GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET FORECAST 2017-2025
KEY FINDINGS
The global semiconductor packaging materials market was valued $21.34 billion in 2016 and is anticipated to reach $32.81 billion by 2025, growing at an estimated CAGR of 4.96% over the forecast period of 2017-2025. The market growth is mainly driven by a growing demand for smart devices, widespread use of semiconductor IC’S in IOT field and the several technological advancements in semiconductor technology.
MARKET INSIGHTS
The global semiconductor packaging material market segmentation is chiefly done on the basis of packaging technology and the materials used. The packaging technology includes Grid Array (GA) Packages, Small Outline (SO) Packages, Flat No-Leads Packages, Dual In-Line Package (DIP), Quad Flat Packages (QFP), and Other Technologies. The packaging material types are sub-divided into lead frames, organic substrates, bonding wires, ceramic package, encapsulation resins, DIE attach materials and solder balls.
REGIONAL INSIGHTS
Region-wise, the Global Semiconductor Packaging Materials Market has been segmented into seven major regions, i.e., Taiwan, China, South Korea, United States, Japan, Europe and Rest of world. The Chinese market dominated the global semiconductor market in the year 2016, closely followed by Taiwan. Over the years, the semiconductor packaging material market has witnessed considerable progress in the Chinese market due to several contributory factors like high production capacity and easy availability of inexpensive raw materials.
COMPETITIVE INSIGHTS
Applied Materials, Amkor Technology, Asm Pacific Technology (ASMPT), Carsem Inc, BASF Se, Dupont, Henkel, Hitachi Chemical, Evergreen Semiconductor Materials, Honeywell, Kyocera, Jiangsu Changjiang Electronics Technology Co Ltd, LG Innotek, Platform Specialty Products Corporation, Mitsui High-Tec Inc, Sumitomo Chemical Co. Ltd, Tanaka Holdings Co. Ltd, Taiwan Semiconductor Manufacturing Company Ltd, Toppan Printing, Xiamen Yonghong Electronics and Toray Industries Corporation are some of the noted companies in the global semiconductor packaging market.
The global semiconductor packaging materials market was valued $21.34 billion in 2016 and is anticipated to reach $32.81 billion by 2025, growing at an estimated CAGR of 4.96% over the forecast period of 2017-2025. The market growth is mainly driven by a growing demand for smart devices, widespread use of semiconductor IC’S in IOT field and the several technological advancements in semiconductor technology.
MARKET INSIGHTS
The global semiconductor packaging material market segmentation is chiefly done on the basis of packaging technology and the materials used. The packaging technology includes Grid Array (GA) Packages, Small Outline (SO) Packages, Flat No-Leads Packages, Dual In-Line Package (DIP), Quad Flat Packages (QFP), and Other Technologies. The packaging material types are sub-divided into lead frames, organic substrates, bonding wires, ceramic package, encapsulation resins, DIE attach materials and solder balls.
REGIONAL INSIGHTS
Region-wise, the Global Semiconductor Packaging Materials Market has been segmented into seven major regions, i.e., Taiwan, China, South Korea, United States, Japan, Europe and Rest of world. The Chinese market dominated the global semiconductor market in the year 2016, closely followed by Taiwan. Over the years, the semiconductor packaging material market has witnessed considerable progress in the Chinese market due to several contributory factors like high production capacity and easy availability of inexpensive raw materials.
COMPETITIVE INSIGHTS
Applied Materials, Amkor Technology, Asm Pacific Technology (ASMPT), Carsem Inc, BASF Se, Dupont, Henkel, Hitachi Chemical, Evergreen Semiconductor Materials, Honeywell, Kyocera, Jiangsu Changjiang Electronics Technology Co Ltd, LG Innotek, Platform Specialty Products Corporation, Mitsui High-Tec Inc, Sumitomo Chemical Co. Ltd, Tanaka Holdings Co. Ltd, Taiwan Semiconductor Manufacturing Company Ltd, Toppan Printing, Xiamen Yonghong Electronics and Toray Industries Corporation are some of the noted companies in the global semiconductor packaging market.
1. RESEARCH SCOPE
1.1. STUDY GOALS
1.2. SCOPE OF THE MARKET STUDY
1.3. WHO WILL FIND THIS REPORT USEFUL?
1.4. STUDY AND FORECASTING YEARS
2. RESEARCH METHODOLOGY
2.1. SOURCES OF DATA
2.1.1. SECONDARY DATA
2.1.2. PRIMARY DATA
2.2. TOP-DOWN APPROACH
2.3. BOTTOM-UP APPROACH
2.4. DATA TRIANGULATION
3. EXECUTIVE SUMMARY
3.1. MARKET SUMMARY
3.2. KEY FINDINGS
4. MARKET DYNAMICS
4.1. MARKET DEFINITION AND SCOPE
4.2. MARKET DRIVERS
4.2.1. RISING DEMAND FOR SMART DEVICES
4.2.2. GROWING AUTOMOTIVE SEMICONDUCTOR MARKET
4.2.3. INCREASING USAGE OF SEMICONDUCTOR IC’S IN IOT FIELD
4.2.4. GROWING TECHNOLOGICAL ADVANCEMENTS IN SEMICONDUCTOR TECHNOLOGY
4.3. MARKET RESTRAINTS
4.3.1. STRICT MATERIAL SPECIFICATIONS SET DOWN BY PACKAGING ASSEMBLERS AND TESTERS
4.3.2. VOLATILE FOREIGN EXCHANGE MARKET
4.3.3. SEMICONDUCTOR CONSUMPTION HIGH IN A PARTICULAR REGION AS COMPARED TO OTHERS
4.3.4. CYCLIC NATURE OF SEMICONDUCTOR INDUSTRY
4.4. MARKET OPPORTUNITIES
4.4.1. SHIFTING FOCUS FROM COPPER TO GOLD AS BONDING WIRE MATERIAL
4.4.2. LEAD-FREE PACKAGING DEMAND ON A RISE
4.4.3. GROWING ADOPTION OF FLIP-CHIP PACKAGING SOLUTIONS
4.5. MARKET CHALLENGES
4.5.1. HIGH DEPENDENCY ON SEMICONDUCTOR INDUSTRY
4.5.2. HIGH CAPITAL REQUIRED FOR INITIAL SETUP
5. SEMICONDUCTOR PACKAGING TECHNOLOGY
5.1. SMALL OUTLINE (SO) PACKAGES
5.2. GRID ARRAY (GA) PACKAGES
5.3. FLAT NO-LEADS PACKAGES
5.4. QUAD FLAT PACKAGES (QFP)
5.5. DUAL IN-LINE PACKAGE (DIP)
5.6. OTHER TECHNOLOGIES
6. MARKET BY TYPE OF MATERIALS
6.1. ORGANIC SUBSTRATES
6.2. LEAD FRAMES
6.3. BONDING WIRES
6.4. ENCAPSULATION RESINS
6.5. CERAMIC PACKAGES
6.6. DIE ATTACH MATERIALS
6.7. SOLDER BALLS
6.8. OTHER MATERIALS
7. KEY ANALYTICS
7.1. PORTER’S FIVE FORCE ANALYSIS
7.1.1. THREAT OF NEW ENTRANTS
7.1.2. THREAT OF SUBSTITUTE
7.1.3. BARGAINING POWER OF SUPPLIERS
7.1.4. BARGAINING POWER OF BUYERS
7.1.5. INTENSITY OF COMPETITIVE RIVALRY
7.2. OPPORTUNITY MATRIX
7.3. VALUE CHAIN ANALYSIS
8. GEOGRAPHICAL ANALYSIS
8.1. CHINA
8.2. TAIWAN
8.3. SOUTH KOREA
8.4. JAPAN
8.5. UNITED STATES
8.6. EUROPE
8.7. REST OF WORLD
9. COMPETITIVE LANDSCAPE
9.1. KEY COMPANY ANALYSIS
9.2. COMPANY PROFILES
9.2.1. AMKOR TECHNOLOGY
9.2.2. APPLIED MATERIALS
9.2.3. ASM PACIFIC TECHNOLOGY (ASMPT)
9.2.4. BASF SE
9.2.5. CARSEM, INC
9.2.6. DUPONT
9.2.7. HENKEL
9.2.8. EVERGREEN SEMICONDUCTOR MATERIALS
9.2.9. HITACHI CHEMICAL
9.2.10. HONEYWELL
9.2.11. JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.
9.2.12. KYOCERA
9.2.13. LG INNOTEK
9.2.14. MITSUI HIGH-TEC INC.
9.2.15. PLATFORM SPECIALTY PRODUCTS CORPORATION
9.2.16. SUMITOMO CHEMICAL CO. LTD.
9.2.17. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
9.2.18. TANAKA HOLDINGS CO., LTD.
9.2.19. TOPPAN PRINTING
9.2.20. TORAY INDUSTRIES CORPORATION
9.2.21. XIAMEN YONGHONG ELECTRONICS
TABLE LIST
TABLE 1: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY GEOGRAPHY, 2017-2025 (IN $ BILLION)
TABLE 2: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY TYPE OF MATERIALS, 2017-2025 (IN $ BILLION)
TABLE 3: GLOBAL ORGANIC SUBSTRATES MARKET, BY REGION, 2017-2025 (IN $ BILLION)
TABLE 4: GLOBAL LEAD FRAMES MARKET, BY REGION, 2017-2025 (IN $ BILLION)
TABLE 5: GLOBAL BONDING WIRES MARKET, BY REGION, 2017-2025 (IN $ BILLION)
TABLE 6: GLOBAL ENCAPSULATION RESINS MARKET, BY REGION, 2017-2025 (IN $ BILLION)
TABLE 7: GLOBAL CERAMIC PACKAGES MARKET, BY REGION, 2017-2025 (IN $ BILLION)
TABLE 8: GLOBAL DIE ATTACH MATERIALS MARKET, BY REGION, 2017-2025 (IN $ BILLION)
TABLE 9: GLOBAL SOLDER BALLS MARKET, BY REGION, 2017-2025 (IN $ BILLION)
TABLE 10: GLOBAL OTHER MATERIALS MARKET, BY REGION, 2017-2025 (IN $ BILLION)
TABLE 11: OPPORTUNITY MATRIX OF SEMICONDUCTOR PACKAGING MATERIALS MARKET
TABLE 12: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY GEOGRAPHY, 2017-2025, (IN $ BILLION)
TABLE 13: COMPANIES PRODUCING SEMICONDUCTORS IN CHINA BASED ON WAFER SIZE
TABLE 14: CHINA-HEADQUARTERED COMPANIES SUPPLYING SEMICONDUCTOR PACKAGING MATERIALS
TABLE 15: TOP SUPPLIERS IN EACH SEGMENT IN JAPAN
FIGURE LIST
FIGURE 1: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY TYPE OF MATERIALS, 2016 & 2025 (IN $ BILLION)
FIGURE 2: NUMBER OF WORLDWIDE SMARTPHONE USERS, 2015-2020 (IN BILLION)
FIGURE 3: NUMBER OF TABLET USERS ACROSS THE WORLD, 2015-2020, (IN BILLIONS)
FIGURE 4: WEARABLE DEVICES MARKET ESTIMATES, 2014-2018 (IN $ BILLION)
FIGURE 5: GLOBAL AUTOMOTIVE SEMICONDUCTOR MARKET, 2017-2025 ($ MILLION)
FIGURE 6: FLUCTUATING EXCHANGE RATES BETWEEN USD AND THE JAPANESE YEN, 2012 TO 2016
FIGURE 7: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY ORGANIC SUBSTRATES, 2017-2025 (IN $ BILLION)
FIGURE 8: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY LEAD FRAMES, 2017-2025 (IN $ BILLION)
FIGURE 9: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY BONDING WIRES, 2017-2025 (IN $ BILLION)
FIGURE 10: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY ENCAPSULATION RESINS, 2017-2025 (IN $ BILLION)
FIGURE 11: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY CERAMIC PACKAGES, 2017-2025 (IN $ BILLION)
FIGURE 12: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY DIE ATTACH MATERIALS, 2017-2025 (IN $ BILLION)
FIGURE 13: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY SOLDER BALLS, 2017-2025 (IN $ BILLION)
FIGURE 14: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY OTHER MATERIALS, 2017-2025 (IN $ BILLION)
FIGURE 15: PORTER’S FIVE FORCE MODEL OF SEMICONDUCTOR PACKAGING MATERIALS MARKET
FIGURE 16: VALUE CHAIN OF SEMICONDUCTOR PACKAGING MATERIALS MARKET
FIGURE 17: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, GEOGRAPHICAL OUTLOOK, 2016 & 2025 (IN %)
FIGURE 18: CHINA SEMICONDUCTOR PACKAGING MATERIALS MARKET, 2017-2025 (IN $ BILLION)
FIGURE 19: TAIWAN SEMICONDUCTOR PACKAGING MATERIALS MARKET, 2017-2025 (IN $ BILLION)
FIGURE 20: SOUTH KOREA SEMICONDUCTOR PACKAGING MATERIALS MARKET, 2017-2025 (IN $ BILLION)
FIGURE 21: JAPAN SEMICONDUCTOR PACKAGING MATERIALS MARKET, 2017-2025 (IN $ BILLION)
FIGURE 22: UNITED STATES SEMICONDUCTOR PACKAGING MATERIALS MARKET, 2017-2025 (IN $ BILLION)
FIGURE 23: EUROPE SEMICONDUCTOR PACKAGING MATERIALS MARKET, 2017-2025 (IN $ BILLION)
FIGURE 24: REST OF WORLD SEMICONDUCTOR PACKAGING MATERIALS MARKET, 2017-2025 (IN $ BILLION)
FIGURE 25: KEY PLAYERS IN THE SEMICONDUCTOR PACKAGING MATERIALS MARKET, 2016
COMPANIES MENTIONED
1. AMKOR TECHNOLOGY
2. APPLIED MATERIALS
3. ASM PACIFIC TECHNOLOGY (ASMPT)
4. BASF SE
5. CARSEM, INC
6. DUPONT
7. HENKEL
8. EVERGREEN SEMICONDUCTOR MATERIALS
.9. HITACHI CHEMICAL
10. HONEYWELL
11. JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.
12. KYOCERA
13. LG INNOTEK
14. MITSUI HIGH-TEC INC.
15. PLATFORM SPECIALTY PRODUCTS CORPORATION
16. SUMITOMO CHEMICAL CO. LTD.
17. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
18. TANAKA HOLDINGS CO., LTD.
19. TOPPAN PRINTING
20. TORAY INDUSTRIES CORPORATION
21. XIAMEN YONGHONG ELECTRONICS
1.1. STUDY GOALS
1.2. SCOPE OF THE MARKET STUDY
1.3. WHO WILL FIND THIS REPORT USEFUL?
1.4. STUDY AND FORECASTING YEARS
2. RESEARCH METHODOLOGY
2.1. SOURCES OF DATA
2.1.1. SECONDARY DATA
2.1.2. PRIMARY DATA
2.2. TOP-DOWN APPROACH
2.3. BOTTOM-UP APPROACH
2.4. DATA TRIANGULATION
3. EXECUTIVE SUMMARY
3.1. MARKET SUMMARY
3.2. KEY FINDINGS
4. MARKET DYNAMICS
4.1. MARKET DEFINITION AND SCOPE
4.2. MARKET DRIVERS
4.2.1. RISING DEMAND FOR SMART DEVICES
4.2.2. GROWING AUTOMOTIVE SEMICONDUCTOR MARKET
4.2.3. INCREASING USAGE OF SEMICONDUCTOR IC’S IN IOT FIELD
4.2.4. GROWING TECHNOLOGICAL ADVANCEMENTS IN SEMICONDUCTOR TECHNOLOGY
4.3. MARKET RESTRAINTS
4.3.1. STRICT MATERIAL SPECIFICATIONS SET DOWN BY PACKAGING ASSEMBLERS AND TESTERS
4.3.2. VOLATILE FOREIGN EXCHANGE MARKET
4.3.3. SEMICONDUCTOR CONSUMPTION HIGH IN A PARTICULAR REGION AS COMPARED TO OTHERS
4.3.4. CYCLIC NATURE OF SEMICONDUCTOR INDUSTRY
4.4. MARKET OPPORTUNITIES
4.4.1. SHIFTING FOCUS FROM COPPER TO GOLD AS BONDING WIRE MATERIAL
4.4.2. LEAD-FREE PACKAGING DEMAND ON A RISE
4.4.3. GROWING ADOPTION OF FLIP-CHIP PACKAGING SOLUTIONS
4.5. MARKET CHALLENGES
4.5.1. HIGH DEPENDENCY ON SEMICONDUCTOR INDUSTRY
4.5.2. HIGH CAPITAL REQUIRED FOR INITIAL SETUP
5. SEMICONDUCTOR PACKAGING TECHNOLOGY
5.1. SMALL OUTLINE (SO) PACKAGES
5.2. GRID ARRAY (GA) PACKAGES
5.3. FLAT NO-LEADS PACKAGES
5.4. QUAD FLAT PACKAGES (QFP)
5.5. DUAL IN-LINE PACKAGE (DIP)
5.6. OTHER TECHNOLOGIES
6. MARKET BY TYPE OF MATERIALS
6.1. ORGANIC SUBSTRATES
6.2. LEAD FRAMES
6.3. BONDING WIRES
6.4. ENCAPSULATION RESINS
6.5. CERAMIC PACKAGES
6.6. DIE ATTACH MATERIALS
6.7. SOLDER BALLS
6.8. OTHER MATERIALS
7. KEY ANALYTICS
7.1. PORTER’S FIVE FORCE ANALYSIS
7.1.1. THREAT OF NEW ENTRANTS
7.1.2. THREAT OF SUBSTITUTE
7.1.3. BARGAINING POWER OF SUPPLIERS
7.1.4. BARGAINING POWER OF BUYERS
7.1.5. INTENSITY OF COMPETITIVE RIVALRY
7.2. OPPORTUNITY MATRIX
7.3. VALUE CHAIN ANALYSIS
8. GEOGRAPHICAL ANALYSIS
8.1. CHINA
8.2. TAIWAN
8.3. SOUTH KOREA
8.4. JAPAN
8.5. UNITED STATES
8.6. EUROPE
8.7. REST OF WORLD
9. COMPETITIVE LANDSCAPE
9.1. KEY COMPANY ANALYSIS
9.2. COMPANY PROFILES
9.2.1. AMKOR TECHNOLOGY
9.2.2. APPLIED MATERIALS
9.2.3. ASM PACIFIC TECHNOLOGY (ASMPT)
9.2.4. BASF SE
9.2.5. CARSEM, INC
9.2.6. DUPONT
9.2.7. HENKEL
9.2.8. EVERGREEN SEMICONDUCTOR MATERIALS
9.2.9. HITACHI CHEMICAL
9.2.10. HONEYWELL
9.2.11. JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.
9.2.12. KYOCERA
9.2.13. LG INNOTEK
9.2.14. MITSUI HIGH-TEC INC.
9.2.15. PLATFORM SPECIALTY PRODUCTS CORPORATION
9.2.16. SUMITOMO CHEMICAL CO. LTD.
9.2.17. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
9.2.18. TANAKA HOLDINGS CO., LTD.
9.2.19. TOPPAN PRINTING
9.2.20. TORAY INDUSTRIES CORPORATION
9.2.21. XIAMEN YONGHONG ELECTRONICS
TABLE LIST
TABLE 1: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY GEOGRAPHY, 2017-2025 (IN $ BILLION)
TABLE 2: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY TYPE OF MATERIALS, 2017-2025 (IN $ BILLION)
TABLE 3: GLOBAL ORGANIC SUBSTRATES MARKET, BY REGION, 2017-2025 (IN $ BILLION)
TABLE 4: GLOBAL LEAD FRAMES MARKET, BY REGION, 2017-2025 (IN $ BILLION)
TABLE 5: GLOBAL BONDING WIRES MARKET, BY REGION, 2017-2025 (IN $ BILLION)
TABLE 6: GLOBAL ENCAPSULATION RESINS MARKET, BY REGION, 2017-2025 (IN $ BILLION)
TABLE 7: GLOBAL CERAMIC PACKAGES MARKET, BY REGION, 2017-2025 (IN $ BILLION)
TABLE 8: GLOBAL DIE ATTACH MATERIALS MARKET, BY REGION, 2017-2025 (IN $ BILLION)
TABLE 9: GLOBAL SOLDER BALLS MARKET, BY REGION, 2017-2025 (IN $ BILLION)
TABLE 10: GLOBAL OTHER MATERIALS MARKET, BY REGION, 2017-2025 (IN $ BILLION)
TABLE 11: OPPORTUNITY MATRIX OF SEMICONDUCTOR PACKAGING MATERIALS MARKET
TABLE 12: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY GEOGRAPHY, 2017-2025, (IN $ BILLION)
TABLE 13: COMPANIES PRODUCING SEMICONDUCTORS IN CHINA BASED ON WAFER SIZE
TABLE 14: CHINA-HEADQUARTERED COMPANIES SUPPLYING SEMICONDUCTOR PACKAGING MATERIALS
TABLE 15: TOP SUPPLIERS IN EACH SEGMENT IN JAPAN
FIGURE LIST
FIGURE 1: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY TYPE OF MATERIALS, 2016 & 2025 (IN $ BILLION)
FIGURE 2: NUMBER OF WORLDWIDE SMARTPHONE USERS, 2015-2020 (IN BILLION)
FIGURE 3: NUMBER OF TABLET USERS ACROSS THE WORLD, 2015-2020, (IN BILLIONS)
FIGURE 4: WEARABLE DEVICES MARKET ESTIMATES, 2014-2018 (IN $ BILLION)
FIGURE 5: GLOBAL AUTOMOTIVE SEMICONDUCTOR MARKET, 2017-2025 ($ MILLION)
FIGURE 6: FLUCTUATING EXCHANGE RATES BETWEEN USD AND THE JAPANESE YEN, 2012 TO 2016
FIGURE 7: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY ORGANIC SUBSTRATES, 2017-2025 (IN $ BILLION)
FIGURE 8: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY LEAD FRAMES, 2017-2025 (IN $ BILLION)
FIGURE 9: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY BONDING WIRES, 2017-2025 (IN $ BILLION)
FIGURE 10: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY ENCAPSULATION RESINS, 2017-2025 (IN $ BILLION)
FIGURE 11: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY CERAMIC PACKAGES, 2017-2025 (IN $ BILLION)
FIGURE 12: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY DIE ATTACH MATERIALS, 2017-2025 (IN $ BILLION)
FIGURE 13: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY SOLDER BALLS, 2017-2025 (IN $ BILLION)
FIGURE 14: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY OTHER MATERIALS, 2017-2025 (IN $ BILLION)
FIGURE 15: PORTER’S FIVE FORCE MODEL OF SEMICONDUCTOR PACKAGING MATERIALS MARKET
FIGURE 16: VALUE CHAIN OF SEMICONDUCTOR PACKAGING MATERIALS MARKET
FIGURE 17: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, GEOGRAPHICAL OUTLOOK, 2016 & 2025 (IN %)
FIGURE 18: CHINA SEMICONDUCTOR PACKAGING MATERIALS MARKET, 2017-2025 (IN $ BILLION)
FIGURE 19: TAIWAN SEMICONDUCTOR PACKAGING MATERIALS MARKET, 2017-2025 (IN $ BILLION)
FIGURE 20: SOUTH KOREA SEMICONDUCTOR PACKAGING MATERIALS MARKET, 2017-2025 (IN $ BILLION)
FIGURE 21: JAPAN SEMICONDUCTOR PACKAGING MATERIALS MARKET, 2017-2025 (IN $ BILLION)
FIGURE 22: UNITED STATES SEMICONDUCTOR PACKAGING MATERIALS MARKET, 2017-2025 (IN $ BILLION)
FIGURE 23: EUROPE SEMICONDUCTOR PACKAGING MATERIALS MARKET, 2017-2025 (IN $ BILLION)
FIGURE 24: REST OF WORLD SEMICONDUCTOR PACKAGING MATERIALS MARKET, 2017-2025 (IN $ BILLION)
FIGURE 25: KEY PLAYERS IN THE SEMICONDUCTOR PACKAGING MATERIALS MARKET, 2016
COMPANIES MENTIONED
1. AMKOR TECHNOLOGY
2. APPLIED MATERIALS
3. ASM PACIFIC TECHNOLOGY (ASMPT)
4. BASF SE
5. CARSEM, INC
6. DUPONT
7. HENKEL
8. EVERGREEN SEMICONDUCTOR MATERIALS
.9. HITACHI CHEMICAL
10. HONEYWELL
11. JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.
12. KYOCERA
13. LG INNOTEK
14. MITSUI HIGH-TEC INC.
15. PLATFORM SPECIALTY PRODUCTS CORPORATION
16. SUMITOMO CHEMICAL CO. LTD.
17. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
18. TANAKA HOLDINGS CO., LTD.
19. TOPPAN PRINTING
20. TORAY INDUSTRIES CORPORATION
21. XIAMEN YONGHONG ELECTRONICS
