Electronic Thermal Management – Technologies, Materials, Devices, New Developments, Industry Structure and Global Markets
“Thermal management” denotes the array of problem-solving design tools and material technologies that systems manufacturers apply to regulate the unwanted heat caused by the normal functioning of an electronic system. Increasing power densities and decreasing transistor dimensions are hallmarks of modern computer chips. Both trends are increasing the thermal management challenge within the chip and surrounding packaging, as well as accelerating research progress on high conductivity materials.
Dramatic changes are underway in the computer, telecommunications and consumer electronics industries. There is a trend toward systems “convergence,” combining computer, telecommunications and consumer system functions all into one system. There is also a trend toward micro-miniaturization and microsystem technologies integrating digital, optical, radio frequency and microelectromechanical systems (MEMS) devices. Microsystem packaging is at the heart of all of these products, since it is this technology that provides the system integration in addition to controlling the size, performance, reliability and cost of the final microsystem.
High-density packaging has been the trend in electronic circuits during the last decade, and that will continue for at least the next five years. In 2013, a typical megaprocessor could pack a staggering 41 million transistors onto a single chip. Running flat out, that chip would dissipate 130 watts of heat – more than a bright household light bulb – from an area the size of a postage stamp.
The trend line of the thermal management industry aligns with the developments of technology in the semiconductor, microprocessor and computer industries. For every advance in performance of these systems, there is a corresponding increase in the operating heat generated by the system. To simply say, however, that demands for thermal management products have increased as the requirements of applications have increased, does not do justice to the unique character of this industry. It is probably more accurate to state that the development of thermal management as an industry is the result of a synergy of solutions constantly engineered to manage excess heat in today’s electronic systems.
STUDY GOAL AND OBJECTIVES
The goal of this iRAP report is to provide an up-to-date analysis of recent developments and current trends in the global thermal management marketplace. The identification of significant drivers of revenue growth in specific product categories is an additional aim. The objective of this kind of systematic research is to quantify the projected impact of the forces — from within and from outside — at work on this industry today.
Products in this report have been grouped into four segments – hardware, software, interfaces and substrates. Product sub-segments within the hardware segment include heat sinks, fans and blowers, fan sinks, heat pipes, and cold plates – chosen because they are established technologies and represent revenue markets of significant size. The software segment focuses on modeling and analysis of the thermal characteristics of an electronic system. While the interface product line primarily attaches the heat sink to the system, several other product sub-segments in this technology are being applied to dissipate heat in applications where there is no room for a conventional heat sink. The categories of interfaces covered in this segment are thermal grease, thermal compounds, thermal pads, adhesive films and tapes, and epoxy. Finally, the report looks at substrates, focusing on two emerging package and component level products, thermally enhanced packages and heat spreaders.
Besides targeting the conventional market of thermal management products and solutions related to electronics usage in computers, telecomm, automotive, consumer, medical/office and industrial/military equipment, the report addresses electronics used in new applications such as high-power LEDs, power circuits used in renewal power (wind and solar) stations, high-performance embedded computing (HPEC) working at more than 5GHz frequency, and the growing industrial usage of electronics in laser machining and industrial robots.
The report also briefly discusses recent research work done on cooling solutions to address complex heat issues arising in commercialization of new three-dimensional integrated circuit (3DIC) chips intended for use in computers, tablets, cellular phones, set-top boxes, LCD monitors, digital cameras and video game consoles.
REASONS FOR DOING THE STUDY
Development within the thermal industry is one of the most interesting sub-plots of the rapid innovation in the high-tech area. As the drive to achieve higher levels of device integration while reducing cost, size and complexity continues, the issue of managing heat and power dissipation has become very significant. Economic and market forces also are important factors. Consequently, current trends (market and technology), as well as potential breakthroughs in the near- and long-term future, become very important.
CONTRIBUTIONS OF THE STUDY
The information presented here is for suppliers participating in the thermal management market with a vital interest in the market potential of a specific technology in one of the product segment markets. This study should also be of interest to companies in the electronic materials, software and other industries, that have an interest in the potential of their products in a thermal management application. In addition, because of this report’s business focus, it should be of use to executives and business managers as an up-to-the-minute guide to current conditions that are expected to be significant in tomorrow’s markets.
FORMAT AND SCOPE
The scope of this report is broad, and covers several product areas. The individual materials, hardware and software product segments are presented in terms of market size and revenue trends. The revenue forecasts are explained in terms of the key market issue for a specific product segment, and are projected for five years from 2013 to 2018. The application section features forecasts for the most important applications by product. The technology discussion concentrates on trends that will develop more significantly during the forecast period. The report also includes a discussion on the competitive aspects of each product segment, along with several successful suppliers’ strategies in the market. A current industry directory, a survey of U.S. thermal management patents from Jan. 2010 to Jan. 2014, and profiles of a selection of the leading thermal management suppliers are also included.
TO WHOM THE STUDY CATERS
The study will benefit existing and new manufacturers of electronic thermal management products, service providers and solution providers. This study also provides a technical overview of electronic thermal management products, service providers and solution providers, especially recent technology developments and existing barriers. Therefore, audiences for this study include marketing executives, business unit managers and other decision makers working in the area of electronic thermal management, as well as those in companies peripheral to these businesses.
REPORT SUMMARY
The thermal management industry is moving toward comprehensive solutions to cool electronics. As a result, the dynamic in this market has not been one where there is a move toward a single technology or product that replaces others. The tendency is for systems designers to look at the entire problem and evaluate multiple options and combinations for a solution.
There are four main segments in thermal management technologies – hardware, software, interfaces, and substrates.
Components of thermal management pave the way for the electronics industry to develop high-performance applications. This report examines the range of thermal management products and solutions in the market today.
The worldwide market for thermal management products is predicted to grow from about $8.8 billion in 2013 to $15.56 billion by 2018, at an average annual growth rate (CAGR) of 12.1%.
Dramatic changes are underway in the computer, telecommunications and consumer electronics industries. There is a trend toward systems “convergence,” combining computer, telecommunications and consumer system functions all into one system. There is also a trend toward micro-miniaturization and microsystem technologies integrating digital, optical, radio frequency and microelectromechanical systems (MEMS) devices. Microsystem packaging is at the heart of all of these products, since it is this technology that provides the system integration in addition to controlling the size, performance, reliability and cost of the final microsystem.
High-density packaging has been the trend in electronic circuits during the last decade, and that will continue for at least the next five years. In 2013, a typical megaprocessor could pack a staggering 41 million transistors onto a single chip. Running flat out, that chip would dissipate 130 watts of heat – more than a bright household light bulb – from an area the size of a postage stamp.
The trend line of the thermal management industry aligns with the developments of technology in the semiconductor, microprocessor and computer industries. For every advance in performance of these systems, there is a corresponding increase in the operating heat generated by the system. To simply say, however, that demands for thermal management products have increased as the requirements of applications have increased, does not do justice to the unique character of this industry. It is probably more accurate to state that the development of thermal management as an industry is the result of a synergy of solutions constantly engineered to manage excess heat in today’s electronic systems.
STUDY GOAL AND OBJECTIVES
The goal of this iRAP report is to provide an up-to-date analysis of recent developments and current trends in the global thermal management marketplace. The identification of significant drivers of revenue growth in specific product categories is an additional aim. The objective of this kind of systematic research is to quantify the projected impact of the forces — from within and from outside — at work on this industry today.
Products in this report have been grouped into four segments – hardware, software, interfaces and substrates. Product sub-segments within the hardware segment include heat sinks, fans and blowers, fan sinks, heat pipes, and cold plates – chosen because they are established technologies and represent revenue markets of significant size. The software segment focuses on modeling and analysis of the thermal characteristics of an electronic system. While the interface product line primarily attaches the heat sink to the system, several other product sub-segments in this technology are being applied to dissipate heat in applications where there is no room for a conventional heat sink. The categories of interfaces covered in this segment are thermal grease, thermal compounds, thermal pads, adhesive films and tapes, and epoxy. Finally, the report looks at substrates, focusing on two emerging package and component level products, thermally enhanced packages and heat spreaders.
Besides targeting the conventional market of thermal management products and solutions related to electronics usage in computers, telecomm, automotive, consumer, medical/office and industrial/military equipment, the report addresses electronics used in new applications such as high-power LEDs, power circuits used in renewal power (wind and solar) stations, high-performance embedded computing (HPEC) working at more than 5GHz frequency, and the growing industrial usage of electronics in laser machining and industrial robots.
The report also briefly discusses recent research work done on cooling solutions to address complex heat issues arising in commercialization of new three-dimensional integrated circuit (3DIC) chips intended for use in computers, tablets, cellular phones, set-top boxes, LCD monitors, digital cameras and video game consoles.
REASONS FOR DOING THE STUDY
Development within the thermal industry is one of the most interesting sub-plots of the rapid innovation in the high-tech area. As the drive to achieve higher levels of device integration while reducing cost, size and complexity continues, the issue of managing heat and power dissipation has become very significant. Economic and market forces also are important factors. Consequently, current trends (market and technology), as well as potential breakthroughs in the near- and long-term future, become very important.
CONTRIBUTIONS OF THE STUDY
The information presented here is for suppliers participating in the thermal management market with a vital interest in the market potential of a specific technology in one of the product segment markets. This study should also be of interest to companies in the electronic materials, software and other industries, that have an interest in the potential of their products in a thermal management application. In addition, because of this report’s business focus, it should be of use to executives and business managers as an up-to-the-minute guide to current conditions that are expected to be significant in tomorrow’s markets.
FORMAT AND SCOPE
The scope of this report is broad, and covers several product areas. The individual materials, hardware and software product segments are presented in terms of market size and revenue trends. The revenue forecasts are explained in terms of the key market issue for a specific product segment, and are projected for five years from 2013 to 2018. The application section features forecasts for the most important applications by product. The technology discussion concentrates on trends that will develop more significantly during the forecast period. The report also includes a discussion on the competitive aspects of each product segment, along with several successful suppliers’ strategies in the market. A current industry directory, a survey of U.S. thermal management patents from Jan. 2010 to Jan. 2014, and profiles of a selection of the leading thermal management suppliers are also included.
TO WHOM THE STUDY CATERS
The study will benefit existing and new manufacturers of electronic thermal management products, service providers and solution providers. This study also provides a technical overview of electronic thermal management products, service providers and solution providers, especially recent technology developments and existing barriers. Therefore, audiences for this study include marketing executives, business unit managers and other decision makers working in the area of electronic thermal management, as well as those in companies peripheral to these businesses.
REPORT SUMMARY
The thermal management industry is moving toward comprehensive solutions to cool electronics. As a result, the dynamic in this market has not been one where there is a move toward a single technology or product that replaces others. The tendency is for systems designers to look at the entire problem and evaluate multiple options and combinations for a solution.
There are four main segments in thermal management technologies – hardware, software, interfaces, and substrates.
Components of thermal management pave the way for the electronics industry to develop high-performance applications. This report examines the range of thermal management products and solutions in the market today.
The worldwide market for thermal management products is predicted to grow from about $8.8 billion in 2013 to $15.56 billion by 2018, at an average annual growth rate (CAGR) of 12.1%.
INTRODUCTION
STUDY GOALS AND OBJECTIVES
REASONS FOR DOING THE STUDY
CONTRIBUTIONS OF THE STUDY
SCOPE AND FORMAT
METHODOLOGY
INFORMATION SOURCES
WHOM THE STUDY CATERS TO
AUTHOR’S CREDENTIALS
EXECUTIVE SUMMARY
SUMMARY TABLE WORLDWIDE REVENUE FOR THE THERMAL MANAGEMENT MARKET, 2013 AND 2018
SUMMARY FIGURE WORLDWIDE REVENUES FOR THE THERMAL MANAGEMENT MARKET, 2013 AND 2018
INDUSTRY OVERVIEW
AN OVERVIEW OF THERMAL MANAGEMENT
INDUSTRY DRIVERS
TABLE 1 NEW ELECTRONICS DEVELOPMENTS IMPACTING
THERMAL MANAGEMENT PRODUCTS, 2013-2018
TABLE 1 NEW ELECTRONICS DEVELOPMENTS IMPACTING
TECHNOLOGY
PHYSICAL ISSUES
FIGURE 1 MAJOR CAUSES OF ELECTRONIC FAILURE
MARKET OVERVIEW
TABLE 2 WORLD THERMAL MANAGEMENT REVENUE ACCORDING
TO PRODUCT CATEGORIES, 2013 AND 2018
INDUSTRY DRIVERS AND STRUCTURE
FIGURE 2 TECHNOLOGY NEEDS AS A DRIVER FOR THERMAL MANAGEMENT
INDUSTRY STRUCTURE
MERGERS AND ACQUISITIONS
TABLE 3 MERGERS, ACQUISITIONS AND NEW FUNDINGS IN ELECTRONICS THERMAL MANAGEMENT FROM 2008 THROUGH 2013
TABLE 4 RESEARCH ORGANIZATIONS AND COMPANIES ACTIVELY ENGAGED IN ELECTRONIC THERMAL MANAGEMENT IN 2013
TABLE 5 LEADING THERMAL CONSULTANTS AND INTEGRATORS
TECHNOLOGY OVERVIEW
THERMAL MANAGEMENT
EFFECTIVE THERMAL DESIGN FOR ELECTRONIC SYSTEMS
CONCEPT DEVELOPMENT PHASE PROCESS AND THERMAL TOOLS
DETAILED DESIGN PHASE PROCESS AND THERMAL TOOLS
HARDWARE TEST PHASE PROCESS AND THERMAL TOOLS
TECHNICAL PROPERTIES
TABLE 6 THERMAL PROPERTIES OF MATERIALS
ELECTRONIC THERMAL MANAGEMENT MATERIALS
COMPOSITES
TABLE 7 METAL MATRIX COMPOSITES
CERAMICS
ALUMINA (Al2O3)
ALUMINUM NITRIDE (AlN)
SILICON CARBIDE (SiC)
ALUMINUM SILICON CARBIDE (AlSiC)
BERYLLIUM OXIDE (BeO)
OTHER THERMAL MANAGEMENT MATERIALS
CONDUCTORS
HIGH PERFORMANCE THERMAL MANAGEMENT MATERIALS
ADVANCED THERMAL SOLUTIONS IN PRACTICE IN 2013
FIGURE 3 LIQUID COOLING LOOP FOR HIGH PERFORMANCE ELECTRONICS
CASE STUDY 1: THERMOELECTRIC COOLERS IN MODULE COOLING ENHANCEMENT
CASE STUDY 2: SIGNIFICANCE IN CONTEMPORARY DATA CENTERS
CASE STUDY 3: COOLING METHODS FOR INDUSTRIAL ELECTRONICS
CASE STUDY 4: HIGH-POWER LEDS
FIGURE 4 TYPICAL USAGE OF FAN-COOLED HEAT SINK IN HIGH-POWER LED ASSEMBLY
CASE STUDY 5: WIND POWER GENERATION
CASE STUDY 6: SOLAR GRID-CONNECTED PHOTOVOLTAIC (PV) GENERATION
GLOBAL ELECTRONIC THERMAL MANAGEMENT MARKETS
THERMAL MANAGEMENT PRODUCT CATEGORIES AND MARKETS
PRODUCT SUMMARY FORECASTS
TABLE 8 GLOBAL REVENUE BY PRODUCT CATEGORY, 2013 AND 2018
FIGURE 5 GLOBAL REVENUE BY PRODUCT CATEGORY, 2013 AND 2018.
GLOBAL AND REGIONAL TRENDS FOR THERMAL MANAGEMENT
TABLE 9 GLOBAL REVENUE BY REGION, 2013 AND 2018
FIGURE 6 WORLD THERMAL MANAGEMENT REVENUE BY REGION, 2013 AND 2018
NORTH AMERICA
EUROPE
ASIA/PACIFIC
JAPAN
THERMAL MANAGEMENT END USE APPLICATION TRENDS AND
MARKETS
TABLE 10 GLOBAL HARDWARE REVENUE BY APPLICATION, 2013 AND 2018
FIGURE 7 GLOBAL REVENUE BY APPLICATION, 2013 AND 2018
COMPUTERS
TABLE 11 GLOBAL REVENUE – COMPUTER APPLICATIONS, 2013 AND 2018
TELECOM
TABLE 12 GLOBAL REVENUE – TELECOM APPLICATIONS, 2013 AND 2018
Telecom and network industry challenges
AUTOMOTIVE INDUSTRY
TABLE 13 GLOBAL REVENUE – AUTOMOTIVE APPLICATIONS, 2013 AND 2018
CONSUMER PRODUCTS
TABLE 14 GLOBAL REVENUE – CONSUMER PRODUCTS, 2013 AND 2018
MEDICAL/OFFICE EQUIPMENT
TABLE 15 GLOBAL REVENUE – MEDICAL/OFFICE APPLICATIONS, 2013 AND 2018
INDUSTRIAL/MILITARY EQUIPMENT
TABLE 16 GLOBAL REVENUE – INDUSTRIAL/MILITARY
APPLICATIONS, 2013 AND 2018
INDUSTRY STUCTURE MARKET SHARES
THERMAL MANAGEMENT HARDWARE MARKET
TABLE 17 GLOBAL HARDWARE REVENUES, 2013 AND 2018
Global and regional trends for thermal management hardware
TABLE 18 GLOBAL HARDWARE REVENUE BY REGION, 2013 AND 2018
Thermal management hardware end use application trends
TABLE 19 GLOBAL HARDWARE REVENUE BY APPLICATION, 2013 AND 2018
Thermal management hardware sub-product categories
TABLE 20 GLOBAL HARDWARE REVENUE BY SUB-PRODUCTS, 2013 AND 2018
FIGURE 8 GLOBAL HARDWARE REVENUE BY SUB-PRODUCTS, 2013 AND 2018
Fans and blowers: overview
TABLE 21 FANS AND BLOWERS END USE APPLICATIONS, 2013 AND 2018
Heat sinks: overview
TABLE 22 HEAT SINKS END USE APPLICATIONS, 2013 AND 2018
Heat pipes: overview
TABLE 23 HEAT PIPES END USE APPLICATIONS, 2013 AND 2018
Fan sinks: overview
TABLE 24 FAN SINKS END USE APPLICATIONS, 2013 AND 2018
Cold plates: overview
TABLE 25 COLD PLATES END USE APPLICATIONS, 2013 AND 2018
Thermoelectric coolers: overview
TABLE 26 THERMOELECTRIC COOLERS END USE APPLICATIONS, 2013 AND 2018
New developments in hardware
FIGURE 9 LIQUID COOLING OF ELECTRONICS SYSTEMS
TABLE 27 MAJOR DEVELOPMENTS IN HARDWARE IN ELECTRONICS THERMAL MANAGEMENT PRACTICES
THERMAL MANAGEMENT SOFTWARE
WORLDWIDE MARKET FORECAST
TABLE 28 GLOBAL SOFTWARE REVENUES, 2013 AND 2018
THERMAL SOFTWARE MODELING OPTIONS
GLOBAL AND REGIONAL TRENDS FOR THERMAL MANAGEMENT SOFTWARE
TABLE 29 SOFTWARE REVENUE BY REGION, 2013 AND 2018
THERMAL MANAGEMENT SOFTWARE END USE APPLICATION TRENDS
TABLE 30 SOFTWARE REVENUE BY APPLICATION, 2013 AND 2018
FIGURE 10 SOFTWARE REVENUE BY APPLICATION, 2013 AND 2018
TABLE 31 COMPUTER APPLICATIONS SOFTWARE SHARES, 2013 AND 2018
THERMAL MANAGEMENT SOFTWARE SUB-PRODUCT CATEGORIES
TABLE 32 SOFTWARE REVENUE BY SUB-PRODUCTS, 2013 AND 2018
CFD: overview
TABLE 33 CFD END USE APPLICATIONS, 2013 AND 2018
CHT: overview
TABLE 34 CHT END USE APPLICATIONS, 2013 AND 2018
Circuit design: overview
TABLE 35 CIRCUIT DESIGN END USE APPLICATIONS, 2013 AND 2018
Power management: overview
TABLE 36 POWER MANAGEMENT END USE APPLICATIONS, 2013 AND 2018
Other software: overview
TABLE 37 OTHER SOFTWARE END USE APPLICATIONS, 2013 AND 2018
TECHNOLOGY TRENDS IN THERMAL MANAGEMENT SOFTWARE
TABLE 38 NEW DEVELOPMENTS IN SOFTWARE RELATED TO ELECTRONIC THERMAL MANAGEMENT
SOFTWARE INDUSTRY STRUCTURE AND MARKET SHARES
TABLE 39 MARKET SHARES OF MAJOR VENDORS – GLOBAL SOFTWARE MARKET FOR THERMAL MANAGEMENT, 2013
FIGURE11 MAJOR VENDORS IN THE GLOBAL THERMAL MANAGEMENT
SOFTWARE MARKET, 2013
THERMAL MANAGEMENT INTERFACE MATERIALS
WORLDWIDE MARKET FORECAST
TABLE 40 GLOBAL INTERFACE REVENUES, 2013 AND 2018
GLOBAL AND REGIONAL TRENDS FOR THERMAL MANAGEMENT INTERFACE
TABLE 41 INTERFACE REVENUE BY REGION, 2013 AND 2018
THERMAL MANAGEMENT INTERFACE END USE APPLICATION TRENDS
TABLE 42 GLOBAL INTERFACE REVENUE BY APPLICATION, 2013 AND 2018
FIGURE 12 GLOBAL INTERFACE REVENUE BY APPLICATION, 2013 AND 2018
THERMAL MANAGEMENT INTERFACE SUB-PRODUCT CATEGORIES
TABLE 43 GLOBAL THERMAL MANAGEMENT INTERFACE
REVENUE BY SUB-PRODUCTS, 2013 AND 2018
Thermal grease: overview
TABLE 44 GLOBAL GREASE END USE APPLICATIONS, 2013 AND 2018
Thermal compounds: overview
TABLE 45 GLOBAL THERMAL COMPOUND END USE
APPLICATIONS,2013 AND 2018
Thermal pads: overview
TABLE 46 GLOBAL THERMAL PADS END USE APPLICATIONS, THROUGH 2018
Adhesive film and tape: overview
TABLE 47 GLOBAL ADHESIVE FILM AND TAPE END USE APPLICATIONS,2013 AND 2018
Epoxy: overview
TABLE 48 GLOBAL EPOXY END USE APPLICATIONS, 2013 TO 2018
TECHNOLOGY TRENDS IN THERMAL MANAGEMENT INTERFACE
TABLE 49 EXAMPLES OF THERMAL INTERFACE PROPERTIES
TRENDS IN THERMAL MANAGEMENT INTERFACE
TABLE 50 NEW DEVELOPMENTS IN THERMAL INTERFACE MATERIALS RELATED TO ELECTRONIC THERMAL MANAGEMENT IN 2013
TIM INDUSTRY STUCTURE AND MARKET SHARES
TABLE 51 MARKET SHARES OF MAJOR VENDORS – GLOBAL INTERFACE MARKET, 2013
FIGURE 13 TOP VENDORS – GLOBAL INTERFACE MARKET, 2002
THERMAL MANAGEMENT SUBSTRATES
WORLDWIDE MARKET FORECAST
TABLE 52 GLOBAL THERMAL MANAGEMENT SUBSTRATE REVENUES, THROUGH 2018
GLOBAL AND REGIONAL TRENDS FOR SUBSTRATE
TABLE 53 SUBSTRATE REVENUE BY REGION, 2013 AND 2018
SUBSTRATE END USE APPLICATION TRENDS
TABLE 54 GLOBAL SUBSTRATE REVENUE BY APPLICATION, THROUGH 2018 ($ MILLIONS)
FIGURE 14 GLOBAL SUBSTRATE REVENUE BY APPLICATION, 2013 AND 2018
THERMAL MANAGEMENT SUBSTRATE SUB-PRODUCT CATEGORIES
TABLE 55 SUBSTRATE REVENUE BY SUB-PRODUCTS, THROUGH 2018
Thermally-enhanced packages: overview
TABLE 56 GLOBAL THERMALLY-ENHANCED PACKAGES END
USE APPLICATIONS, 2013 AND 2018
Heat spreader: overview
Heat spreader: overview (CONT.)
TABLE 57 GLOBAL THERMAL MANAGEMENT HEAT SPREADERS
END-USE APPLICATIONS, THROUGH 2008
Technology trends in substrates
TABLE 58 NEW DEVELOPMENTS IN THERMAL SUBSTRATES MATERIALS RELATED TO ELECTRONIC THERMAL MANAGEMENT IN 2013
INDUSTRY STUCTURE MARKET SHARES
TABLE 59 MARKET SHARES OF MAJOR VENDORS – GLOBAL SUBSTRATE MARKET, 2013
FIGURE 15 MARKET SHARES OF MAJOR VENDORS – GLOBAL SUBSTRATE MARKET, 2013
PATENTS AND PATENT ANALYSIS
TABLE 60 NUMBER OF U.S. THERMAL MANAGEMENT PATENTS, 2010-2014
OVERVIEW OF U.S. PATENT ACTIVITY IN THERMAL MANAGEMENT
TABLE 61 NUMBER OF U.S. ELECTRONIC THERMAL
MANAGEMENT PATENTS ASSIGNED BY REGION, FROM
JANUARY 2010 THROUGH FEBRUARY 2014
PATENTS: THERMAL MANAGEMENT HARDWARE
TABLE 62 TOP U.S. ELECTRONIC THERMAL MANAGEMENT HARDWARE PATENT ASSIGNEES, JANUARY 2010 TO FEBRUARY 2014
FIGURE 16 TOP U.S. ELECTRONIC THERMAL MANAGEMENT HARDWARE PATENT ASSIGNEES, JANUARY 2010 TO FEBRUARY 2014
PUMP AND FAN CONTROL CONCEPTS IN A COOLING SYSTEM
SEMICONDUCTOR PACKAGE THERMAL TAPE WINDOW FRAME FOR HEAT SINK ATTACHMENT
THERMOELECTRIC DEVICES INCLUDING THERMOELECTRIC ELEMENTS HAVING OFF-SET METAL PADS AND RELATED STRUCTURES, METHODS, AND SYSTEMS
ASSEMBLIES AND METHODS FOR DISSIPATING HEAT FROM
HANDHELD ELECTRONIC DEVICES
COOLING SYSTEMS INCORPORATING HEAT EXCHANGERS AND THERMOELECTRIC LAYERS
ASSEMBLIES AND METHODS FOR DISSIPATING HEAT FROM HANDHELD ELECTRONIC DEVICES
HEAT SINK FOR LED LIGHT BULB
BONDED METAL AND CERAMIC PLATES FOR THERMAL MANAGEMENT OF OPTICAL AND ELECTRONIC DEVICES
HEAT SINK BASE PLATE WITH HEAT PIPE
MICROHEAT EXCHANGER FOR LASER DIODE COOLING
DEVICE AND METHODOLOGY FOR THE REMOVAL OF HEAT FROM AN EQUIPMENT RACK BY MEANS OF HEAT EXCHANGERS MOUNTED TO A DOOR
SYSTEMS AND ASSOCIATED METHODS FOR CONTROLLABLY COOLING COMPUTER COMPONENTS
CLAMP-TYPE HEAT SINK FOR MEMORY
METHODS OF FORMING EMBEDDED THERMOELECTRIC COOLERS WITH ADJACENT THERMALLY CONDUCTIVE FIELDS
HOLISTIC THERMAL MANAGEMENT SYSTEM FOR A
SEMICONDUCTOR CHIP
HEAT SINK FOR MEMORY AND MEMORY DEVICE HAVING HEAT SINK
SOLAR POWER SYSTEM WITH TOWER TYPE HEAT DISSIPATING STRUCTURE
THERMALLY CONDUCTIVE STRUCTURE OF LED AND MANUFACTURING METHOD THEREOF
AIRFLOW INTAKE SYSTEMS AND ASSOCIATED METHODS FOR USE WITH COMPUTER CABINETS
METHOD OF FABRICATING HIGH SURFACE TO VOLUME RATIO STRUCTURES AND THEIR INTEGRATION IN MICROHEAT EXCHANGERS FOR LIQUID COOLING SYSTEM
OPTIMAL SPREADER SYSTEM, DEVICE AND METHOD FOR FLUID COOLED MICRO-SCALED HEAT EXCHANGE
METHODOLOGY OF COOLING MULTIPLE HEAT SOURCES IN A PERSONAL COMPUTER THROUGH THE USE OF MULTIPLE FLUID-BASED HEAT EXCHANGING LOOPS COUPLED VIA MODULAR BUS-TYPE HEAT EXCHANGERS
HEAT DISSIPATION DEVICE
METHODS OF FORMING THERMOELECTRIC DEVICES USING ISLANDS OF THERMOELECTRIC MATERIAL AND RELATED STRUCTURES
THERMAL MANAGEMENT SOFTWARE PATENTS
TABLE 63 TOP U.S. ELECTRONIC THERMAL MANAGEMENT SOFTWARE PATENT ASSIGNEES, JANUARY 2010 THROUGH FEBRUARY 2014
FIGURE 17 TOP U.S. ELECTRONIC THERMAL MANAGEMENT SOFTWARE PATENT ASSIGNEES, JANUARY 2010 THROUGH FEBRUARY 2014
THERMAL ANALYSIS
SYSTEM AND METHOD FOR ACCESSING A MULTIPHYSICS MODELING SYSTEM VIA A DESIGN SYSTEM USER INTERFACE
MODEL-BASED FILL
MODEL-BASED DESIGN VERIFICATION
MODELING AND SIMULATION METHOD
METHOD AND APPARATUS FOR MULTI-DIE THERMAL ANALYSIS
REDUCING THE SIZE OF A MODEL USING VISIBILITY FACTORS
SIMULATION AND CORRECTION OF MASK SHADOWING EFFECT
METHOD FOR ASSEMBLING THE FINITE ELEMENT
DISCRETIZATION OF ARBITRARY WEAK EQUATIONS
SELECTIVELY REDUCING THE NUMBER OF CELL EVALUATIONS IN A HARDWARE SIMULATION
LOCALLY UPDATING A THREE-DIMENSIONAL MODEL
SYSTEMS, METHODS, AND TOOLS FOR PROOFING A
COMPUTER-AIDED DESIGN OBJECT
PROCESS FOR DISPLAYING OBJECTS OF A PLM DATABASE AND APPARATUS IMPLEMENTING THIS PROCESS
PATENTS: THERMAL MANAGEMENT INTERFACE
TABLE 64 TOP U.S. ELECTRONIC THERMAL MANAGEMENT INTERFACE MATERIALS PATENT ASSIGNEES, JANUARY 2010 TO FEBRUARY 2014
FIGURE 18 TOP U.S. ELECTRONIC THERMAL MANAGEMENT INTERFACE MATERIALS PATENT ASSIGNEES, JANUARY 2010 TO FEBRUARY 2014
THERMAL INTERFACE MATERIAL WITH THIN TRANSFER FILM OR METALLIZATION
THERMALLY CONDUCTIVE DEVICE WITH A THERMAL INTERFACE MATERIAL
METHOD AND SYSTEM FOR ALIGNMENT OF GRAPHITE NANOFIBERS FOR ENHANCED THERMAL INTERFACE MATERIAL PERFORMANCE
SYSTEM INCLUDING THERMAL CONTROL UNIT HAVING CONDUIT FOR DISPENSE AND REMOVAL OF LIQUID THERMAL INTERFACE MATERIAL
THERMAL INTERFACE MATERIALS AND METHODS FOR MAKING THEREOF
REINFORCED RESIN-DERIVED CARBON FOAM
FLEXIBLE GRAPHITE FLOORING HEAT SPREADER
THERMAL INTERFACE MATERIAL AND SEMICONDUCTOR COMPONENT INCLUDING THE THERMAL INTERFACE MATERIAL
UNIFORM GRAPHITE PLATE
HIGH STRENGTH MONOLITHIC CARBON FOAM
THERMAL MANAGEMENT OF ELECTRONIC DEVICES
HIGHLY THERMALLY-CONDUCTIVE MOLDABLE THERMOPLASTIC COMPOSITES AND COMPOSITIONS
HEAT SPREADER FOR PLASMA DISPLAY PANEL
METHOD FOR PACKAGING THERMAL INTERFACE MATERIALS
THERMAL INTERFACE WITH NON-TACKY SURFACE
CARBON FOAM EVAPORATOR
DIMENSIONALLY STABLE, LEAK-FREE GRAPHITE SUBSTRATE
CARBON FOAM CORE PANELS
METHOD AND ARRANGEMENT FOR COOLING A SUBSTRATE, PARTICULARLY A EMICONDUCTOR
CARBON FOAM WITH SUPPLEMENTAL MATERIAL
HEAT SPREADING CIRCUIT ASSEMBLY
LAYOUT OF POWER SEMICONDUCTOR CONTACTS ON A COOLING SURFACE
ENHANCED DIRECTIONAL CONDUCTIVITY OF GRAPHITIZABLE FOAM
SANDWICHED THERMAL SOLUTION
AREA WEIGHT UNIFORMITY FLEXIBLE GRAPHITE SHEET MATERIAL
CARBON FOAM STRUCTURAL INSULATED PANEL
THERMALLY AND ELECTRICALLY CONDUCTIVE INTERCONNECT STRUCTURES
REINFORCED RESIN-DERIVED CARBON FOAM
THERMOFORMED PLATFORM
HEAT SPREADER FOR DISPLAY PANEL
HIGH PURITY NUCLEAR GRAPHITE
LOW CTE HIGHLY ISOTROPIC GRAPHITE
PATENTS: THERMAL MANAGEMENT SUBSTRATES
TABLE 65 TOP U.S. ELECTRONIC THERMAL MANAGEMENT SUBSTRATES PATENT ASSIGNEES, JANUARY 2010 TO
FEBRUARY 2014
FIGURE 19 TOP U.S. ELECTRONIC THERMAL MANAGEMENT SUBSTRATES PATENT ASSIGNEES, JANUARY 2010 TO FEBRUARY 2014
HEAT SPREADER FOR CENTER GATE MOLDING
HEAT SPREADER AS MECHANICAL REINFORCEMENT FOR ULTRA-THIN DIE
USER-SERVICEABLE LIQUID DIMM COOLING SYSTEM
COOLING MEMORY MODULES USING COLD PLATE BLADES COUPLED TO THE MEMORY MODULES VIA CLIPS
THREE-DIMENSIONAL SEMICONDUCTOR ASSEMBLY BOARD
WITH BUMP/FLANGE SUPPORTING BOARD, CORELESS
SEMICONDUCTOR DEVICE WITH HEAT SPREADER
BUILD-UP CIRCUITRY AND BUILT-IN ELECTRONIC DEVICE
BALL GRID ARRAY PACKAGE WITH IMPROVED THERMAL CHARACTERISTICS
ON-CHIP HEAT SPREADER
SEMICONDUCTOR PACKAGE WITH THERMAL HEAT
SPREADER
ON-CHIP HEAT SPREADER
METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEAT SPREADER WITH AN ESD PROTECTION LAYER
SEMICONDUCTOR CHIP ASSEMBLY WITH BUMP/BASE HEAT SPREADER AND DUAL-ANGLE CAVITY IN BUMP
ENHANCED THERMAL MANAGEMENT OF 3-D STACKED DIE PACKAGING
HEAT DISSIPATION DEVICE
METHOD OF FORMING ELECTRONIC PACKAGE HAVING FLUID-CONDUCTING CHANNEL
SEMICONDUCTOR DEVICE THERMAL CONNECTION
BALL GRID ARRAY PACKAGE STACKING SYSTEM
BALL GRID ARRAY PACKAGE SYSTEM
DIE-UP BALL GRID ARRAY PACKAGE WITH DIE-ATTACHED HEAT SPREADER
PACKAGING OF INTEGRATED CIRCUITS WITH CARBON NANOTUBE ARRAYS TO ENHANCE HEAT DISSIPATION THROUGH A THERMAL INTERFACE
SILICON CARBIDE SEMICONDUCTOR DEVICE HAVING JUNCTION FIELD EFFECT TRANSISTOR AND METHOD FOR MANUFACTURING THE SAME
METHOD OF MANUFACTURING SILICON CARBIDE
SEMICONDUCTOR DEVICE
METHOD OF MANUFACTURING SILICON CARBIDE
SEMICONDUCTOR DEVICE
APPENDIX I - PROFILES OF COMPANIES PRODUCING AND SUPPLYING ELECTRONIC THERMAL MANAGEMENT HARDWARE
AAVID THERMAL TECHNOLOGIES
ADDA-TAIWAN
WAKEFIELD-VETTE
XCELAERO CORPORATION
APPENDIX II - PROFILES OF COMPANIES PRODUCING AND SUPPLYING ELECTRONIC THERMAL MANAGEMENT SOFTWARES
AAVID DESIGN
ADVANCED THERMAL SOLUTIONS, INC.
SYNOPSYS, INC.
THERMACORE, INC.
APPENDIX III - PROFILES OF COMPANIES PRODUCING AND SUPPLYING ELECTRONIC THERMAL MANAGEMENT INTERFACE MATERIALS
3M
AOS THERMAL COMPOUNDS
T-GLOBAL THERMAL TECHNOLOGY CO., LTD.
WAKEFIELD–VETTE, INC.
APPENDIX IV - PROFILES OF COMPANIES PRODUCING AND SUPPLYING ELECTRONIC THERMAL MANAGEMENT SUBSTRATES
AMKOR ELECTRONICS, INC.
ASAT
SUMITOMO ELECTRIC U.S.A., INC.
VISHAY SILICONIX
STUDY GOALS AND OBJECTIVES
REASONS FOR DOING THE STUDY
CONTRIBUTIONS OF THE STUDY
SCOPE AND FORMAT
METHODOLOGY
INFORMATION SOURCES
WHOM THE STUDY CATERS TO
AUTHOR’S CREDENTIALS
EXECUTIVE SUMMARY
SUMMARY TABLE WORLDWIDE REVENUE FOR THE THERMAL MANAGEMENT MARKET, 2013 AND 2018
SUMMARY FIGURE WORLDWIDE REVENUES FOR THE THERMAL MANAGEMENT MARKET, 2013 AND 2018
INDUSTRY OVERVIEW
AN OVERVIEW OF THERMAL MANAGEMENT
INDUSTRY DRIVERS
TABLE 1 NEW ELECTRONICS DEVELOPMENTS IMPACTING
THERMAL MANAGEMENT PRODUCTS, 2013-2018
TABLE 1 NEW ELECTRONICS DEVELOPMENTS IMPACTING
TECHNOLOGY
PHYSICAL ISSUES
FIGURE 1 MAJOR CAUSES OF ELECTRONIC FAILURE
MARKET OVERVIEW
TABLE 2 WORLD THERMAL MANAGEMENT REVENUE ACCORDING
TO PRODUCT CATEGORIES, 2013 AND 2018
INDUSTRY DRIVERS AND STRUCTURE
FIGURE 2 TECHNOLOGY NEEDS AS A DRIVER FOR THERMAL MANAGEMENT
INDUSTRY STRUCTURE
MERGERS AND ACQUISITIONS
TABLE 3 MERGERS, ACQUISITIONS AND NEW FUNDINGS IN ELECTRONICS THERMAL MANAGEMENT FROM 2008 THROUGH 2013
TABLE 4 RESEARCH ORGANIZATIONS AND COMPANIES ACTIVELY ENGAGED IN ELECTRONIC THERMAL MANAGEMENT IN 2013
TABLE 5 LEADING THERMAL CONSULTANTS AND INTEGRATORS
TECHNOLOGY OVERVIEW
THERMAL MANAGEMENT
EFFECTIVE THERMAL DESIGN FOR ELECTRONIC SYSTEMS
CONCEPT DEVELOPMENT PHASE PROCESS AND THERMAL TOOLS
DETAILED DESIGN PHASE PROCESS AND THERMAL TOOLS
HARDWARE TEST PHASE PROCESS AND THERMAL TOOLS
TECHNICAL PROPERTIES
TABLE 6 THERMAL PROPERTIES OF MATERIALS
ELECTRONIC THERMAL MANAGEMENT MATERIALS
COMPOSITES
TABLE 7 METAL MATRIX COMPOSITES
CERAMICS
ALUMINA (Al2O3)
ALUMINUM NITRIDE (AlN)
SILICON CARBIDE (SiC)
ALUMINUM SILICON CARBIDE (AlSiC)
BERYLLIUM OXIDE (BeO)
OTHER THERMAL MANAGEMENT MATERIALS
CONDUCTORS
HIGH PERFORMANCE THERMAL MANAGEMENT MATERIALS
ADVANCED THERMAL SOLUTIONS IN PRACTICE IN 2013
FIGURE 3 LIQUID COOLING LOOP FOR HIGH PERFORMANCE ELECTRONICS
CASE STUDY 1: THERMOELECTRIC COOLERS IN MODULE COOLING ENHANCEMENT
CASE STUDY 2: SIGNIFICANCE IN CONTEMPORARY DATA CENTERS
CASE STUDY 3: COOLING METHODS FOR INDUSTRIAL ELECTRONICS
CASE STUDY 4: HIGH-POWER LEDS
FIGURE 4 TYPICAL USAGE OF FAN-COOLED HEAT SINK IN HIGH-POWER LED ASSEMBLY
CASE STUDY 5: WIND POWER GENERATION
CASE STUDY 6: SOLAR GRID-CONNECTED PHOTOVOLTAIC (PV) GENERATION
GLOBAL ELECTRONIC THERMAL MANAGEMENT MARKETS
THERMAL MANAGEMENT PRODUCT CATEGORIES AND MARKETS
PRODUCT SUMMARY FORECASTS
TABLE 8 GLOBAL REVENUE BY PRODUCT CATEGORY, 2013 AND 2018
FIGURE 5 GLOBAL REVENUE BY PRODUCT CATEGORY, 2013 AND 2018.
GLOBAL AND REGIONAL TRENDS FOR THERMAL MANAGEMENT
TABLE 9 GLOBAL REVENUE BY REGION, 2013 AND 2018
FIGURE 6 WORLD THERMAL MANAGEMENT REVENUE BY REGION, 2013 AND 2018
NORTH AMERICA
EUROPE
ASIA/PACIFIC
JAPAN
THERMAL MANAGEMENT END USE APPLICATION TRENDS AND
MARKETS
TABLE 10 GLOBAL HARDWARE REVENUE BY APPLICATION, 2013 AND 2018
FIGURE 7 GLOBAL REVENUE BY APPLICATION, 2013 AND 2018
COMPUTERS
TABLE 11 GLOBAL REVENUE – COMPUTER APPLICATIONS, 2013 AND 2018
TELECOM
TABLE 12 GLOBAL REVENUE – TELECOM APPLICATIONS, 2013 AND 2018
Telecom and network industry challenges
AUTOMOTIVE INDUSTRY
TABLE 13 GLOBAL REVENUE – AUTOMOTIVE APPLICATIONS, 2013 AND 2018
CONSUMER PRODUCTS
TABLE 14 GLOBAL REVENUE – CONSUMER PRODUCTS, 2013 AND 2018
MEDICAL/OFFICE EQUIPMENT
TABLE 15 GLOBAL REVENUE – MEDICAL/OFFICE APPLICATIONS, 2013 AND 2018
INDUSTRIAL/MILITARY EQUIPMENT
TABLE 16 GLOBAL REVENUE – INDUSTRIAL/MILITARY
APPLICATIONS, 2013 AND 2018
INDUSTRY STUCTURE MARKET SHARES
THERMAL MANAGEMENT HARDWARE MARKET
TABLE 17 GLOBAL HARDWARE REVENUES, 2013 AND 2018
Global and regional trends for thermal management hardware
TABLE 18 GLOBAL HARDWARE REVENUE BY REGION, 2013 AND 2018
Thermal management hardware end use application trends
TABLE 19 GLOBAL HARDWARE REVENUE BY APPLICATION, 2013 AND 2018
Thermal management hardware sub-product categories
TABLE 20 GLOBAL HARDWARE REVENUE BY SUB-PRODUCTS, 2013 AND 2018
FIGURE 8 GLOBAL HARDWARE REVENUE BY SUB-PRODUCTS, 2013 AND 2018
Fans and blowers: overview
TABLE 21 FANS AND BLOWERS END USE APPLICATIONS, 2013 AND 2018
Heat sinks: overview
TABLE 22 HEAT SINKS END USE APPLICATIONS, 2013 AND 2018
Heat pipes: overview
TABLE 23 HEAT PIPES END USE APPLICATIONS, 2013 AND 2018
Fan sinks: overview
TABLE 24 FAN SINKS END USE APPLICATIONS, 2013 AND 2018
Cold plates: overview
TABLE 25 COLD PLATES END USE APPLICATIONS, 2013 AND 2018
Thermoelectric coolers: overview
TABLE 26 THERMOELECTRIC COOLERS END USE APPLICATIONS, 2013 AND 2018
New developments in hardware
FIGURE 9 LIQUID COOLING OF ELECTRONICS SYSTEMS
TABLE 27 MAJOR DEVELOPMENTS IN HARDWARE IN ELECTRONICS THERMAL MANAGEMENT PRACTICES
THERMAL MANAGEMENT SOFTWARE
WORLDWIDE MARKET FORECAST
TABLE 28 GLOBAL SOFTWARE REVENUES, 2013 AND 2018
THERMAL SOFTWARE MODELING OPTIONS
GLOBAL AND REGIONAL TRENDS FOR THERMAL MANAGEMENT SOFTWARE
TABLE 29 SOFTWARE REVENUE BY REGION, 2013 AND 2018
THERMAL MANAGEMENT SOFTWARE END USE APPLICATION TRENDS
TABLE 30 SOFTWARE REVENUE BY APPLICATION, 2013 AND 2018
FIGURE 10 SOFTWARE REVENUE BY APPLICATION, 2013 AND 2018
TABLE 31 COMPUTER APPLICATIONS SOFTWARE SHARES, 2013 AND 2018
THERMAL MANAGEMENT SOFTWARE SUB-PRODUCT CATEGORIES
TABLE 32 SOFTWARE REVENUE BY SUB-PRODUCTS, 2013 AND 2018
CFD: overview
TABLE 33 CFD END USE APPLICATIONS, 2013 AND 2018
CHT: overview
TABLE 34 CHT END USE APPLICATIONS, 2013 AND 2018
Circuit design: overview
TABLE 35 CIRCUIT DESIGN END USE APPLICATIONS, 2013 AND 2018
Power management: overview
TABLE 36 POWER MANAGEMENT END USE APPLICATIONS, 2013 AND 2018
Other software: overview
TABLE 37 OTHER SOFTWARE END USE APPLICATIONS, 2013 AND 2018
TECHNOLOGY TRENDS IN THERMAL MANAGEMENT SOFTWARE
TABLE 38 NEW DEVELOPMENTS IN SOFTWARE RELATED TO ELECTRONIC THERMAL MANAGEMENT
SOFTWARE INDUSTRY STRUCTURE AND MARKET SHARES
TABLE 39 MARKET SHARES OF MAJOR VENDORS – GLOBAL SOFTWARE MARKET FOR THERMAL MANAGEMENT, 2013
FIGURE11 MAJOR VENDORS IN THE GLOBAL THERMAL MANAGEMENT
SOFTWARE MARKET, 2013
THERMAL MANAGEMENT INTERFACE MATERIALS
WORLDWIDE MARKET FORECAST
TABLE 40 GLOBAL INTERFACE REVENUES, 2013 AND 2018
GLOBAL AND REGIONAL TRENDS FOR THERMAL MANAGEMENT INTERFACE
TABLE 41 INTERFACE REVENUE BY REGION, 2013 AND 2018
THERMAL MANAGEMENT INTERFACE END USE APPLICATION TRENDS
TABLE 42 GLOBAL INTERFACE REVENUE BY APPLICATION, 2013 AND 2018
FIGURE 12 GLOBAL INTERFACE REVENUE BY APPLICATION, 2013 AND 2018
THERMAL MANAGEMENT INTERFACE SUB-PRODUCT CATEGORIES
TABLE 43 GLOBAL THERMAL MANAGEMENT INTERFACE
REVENUE BY SUB-PRODUCTS, 2013 AND 2018
Thermal grease: overview
TABLE 44 GLOBAL GREASE END USE APPLICATIONS, 2013 AND 2018
Thermal compounds: overview
TABLE 45 GLOBAL THERMAL COMPOUND END USE
APPLICATIONS,2013 AND 2018
Thermal pads: overview
TABLE 46 GLOBAL THERMAL PADS END USE APPLICATIONS, THROUGH 2018
Adhesive film and tape: overview
TABLE 47 GLOBAL ADHESIVE FILM AND TAPE END USE APPLICATIONS,2013 AND 2018
Epoxy: overview
TABLE 48 GLOBAL EPOXY END USE APPLICATIONS, 2013 TO 2018
TECHNOLOGY TRENDS IN THERMAL MANAGEMENT INTERFACE
TABLE 49 EXAMPLES OF THERMAL INTERFACE PROPERTIES
TRENDS IN THERMAL MANAGEMENT INTERFACE
TABLE 50 NEW DEVELOPMENTS IN THERMAL INTERFACE MATERIALS RELATED TO ELECTRONIC THERMAL MANAGEMENT IN 2013
TIM INDUSTRY STUCTURE AND MARKET SHARES
TABLE 51 MARKET SHARES OF MAJOR VENDORS – GLOBAL INTERFACE MARKET, 2013
FIGURE 13 TOP VENDORS – GLOBAL INTERFACE MARKET, 2002
THERMAL MANAGEMENT SUBSTRATES
WORLDWIDE MARKET FORECAST
TABLE 52 GLOBAL THERMAL MANAGEMENT SUBSTRATE REVENUES, THROUGH 2018
GLOBAL AND REGIONAL TRENDS FOR SUBSTRATE
TABLE 53 SUBSTRATE REVENUE BY REGION, 2013 AND 2018
SUBSTRATE END USE APPLICATION TRENDS
TABLE 54 GLOBAL SUBSTRATE REVENUE BY APPLICATION, THROUGH 2018 ($ MILLIONS)
FIGURE 14 GLOBAL SUBSTRATE REVENUE BY APPLICATION, 2013 AND 2018
THERMAL MANAGEMENT SUBSTRATE SUB-PRODUCT CATEGORIES
TABLE 55 SUBSTRATE REVENUE BY SUB-PRODUCTS, THROUGH 2018
Thermally-enhanced packages: overview
TABLE 56 GLOBAL THERMALLY-ENHANCED PACKAGES END
USE APPLICATIONS, 2013 AND 2018
Heat spreader: overview
Heat spreader: overview (CONT.)
TABLE 57 GLOBAL THERMAL MANAGEMENT HEAT SPREADERS
END-USE APPLICATIONS, THROUGH 2008
Technology trends in substrates
TABLE 58 NEW DEVELOPMENTS IN THERMAL SUBSTRATES MATERIALS RELATED TO ELECTRONIC THERMAL MANAGEMENT IN 2013
INDUSTRY STUCTURE MARKET SHARES
TABLE 59 MARKET SHARES OF MAJOR VENDORS – GLOBAL SUBSTRATE MARKET, 2013
FIGURE 15 MARKET SHARES OF MAJOR VENDORS – GLOBAL SUBSTRATE MARKET, 2013
PATENTS AND PATENT ANALYSIS
TABLE 60 NUMBER OF U.S. THERMAL MANAGEMENT PATENTS, 2010-2014
OVERVIEW OF U.S. PATENT ACTIVITY IN THERMAL MANAGEMENT
TABLE 61 NUMBER OF U.S. ELECTRONIC THERMAL
MANAGEMENT PATENTS ASSIGNED BY REGION, FROM
JANUARY 2010 THROUGH FEBRUARY 2014
PATENTS: THERMAL MANAGEMENT HARDWARE
TABLE 62 TOP U.S. ELECTRONIC THERMAL MANAGEMENT HARDWARE PATENT ASSIGNEES, JANUARY 2010 TO FEBRUARY 2014
FIGURE 16 TOP U.S. ELECTRONIC THERMAL MANAGEMENT HARDWARE PATENT ASSIGNEES, JANUARY 2010 TO FEBRUARY 2014
PUMP AND FAN CONTROL CONCEPTS IN A COOLING SYSTEM
SEMICONDUCTOR PACKAGE THERMAL TAPE WINDOW FRAME FOR HEAT SINK ATTACHMENT
THERMOELECTRIC DEVICES INCLUDING THERMOELECTRIC ELEMENTS HAVING OFF-SET METAL PADS AND RELATED STRUCTURES, METHODS, AND SYSTEMS
ASSEMBLIES AND METHODS FOR DISSIPATING HEAT FROM
HANDHELD ELECTRONIC DEVICES
COOLING SYSTEMS INCORPORATING HEAT EXCHANGERS AND THERMOELECTRIC LAYERS
ASSEMBLIES AND METHODS FOR DISSIPATING HEAT FROM HANDHELD ELECTRONIC DEVICES
HEAT SINK FOR LED LIGHT BULB
BONDED METAL AND CERAMIC PLATES FOR THERMAL MANAGEMENT OF OPTICAL AND ELECTRONIC DEVICES
HEAT SINK BASE PLATE WITH HEAT PIPE
MICROHEAT EXCHANGER FOR LASER DIODE COOLING
DEVICE AND METHODOLOGY FOR THE REMOVAL OF HEAT FROM AN EQUIPMENT RACK BY MEANS OF HEAT EXCHANGERS MOUNTED TO A DOOR
SYSTEMS AND ASSOCIATED METHODS FOR CONTROLLABLY COOLING COMPUTER COMPONENTS
CLAMP-TYPE HEAT SINK FOR MEMORY
METHODS OF FORMING EMBEDDED THERMOELECTRIC COOLERS WITH ADJACENT THERMALLY CONDUCTIVE FIELDS
HOLISTIC THERMAL MANAGEMENT SYSTEM FOR A
SEMICONDUCTOR CHIP
HEAT SINK FOR MEMORY AND MEMORY DEVICE HAVING HEAT SINK
SOLAR POWER SYSTEM WITH TOWER TYPE HEAT DISSIPATING STRUCTURE
THERMALLY CONDUCTIVE STRUCTURE OF LED AND MANUFACTURING METHOD THEREOF
AIRFLOW INTAKE SYSTEMS AND ASSOCIATED METHODS FOR USE WITH COMPUTER CABINETS
METHOD OF FABRICATING HIGH SURFACE TO VOLUME RATIO STRUCTURES AND THEIR INTEGRATION IN MICROHEAT EXCHANGERS FOR LIQUID COOLING SYSTEM
OPTIMAL SPREADER SYSTEM, DEVICE AND METHOD FOR FLUID COOLED MICRO-SCALED HEAT EXCHANGE
METHODOLOGY OF COOLING MULTIPLE HEAT SOURCES IN A PERSONAL COMPUTER THROUGH THE USE OF MULTIPLE FLUID-BASED HEAT EXCHANGING LOOPS COUPLED VIA MODULAR BUS-TYPE HEAT EXCHANGERS
HEAT DISSIPATION DEVICE
METHODS OF FORMING THERMOELECTRIC DEVICES USING ISLANDS OF THERMOELECTRIC MATERIAL AND RELATED STRUCTURES
THERMAL MANAGEMENT SOFTWARE PATENTS
TABLE 63 TOP U.S. ELECTRONIC THERMAL MANAGEMENT SOFTWARE PATENT ASSIGNEES, JANUARY 2010 THROUGH FEBRUARY 2014
FIGURE 17 TOP U.S. ELECTRONIC THERMAL MANAGEMENT SOFTWARE PATENT ASSIGNEES, JANUARY 2010 THROUGH FEBRUARY 2014
THERMAL ANALYSIS
SYSTEM AND METHOD FOR ACCESSING A MULTIPHYSICS MODELING SYSTEM VIA A DESIGN SYSTEM USER INTERFACE
MODEL-BASED FILL
MODEL-BASED DESIGN VERIFICATION
MODELING AND SIMULATION METHOD
METHOD AND APPARATUS FOR MULTI-DIE THERMAL ANALYSIS
REDUCING THE SIZE OF A MODEL USING VISIBILITY FACTORS
SIMULATION AND CORRECTION OF MASK SHADOWING EFFECT
METHOD FOR ASSEMBLING THE FINITE ELEMENT
DISCRETIZATION OF ARBITRARY WEAK EQUATIONS
SELECTIVELY REDUCING THE NUMBER OF CELL EVALUATIONS IN A HARDWARE SIMULATION
LOCALLY UPDATING A THREE-DIMENSIONAL MODEL
SYSTEMS, METHODS, AND TOOLS FOR PROOFING A
COMPUTER-AIDED DESIGN OBJECT
PROCESS FOR DISPLAYING OBJECTS OF A PLM DATABASE AND APPARATUS IMPLEMENTING THIS PROCESS
PATENTS: THERMAL MANAGEMENT INTERFACE
TABLE 64 TOP U.S. ELECTRONIC THERMAL MANAGEMENT INTERFACE MATERIALS PATENT ASSIGNEES, JANUARY 2010 TO FEBRUARY 2014
FIGURE 18 TOP U.S. ELECTRONIC THERMAL MANAGEMENT INTERFACE MATERIALS PATENT ASSIGNEES, JANUARY 2010 TO FEBRUARY 2014
THERMAL INTERFACE MATERIAL WITH THIN TRANSFER FILM OR METALLIZATION
THERMALLY CONDUCTIVE DEVICE WITH A THERMAL INTERFACE MATERIAL
METHOD AND SYSTEM FOR ALIGNMENT OF GRAPHITE NANOFIBERS FOR ENHANCED THERMAL INTERFACE MATERIAL PERFORMANCE
SYSTEM INCLUDING THERMAL CONTROL UNIT HAVING CONDUIT FOR DISPENSE AND REMOVAL OF LIQUID THERMAL INTERFACE MATERIAL
THERMAL INTERFACE MATERIALS AND METHODS FOR MAKING THEREOF
REINFORCED RESIN-DERIVED CARBON FOAM
FLEXIBLE GRAPHITE FLOORING HEAT SPREADER
THERMAL INTERFACE MATERIAL AND SEMICONDUCTOR COMPONENT INCLUDING THE THERMAL INTERFACE MATERIAL
UNIFORM GRAPHITE PLATE
HIGH STRENGTH MONOLITHIC CARBON FOAM
THERMAL MANAGEMENT OF ELECTRONIC DEVICES
HIGHLY THERMALLY-CONDUCTIVE MOLDABLE THERMOPLASTIC COMPOSITES AND COMPOSITIONS
HEAT SPREADER FOR PLASMA DISPLAY PANEL
METHOD FOR PACKAGING THERMAL INTERFACE MATERIALS
THERMAL INTERFACE WITH NON-TACKY SURFACE
CARBON FOAM EVAPORATOR
DIMENSIONALLY STABLE, LEAK-FREE GRAPHITE SUBSTRATE
CARBON FOAM CORE PANELS
METHOD AND ARRANGEMENT FOR COOLING A SUBSTRATE, PARTICULARLY A EMICONDUCTOR
CARBON FOAM WITH SUPPLEMENTAL MATERIAL
HEAT SPREADING CIRCUIT ASSEMBLY
LAYOUT OF POWER SEMICONDUCTOR CONTACTS ON A COOLING SURFACE
ENHANCED DIRECTIONAL CONDUCTIVITY OF GRAPHITIZABLE FOAM
SANDWICHED THERMAL SOLUTION
AREA WEIGHT UNIFORMITY FLEXIBLE GRAPHITE SHEET MATERIAL
CARBON FOAM STRUCTURAL INSULATED PANEL
THERMALLY AND ELECTRICALLY CONDUCTIVE INTERCONNECT STRUCTURES
REINFORCED RESIN-DERIVED CARBON FOAM
THERMOFORMED PLATFORM
HEAT SPREADER FOR DISPLAY PANEL
HIGH PURITY NUCLEAR GRAPHITE
LOW CTE HIGHLY ISOTROPIC GRAPHITE
PATENTS: THERMAL MANAGEMENT SUBSTRATES
TABLE 65 TOP U.S. ELECTRONIC THERMAL MANAGEMENT SUBSTRATES PATENT ASSIGNEES, JANUARY 2010 TO
FEBRUARY 2014
FIGURE 19 TOP U.S. ELECTRONIC THERMAL MANAGEMENT SUBSTRATES PATENT ASSIGNEES, JANUARY 2010 TO FEBRUARY 2014
HEAT SPREADER FOR CENTER GATE MOLDING
HEAT SPREADER AS MECHANICAL REINFORCEMENT FOR ULTRA-THIN DIE
USER-SERVICEABLE LIQUID DIMM COOLING SYSTEM
COOLING MEMORY MODULES USING COLD PLATE BLADES COUPLED TO THE MEMORY MODULES VIA CLIPS
THREE-DIMENSIONAL SEMICONDUCTOR ASSEMBLY BOARD
WITH BUMP/FLANGE SUPPORTING BOARD, CORELESS
SEMICONDUCTOR DEVICE WITH HEAT SPREADER
BUILD-UP CIRCUITRY AND BUILT-IN ELECTRONIC DEVICE
BALL GRID ARRAY PACKAGE WITH IMPROVED THERMAL CHARACTERISTICS
ON-CHIP HEAT SPREADER
SEMICONDUCTOR PACKAGE WITH THERMAL HEAT
SPREADER
ON-CHIP HEAT SPREADER
METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEAT SPREADER WITH AN ESD PROTECTION LAYER
SEMICONDUCTOR CHIP ASSEMBLY WITH BUMP/BASE HEAT SPREADER AND DUAL-ANGLE CAVITY IN BUMP
ENHANCED THERMAL MANAGEMENT OF 3-D STACKED DIE PACKAGING
HEAT DISSIPATION DEVICE
METHOD OF FORMING ELECTRONIC PACKAGE HAVING FLUID-CONDUCTING CHANNEL
SEMICONDUCTOR DEVICE THERMAL CONNECTION
BALL GRID ARRAY PACKAGE STACKING SYSTEM
BALL GRID ARRAY PACKAGE SYSTEM
DIE-UP BALL GRID ARRAY PACKAGE WITH DIE-ATTACHED HEAT SPREADER
PACKAGING OF INTEGRATED CIRCUITS WITH CARBON NANOTUBE ARRAYS TO ENHANCE HEAT DISSIPATION THROUGH A THERMAL INTERFACE
SILICON CARBIDE SEMICONDUCTOR DEVICE HAVING JUNCTION FIELD EFFECT TRANSISTOR AND METHOD FOR MANUFACTURING THE SAME
METHOD OF MANUFACTURING SILICON CARBIDE
SEMICONDUCTOR DEVICE
METHOD OF MANUFACTURING SILICON CARBIDE
SEMICONDUCTOR DEVICE
APPENDIX I - PROFILES OF COMPANIES PRODUCING AND SUPPLYING ELECTRONIC THERMAL MANAGEMENT HARDWARE
AAVID THERMAL TECHNOLOGIES
ADDA-TAIWAN
WAKEFIELD-VETTE
XCELAERO CORPORATION
APPENDIX II - PROFILES OF COMPANIES PRODUCING AND SUPPLYING ELECTRONIC THERMAL MANAGEMENT SOFTWARES
AAVID DESIGN
ADVANCED THERMAL SOLUTIONS, INC.
SYNOPSYS, INC.
THERMACORE, INC.
APPENDIX III - PROFILES OF COMPANIES PRODUCING AND SUPPLYING ELECTRONIC THERMAL MANAGEMENT INTERFACE MATERIALS
3M
AOS THERMAL COMPOUNDS
T-GLOBAL THERMAL TECHNOLOGY CO., LTD.
WAKEFIELD–VETTE, INC.
APPENDIX IV - PROFILES OF COMPANIES PRODUCING AND SUPPLYING ELECTRONIC THERMAL MANAGEMENT SUBSTRATES
AMKOR ELECTRONICS, INC.
ASAT
SUMITOMO ELECTRIC U.S.A., INC.
VISHAY SILICONIX
