Connectivity Chip Trends: Market Research Report

December 2013 | 24 pages | ID: C1481A05179EN
Global Industry Analysts, Inc

Abstracts

The report analyzes and presents an overview of Connectivity Chips market worldwide. The report in addition provides global market estimates and projections for Wireless Connectivity ICs in US dollars for years 2012 through 2017. Supported with 7 market data tables, the report provides a review of global market trends, technological advancements, and competitive scenario. The report highlights on various strategic industry activities of major companies witnessed by the industry over the last few years. In addition, 42 companies operating in the Connectivity Chips arena worldwide including Broadcom Corporation, CSR PLC, INSIDE Secure, Marvell Technology Group Ltd., Qualcomm Atheros Inc., Samsung Semiconductor Inc., ST-Ericsson, Texas Instruments Inc., Toumaz Microsystems and others are profiled.

Contents

1. CONNECTIVITY CHIPS – A MARKET OVERVIEW

A Prelude

Table 1. Global Wireless Connectivity ICs Market (2012-2017) in US$ Million

Table 2. Global Video-Oriented Consumer Electronics Devices Equipped with High-Bandwidth Wireless Solutions ICs (2012-2017) in Million Units

Wi-Fi-enabled Mobile Devices to Witness Robust Growth

Table 3. Global Wi-Fi-enabled Device Shipments (2012-2017) in Million Units

Increased Consumer Demand for Wi-Fi Mobile Devices Driving Growth in Semiconductor Industry
Key Factors Expected to Drive Wireless Connectivity Chips Market in Near Term
Increase in Consumer Interest for Wire-Free Solutions

Table 4. Global Bluetooth-Enabled Chip Shipments (2012-2017) in Million Units

Growing Use of Internet in Next-Generation Consumer Devices
Technological Advancements
Competitive Scenario

Table 5. Leading Connectivity Chip Producers’ Market Share by Value Sales Worldwide (2012) - Percentage Breakdown for Broadcom, Texas Instruments, CSR PLC, Marvell Technology Group Ltd, and Others

Table 6. Leading Bluetooth Chip Producers’ Market Share by Value Sales Worldwide (2012) - Percentage Breakdown for Broadcom, CSR PLC, Media Tek, RDA Microelectronics, and Others

Table 7. Leading GPS Chip Producers’ Market Share by Value Sales Worldwide (2012) Percentage Breakdown for CSR Plc, u-blox AG, Texas Instruments, Broadcom, and Others

2. RECENT INDUSTRY ACTIVITY

Amazon. com to Take Over Mobile Processor Division of Texas Instruments
Samsung Acquires Handset Technology Development Division of CSR
Toumaz Establishes Toumaz Microsystems
Broadcom Takes Over NetLogic Microsystems
CSR Takes Over Zoran
Inside Secure Signs Agreement with Intel for NFC Technology
Qualcomm Acquires Atheros Communications
Texas Instruments Acquires National Semiconductor

3. PRODUCT LAUNCHES/INNOVATIONS

Apple to Introduce 802. 11ac Networking Capabilities in New Mac Models
Broadcom Launches New 5G WiFi Product Line
Broadcom Rolls Out BCM20732 Bluetooth Smart System-on-Chip
Dialog Semiconductor Introduces DA14580 SmartBond System-on-Chip
Broadcom Introduces BCM4752 Location Architecture
Marvell and Atheros Independently Introduce Wi-Fi Chips
ST-Ericsson Introduces Mobile Connectivity Chips

4. MARKET PARTICIPANTS

Analog Devices, Inc. (USA)
Aquantia Corporation (USA)
ASIX Electronics Corporation (Taiwan)
Atmel Corporation (USA)
Beken Corporation (China)
Broadcom Corporation (USA)
Cadence Design Systems, Inc. (USA)
Celeno Communications (Israel)
CellGuide Ltd. (Israel)

CSR PLC (UK)

Dialog Semiconductor (Germany)
Freescale Semiconductor, Inc. (USA)
Fujitsu Ltd. (Japan)
Gainspan Corporation (USA)
GCT Semiconductor, Inc. (USA)
Glyn Ltd. (Australia)
INSIDE Secure (France)
Intel Corporation (USA)
Lantiq (Germany)
Marvell Technology Group Ltd. (Bermuda)
Maxim Integrated Products, Inc. (USA)
MediaTek, Inc. (Taiwan)
Microchip Technology, Inc. (USA)
Nordic Semiconductor ASA (Norway)
Nvidia Corporation (USA)
NXP Semiconductors NV (The Netherlands)
PMC-Sierra, Inc. (USA)
Qualcomm Atheros, Inc. (USA)
Quantenna Communications, Inc. (USA)
RDA Microelectronics (China)
Realtek Semiconductor Corporation (Taiwan)
Redpine Signals (USA)
Renesas Electronics Corporation (Japan)
RF Micro Devices, Inc. (USA)
Samsung Semiconductor, Inc. (USA)
Silicon Laboratories, Inc. (USA)
SkyTraq Technology, Inc. (Taiwan)
ST-Ericsson (Switzerland)
Telechips, Inc. (Korea)
Texas Instruments, Inc. (USA)
Toumaz Microsystems (UK)
u-blox AG (Switzerland)

5. APPENDIX