Semiconductor Packaging Materials Market
In Progress. Get it in 2 to 4 weeks by ordering today
The future of the global semiconductor packaging materials market looks promising with opportunities in consumer electronics, aerospace & defense, healthcare, communication, and automotive industries. The global semiconductor packaging materials market is expected to decline in 2020 due to global economic recession led by COVID-19. However, the market will witness recovery in the year 2021 and it is expected to grow with a CAGR of 8% to 10% from 2020 to 2025. The major growth drivers for this market are a growing trend of miniaturization of the electronic devices across the world and high demand for mobile phones, tablets, and other communication devices.
A total of XX figures / charts and XX tables are provided in more than 150 pages report is developed to help in your business decisions. Sample figures with some insights are shown below. To learn the scope of, benefits, companies researched and other details of global semiconductor packaging materials market report download the report brochure.
Growth in various segments of the semiconductor packaging materials market are given below
The study includes trends and forecast for the global semiconductor packaging materials market by product, technology, and region as follows:
By Product Type [$M shipment analysis for 2014 – 2025]:
SubstratesLeadframesBonding WiresEncapsulantsUnderfill MaterialsDie AttachSolder BallsWafer Level Packaging Dielectrics Others
By Technology [$M shipment analysis for 2014 – 2025]:
Grid ArraySmall Outline PackageDual Flat No-LeadsQuad Flat PackageDual In-Line PackageOthers
By End Use Industry [$M shipment analysis for 2014 – 2025]:
Consumer ElectronicsAerospace & DefenseHealthcareCommunicationAutomotiveOthers
By Region [$M shipment analysis for 2014 – 2025]:
North AmericaUnited StatesCanadaMexicoEuropeGermanyUKItalyAsia PacificChinaJapanIndiaSouth KoreaRest of the World
Some of the gyroscope sensor manufacturers profiled in this report include, Henkel, Hitachi Chemical Company, Sumitomo Chemical Co., Ltd., Kyocera Chemical Corporation, and Toray Industries, Inc.
Lucintel forecasts that substrates will remain the largest segment over the forecast period due to demand for system-in-package (SIP) and high-performance devices.
Within this market, consumer electronics is expected to witness the highest growth over the forecast period due to an increasing number of smartphones.
Asia-Pacific will remain the largest region and it is also expected to witness the highest growth over the forecast period due to the high demand for electronic packaging materials and for consumer electronics in China, Taiwan, and India.
Features of the Global Semiconductor Packaging Materials Market
Market size estimates: Global semiconductor packaging materials market size estimation in terms of value ($M) shipment.Trend and forecast analysis: Market trend (2014-2019) and forecast (2020-2025) by various segments and regions.Segmentation analysis: Market size by various segments such as by product type, technology, end use industry and regionRegional analysis: Global semiconductor packaging materials market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.Growth opportunities: Analysis on growth opportunities in different product type, technology, end use industry and regions for the global semiconductor packaging materials market.Strategic analysis: This includes M&A, new product development, and competitive landscape of the global semiconductor packaging materials market.Analysis of competitive intensity of the industry based on Porter’s Five Forces model.
This report answers following 11 key questions
Q.1 What are some of the most promising potential, high-growth opportunities for the global semiconductor packaging materials market by product type (substrates, leadframe, bonding wires, encapsulants, underfill materials, die attach, solder balls, wafer-leve package dielectric, and others), technology (grid array, small outline package, dual flat no-leads, quad flat package, dual in-line package, and others), end use industry (consumer electronics, aerospace & defense, healthcare, communication, automotive, and others), and region (North America, Europe, Asia Pacific (APAC), and Rest of the World (ROW)?
Q. 2 Which segments will grow at a faster pace and why?
Q.3 Which regions will grow at a faster pace and why?
Q.4 What are the key factors affecting market dynamics? What are the drivers and challenges of the market?
Q.5 What are the business risks and threats to the global semiconductor packaging materials market?
Q.6 What are emerging trends in global semiconductor packaging materials market and the reasons behind them?
Q.7 What are some changing demands of customers in the global semiconductor packaging materials market?
Q.8 What are the new developments in the semiconductor packaging materials market? Which companies are leading these developments?
Q.9 Who are the major players in this global semiconductor packaging materials market? What strategic initiatives are being implemented by key players for business growth?
Q.10 What are some of the competitive products and processes in this global semiconductor packaging materials market, and how big of a threat do they pose for loss of market share via material or product substitution?
Q.11 What M & A activities did take place in the last five years in this, global semiconductor packaging materials market?
The future of the global semiconductor packaging materials market looks promising with opportunities in consumer electronics, aerospace & defense, healthcare, communication, and automotive industries. The global semiconductor packaging materials market is expected to decline in 2020 due to global economic recession led by COVID-19. However, the market will witness recovery in the year 2021 and it is expected to grow with a CAGR of 8% to 10% from 2020 to 2025. The major growth drivers for this market are a growing trend of miniaturization of the electronic devices across the world and high demand for mobile phones, tablets, and other communication devices.
A total of XX figures / charts and XX tables are provided in more than 150 pages report is developed to help in your business decisions. Sample figures with some insights are shown below. To learn the scope of, benefits, companies researched and other details of global semiconductor packaging materials market report download the report brochure.
Growth in various segments of the semiconductor packaging materials market are given below
The study includes trends and forecast for the global semiconductor packaging materials market by product, technology, and region as follows:
By Product Type [$M shipment analysis for 2014 – 2025]:
SubstratesLeadframesBonding WiresEncapsulantsUnderfill MaterialsDie AttachSolder BallsWafer Level Packaging Dielectrics Others
By Technology [$M shipment analysis for 2014 – 2025]:
Grid ArraySmall Outline PackageDual Flat No-LeadsQuad Flat PackageDual In-Line PackageOthers
By End Use Industry [$M shipment analysis for 2014 – 2025]:
Consumer ElectronicsAerospace & DefenseHealthcareCommunicationAutomotiveOthers
By Region [$M shipment analysis for 2014 – 2025]:
North AmericaUnited StatesCanadaMexicoEuropeGermanyUKItalyAsia PacificChinaJapanIndiaSouth KoreaRest of the World
Some of the gyroscope sensor manufacturers profiled in this report include, Henkel, Hitachi Chemical Company, Sumitomo Chemical Co., Ltd., Kyocera Chemical Corporation, and Toray Industries, Inc.
Lucintel forecasts that substrates will remain the largest segment over the forecast period due to demand for system-in-package (SIP) and high-performance devices.
Within this market, consumer electronics is expected to witness the highest growth over the forecast period due to an increasing number of smartphones.
Asia-Pacific will remain the largest region and it is also expected to witness the highest growth over the forecast period due to the high demand for electronic packaging materials and for consumer electronics in China, Taiwan, and India.
Features of the Global Semiconductor Packaging Materials Market
Market size estimates: Global semiconductor packaging materials market size estimation in terms of value ($M) shipment.Trend and forecast analysis: Market trend (2014-2019) and forecast (2020-2025) by various segments and regions.Segmentation analysis: Market size by various segments such as by product type, technology, end use industry and regionRegional analysis: Global semiconductor packaging materials market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.Growth opportunities: Analysis on growth opportunities in different product type, technology, end use industry and regions for the global semiconductor packaging materials market.Strategic analysis: This includes M&A, new product development, and competitive landscape of the global semiconductor packaging materials market.Analysis of competitive intensity of the industry based on Porter’s Five Forces model.
This report answers following 11 key questions
Q.1 What are some of the most promising potential, high-growth opportunities for the global semiconductor packaging materials market by product type (substrates, leadframe, bonding wires, encapsulants, underfill materials, die attach, solder balls, wafer-leve package dielectric, and others), technology (grid array, small outline package, dual flat no-leads, quad flat package, dual in-line package, and others), end use industry (consumer electronics, aerospace & defense, healthcare, communication, automotive, and others), and region (North America, Europe, Asia Pacific (APAC), and Rest of the World (ROW)?
Q. 2 Which segments will grow at a faster pace and why?
Q.3 Which regions will grow at a faster pace and why?
Q.4 What are the key factors affecting market dynamics? What are the drivers and challenges of the market?
Q.5 What are the business risks and threats to the global semiconductor packaging materials market?
Q.6 What are emerging trends in global semiconductor packaging materials market and the reasons behind them?
Q.7 What are some changing demands of customers in the global semiconductor packaging materials market?
Q.8 What are the new developments in the semiconductor packaging materials market? Which companies are leading these developments?
Q.9 Who are the major players in this global semiconductor packaging materials market? What strategic initiatives are being implemented by key players for business growth?
Q.10 What are some of the competitive products and processes in this global semiconductor packaging materials market, and how big of a threat do they pose for loss of market share via material or product substitution?
Q.11 What M & A activities did take place in the last five years in this, global semiconductor packaging materials market?
1. EXECUTIVE SUMMARY
2. MARKET BACKGROUND AND CLASSIFICATION
2.1: Introduction, Background, and Classification
2.2: Supply Chain
2.3: Industry Drivers and Challenges
3 MARKET TRENDS AND FORECAST ANALYSIS FROM 2014 T 2025
3.1: Macroeconomic Trends and Forecast
3.2: Global Semiconductor Packaging Materials Market Trends and Forecast
3.3: Global Semiconductor Packaging Materials Market by Product Type
3.3.1: Substrates
3.3.2: Leadframes
3.3.3: Bonding Wires
3.3.4: Encapsulants
3.3.5: Underfill Materials
3.3.6: Die Attach
3.3.7: Solder Balls
3.3.8: Wafer Level Packaging Dielectrics
3.3.9: Others
3.4: Global Semiconductor Packaging Materials Market by Technology
3.4.1: Grid Array
3.4.2: Small Outline Package
3.4.3: Dual Flat No-Leads
3.4.4: Quad Flat Package
3.4.5: Dual In-Line Package
3.4.6: Others
3.5: Global Gyroscope Sensor Market by End Use Industry
3.5.1: Consumer Electronics
3.5.2: Aerospace & Defense
3.5.3: Healthcare
3.5.4: Communication
3.5.5: Automotive
3.5.6: Others
4. MARKET TRENDS AND FORECAST ANALYSIS BY REGION
4.1: Global Semiconductor Packaging Materials Market by Region
4.2: North American Semiconductor Packaging Materials Market
4.2.1: Market by Product Type: Substrates, Leadframe, Bonding Wires, Encapsulants, Underfill Materials, Die Attach, Solder Balls, Wafer-Leve Package Dielectric, and Others
4.2.2: Market by Technology: Grid Array, Small Outline Package, Dual Flat No-Leads, Quad Flat Package, Dual In-Line Package, and Others
4.2.3: Market by End Use Industry: Consumer Electronics, Aerospace & Defense, Healthcare, Communication, Automotive, and Others
4.2.4: United States Semiconductor Packaging Materials Market
4.2.5: Canadian Semiconductor Packaging Materials Market
4.2.6: Mexican Semiconductor Packaging Materials Market
4.3: European Semiconductor Packaging Materials Market
4.3.1: Market by Product Type: Substrates, Leadframe, Bonding Wires, Encapsulants, Underfill Materials, Die Attach, Solder Balls, Wafer-Leve Package Dielectric, and Others
4.3.2: Market by Technology: Grid Array, Small Outline Package, Dual Flat No-Leads, Quad Flat Package, Dual In-Line Package, and Others
4.3.3: Market by End Use Industry: Consumer Electronics, Aerospace & Defense, Healthcare, Communication, Automotive, and Others
4.3.4: UK Semiconductor Packaging Materials Market
4.3.5: Italy Semiconductor Packaging Materials Market
4.4: APAC Semiconductor Packaging Materials Market
4.4.1: Market by Product Type: Substrates, Leadframe, Bonding Wires, Encapsulants, Underfill Materials, Die Attach, Solder Balls, Wafer-Leve Package Dielectric, and Others
4.4.2: Market by Technology: Grid Array, Small Outline Package, Dual Flat No-Leads, Quad Flat Package, Dual In-Line Package, and Others
4.4.3: Market by End Use Industry: Consumer Electronics, Aerospace & Defense, Healthcare, Communication, Automotive, and Others
4.4.4: China Semiconductor Packaging Materials Market
4.4.5: Japan Semiconductor Packaging Materials Market
4.4.6: South Korea Semiconductor Packaging Materials Market
4.4.7: India Semiconductor Packaging Materials Market
4.5: ROW Semiconductor Packaging Materials Market
4.5.1: Market by Product Type: Substrates, Leadframe, Bonding Wires, Encapsulants, Underfill Materials, Die Attach, Solder Balls, Wafer-Leve Package Dielectric, and Others
4.5.2: Market by Technology: Grid Array, Small Outline Package, Dual Flat No-Leads, Quad Flat Package, Dual In-Line Package, and Others
4.5.3: Market by End Use Industry: Consumer Electronics, Aerospace & Defense, Healthcare, Communication, Automotive, and Others
5. COMPETITOR ANALYSIS
5.1: Product Portfoli Analysis
5.2: Market Share Analysis
5.3: Operational Integration
5.4: Geographical Reach
5.5: Porter’s Five Forces Analysis
6. GROWTH OPPORTUNITIES AND STRATEGIC ANALYSIS
6.1: Growth Opportunity Analysis
6.1.1: Growth Opportunities for Semiconductor Packaging Materials Market by Product Type
6.1.2: Growth Opportunities for Semiconductor Packaging Materials Market by Technology
6.1.3: Growth Opportunities for Semiconductor Packaging Materials Market by End Use Industry
6.1.4: Growth Opportunities for Semiconductor Packaging Materials Market by Region
6.2: Emerging Trends in Semiconductor Packaging Materials Market
6.3: Strategic Analysis
6.3.1: New Product Development
6.3.2: Capacity Expansion of Global Semiconductor Packaging Materials Market
6.3.3: Mergers, Acquisitions and Joint Ventures in the Global Semiconductor Packaging Materials Market
6.3.4: Certification and Licensing
7. COMPANY PROFILES OF LEADING PLAYERS
7.1: Henkel
7.2: Hitachi Chemical
7.3: Sumitom Chemical
7.4: Kyocera Chemical Corporation
7.5: Toray Industries, Inc.
2. MARKET BACKGROUND AND CLASSIFICATION
2.1: Introduction, Background, and Classification
2.2: Supply Chain
2.3: Industry Drivers and Challenges
3 MARKET TRENDS AND FORECAST ANALYSIS FROM 2014 T 2025
3.1: Macroeconomic Trends and Forecast
3.2: Global Semiconductor Packaging Materials Market Trends and Forecast
3.3: Global Semiconductor Packaging Materials Market by Product Type
3.3.1: Substrates
3.3.2: Leadframes
3.3.3: Bonding Wires
3.3.4: Encapsulants
3.3.5: Underfill Materials
3.3.6: Die Attach
3.3.7: Solder Balls
3.3.8: Wafer Level Packaging Dielectrics
3.3.9: Others
3.4: Global Semiconductor Packaging Materials Market by Technology
3.4.1: Grid Array
3.4.2: Small Outline Package
3.4.3: Dual Flat No-Leads
3.4.4: Quad Flat Package
3.4.5: Dual In-Line Package
3.4.6: Others
3.5: Global Gyroscope Sensor Market by End Use Industry
3.5.1: Consumer Electronics
3.5.2: Aerospace & Defense
3.5.3: Healthcare
3.5.4: Communication
3.5.5: Automotive
3.5.6: Others
4. MARKET TRENDS AND FORECAST ANALYSIS BY REGION
4.1: Global Semiconductor Packaging Materials Market by Region
4.2: North American Semiconductor Packaging Materials Market
4.2.1: Market by Product Type: Substrates, Leadframe, Bonding Wires, Encapsulants, Underfill Materials, Die Attach, Solder Balls, Wafer-Leve Package Dielectric, and Others
4.2.2: Market by Technology: Grid Array, Small Outline Package, Dual Flat No-Leads, Quad Flat Package, Dual In-Line Package, and Others
4.2.3: Market by End Use Industry: Consumer Electronics, Aerospace & Defense, Healthcare, Communication, Automotive, and Others
4.2.4: United States Semiconductor Packaging Materials Market
4.2.5: Canadian Semiconductor Packaging Materials Market
4.2.6: Mexican Semiconductor Packaging Materials Market
4.3: European Semiconductor Packaging Materials Market
4.3.1: Market by Product Type: Substrates, Leadframe, Bonding Wires, Encapsulants, Underfill Materials, Die Attach, Solder Balls, Wafer-Leve Package Dielectric, and Others
4.3.2: Market by Technology: Grid Array, Small Outline Package, Dual Flat No-Leads, Quad Flat Package, Dual In-Line Package, and Others
4.3.3: Market by End Use Industry: Consumer Electronics, Aerospace & Defense, Healthcare, Communication, Automotive, and Others
4.3.4: UK Semiconductor Packaging Materials Market
4.3.5: Italy Semiconductor Packaging Materials Market
4.4: APAC Semiconductor Packaging Materials Market
4.4.1: Market by Product Type: Substrates, Leadframe, Bonding Wires, Encapsulants, Underfill Materials, Die Attach, Solder Balls, Wafer-Leve Package Dielectric, and Others
4.4.2: Market by Technology: Grid Array, Small Outline Package, Dual Flat No-Leads, Quad Flat Package, Dual In-Line Package, and Others
4.4.3: Market by End Use Industry: Consumer Electronics, Aerospace & Defense, Healthcare, Communication, Automotive, and Others
4.4.4: China Semiconductor Packaging Materials Market
4.4.5: Japan Semiconductor Packaging Materials Market
4.4.6: South Korea Semiconductor Packaging Materials Market
4.4.7: India Semiconductor Packaging Materials Market
4.5: ROW Semiconductor Packaging Materials Market
4.5.1: Market by Product Type: Substrates, Leadframe, Bonding Wires, Encapsulants, Underfill Materials, Die Attach, Solder Balls, Wafer-Leve Package Dielectric, and Others
4.5.2: Market by Technology: Grid Array, Small Outline Package, Dual Flat No-Leads, Quad Flat Package, Dual In-Line Package, and Others
4.5.3: Market by End Use Industry: Consumer Electronics, Aerospace & Defense, Healthcare, Communication, Automotive, and Others
5. COMPETITOR ANALYSIS
5.1: Product Portfoli Analysis
5.2: Market Share Analysis
5.3: Operational Integration
5.4: Geographical Reach
5.5: Porter’s Five Forces Analysis
6. GROWTH OPPORTUNITIES AND STRATEGIC ANALYSIS
6.1: Growth Opportunity Analysis
6.1.1: Growth Opportunities for Semiconductor Packaging Materials Market by Product Type
6.1.2: Growth Opportunities for Semiconductor Packaging Materials Market by Technology
6.1.3: Growth Opportunities for Semiconductor Packaging Materials Market by End Use Industry
6.1.4: Growth Opportunities for Semiconductor Packaging Materials Market by Region
6.2: Emerging Trends in Semiconductor Packaging Materials Market
6.3: Strategic Analysis
6.3.1: New Product Development
6.3.2: Capacity Expansion of Global Semiconductor Packaging Materials Market
6.3.3: Mergers, Acquisitions and Joint Ventures in the Global Semiconductor Packaging Materials Market
6.3.4: Certification and Licensing
7. COMPANY PROFILES OF LEADING PLAYERS
7.1: Henkel
7.2: Hitachi Chemical
7.3: Sumitom Chemical
7.4: Kyocera Chemical Corporation
7.5: Toray Industries, Inc.
