC Sales Market Share by Company Headquarters Location, 2013
Top10 IC Vendors in China, 2008-2013
Global Memory Market Size, 2009-2016E
Global Memory Market by Type, 2014
Automotive Memory Market Size, 2008-2015
Automotive Memory Market by Technology, 2010-2015
Capex of DRAM Industry, 2008-2015
Oversupply Ratio of DRAM, 2013-2016E
DRAM Demand by Device, 2013-2015
DRAM GB/System, 2013-2015
Oversupply Ratio of DRAM, 2014Q1-2016Q4E
Capex of NAND Industry, 2008-2015
Mainstream Tech-node on Typical Smartphone IC, 2011-2018E
Average IC Costs Per Mobile Phone, 2008-2016E
Frequency Bands Per Mobile Handset Device, 2000-2018E
Cellular Terminal Shipment Forecast by Cellular Standard, 2000-2018E
LTE-enabled Cellular Terminal Forecast, 2011-2018E
Global Mobile Phone Shipments, 2007-2015
Global 3G/4G Mobile Phone Shipments Breakdown by Region, 2011-2014
Worldwide Smartphone Sales to End Users by Vendor, 2014 (Thousands of Units)
Worldwide Smartphone Sales to End Users by Operating System, 2014 (Thousands of Units)
Shipments of Global Top10 Mobile Phone Vendors, 2014
Shipments of Major Mobile Phone Vendors, 2015Q1
Market Share of Major Mobile Phone Vendors, 2015Q1
Market Share of Major Mobile Phone Operating Systems, 2015Q1
Worldwide Smartphone Sales to End Users by Vendor, 2014 (Thousands of Units)
Worldwide Smartphone Sales to End Users by Operating System, 2014 (Thousands of Units)
Market Share of Major Chinese Smartphone Vendors, 2014
Market Share of Major Vendors in Chinese 4G Mobile Phone Market, 2014
Laptop Computer Shipments, 2008-2015
Shipments of Major Global Notebook PC ODM Vendors, 2010-2014
Global Tablet PC Shipments, 2011-2016E
Shipments of Top5 Tablet PC Vendors, 2014Q4
Shipments, Market Share and Growth of Top5 Tablet PC Vendors, 2014
Global Server Market Size, 2013-2018E
Worldwide Server Systems Factory Revenue of Top5 Corporate Family, 2013
Worldwide Server Systems Factory Revenue of Top5 Corporate Family, 2014Q4
Market Share of Global Server Vendors, 2015
HBM Architecture
Mobile DRAM Trend
Advantages of WIDE IO
SK Hynix WIDE IO2 Roadmap
HMC Architecture
Benefits of HMC
Advantages of Embedded Passive/Active Substrate
Embedded Component Substrate Process
Comparison of Embedded Active & Passive Components
Roadmap of Embedded Passive Substrate
Structure Roadmap of Embedded Active Substrate
FOWLP and PLP Process Comparison
Why Embedded Trace?
Embedded Trace Package Features
Embedded Trace Package Sweet Spot (for Wire Bonding)
Embedded Trace Package Sweet Spot (for FLIP CHIP)
Development Trend of PoP Packaging
Samsung Widcon
ePoP Architecture
Application of FOWLP
Fan-Out eWLP (Embedded Wafer-Level Packaging) Architecture
Embedded Fan-Out Wafer Level Package (eWLP) vs. PBGA (Plastic Ball Grid Array)
Thermal Management between PBGA and InFO-WLP of Baseband Chip Set (TSMC Results)
SiP Module Technologies
Business Model of ASE and USI
SoC, SiP and SoB
SiP Roadmap
Market Share of Major SiP Packaging Vendors, 2014
Sales and Operation Margin of Murata, FY2009-FY2016
Sales Breakdown of Murata by Product, FY2013-FY2015
Major Products of Murata
Sales Breakdown of Murata by Application, FY2013-FY2016
Operation Income Bridge of Murata, FY2014-FY2015
Quarterly Sales, Order and Backlog of Murata, 2012Q2-2015Q1
Revenue and Operating Margin of USI, 2008-2015
Revenue of USI by Application, 2011-2014
Output of USI’s Products, 2011-2014
Cost Structure of USI, 2014
ASE (USI) SiP Module Roadmap for System Integration
ASE (USI) SiP Module Roadmap for Miniaturization
ASE (USI) SiP Module Roadmap Advanced Process
Challenges of 2.5D Packaging Technology
Current 2.5D Packaging Business Model
Future 2.5D Packaging Business Model
2.5D Interposer Manufacturing Revenue
Breakdown by Interposer Bulk Material, 2010-2017
Applications of TSV
Suppliers of TSV Equipment
TSV Packaging Equipment Distribution, 2012-2017E
MEMS -NEMS Trend
MEMS Shipments, 20132018E
MEMS Market Size, 2012-2018E
Main MEMS Players, 2014-2015
Avago’s FBAR MEMS Filter with TSV
CIS Packaging Trend
Cross-section SEM Image of a BI-CIS
OSAT Market Size, 2008-2018E
Share of IC Package Value Add, 1990-2020E
Global Shipments of IC Packaging Type, 2011/2013/2018E
BUMPED WAFER PRODUCTION BY PITCH (300mm Equivalent), 2013/2018E
Middle-End Packaging Industry Process
China Semiconductor Packaging & Test Industry Size, 2009-2015
Number of Capacity of Chinese Semiconductor Packaging & Test Vendors, 2010-2014
Top30 Chinese IC Packaging & Test Vendors by Revenue, 2014
Ranking of FIQFN Vendors, 2013
Ranking of FOWLP Vendors, 2013
Ranking of Stacked Package Vendors, 2013
Ranking of Global Top24 OSAT Companies by Revenue, 2013-2015
Operating Margin and Gross Margin Comparison of Major Global OSAT Companies, 2013-2015
Global Foundry Market Size, 2008-2017E
Chinese IC Market Size, 2011-2017E
China’s IC Imports, 2006-2013
China’s IC Exports, 2006-2013
China’s IC Industry Sales, 2008-2014
Capex of China’s IC Industry, 2008-2014
Top10 Chinese IC Design Houses by Sales, 2004/2014
China Foundry Sales Share of the Pure-play IC Foundry Market, 2002-2018E
China National IC Fund Structure
Organizational Structure of ASE
Revenue and Gross Margin of ASE, 2003-2015
Revenue and Operating Margin of ASE, 2009-2015
Monthly Revenue of ASE, May 2013-May 2015
Revenue of ASE by Business, 2010-2015
Revenue and Gross Margin of ASE Packaging, 2013Q1-2015Q1
Revenue of ASE Packaging by Type, 2013Q1-2015Q1
Revenue and Gross Margin of ASE Testing, 2013Q1-2015Q1
Revenue and Gross Margin of ASE Material, 2013Q1-2015Q1
EMS Revenue and Gross Margin of ASE, 2013Q1-2015Q1
IC ATM Revenue Structure of ASE by Application, 2013Q1-2015Q1
EMS Revenue Structure of ASE by Application, 2013Q1-2015Q1
Machinery & Equipment Capital Expenditure vs. EBITDA of ASE, 2013Q1-2015 Q1
Major Customers of ASE
Revenue, Gross Margin and Operating Margin of Amkor, 2005-2015
Revenue of Amkor by Packaging Type, 2007-2015
Shipments of Amkor by Packaging Type, 2012-2015
Revenue of Amkor by Application, 2012-2015
Amkor’s Capital Intensity, 2012-2015
Debt and Cash of Amkor, 2012-2015
Property, Plant and Equipment of Amkor by Region 20122013
Revenue and Shipments of Amkor by Region, 2012
Net Sales of Amkor by Country Based on Customer Location, 2012-2014
Organizational Structure of SPIL
Revenue, Gross Margin and Operating Margin of SPIL, 2005-2015
Monthly Revenue of SPIL, May 2013-May 2015
Quarterly Revenue, Gross Margin and Operating Margin of SPIL, 2013Q1-2015Q1
Revenue of SPIL by Region, 2005-2015
Revenue of SPIL by Application, 2005-2015
Revenue of SPIL by Business, 2005-2015
Capacity of SPIL, 2006-2015
Equity Structure of New STATS ChipPAC
Revenue and Gross Margin of STATS ChipPAC, 2004-2015
Revenue of STATS ChipPAC by Packaging Type, 2006-2015
Revenue of STATS ChipPAC by Application, 2006-2015
Revenue of STATS ChipPAC by Region, 2006-2015
Organizational Structure of PTI
Revenue and Gross Margin of PTI, 2008-2015
Monthly Revenue of PTI, May 2013-May 2015
Revenue Mix of PTI by Application, 2014Q1-2015Q1
Revenue, Gross Margin and Operating Margin of Greatek, 2005-2015
Monthly Revenue and Growth of Greatek, May 2013-May 2015
Revenue and Gross Margin of ChipMOS, 2003-2015
Revenue and Operating Margin of ChipMOS, 2009-2015
Revenue of ChipMOS by Business, 2010-2015
Revenue of ChipMOS by Product, 2010-2015
Utilization Rate and EBITDA Margin of ChipMOS, 2011-2015
Cash Flow and CAPEX of ChipMOS, 2011-2015
Technology Roadmap of ChipMOS, 2014-2016
ChipMOS Technology Development & Business Alignment
Revenue and Gross Margin of KYEC, 2003-2015
Revenue and Operating Margin of KYEC, 2009-2015
Monthly Revenue of KYEC, May 2013-May 2015
Distribution of KYEC’s Plants
Testing Platforms of KYEC
Revenue and EBITDA of Unisem, 2006-2015
Revenue and EBITDA of Unisem, 2012Q1-2015Q1
Quarterly Gross Margin of Unisem, 2012Q1-2015Q1
Quarterly Revenue Structure of Unisem by Technology, 2012Q2-2015Q1
Quarterly Revenue Structure of Unisem by Application, 2012Q2-2015Q1
Organizational Structure of Formosa Plastics
Organizational Structure of FATC
Revenue and Operating Margin of FATC, 2006-2015
Revenue and Gross Margin of FATC, 2009-2015
Monthly Revenue of FATC, May 2013-May 2015
Revenue and Operating Margin of JECT, 2006-2015
Output of JECT, 2011-2014
Chip Packaging Cost Structure of JECT, 2012-2014
Revenue of JECT by Product, 2013-2014
Global CU Pilluar Capacity, 2012
Assets and Liabilities of JECT, 2009-2014
Quarterly Revenue of JECT, 2007Q1-2015Q1
Quarterly Net Income of JECT, 2007Q1-2015Q1
Revenue and Profit of JECT’s Major Subsidiaries, 2013-2014
JCET Roadmap
Revenue and Gross Margin of UTAC, 2010-2015
Revenue of UTAC by Business, 2010-2014
Revenue of UTAC by Business, 2010-2015
Revenue of UTAC by Product, 2010-2015
Revenue of UTAC by Customer, 2011-2013
Technological Distribution of UTAC
Global Distribution of UTAC
Revenue and Operating Margin of Lingsen Precision, 2007-2015
Revenue and Gross Margin of Lingsen Precision, 2009-2015
Monthly Revenue of Lingsen Precision, May 2013-May 2015
Revenue and Operating Income of Nantong Fujitsu Microelectronics, 2007-2015
Balance Sheet of Nantong Fujitsu Microelectronics, 2012-2014
Cash Flows of Nantong Fujitsu Microelectronics, 2012-2014
Key Ratio of Nantong Fujitsu Microelectronics, 2012-2014
Revenue and Operating Margin of Walton Advanced Engineering, 2007-2015
Revenue and Gross Margin of Walton Advanced Engineering, 2009-2015
Monthly Revenue and Growth of Walton Advanced Engineering, May 2013-May 2015
Revenue and Operating Margin of Chipbond, 2006-2015
Revenue and Gross Margin of Chipbond, 2009-2015
Monthly Revenue and Growth of Chipbond, May 2013-May 2015
Revenue of Chipbond by Business, 2012
Global Gold Bumping Vendor Capacity Share, 2013
Organizational Structure of J-DEVICES
Revenue and PBT of MPI, FY2007-FY2015
Equity and Assets of MPI, FY2010-FY2014
Revenue of MPI by Region, FY2011-FY2014
Organizational Structure of STS Semiconductor
Revenue and Operating Margin of STS Semiconductor, 2006-2015
Revenue of STS Semiconductor by Business, 2011-2013
Capacity of STS Semiconductor, 2011-2013
Output of STS Semiconductor, 2011-2013
Customer Distribution of STS Semiconductor, 2013-2015
Shareholder Structure of Signetics
Revenue and Operating Margin of Signetics, 2007-2015
Revenue and Operating Margin of Hana Micron, 2006-2015
Revenue of Hana Micron by Customer, 2014
Revenue of Hana Micron by Market, 2013Q1-2014Q4
Revenue and Operating Margin of Nepes, 2007-2015
Quarterly Revenue of Nepes by Division, 2013-2014
Revenue and Operating Margin of Tianshui Huatian Technology, 2006-2015
Revenue and Operating Income of China Wafer Level CSP, 2010-2015
Revenue of China Wafer Level CSP by Customer, 2014
Skip to top


IC Advanced Packaging Industry Report, 2009 US$ 2,500.00 Oct, 2009 · 189 pages

Ask Your Question

Global and China Advanced Packaging Industry Report, 2014-2015
Company name*:
Contact person*:
Phone/fax*:
Email*:
Request invoice
Your enquiry:
Please click on a Check Box below to confirm you are not a robot: