The Global Advanced IC Substrates Market 2027–2037

September 2026 | 354 pages | ID: GFB020CCBBADEN
Future Markets, Inc.

Abstracts

Advanced IC substrate materials form the physical foundation of AI hardware, and the market has moved from mature commodity supply to acute constraint within a single product cycle. The nine material classes consumed in substrate manufacture — build-up dielectric film, copper-clad laminate and prepreg, glass cloth reinforcement, fillers, copper foil, dry film photoresist, solder resist, plating and desmear chemistries, and surface finish chemistries. Growth substantially outpaces the substrate market it supplies.

Recent developments have reshaped the supply picture. Ibiden committed ?500 billion over three years from FY2026 alongside a US$1.2 billion Arizona facility; AT&S secured €1.5 to 2.0 billion for Kulim expansion financed entirely by AMD and one further customer; Unimicron set 2026 capital expenditure above NT$25 billion. Combined announced substrate investment exceeds US$12.9 billion against approximately US$1.55 billion directed at the materials that supply it — a ratio of more than eight to one that sustains material tightness even as substrate tightness eases.

Concentration is the defining structural feature. Substitution pressure is intensifying. Kyocera commercialised a multilayer ceramic core substrate in April 2026, and Samsung Electro-Mechanics formed a glass substrate joint venture with Sumitomo Chemical targeting production in early 2027, joining Unimicron's stake in the Corning pilot. Non-organic core adoption at accelerated rates would remove 32 per cent of laminate and glass cloth demand by 2037 while leaving build-up film reduced by 16 per cent and plating chemistry higher.

The Global Advanced IC Substrates Market 2027–2037 forecasts consumption of the materials used to manufacture advanced IC substrates, expressed in the units in which those materials are produced, sold and capacity-planned: tonnes, square metres and litres. It is not a study of substrates. Substrate production is the input; material consumption is the output. Existing substrate market studies forecast substrate units and revenue, serving package designers, OSATs and fabless companies. Material input is treated as a modelling assumption and is not disclosed. For producers of build-up film, copper foil, glass cloth, fillers and plating chemistry, that assumption constitutes the entire addressable market. This report makes it the subject.

Coverage spans nine material classes and seven regions, with demand allocated to the region of substrate manufacture. Six scenarios test AI capex slowdown, accelerated glass core adoption, supply disruption, rapid Chinese localisation and panel format transition.

Contents include:

• Market size and forecasts 2027–2037 in tonnes, square metres and US dollars, by material class, substrate platform, application and region
• Five-stage forecast methodology with full conversion factor disclosure and areal density tables
• Layer multipliers by material class, and the resulting divergence between classes growing at 12 per cent and those growing at 4.7 per cent
• Panel utilisation geometry, computed for 510 ? 515 mm and 730 ? 920 mm formats across the body size range
• Compound stack yield modelling by per-layer yield and layer count
• Signal integrity roadmap to 224G and 448G, with dielectric attenuation computed by laminate loss class
• Material-by-material analysis: grades, specifications, supplier landscapes, capacity, qualification cycles and demand forecasts
• Non-organic core substitution: glass and ceramic, with material displacement quantified per square metre
• Concentration analysis with CR1, CR3, CR5 and HHI by class; single-source exposure and disruption cost modelling
• Regional production versus consumption balance and trade exposure
• PFAS exposure, recovery rates and embodied carbon by material class
• 116 company profiles including 3D Glass Solutions, Absolics, Admatechs, Advanced Chip and Circuit Materials, Advanced Semiconductor Engineering (ASE), Aeluma, AGY Holding, Ajinomoto Co., Ajinomoto Fine-Techno, AKM Meadville, Alliance Material, AMD, Asahi Kasei, AT&S, Baotek Industrial Materials, BOE Technology, Chang Chun Group, Chang Chun Petrochemical, Chemtronics, Chongqing Polycomp, Circuit Foil Luxembourg, Co-Tech Development, Coherent, Compeq Manufacturing, Corning, Daeduck Electronics, Dai Nippon Printing, Denka, Doosan Corporation, Doosan Corporation Electro-Materials, DuPont Electronics / Qnity, Elite Material, Eternal Materials, Fastprint Circuit Tech, FICT, Fujikura, Fukuda Metal Foil & Powder, Furukawa Electric, FusionAP, Goldenmax International, Grace Fabric Technology, Haesung DS, Ibiden, Intel, Isola Group, ITEQ Corporation, Itera, JCET, JCU Corporation, Jiujiang Defu Technology, JNTC, Jushi Group, JX Advanced Metals, KCC Corporation, Kingboard Laminates, Kinsus Interconnect, Kinwong Electronic, Kyocera, Lens Technology, LG Chem, LG Innotek, Lotte Energy Materials, LPKF Laser & Electronics, MacDermid Alpha, Meiko Electronics, Mitsubishi Chemical and more.....

Contents

1 EXECUTIVE SUMMARY

1.1 Scope and headline definitions
1.2 The substrate materials stack
1.3 Key findings
1.4 Market size, growth and CAGR summary
1.5 Headline forecasts by material class
1.6 Headline forecasts by region
1.7 Supply concentration at a glance
1.8 The utilisation asymmetry: why material demand outgrows substrate area
1.9 Strategic implications for suppliers
1.10 Strategic implications for buyers

2 INTRODUCTION AND SCOPE

2.1 Report objectives
2.2 Product scope: the nine material classes
2.3 Geographic scope: the seven regions
2.4 Grade and specification definitions
  2.4.1 Build-up film grade families
  2.4.2 CCL loss-tangent classes
  2.4.3 Glass cloth dielectric grades and weave styles
  2.4.4 Copper foil profile classes
  2.4.5 Dry film resist resolution classes
2.5 Units, conventions and abbreviations

3 THE ADVANCED IC SUBSTRATE DEMAND BASE

3.1 Substrate platforms in scope
  3.1.1 Flip-chip BGA and build-up substrates
  3.1.2 Substrate-like PCB (SLP)
  3.1.3 Embedded die substrates
  3.1.4 Coreless and substrate-less architectures (CoWoP)
  3.1.5 Non-organic cores
3.2 Substrate area as the demand unit
  3.2.1 Body size trends by application
  3.2.2 Build-up layer count trends
  3.2.3 Line/space roadmap and material implications
3.3 Panel formats and utilisation
  3.3.1 Strip, panel and large-panel processing
  3.3.2 Panel utilisation and edge loss
  3.3.3 Yield assumptions by platform
3.4 Substrate production capacity outlook 2025–2037
3.5 Substrate manufacturer landscape
3.6 Material qualification practice and cycle times

4 DEMAND DRIVERS

4.1 AI accelerator and GPU shipments
4.2 HBM stack height and memory substrate demand
4.3 Chiplet adoption and package area growth
4.4 Co-packaged optics and photonic substrates
4.5 Server CPU and networking ASICs
4.6 Mobile and consumer
4.7 Automotive and industrial
4.8 Aerospace and defence
4.9 Signal integrity roadmap: 224G, 448G and material consequences
4.10 Demand scenario definitions

5 FORECAST METHODOLOGY

5.1 Model architecture
5.2 Device shipments to substrate area
5.3 Substrate area to layer area
5.4 Layer area to material mass: areal density and thickness
5.5 Copper thickness, plating allowance and etch loss
5.6 Yield, scrap and utilisation factors
5.7 Panel-format sensitivity
5.8 Price modelling and ASP erosion
5.9 Top-down reconciliation against supplier segment reporting

6 MATERIAL SEGMENTATION

6.1 Material-to-process mapping
6.2 Material-to-platform mapping
6.3 Segment definitions and primary applications
6.4 Cost breakdown of a representative advanced substrate

7 GLOBAL MARKET SIZE AND FORECAST 2027–2037

7.1 Total market volume and value
7.2 Forecast by material class
7.3 Forecast by substrate platform
7.4 Forecast by application
7.5 Forecast by region
7.6 Price forecasts and ASP trajectories
7.7 Scenario analysis
  7.7.1 AI capex slowdown
  7.7.2 Accelerated glass core adoption
  7.7.3 Supply disruption
  7.7.4 Rapid Chinese localisation

8 MATERIAL-BY-MATERIAL ANALYSIS

8.1 Build-up dielectric films
  8.1.1 Function and requirements
  8.1.2 ABF construction: resin, carrier and cover sheet
  8.1.3 GX to GL series evolution and filler loading
  8.1.4 Dk/Df targets for 224G and beyond
  8.1.5 CTE, warpage and dimensional stability
  8.1.6 Filler chemistry, loading and particle size
  8.1.7 Lamination and cure process windows
  8.1.8 Desmear compatibility and copper adhesion
  8.1.9 ABF-RCC and resin-coated variants
  8.1.10 Challenger films: Japan, USA, China, Korea
  8.1.11 Qualification barriers and switching costs
  8.1.12 Capacity, expansion and lead times
  8.1.13 Single-source dependency quantified
  8.1.14 Demand forecast 2027–2037
8.2 Copper-clad laminate and prepreg
  8.2.1 Construction and grades
  8.2.2 BT resin systems
  8.2.3 Epoxy and modified epoxy
  8.2.4 Low-loss and ultra-low-loss systems
  8.2.5 Halogen-free reformulation
  8.2.6 Thin-core and coreless processing
  8.2.7 Supplier landscape and capacity
  8.2.8 Demand forecast 2027–2037
8.3 Glass cloth reinforcement
  8.3.1 Styles and weave constructions
  8.3.2 Low-Dk and low-Df compositions
  8.3.3 Low-CTE and high-modulus: T-glass
  8.3.4 Ultra-thin and spread-yarn fabrics
  8.3.5 The low-Dk and low-CTE bottleneck quantified
  8.3.6 Chinese localisation programmes
  8.3.7 Demand forecast 2027–2037 by grade
8.4 Fillers
  8.4.1 Silica, alumina and specialty fillers
  8.4.2 Particle size distribution and surface treatment
  8.4.3 Supplier landscape
  8.4.4 Demand forecast 2027–2037
8.5 Copper foil
  8.5.1 Electrodeposited versus rolled annealed
  8.5.2 Low-profile, VLP and HVLP grades
  8.5.3 Carrier foil constructions and release layer chemistry
  8.5.4 Roughness versus insertion loss trade-off
  8.5.5 Capacity competition with battery copper foil
  8.5.6 Copper price exposure and pass-through
  8.5.7 Demand forecast 2027–2037
8.6 Dry film photoresist
  8.6.1 Resolution requirements by line/space node
  8.6.2 Supplier landscape
  8.6.3 Demand forecast 2027–2037
8.7 Solder resist
  8.7.1 Formulation and requirements
  8.7.2 Supplier landscape
  8.7.3 Demand forecast 2027–2037
8.8 Plating and desmear chemistries
  8.8.1 Desmear and permanganate systems
  8.8.2 Electroless copper
  8.8.3 Electrolytic copper, additives and levellers
  8.8.4 Via fill and through-glass-via metallisation
  8.8.5 Overlap with fab wet chemistry supply
  8.8.6 Demand forecast 2027–2037
8.9 Surface finish chemistries
  8.9.1 ENIG, ENEPIG, OSP and alternatives
  8.9.2 Gold and palladium consumption
  8.9.3 Demand forecast 2027–2037
8.10 Cross-material summary

9 NON-ORGANIC AND HYBRID CORES

9.1 Glass core substrates
9.2 Silicon core substrates
9.3 Ceramic and glass-ceramic cores
9.4 Material implications of the core transition
9.5 Substitution scenarios and effect on organic material demand

10 REGIONAL ANALYSIS

10.1 China
10.2 Japan
10.3 Korea
10.4 Taiwan
10.5 USA
10.6 Europe
10.7 Southeast Asia
10.8 Cross-regional summary and trade balance

11 SUPPLY CHAIN, CONCENTRATION AND RISK

11.1 Value chain mapped
11.2 Concentration analysis by material class
11.3 Single-source and dual-source exposure quantified
11.4 Chip designers and OEMs contracting upstream
11.5 Export controls, trade measures and tariff exposure
11.6 Upstream raw material inputs
11.7 Disruption scenarios and cost-of-disruption modelling
11.8 Inventory, allocation and lead-time behaviour

12 COMPETITIVE AND SUPPLIER LANDSCAPE

12.1 Supplier landscape overview
12.2 Multi-material majors
12.3 Regional champions
12.4 Share positions by material and region
12.5 Capacity investment tracker
12.6 Partnerships, JVs and acquisitions
12.7 New entrant assessment

13 SUSTAINABILITY AND REGULATORY

13.1 PFAS exposure in substrate materials
13.2 Halogen-free, RoHS and REACH compliance
13.3 Copper and precious metal recovery
13.4 Embodied carbon in substrate manufacture
13.5 Regulatory outlook

14 COMPANY PROFILES

14.1 Build-up dielectric film (12 company profiles)
14.2 Copper-clad laminate and prepreg (17 company profiles)
14.3 Glass cloth and glass yarn (7 company profiles)
14.4 Fillers (4 company profiles)
14.5 Copper foil (15 company profiles)
14.6 Dry film and solder resist (7 company profiles)
14.7 Plating, desmear and surface finish chemistry (11 company profiles)
14.8 Substrate manufacturers (26 company profiles)
14.9 Glass core substrates and other companies (34 company profiles)

15 APPENDICES

15.1 Glossary and abbreviations
15.2 Material specification reference tables
15.3 Conversion factors and areal density assumptions
15.4 Substrate manufacturer capacity table
15.5 Research methodology

16 REFERENCES

List Of Tables

LIST OF TABLES

Table 1. Headline market summary: volume, value and CAGR by material class
Table 2. Material demand 2027–2037, tonnes and m?
Table 3. Material demand by region 2027–2037
Table 4. Concentration summary by material class
Table 5. Indexed growth, 2027 = 100
Table 6. Material class definitions, forecast units and scope boundaries
Table 7. Region definitions and demand allocation rules
Table 8. Build-up film grade families and property bands
Table 9. CCL grade classes by loss tangent
Table 10. Glass cloth grades and IPC-4412 style classification
Table 11. Glass composition classes
Table 12. Copper foil profile classes and applications
Table 13. Dry film resist resolution classes
Table 14. Substrate platform definitions and material implications
Table 15. AI accelerator package and substrate dimensions
Table 16. Body size and layer count by application
Table 17. Build-up layer count series by application, layers per side
Table 18. Line/space roadmap and material requirement consequences
Table 19. Line/space capability and via formation by process generation
Table 20. Panel formats and utilisation factors by body size class
Table 21. Substrate area and panel consumption at representative body sizes
Table 22. Compound stack yield by per-layer yield and layer count (core yield 98%)
Table 23. Line yield assumptions by platform, layer count and process generation
Table 24. Scrap recovery by material class
Table 25. Announced substrate capacity investment programmes
Table 26. Substrate capacity by region
Table 27. Announced substrate capex programmes
Table 28. Aggregate investment by tier
Table 29. Qualification cycle durations by material class
Table 30. Derivation of accelerator units from packaging wafer supply
Table 31. AI accelerator shipments and substrate area consumption
Table 32. Accelerator shipments by product class
Table 33. HBM contribution to package area
Table 34. HBM generation and interconnect requirements
Table 35. HBM generation, stack construction and package consequence
Table 36. Substrate area consequences of chiplet partitioning
Table 37. Package area and material consequence by partitioning approach
Table 38. Co-packaged optics substrate requirements against organic capability
Table 39. Server CPU and networking ASIC substrate parameters
Table 40. Substrate area by application, 2027 and 2037
Table 41. Dielectric attenuation at PAM4 Nyquist frequencies, dB per inch
Table 42. Material grade requirements by per-lane data rate
Table 43. Scenario definitions, varied inputs and quantified effect
Table 44. Conversion chain, stage by stage
Table 45. Substrates per device by application
Table 46. Layer multipliers by material class, for a substrate with n build-up layers per side
Table 47. Areal density and thickness assumptions by material class and grade
Table 48. Plating allowance and etch loss by line/space class
Table 49. Worked copper accounting, 120 ? 120 mm substrate, 16 build-up layers per side
Table 50. Copper accounting, 120 ? 120 mm substrate, 16 build-up layers per side
Table 51. Combined yield, scrap and utilisation factors
Table 52. Supporting detail: compound stack yield by per-layer yield and layer count, core yield 98%
Table 53. Supporting detail: scrap recovery by material class
Table 54. Panel utilisation by format and body size
Table 55. Utilisation statistics by band and format
Table 56. Purchased area penalty at representative body sizes, 510 ? 515 mm panel
Table 57. Price series requirements and pass-through mechanics by material class
Table 58. Material-to-process mapping matrix
Table 59. Consumption basis and scaling by process step
Table 60. Consumption basis by process step
Table 61. Material-to-platform mapping matrix
Table 62. Relative material consumption index by platform, flip-chip BGA base case = 100
Table 63. Material class segmentation and demand anchors
Table 64. Primary applications by material grade
Table 65. Material composition per substrate, consumed basis
Table 66. Substrate cost breakdown by material class
Table 67. Total material volume 2027–2037
Table 68. Total material value 2027–2037
Table 69. Total material value 2027–2037, US$ million
Table 70. Volume forecast by material class
Table 71. Value forecast by material class
Table 72. Forecast by substrate platform
Table 73. Forecast by application
Table 74. Forecast by region
Table 75. ASP trajectories by material class
Table 76. Scenario comparison against base case
Table 77. Supplied construction and material accounting
Table 78. ABF grade properties: Dk, Df, CTE, Tg, filler loading
Table 79. Dielectric property targets by data rate
Table 80. Filler requirements by film class and line/space capability
Table 81. Process parameters and constraints
Table 82. Resin-coated copper construction
Table 83. Build-up film challengers: company, product, qualification status
Table 84. Qualification stages and duration
Table 85. Build-up film capacity by supplier and site
Table 86. Build-up film single-source exposure
Table 87. Core construction parameters
Table 88. Low-loss CCL grades by supplier
Table 89. CCL supplier capacity by region
Table 90. CCL and prepreg demand forecast
Table 91. Ultra low loss segment within the class, US$ million
Table 92. Glass cloth areal mass and thickness by style
Table 93. Low-Dk and low-Df glass compositions by supplier
Table 94. Low-CTE glass grades and target applications
Table 95. Ultra-thin cloth specifications
Table 96. Glass cloth supplier capacity by grade
Table 97. Constrained grade supply assessment
Table 98. Glass cloth demand forecast by grade
Table 99. Filler types, particle size and loading by application
Table 100. Filler supplier landscape and capacity
Table 101. Filler demand forecast
Table 102. Copper foil thickness ranges and profile classes by application
Table 103. Carrier foil constructions and release layer types
Table 104. Copper skin depth and roughness ratio by frequency
Table 105. Copper foil capacity allocation, substrate versus battery
Table 106. Copper foil demand forecast, tonnes
Table 107. Resist resolution capability by supplier
Table 108. Dry film resist demand forecast
Table 109. Solder resist demand forecast
Table 110. Chemistry consumption per panel by process step
Table 111. Plating chemistry supplier landscape
Table 112. Plating chemistry demand forecast
Table 113. Surface finish types: process, thickness, precious metal content
Table 114. Gold and palladium consumption forecast
Table 115. Cross-material summary: volume, value, CAGR, concentration
Table 116. Quadrant assessment
Table 117. Aggregate versus constrained-grade divergence
Table 118. Mass and value ranking compared
Table 119. Glass core position summary
Table 120. Silicon core assessment
Table 121. Ceramic core assessment
Table 122. Material displacement per m? of non-organic core
Table 123. Non-organic core substitution scenarios
Table 124. Displacement by material class under accelerated adoption, 2037
Table 125. China position summary
Table 126. Japan position summary
Table 127. Korea position summary
Table 128. Taiwan position summary
Table 129. USA position summary
Table 130. Europe position summary
Table 131. Southeast Asia position summary
Table 132. Regional demand by material class 2027–2037, US$ million (2037)
Table 133. Production capacity versus demand balance by region
Table 134. Value chain tiers and participant counts
Table 135. Concentration ratios (CR3, CR5, HHI) by material class
Table 136. Single-source exposure by material class
Table 137. Direct material agreements between OEMs and material suppliers
Table 138. Export controls, trade measures and tariff exposure
Table 139. Upstream input assessment
Table 140. Lead times by material class
Table 141. Supplier landscape structure
Table 142. Multi-material supplier positions by class
Table 143. Regional champion positions
Table 144. Supplier share positions by material class and region, constrained grade
Table 145. Capacity investment tracker 2024–2030
Table 146. Investment ratio, substrate manufacture versus substrate materials
Table 147. Partnerships, JVs and acquisitions 2024–2026
Table 148. New entrant assessment matrix
Table 149. PFAS exposure by material class
Table 150. Regulatory instrument coverage
Table 151. Recovery rates by material stream
Table 152. Embodied carbon by material class
Table 153. Regulatory trajectory and material implications
Table 154. Glossary and abbreviations
Table 155. Consolidated material specification reference
Table 156. Consolidated conversion factors
Table 157. Substrate manufacturer capacity, full detail
Table 158. Regional capacity share

List Of Figures

LIST OF FIGURES

Figure 1. The advanced IC substrate materials stack, exploded cross-section Source: Future Markets.
Figure 2. Material classes mapped to substrate cross-section Source: Future Markets.
Figure 3. Market value by material class 2027–2037 Source: Future Markets.
Figure 4. Market value by region 2027–2037 Source: Future Markets.
Figure 5. Concentration heat map Source: Future Markets.
Figure 6. Material demand growth versus substrate area growth, indexed Source: Future Markets.
Figure 7. Substrate platform cross-sections compared
Figure 8. Body size growth by application
Figure 9. Layer count growth by application
Figure 10. Line/space class adoption timeline, 2024–2037
Figure 11. Panel utilisation versus body size
Figure 12. Compound stack yield as a function of build-up layer count and per-layer yield
Figure 13. Substrate capacity share by region
Figure 14. Material qualification cycle, illustrative timeline
Figure 15. AI accelerator shipments and substrate area
Figure 16. HBM stack height evolution
Figure 17. Package area growth attributable to chiplet adoption
Figure 18. Dielectric attenuation versus frequency by laminate loss class
Figure 19. Five-stage forecast model schematic
Figure 20. Layer multiplier logic by material class
Figure 21. Build-up film composite density versus silica filler loading
Figure 22. Copper mass: deposited, etched and retained
Figure 23. Panel format sensitivity, tornado chart
Figure 24. Substrate process flow with material consumption points
Figure 25. Material mass breakdown for the reference substrate
Figure 26. Substrate cost breakdown, representative AI accelerator substrate
Figure 27. Total material volume, stacked by class
Figure 28. Total material value, stacked by class
Figure 29. Volume CAGR by material class
Figure 30. Regional demand shares, 2027 versus 2037
Figure 31. ASP trajectories indexed to 2027
Figure 32. Scenario fan chart, total market value
Figure 33. ABF cross-section construction
Figure 34. GX to GL series: filler loading, CTE and Dk trends
Figure 35. Vacuum lamination process flow
Figure 36. Melt viscosity versus temperature
Figure 37. ABF-RCC construction and process flow
Figure 38. Challenger qualification status timeline
Figure 39. Build-up film demand 2027–2037
Figure 40. CCL construction cross-section
Figure 41. Loss tangent by resin system
Figure 42. CCL demand 2027–2037
Figure 43. Weave constructions compared Source: Future Markets.
Figure 44. Areal mass versus thickness by style Source: Future Markets.
Figure 45. Dk versus glass composition Source: Future Markets.
Figure 46. Spread-yarn processing schematic Source: Future Markets.
Figure 47. Glass cloth demand by grade 2027–2037 Source: Future Markets.
Figure 48. Filler particle size distributions by grade Source: Future Markets.
Figure 49. Filler demand 2027–2037 Source: Future Markets.
Figure 50. Profile classes: surface roughness compared Source: Future Markets.
Figure 51. Carrier foil construction and release Source: Future Markets.
Figure 52. Roughness versus insertion loss Source: Future Markets.
Figure 53. Capacity allocation by supplier Source: Future Markets.
Figure 54. Copper foil demand 2027–2037 Source: Future Markets.
Figure 55. Resolution capability versus line/space requirement Source: Future Markets.
Figure 56. Plating process flow and chemistry consumption points Source: Future Markets.
Figure 57. Plating chemistry demand 2027–2037 Source: Future Markets.
Figure 58. Surface finish cross-sections compared
Figure 59. Precious metal consumption 2027–2037 Source: Future Markets.
Figure 60. Cross-material growth and concentration Source: Future Markets.
Figure 61. Multilayer ceramic core substrate for advanced semiconductor packaging
Figure 62. 2.5D integration warpage comparison and simulation model
Figure 63. Organic material displacement under three adoption scenarios Source: Future Markets.
Figure 64. Displacement by material class under accelerated adoption Source: Future Markets.
Figure 65. Regional demand by material class
Figure 66. Production versus demand balance
Figure 67. Value chain map, tier by tier
Figure 68. Concentration ratios by material class
Figure 69. Single-source exposure map
Figure 70. Export control exposure by value chain node Source: Future Markets.
Figure 71. Disruption scenario impact Source: Future Markets.
Figure 72. Capacity investment by region and material class Source: Future Markets.
Figure 73. PFAS exposure across the materials stack Source: Future Markets.
Figure 74. Absolics' glass substrate
Figure 75. Glass substrate test units at Intel’s Assembly and Test Technology Development factory.
Figure 76. JNTC Next-Generation Glass Substrate for Semiconductors.