Global Semiconductor Silicon Wafer Market

October 2019 | 163 pages | ID: G7C78484C6F2EN
BCC Research

Abstracts

REPORT SCOPE:

This report forecasts the market for compound semiconductor wafers for 2018-2023. The report presents the market forecast in terms of dollar value ($ million) and shipment volume (msi).

Dollar value and shipment volume are broken down along the following end uses -

• Telecommunications.
• Instrumentation and scientific research.
• Healthcare.
• Energy, defense and surveillance.
• Computing and entertainment.
• Industrial and automotive.
• Retail and others.

Each of the end applications is further broken down by crystal growth methods -

• Bridgman and allied methods (Bridgman).
• Float-zone (FZ).
• Czochralski (CZ) and allied methods (Czochralski).

Each end application is broken down by the following wafer-bonding methods -

• Direct bonding.
• Surface-activated bonding.
• Anodic bonding.
• Plasma bonding.

Each end application is further broken down by node size -

• 10 nm and lower.
• 12 to 22 nm.
• 28 nm and above.

Each end-application is further broken down by regional market -

• Americas.
• Europe, Middle East and Africa (EMEA).
• Asia Pacific (APAC).

REPORT INCLUDES:

• 72 data tables and 10 additional tables
• An overview of the global markets for semiconductor silicon wafers
• Analyses of global market trends, with data from 2017, 2018, and projections of compound annual growth rates (CAGRs) through 2023
• Identification of potential applications of semiconductor silicon wafers in consumer electronics, telecommunications, automotive, defence, and healthcare industry
• Overview of various bonding technologies in the semiconductor silicon wafers industry, including direct bonding, surface activated bonding, plasma activated bonding and anodic bonding
• Coverage of major innovation initiatives in silicon wafer fabrication technology
• Detailed analysis of major vendors and suppliers of the industry, including 3M, Global Wafers Co., Ltd., Mechatronik Systemtechnik GmbH, Nissan Chemical Corporation, Samsung, Shanghai Simgui Technology, Toshiba and Wafer World Inc

Contents

CHAPTER 1 INTRODUCTION

Study Goals and Objectives
Reasons for Doing the Study
Scope of the Report
Intended Audience
Methodology and Information Sources
Geographic Breakdown
Analyst's Credentials
BCC Custom Research
Related BCC Research Reports

CHAPTER 2 EXECUTIVE SUMMARY

CHAPTER 3 SEMICONDUCTOR DEVICE MANUFACTURING AND MATERIAL PROPERTIES

Steps in Semiconductor Device Manufacturing
Wafering
Fabrication
Packaging
Silicon (Si)
Silicon and the Periodic Table
The Carbon Family
Silicon
Compound Semiconductors
Gallium Arsenide (GaAs)
Indium Phosphide (InP)
Gallium Nitride (GaN)
Group II-VI: Oxides, Sulfides, Selenides and Tellurides
Group IV: Silicon-Based Compounds and Alloys
Gate Definition Methodology
Transistor-Transistor Logic (TTL)
Complementary Metal Oxide Semiconductor (CMOS)
Field Effect Transistor (FET)
Metal Oxide/Insulator Semiconductor Field Effect Transistor (MISFET/MOSFET)
Bipolar CMOS (BiCMOS)
Metal Semiconductor Field Effect Transistor (MESFET)
High Electron Mobility Transistor (HEMT)
Hetero-Junction Bipolar Transistor (HBT)
Wafer Sizing
The 450 mm Wafer Challenge

CHAPTER 4 CRYSTAL GROWTH METHODS

Introduction
Czochralski (CZ) and Related Methods
Methodology
Key Vendors and Innovations
Bridgman-Stockbarger and Related Methods
Methodology
Key Vendors and Innovations
Float Zone (FZ) and Allied Methods
Methodology
Key Vendors and Innovations
Market Overview
Post-Crystal Growth Wafer Processing
Ingot Formation, Grinding and Trimming
Wafer Slicing and Rounding
Lapping

CHAPTER 5 WAFER-BONDING PROCESS

Direct Bonding
Methodology
Advantages
Surface-Activated Bonding (SAB)
Methodology
Advantages
Plasma-Activated Bonding (PAB)
Methodology
Advantages
Anodic Bonding
Methodology
Advantages
Market Overview

CHAPTER 6 NODE SIZES

Introduction
Overview of the Etching Process
Equipment Involved
Process Challenges
Moore's Law
10 nm and Less
Architecture
Key Developments
12 nm to 22 nm
Architecture
Key Developments
28 nm and More
Architecture
Key Developments
Market Overview

CHAPTER 7 REGIONAL MARKETS

Americas
User Profile
Macroeconomic Overview
Key Companies
EMEA
User Profile
Macroeconomic Overview
Key Companies
APAC
User Profile
Macroeconomic Overview
Key Companies
Market Overview

CHAPTER 8 GLOBAL MARKETS

Telecommunications
Market Overview
Breakdown by Crystal Growth Method
Breakdown by Wafer-Bonding Method
Breakdown by Node Size
Breakdown by Regional Market
Instrumentation and Scientific Research
Market Overview
Breakdown by Crystal Growth Method
Breakdown by Wafer-Bonding Method
Breakdown by Node Size
Breakdown by Regional Market
Healthcare
Market Overview
Breakdown by Crystal Growth Method
Breakdown by Wafer-Bonding Method
Breakdown by Node Size
Breakdown by Regional Market
Energy, Defense and Surveillance
Market Overview
Breakdown by Crystal Growth Method
Breakdown by Wafer-Bonding Method
Breakdown by Node Size
Breakdown by Regional Market
Computing and Entertainment
Market Overview
Breakdown by Crystal Growth Method
Breakdown by Wafer-Bonding Method
Breakdown by Node Size
Breakdown by Regional Market
Industrial and Automotive
Market Overview
Breakdown by Crystal Growth Method
Breakdown by Wafer-Bonding Method
Breakdown by Node Size
Breakdown by Regional Market
Retail and Others
Market Overview
Breakdown by Crystal Growth Method
Breakdown by Wafer-Bonding Method
Breakdown by Node Size
Breakdown by Regional Market

CHAPTER 9 PATENT ANALYSIS

Introduction
Breakdown by Category
Breakdown by Year
Breakdown by Country
Profile of Assignees

CHAPTER 10 COMPANY PROFILES

Wafer Manufacturing and Processing Equipment Vendors
Pricing Dynamics
Key Companies
Semiconductor Material Suppliers
Pricing Dynamics
Key Companies
Additive Materials Suppliers
Pricing Dynamics
Key Companies
Wafer Manufacturers
Pricing Dynamics
Key Companies
Foundries and Semiconductor Device Designers
Pricing Dynamics
Key Companies
Companies
3M
II-VI EPIWORKS
AIXTRON
APPLIED MATERIALS
ALINEASON
BREWER SCIENCE INC.
CMK SRO
DISCO CORP.
ELECTRONICS AND MATERIALS CORP. LTD (E&M)
ELKEM
EV GROUP
GLOBALWAFERS JAPAN CO. LTD.
HEMLOCK SEMICONDUCTOR CORP.
KOKUSAI ELECTRIC
INTEL
LINTEC CORP.
MECHATRONIK SYSTEMTECHNIK GMBH
MICRON
NICHIA CORP.
NISSAN CHEMICAL CORP.
OKMETIC
POWERCHIP
SAMSUNG
SHANGHAI SIMGUI TECHNOLOGY
SHIN-ETSU CHEMICAL CO. LTD.
SILTRONIX SILICON TECHNOLOGIES
SILICON MATERIALS INC.
SILICON VALLEY MICROELECTRONICS
SILTRONIC AG
SK HYNIX
SK SILTRON
SOITEC
SUMCO CORP.
SUSS MICRO TEC AG
SYNOVA
THERMCRAFT
TOKUYAMA CORP.
TOSHIBA
TSMC
ULVAC INC.
UMC
VIRGINIA SEMICONDUCTOR
WACKER CHEMIE AG
WAFER WORKS CORP.
WAFER WORLD INC

List Of Tables

LIST OF TABLES

Summary Table: Global Market for Semiconductor Wafers, Through 2023
Table 1: Physical Properties of the Main Compound Semiconductor Materials Compared to Silicon
Table 2: Group III-V Compound Semiconductors, by Chemical Composition
Table 3: Group II-VI Compound Semiconductors, by Chemical Composition
Table 4: Group IV Compound Semiconductors
Table 5: Other Compounds: Semiconductors, by Chemical Composition
Table 6: Global Market for Semiconductor Wafers, by Crystal Growth Method, Through 2023
Table 7: Global Market Volume for Semiconductor Wafers, by Crystal Growth Method, Through 2023
Table 8: Global Market for Semiconductor Wafers, by Wafer-Bonding Method, Through 2023
Table 9: Global Market Volume for Semiconductor Wafers, by Wafer-Bonding Method, Through 2023
Table 10: Global Market for Semiconductor Wafers, by Node Size, Through 2023
Table 11: Global Market Volume for Semiconductor Wafers, by Node Size, Through 2023
Table 12: Global Market for Semiconductor Wafers, by Region, Through 2023
Table 13: Global Market Volume for Semiconductor Wafers, by Region, Through 2023
Table 14: Global Market for Semiconductor Wafers in Telecommunications End-Use Applications, Through 2023
Table 15: Global Market for Semiconductor Wafers in Telecommunication End-Use Applications, by Crystal Growth Method, Through 2023
Table 16: Global Market Volume for Semiconductor Wafers in Telecommunications End-Use Applications, by Crystal Growth Method, Through 2023
Table 17: Global Market for Semiconductor Wafers in Telecommunication End-Use Applications, by Wafer-Bonding Method, Through 2023
Table 18: Global Market Volume for Semiconductor Wafers, in Telecommunications End-Use Applications, by Wafer-Bonding Method, Through 2023
Table 19: Global Market for Semiconductor Wafers in Telecommunication End-Use Applications, by Node Size, Through 2023
Table 20: Global Market Volume for Semiconductor Wafers in Telecommunications End-Use Applications, by Node Size, Through 2023
Table 21: Global Market for Semiconductor Wafers in Telecommunications End-Use Applications, by Region, Through 2023
Table 22: Global Market Volume for Semiconductor Wafers in Telecommunications End-Use Applications, by Region, Through 2023
Table 23: Global Market for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, Through 2023
Table 24: Global Market for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, by Crystal Growth Method, Through 2023
Table 25: Global Market Volume for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, by Crystal Growth Method, Through 2023
Table 26: Global Market for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, by Wafer-Bonding Method, Through 2023
Table 27: Global Market Volume for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, by Wafer-Bonding Method, Through 2023
Table 28: Global Market for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, by Node Size, Through 2023
Table 29: Global Market Volume for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, by Node Size, Through 2023
Table 30: Global Market for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, by Region, Through 2023
Table 31: Global Market Volume for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, by Region, Through 2023
Table 32: Global Market for Semiconductor Wafers in Healthcare End-Use Applications, Through 2023
Table 33: Global Market for Semiconductor Wafers in Healthcare End-Use Applications, by Crystal Growth Method, Through 2023
Table 34: Global Market Volume for Semiconductor Wafers in Healthcare End-Use Applications, by Crystal Growth Method, Through 2023
Table 35: Global Market for Semiconductor Wafers in Healthcare End-Use Applications, by Wafer-Bonding Method, Through 2023
Table 36: Global Market Volume for Semiconductor Wafers in Healthcare End-Use Applications, by Wafer-Bonding Method, Through 2023
Table 37: Global Market for Semiconductor Wafers in Healthcare End-Use Applications, by Node Size, Through 2023
Table 38: Global Market Volume for Semiconductor Wafers in Healthcare End-Use Applications, by Node Size, Through 2023
Table 39: Global Market for Semiconductor Wafers in Healthcare End-Use Applications by Region, Through 2023
Table 40: Global Market Volume for Semiconductor Wafers in Healthcare End-Use Applications, by Region, Through 2023
Table 41: Global Market for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, Through 2023
Table 42: Global Market for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, by Crystal Growth Method, Through 2023
Table 43: Global Market Volume for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, by Crystal Growth Method, Through 2023
Table 44: Global Market for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, by Wafer-Bonding Method, Through 2023
Table 45: Global Market Volume for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, by Wafer-Bonding Method, Through 2023
Table 46: Global Market for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, by Node Size, Through 2023
Table 47: Global Market Volume for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, by Node Size, Through 2023
Table 48: Global Market for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, by Region, Through 2023
Table 49: Global Market Volume for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, by Region, Through 2023
Table 50: Global Market for Semiconductor Wafers in Computing and Entertainment End-Use Applications, Through 2023
Table 51: Global Market for Semiconductor Wafers in Computing and Entertainment End-Use Applications, by Crystal Growth Method, Through 2023
Table 52: Global Market Volume for Semiconductor Wafers in Computing and Entertainment End-Use Applications, by Crystal Growth Method, Through 2023
Table 53: Global Market for Semiconductor Wafers in Computing and Entertainment End-Use Applications, by Wafer-Bonding Method, Through 2023
Table 54: Global Market Volume for Semiconductor Wafers in Computing and Entertainment End-Use Applications, by Wafer-Bonding Method, Through 2023
Table 55: Global Market for Semiconductor Wafers in Computing and Entertainment End-Use Applications, by Node Size Through 2023
Table 56: Global Market Volume for Semiconductor Wafers in Computing and Entertainment End-Use Applications, by Node Size, Through 2023
Table 57: Global Market for Semiconductor Wafers in Computing and Entertainment End-Use Applications, by Region, Through 2023
Table 58: Global Market Volume for Semiconductor Wafers in Computing and Entertainment End-Use Applications, by Region, Through 2023
Table 59: Global Market for Semiconductor Wafers in Industrial and Automotive End-Use Applications, Through 2023
Table 60: Global Market for Semiconductor Wafers in Industrial and Automotive End-Use Applications, by Crystal Growth Method, Through 2023
Table 61: Global Market Volume for Semiconductor Wafers in Industrial and Automotive End-Use Applications, by Crystal Growth Method, Through 2023
Table 62: Global Market for Semiconductor Wafers in Industrial and Automotive End-Use Applications, by Wafer-Bonding Method, Through 2023
Table 63: Global Market Volume for Semiconductor Wafers in Industrial and Automotive End-Use Applications, by Wafer-Bonding Method, Through 2023
Table 64: Global Market for Semiconductor Wafers in Industrial and Automotive End-Use Applications, by Node Size, Through 2023
Table 65: Global Market Volume for Semiconductor Wafers in Industrial and Automotive End-Use Applications, by Node Size, Through 2023
Table 66: Global Market for Semiconductor Wafers in Industrial and Automotive End-Use Applications, by Region, Through 2023
Table 67: Global Market Volume for Semiconductor Wafers in Industrial and Automotive End-Use Applications, by Region, Through 2023
Table 68: Global Market for Semiconductor Wafers in Retail and Other End-Use Applications, Through 2023
Table 69: Global Market for Semiconductor Wafers in Retail and Others End-Use Applications, by Crystal Growth Method, Through 2023
Table 70: Global Market Volume for Semiconductor Wafers in Retail and Other End-Use Applications, by Crystal Growth Method, Through 2023
Table 71: Global Market for Semiconductor Wafers in Retail and Other End-Use Applications, by Wafer-Bonding Method, Through 2023
Table 72: Global Market Volume for Semiconductor Wafers in Retail and Other End-Use Applications, by Wafer-Bonding Method, Through 2023
Table 73: Global Market for Semiconductor Wafers in Retail and Other End-Use Applications, by Node Size, Through 2023
Table 74: Global Market Volume for Semiconductor Wafers in Retail and Other End-Use Applications, by Node Size, Through 2023
Table 75: Global Market for Semiconductor Wafers in Retail and Others End-Use Applications, by Region, Through 2023
Table 76: Global Market Volume for Semiconductor Wafers in Retail and Other End-Use Applications, by Region, Through 2023
Table 77: U.S. Patents on Semiconductor Wafer Technologies, by Patent Category, 1976 Through Aug. 2018
Table 78: U.S. Patent Trends: Semiconductor Wafer Technologies, by Year Granted, 1976 Through Aug. 2018
Table 79: U.S. Patent Shares of Semiconductor Wafer Technologies, by Assignee’s Country, 1976 Through Aug. 2018
Table 80: U.S. Patent Holders of Semiconductor Wafer Technologies, 1976 Through Aug. 2018
Table 81: Patent Holders with Three or More U.S. Patents on Food Processing and Food Packaging Technologies, 1976 Through July 2018

List Of Figures

LIST OF FIGURES

Summary Figure: Global Market for Semiconductor Wafers, Through 2017-2023