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IC Substrate Industry Globally & in China Examined in New In-Demand Report Published at MarketPublishers.com

15 May 2012 • by Natalie Aster

LONDON – The global IC substrate market is expected to value USD 8.67 billion in 2012. Major applications of IC substrates are PC, mobile phone and base station, with PC being the biggest consumer. Inside PC, CPU, GPU and Northbridge IC all employs FC-BGA packaging, featuring large packaging area, many layers and high unit price. CPU and GPU of smartphones use FC-CSP packaging, so does CPU of some feature phones. Most of the IC in mobile phone, like Bluetooth, WiFi, FM, CMOS image sensor, GPS, etc., adopt WLCSP packaging. The mobile phone IC shipment is huge, but with the small-sized substrates, the mobile phone IC substrate has a far smaller market size than the PC IC substrate.

Boasting the largest wafer foundries globally, Taiwan’s IC packaging and testing industry ranks first in the world, with 56% market share; whereas Chinese Mainland packaging and testing industry just shares 3%.

New market report “Global and China IC Substrate Industry Report, 2011-2012” prepared by ResearchInChina offers a comprehensive guide to the IC substrate industry from a global perspective with a special focus on China, covering the following aspects:

  • global semiconductor industry; 
  • IC substrate; 
  • IC substrate market; 
  • IC substrate manufacturers; 
  • IC substrate packaging companies.

Report Details:

Global and China IC Substrate Industry Report, 2011-2012
Published: April, 2012
Pages: 89
Price: US$ 2.100,00

More new market reports by the publisher can be found at ResearchInChina page.


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