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3D IC Marketplace Assessed by MIC in New Market Research Report Now Available at MarketPublishers.com

30 Nov 2015 • by Natalie Aster

LONDON – Growth of the global three-dimensional integrated circuit (3D IC) market is driven by the developments of micro-electro-mechanical systems (MEMS) and sensors, logic 3D system-in-package (SiP)/system-on-chips (SoCs), cost considerations and heat effects, and a number of hetero-stacks in various end-use device industries. Sensors, MEMS, and logic 3D SiP/SoCs are the products made by a variety of end-use industries utilising 3D IC technologies. Hence, 3D IC design is expected to determine the usage of 3D IC technologies in these industries. With the acceleration of the development of these products, the uptake of 3D IC technologies in various applications is poised to increase. Testing and heat dissipation in 3D IC integration are set greatly influence the deployment of 3D IC in diverse end-use industries. In comparison with other industry sectors, ICT and consumer electronics are set to evolve as important 3D IC markets. The enhanced adoption of logic 3D SiP/SoC and MEMS devices across the ICT industry is anticipated to underpin the demand for 3D ICs.

3D IC revolutionises the way consumer electronics systems and products are developed, comprising game consoles, TV sets, stereos, smart phones, cameras, tablets, camcorders, and home appliances. With the fastest growth amongst other consumer electronics, smart phones and tablets will likely see higher sales value as more sophisticated products are being launched into the market, with more variety in size, price, storage capacity, and application. Demand for mobile devices has thus increased. Smartphones and tablets with a smaller form factor and higher performance will contribute to 3D IC market growth in the near future. Contributed by the consumer electronics sector, the value of the 3D IC market will likely grow from USD 570 million in 2012 to amount to USD 2.1 billion in 2019, with a CAGR of 21% during 2013-2019.

New research report “The Worldwide 3D IC Market and Major Supply Chain Players in Taiwan” elaborated by Market Intelligence & Consulting Institute (MIC) provides an in-depth overview of the global 3D IC market, limelighting key application and regional markets, and top vendors of 3D IC key components in Taiwan.

Report Details:

The Worldwide 3D IC Market and Major Supply Chain Players in Taiwan
Published: November, 2015
Pages: 48 
Price: US$ 2,500.00

More reports by the publisher can be found at MIC page.


The Market Publishers, Ltd.
Natalie Aster
Tel: +44 208 144 6009
Fax: +44 207 900 3970
[email protected] 


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