GaN Power Device Market By Device Type (Power Discrete, Power Module, Power IC), By End Use (Telecommunication, Industrial, Automotive, Consumer Electronics, Military and Defense, Energy and Power, Others): Global Opportunity Analysis and Industry Forecast, 2024-2033
The GaN power device market was valued at $ 305.0 million in 2023 and is estimated to reach $12,849.3 million by 2033, exhibiting a CAGR of 45.6% from 2024 to 2033.
The GaN power device market includes gallium nitride-based components engineered for optimal power conversion and regulation. Utilizing exceptional thermal conductivity and efficiency, GaN devices facilitate compact, high-performance solutions across sectors like electric vehicles and renewable energy, propelling innovations in energy management and eco-friendly technologies.
The trend toward smaller electronics is a key driver of the GaN power devices market, highlighting the industry's shift towards smaller, more efficient components. As consumer demand for compact and lightweight devices grows, manufacturers are increasingly challenged to deliver high performance within limited space. GaN power devices offer a compelling solution due to their superior efficiency, higher power density, and smaller size as compared to traditional silicon-based devices.
GaN technology enables smaller designs without compromising performance. This is particularly important in applications such as smartphones, laptops, and wearables, where there is limited space available for components.. The compact size of GaN devices allows for more streamlined power supplies and converters, facilitating sleeker designs while maintaining high efficiency. This is crucial in portable electronics, where battery life and thermal management are critical considerations. Moreover, GaN devices exhibit lower switching losses and faster switching speeds, making them ideal for high-frequency applications. This capability not only enhances the performance of power supplies but also allows for lighter and smaller passive components, further contributing to miniaturization.
Rise in demand for energy-efficient solutions and the miniaturization of electronic components in the automotive industry significantly benefit from this trend,, particularly with the rise of electric vehicles (EVs). GaN devices are essential for efficient onboard chargers and power electronics, enabling manufacturers to create smaller and lighter vehicle systems that enhance performance and range. The miniaturization of electronics drives the demand for GaN power devices by necessitating smaller, more efficient solutions. As industries continue to innovate towards compact designs, the reliance on GaN technology will grow, positioning it as a key player in the evolving landscape of electronic devices and systems. This trend not only boosts the GaN power devices market but also aligns with broader technological advancements and consumer preferences for efficient, space-saving products.
However, thermal management challenges significantly impact the GaN power device market, as effective heat dissipation is crucial for performance and reliability. GaN devices operate at higher frequencies and power densities, generating more heat than traditional silicon counterparts. While GaN technology offers superior efficiency, improper thermal management can lead to overheating, which affects device longevity and performance. The need for advanced cooling solutions, such as heat sinks, thermal interface materials, and innovative packaging techniques, complicates design processes and increases system costs. Moreover, in space-constrained applications like electric vehicles and consumer electronics, space constraints further hinder effective thermal management. As manufacturers strive to address these challenges, the demand for integrated thermal management solutions will grow, thus restraining the growth of the GaN power device market.
Moreover, rise in need for high-performance computing (HPC) presents a significant opportunity for the GaN power device market. As industries increasingly rely on data-intensive applications, such as artificial intelligence, machine learning, and big data analytics, efficient power management becomes critical. GaN devices, known for their high efficiency and power density, are well-equipped to meet the specific energy and performance requirements of HPC environments..
GaN technology enables faster switching speeds and reduced power losses compared to traditional silicon devices. This capability is essential in data centers and supercomputing facilities, where efficient power conversion directly impacts performance and operational costs. By utilizing GaN power devices, companies can achieve higher performance levels while minimizing energy consumption and heat generation, leading to cost savings in cooling and infrastructure.
Furthermore, as the global demand for cloud computing and advanced computing solutions continues to rise, the adoption of GaN devices can facilitate the development of more compact and energy-efficient server architectures. This trend not only enhances processing capabilities but also aligns with sustainability goals, as reducing energy usage is increasingly prioritized. Overall, the shift toward HPC offers a lucrative avenue for growth in the GaN power device market, driving innovation and technological advancements in power management solutions.
The GaN power devices market is segmented into device type, end use, and region. By device type, the market is segmented into power discrete, power module, and power IC. By end use, the market is segmented into telecommunication, industrial, automotive, consumer electronics, military and defense, energy and power, and others. On the basis of region, it is analyzed across North America (the U.S., Canada, and Mexico), Europe (the UK, Germany, France, Italy, Spain, and the rest of Europe), Asia-Pacific (China, Japan, India, South Korea, and rest of Asia-Pacific), and LAMEA (Latin America, Middle East, and Africa).
The players operating in the global GaN power devices market include Efficient Power Conversion Corporation (EPC), Fujitsu Limited, GaN Systems, On Semiconductors, Panasonic Corporation, VisIC, Texas Instruments Inc., Toshiba Corporation, Fujitsu Limited, Infineon Technologies AG, and Taiwan Semiconductor Manufacturing Company. The key players in the GaN power devices market are focusing on acquisition and partnership to increase GaN power devices capabilities and to invest in research and development of GaN power devices.
Key Benefits For Stakeholders
By Device Type
The GaN power device market includes gallium nitride-based components engineered for optimal power conversion and regulation. Utilizing exceptional thermal conductivity and efficiency, GaN devices facilitate compact, high-performance solutions across sectors like electric vehicles and renewable energy, propelling innovations in energy management and eco-friendly technologies.
The trend toward smaller electronics is a key driver of the GaN power devices market, highlighting the industry's shift towards smaller, more efficient components. As consumer demand for compact and lightweight devices grows, manufacturers are increasingly challenged to deliver high performance within limited space. GaN power devices offer a compelling solution due to their superior efficiency, higher power density, and smaller size as compared to traditional silicon-based devices.
GaN technology enables smaller designs without compromising performance. This is particularly important in applications such as smartphones, laptops, and wearables, where there is limited space available for components.. The compact size of GaN devices allows for more streamlined power supplies and converters, facilitating sleeker designs while maintaining high efficiency. This is crucial in portable electronics, where battery life and thermal management are critical considerations. Moreover, GaN devices exhibit lower switching losses and faster switching speeds, making them ideal for high-frequency applications. This capability not only enhances the performance of power supplies but also allows for lighter and smaller passive components, further contributing to miniaturization.
Rise in demand for energy-efficient solutions and the miniaturization of electronic components in the automotive industry significantly benefit from this trend,, particularly with the rise of electric vehicles (EVs). GaN devices are essential for efficient onboard chargers and power electronics, enabling manufacturers to create smaller and lighter vehicle systems that enhance performance and range. The miniaturization of electronics drives the demand for GaN power devices by necessitating smaller, more efficient solutions. As industries continue to innovate towards compact designs, the reliance on GaN technology will grow, positioning it as a key player in the evolving landscape of electronic devices and systems. This trend not only boosts the GaN power devices market but also aligns with broader technological advancements and consumer preferences for efficient, space-saving products.
However, thermal management challenges significantly impact the GaN power device market, as effective heat dissipation is crucial for performance and reliability. GaN devices operate at higher frequencies and power densities, generating more heat than traditional silicon counterparts. While GaN technology offers superior efficiency, improper thermal management can lead to overheating, which affects device longevity and performance. The need for advanced cooling solutions, such as heat sinks, thermal interface materials, and innovative packaging techniques, complicates design processes and increases system costs. Moreover, in space-constrained applications like electric vehicles and consumer electronics, space constraints further hinder effective thermal management. As manufacturers strive to address these challenges, the demand for integrated thermal management solutions will grow, thus restraining the growth of the GaN power device market.
Moreover, rise in need for high-performance computing (HPC) presents a significant opportunity for the GaN power device market. As industries increasingly rely on data-intensive applications, such as artificial intelligence, machine learning, and big data analytics, efficient power management becomes critical. GaN devices, known for their high efficiency and power density, are well-equipped to meet the specific energy and performance requirements of HPC environments..
GaN technology enables faster switching speeds and reduced power losses compared to traditional silicon devices. This capability is essential in data centers and supercomputing facilities, where efficient power conversion directly impacts performance and operational costs. By utilizing GaN power devices, companies can achieve higher performance levels while minimizing energy consumption and heat generation, leading to cost savings in cooling and infrastructure.
Furthermore, as the global demand for cloud computing and advanced computing solutions continues to rise, the adoption of GaN devices can facilitate the development of more compact and energy-efficient server architectures. This trend not only enhances processing capabilities but also aligns with sustainability goals, as reducing energy usage is increasingly prioritized. Overall, the shift toward HPC offers a lucrative avenue for growth in the GaN power device market, driving innovation and technological advancements in power management solutions.
The GaN power devices market is segmented into device type, end use, and region. By device type, the market is segmented into power discrete, power module, and power IC. By end use, the market is segmented into telecommunication, industrial, automotive, consumer electronics, military and defense, energy and power, and others. On the basis of region, it is analyzed across North America (the U.S., Canada, and Mexico), Europe (the UK, Germany, France, Italy, Spain, and the rest of Europe), Asia-Pacific (China, Japan, India, South Korea, and rest of Asia-Pacific), and LAMEA (Latin America, Middle East, and Africa).
The players operating in the global GaN power devices market include Efficient Power Conversion Corporation (EPC), Fujitsu Limited, GaN Systems, On Semiconductors, Panasonic Corporation, VisIC, Texas Instruments Inc., Toshiba Corporation, Fujitsu Limited, Infineon Technologies AG, and Taiwan Semiconductor Manufacturing Company. The key players in the GaN power devices market are focusing on acquisition and partnership to increase GaN power devices capabilities and to invest in research and development of GaN power devices.
Key Benefits For Stakeholders
- This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the GaN power device market analysis from 2023 to 2033 to identify the prevailing GaN power device market opportunities.
- The market research is offered along with information related to key drivers, restraints, and opportunities.
- Porter's five forces analysis highlights the potency of buyers and suppliers to enable stakeholders make profit-oriented business decisions and strengthen their supplier-buyer network.
- In-depth analysis of the GaN power device market segmentation assists to determine the prevailing market opportunities.
- Major countries in each region are mapped according to their revenue contribution to the global market.
- Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.
- The report includes the analysis of the regional as well as global GaN power device market trends, key players, market segments, application areas, and market growth strategies.
- Quarterly Update and* (only available with a corporate license, on listed price)
- 5 additional Company Profile of client Choice pre- or Post-purchase, as a free update.
- Free Upcoming Version on the Purchase of Five and Enterprise User License.
- 16 analyst hours of support* (post-purchase, if you find additional data requirements upon review of the report, you may receive support amounting to 16 analyst hours to solve questions, and post-sale queries)
- 15% Free Customization* (in case the scope or segment of the report does not match your requirements, 15% is equivalent to 3 working days of free work, applicable once)
- Free data Pack on the Five and Enterprise User License. (Excel version of the report)
- Free Updated report if the report is 6-12 months old or older.
- 24-hour priority response*
- Free Industry updates and white papers.
- Investment Opportunities
- Upcoming/New Entrant by Regions
- Go To Market Strategy
- Regulatory Guidelines
- Additional company profiles with specific to client's interest
- Additional country or region analysis- market size and forecast
- Average Selling Price Analysis / Price Point Analysis
- Brands Share Analysis
- Criss-cross segment analysis- market size and forecast
- Expanded list for Company Profiles
- Historic market data
- Import Export Analysis/Data
- Key player details (including location, contact details, supplier/vendor network etc. in excel format)
- List of customers/consumers/raw material suppliers- value chain analysis
- Market share analysis of players at global/region/country level
- SWOT Analysis
- Volume Market Size and Forecast
By Device Type
- Power Discrete
- Power Module
- Power IC
- Industrial
- Automotive
- Consumer Electronics
- Military and Defense
- Telecommunication
- Energy and Power
- Others
- North America
- U.S.
- Canada
- Mexico
- Europe
- Germany
- France
- UK
- Italy
- Rest of Europe
- Asia-Pacific
- China
- India
- Japan
- South Korea
- Rest of Asia-Pacific
- LAMEA
- Latin America
- Middle East
- Africa
- Key Market Players
- Efficient Power Conversion Corporation Inc.
- Fujitsu Limited
- GaN Systems Inc.
- Infineon Technologies AG
- ON SEMICONDUCTOR CORPORATION
- Panasonic Corporation
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- TEXAS INSTRUMENTS INC.
- Toshiba Corporation
- VISIC TECHNOLOGIES LTD
CHAPTER 1: INTRODUCTION
1.1. Report description
1.2. Key market segments
1.3. Key benefits to the stakeholders
1.4. Research methodology
1.4.1. Primary research
1.4.2. Secondary research
1.4.3. Analyst tools and models
CHAPTER 2: EXECUTIVE SUMMARY
2.1. CXO perspective
CHAPTER 3: MARKET OVERVIEW
3.1. Market definition and scope
3.2. Key findings
3.2.1. Top impacting factors
3.2.2. Top investment pockets
3.3. Porter’s five forces analysis
3.4. Market dynamics
3.4.1. Drivers
3.4.2. Restraints
3.4.3. Opportunities
CHAPTER 4: GAN POWER DEVICE MARKET, BY DEVICE TYPE
4.1. Overview
4.1.1. Market size and forecast
4.2. Power Discrete
4.2.1. Key market trends, growth factors and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Market share analysis by country
4.3. Power Module
4.3.1. Key market trends, growth factors and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market share analysis by country
4.4. Power IC
4.4.1. Key market trends, growth factors and opportunities
4.4.2. Market size and forecast, by region
4.4.3. Market share analysis by country
CHAPTER 5: GAN POWER DEVICE MARKET, BY END USE
5.1. Overview
5.1.1. Market size and forecast
5.2. Telecommunication
5.2.1. Key market trends, growth factors and opportunities
5.2.2. Market size and forecast, by region
5.2.3. Market share analysis by country
5.3. Industrial
5.3.1. Key market trends, growth factors and opportunities
5.3.2. Market size and forecast, by region
5.3.3. Market share analysis by country
5.4. Automotive
5.4.1. Key market trends, growth factors and opportunities
5.4.2. Market size and forecast, by region
5.4.3. Market share analysis by country
5.5. Consumer Electronics
5.5.1. Key market trends, growth factors and opportunities
5.5.2. Market size and forecast, by region
5.5.3. Market share analysis by country
5.6. Military and Defense
5.6.1. Key market trends, growth factors and opportunities
5.6.2. Market size and forecast, by region
5.6.3. Market share analysis by country
5.7. Energy and Power
5.7.1. Key market trends, growth factors and opportunities
5.7.2. Market size and forecast, by region
5.7.3. Market share analysis by country
5.8. Others
5.8.1. Key market trends, growth factors and opportunities
5.8.2. Market size and forecast, by region
5.8.3. Market share analysis by country
CHAPTER 6: GAN POWER DEVICE MARKET, BY REGION
6.1. Overview
6.1.1. Market size and forecast By Region
6.2. North America
6.2.1. Key market trends, growth factors and opportunities
6.2.2. Market size and forecast, by Device Type
6.2.3. Market size and forecast, by End Use
6.2.4. Market size and forecast, by country
6.2.4.1. U.S.
6.2.4.1.1. Market size and forecast, by Device Type
6.2.4.1.2. Market size and forecast, by End Use
6.2.4.2. Canada
6.2.4.2.1. Market size and forecast, by Device Type
6.2.4.2.2. Market size and forecast, by End Use
6.2.4.3. Mexico
6.2.4.3.1. Market size and forecast, by Device Type
6.2.4.3.2. Market size and forecast, by End Use
6.3. Europe
6.3.1. Key market trends, growth factors and opportunities
6.3.2. Market size and forecast, by Device Type
6.3.3. Market size and forecast, by End Use
6.3.4. Market size and forecast, by country
6.3.4.1. Germany
6.3.4.1.1. Market size and forecast, by Device Type
6.3.4.1.2. Market size and forecast, by End Use
6.3.4.2. France
6.3.4.2.1. Market size and forecast, by Device Type
6.3.4.2.2. Market size and forecast, by End Use
6.3.4.3. UK
6.3.4.3.1. Market size and forecast, by Device Type
6.3.4.3.2. Market size and forecast, by End Use
6.3.4.4. Italy
6.3.4.4.1. Market size and forecast, by Device Type
6.3.4.4.2. Market size and forecast, by End Use
6.3.4.5. Rest of Europe
6.3.4.5.1. Market size and forecast, by Device Type
6.3.4.5.2. Market size and forecast, by End Use
6.4. Asia-Pacific
6.4.1. Key market trends, growth factors and opportunities
6.4.2. Market size and forecast, by Device Type
6.4.3. Market size and forecast, by End Use
6.4.4. Market size and forecast, by country
6.4.4.1. China
6.4.4.1.1. Market size and forecast, by Device Type
6.4.4.1.2. Market size and forecast, by End Use
6.4.4.2. India
6.4.4.2.1. Market size and forecast, by Device Type
6.4.4.2.2. Market size and forecast, by End Use
6.4.4.3. Japan
6.4.4.3.1. Market size and forecast, by Device Type
6.4.4.3.2. Market size and forecast, by End Use
6.4.4.4. South Korea
6.4.4.4.1. Market size and forecast, by Device Type
6.4.4.4.2. Market size and forecast, by End Use
6.4.4.5. Rest of Asia-Pacific
6.4.4.5.1. Market size and forecast, by Device Type
6.4.4.5.2. Market size and forecast, by End Use
6.5. LAMEA
6.5.1. Key market trends, growth factors and opportunities
6.5.2. Market size and forecast, by Device Type
6.5.3. Market size and forecast, by End Use
6.5.4. Market size and forecast, by country
6.5.4.1. Latin America
6.5.4.1.1. Market size and forecast, by Device Type
6.5.4.1.2. Market size and forecast, by End Use
6.5.4.2. Middle East
6.5.4.2.1. Market size and forecast, by Device Type
6.5.4.2.2. Market size and forecast, by End Use
6.5.4.3. Africa
6.5.4.3.1. Market size and forecast, by Device Type
6.5.4.3.2. Market size and forecast, by End Use
CHAPTER 7: COMPETITIVE LANDSCAPE
7.1. Introduction
7.2. Top winning strategies
7.3. Product mapping of top 10 player
7.4. Competitive dashboard
7.5. Competitive heatmap
7.6. Top player positioning, 2023
CHAPTER 8: COMPANY PROFILES
8.1. Efficient Power Conversion Corporation Inc.
8.1.1. Company overview
8.1.2. Key executives
8.1.3. Company snapshot
8.1.4. Operating business segments
8.1.5. Product portfolio
8.1.6. Business performance
8.1.7. Key strategic moves and developments
8.2. Fujitsu Limited
8.2.1. Company overview
8.2.2. Key executives
8.2.3. Company snapshot
8.2.4. Operating business segments
8.2.5. Product portfolio
8.2.6. Business performance
8.2.7. Key strategic moves and developments
8.3. GaN Systems Inc.
8.3.1. Company overview
8.3.2. Key executives
8.3.3. Company snapshot
8.3.4. Operating business segments
8.3.5. Product portfolio
8.3.6. Business performance
8.3.7. Key strategic moves and developments
8.4. Infineon Technologies AG
8.4.1. Company overview
8.4.2. Key executives
8.4.3. Company snapshot
8.4.4. Operating business segments
8.4.5. Product portfolio
8.4.6. Business performance
8.4.7. Key strategic moves and developments
8.5. ON SEMICONDUCTOR CORPORATION
8.5.1. Company overview
8.5.2. Key executives
8.5.3. Company snapshot
8.5.4. Operating business segments
8.5.5. Product portfolio
8.5.6. Business performance
8.5.7. Key strategic moves and developments
8.6. Panasonic Corporation
8.6.1. Company overview
8.6.2. Key executives
8.6.3. Company snapshot
8.6.4. Operating business segments
8.6.5. Product portfolio
8.6.6. Business performance
8.6.7. Key strategic moves and developments
8.7. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8.7.1. Company overview
8.7.2. Key executives
8.7.3. Company snapshot
8.7.4. Operating business segments
8.7.5. Product portfolio
8.7.6. Business performance
8.7.7. Key strategic moves and developments
8.8. TEXAS INSTRUMENTS INC.
8.8.1. Company overview
8.8.2. Key executives
8.8.3. Company snapshot
8.8.4. Operating business segments
8.8.5. Product portfolio
8.8.6. Business performance
8.8.7. Key strategic moves and developments
8.9. Toshiba Corporation
8.9.1. Company overview
8.9.2. Key executives
8.9.3. Company snapshot
8.9.4. Operating business segments
8.9.5. Product portfolio
8.9.6. Business performance
8.9.7. Key strategic moves and developments
8.10. VISIC TECHNOLOGIES LTD
8.10.1. Company overview
8.10.2. Key executives
8.10.3. Company snapshot
8.10.4. Operating business segments
8.10.5. Product portfolio
8.10.6. Business performance
8.10.7. Key strategic moves and developments
1.1. Report description
1.2. Key market segments
1.3. Key benefits to the stakeholders
1.4. Research methodology
1.4.1. Primary research
1.4.2. Secondary research
1.4.3. Analyst tools and models
CHAPTER 2: EXECUTIVE SUMMARY
2.1. CXO perspective
CHAPTER 3: MARKET OVERVIEW
3.1. Market definition and scope
3.2. Key findings
3.2.1. Top impacting factors
3.2.2. Top investment pockets
3.3. Porter’s five forces analysis
3.4. Market dynamics
3.4.1. Drivers
3.4.2. Restraints
3.4.3. Opportunities
CHAPTER 4: GAN POWER DEVICE MARKET, BY DEVICE TYPE
4.1. Overview
4.1.1. Market size and forecast
4.2. Power Discrete
4.2.1. Key market trends, growth factors and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Market share analysis by country
4.3. Power Module
4.3.1. Key market trends, growth factors and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market share analysis by country
4.4. Power IC
4.4.1. Key market trends, growth factors and opportunities
4.4.2. Market size and forecast, by region
4.4.3. Market share analysis by country
CHAPTER 5: GAN POWER DEVICE MARKET, BY END USE
5.1. Overview
5.1.1. Market size and forecast
5.2. Telecommunication
5.2.1. Key market trends, growth factors and opportunities
5.2.2. Market size and forecast, by region
5.2.3. Market share analysis by country
5.3. Industrial
5.3.1. Key market trends, growth factors and opportunities
5.3.2. Market size and forecast, by region
5.3.3. Market share analysis by country
5.4. Automotive
5.4.1. Key market trends, growth factors and opportunities
5.4.2. Market size and forecast, by region
5.4.3. Market share analysis by country
5.5. Consumer Electronics
5.5.1. Key market trends, growth factors and opportunities
5.5.2. Market size and forecast, by region
5.5.3. Market share analysis by country
5.6. Military and Defense
5.6.1. Key market trends, growth factors and opportunities
5.6.2. Market size and forecast, by region
5.6.3. Market share analysis by country
5.7. Energy and Power
5.7.1. Key market trends, growth factors and opportunities
5.7.2. Market size and forecast, by region
5.7.3. Market share analysis by country
5.8. Others
5.8.1. Key market trends, growth factors and opportunities
5.8.2. Market size and forecast, by region
5.8.3. Market share analysis by country
CHAPTER 6: GAN POWER DEVICE MARKET, BY REGION
6.1. Overview
6.1.1. Market size and forecast By Region
6.2. North America
6.2.1. Key market trends, growth factors and opportunities
6.2.2. Market size and forecast, by Device Type
6.2.3. Market size and forecast, by End Use
6.2.4. Market size and forecast, by country
6.2.4.1. U.S.
6.2.4.1.1. Market size and forecast, by Device Type
6.2.4.1.2. Market size and forecast, by End Use
6.2.4.2. Canada
6.2.4.2.1. Market size and forecast, by Device Type
6.2.4.2.2. Market size and forecast, by End Use
6.2.4.3. Mexico
6.2.4.3.1. Market size and forecast, by Device Type
6.2.4.3.2. Market size and forecast, by End Use
6.3. Europe
6.3.1. Key market trends, growth factors and opportunities
6.3.2. Market size and forecast, by Device Type
6.3.3. Market size and forecast, by End Use
6.3.4. Market size and forecast, by country
6.3.4.1. Germany
6.3.4.1.1. Market size and forecast, by Device Type
6.3.4.1.2. Market size and forecast, by End Use
6.3.4.2. France
6.3.4.2.1. Market size and forecast, by Device Type
6.3.4.2.2. Market size and forecast, by End Use
6.3.4.3. UK
6.3.4.3.1. Market size and forecast, by Device Type
6.3.4.3.2. Market size and forecast, by End Use
6.3.4.4. Italy
6.3.4.4.1. Market size and forecast, by Device Type
6.3.4.4.2. Market size and forecast, by End Use
6.3.4.5. Rest of Europe
6.3.4.5.1. Market size and forecast, by Device Type
6.3.4.5.2. Market size and forecast, by End Use
6.4. Asia-Pacific
6.4.1. Key market trends, growth factors and opportunities
6.4.2. Market size and forecast, by Device Type
6.4.3. Market size and forecast, by End Use
6.4.4. Market size and forecast, by country
6.4.4.1. China
6.4.4.1.1. Market size and forecast, by Device Type
6.4.4.1.2. Market size and forecast, by End Use
6.4.4.2. India
6.4.4.2.1. Market size and forecast, by Device Type
6.4.4.2.2. Market size and forecast, by End Use
6.4.4.3. Japan
6.4.4.3.1. Market size and forecast, by Device Type
6.4.4.3.2. Market size and forecast, by End Use
6.4.4.4. South Korea
6.4.4.4.1. Market size and forecast, by Device Type
6.4.4.4.2. Market size and forecast, by End Use
6.4.4.5. Rest of Asia-Pacific
6.4.4.5.1. Market size and forecast, by Device Type
6.4.4.5.2. Market size and forecast, by End Use
6.5. LAMEA
6.5.1. Key market trends, growth factors and opportunities
6.5.2. Market size and forecast, by Device Type
6.5.3. Market size and forecast, by End Use
6.5.4. Market size and forecast, by country
6.5.4.1. Latin America
6.5.4.1.1. Market size and forecast, by Device Type
6.5.4.1.2. Market size and forecast, by End Use
6.5.4.2. Middle East
6.5.4.2.1. Market size and forecast, by Device Type
6.5.4.2.2. Market size and forecast, by End Use
6.5.4.3. Africa
6.5.4.3.1. Market size and forecast, by Device Type
6.5.4.3.2. Market size and forecast, by End Use
CHAPTER 7: COMPETITIVE LANDSCAPE
7.1. Introduction
7.2. Top winning strategies
7.3. Product mapping of top 10 player
7.4. Competitive dashboard
7.5. Competitive heatmap
7.6. Top player positioning, 2023
CHAPTER 8: COMPANY PROFILES
8.1. Efficient Power Conversion Corporation Inc.
8.1.1. Company overview
8.1.2. Key executives
8.1.3. Company snapshot
8.1.4. Operating business segments
8.1.5. Product portfolio
8.1.6. Business performance
8.1.7. Key strategic moves and developments
8.2. Fujitsu Limited
8.2.1. Company overview
8.2.2. Key executives
8.2.3. Company snapshot
8.2.4. Operating business segments
8.2.5. Product portfolio
8.2.6. Business performance
8.2.7. Key strategic moves and developments
8.3. GaN Systems Inc.
8.3.1. Company overview
8.3.2. Key executives
8.3.3. Company snapshot
8.3.4. Operating business segments
8.3.5. Product portfolio
8.3.6. Business performance
8.3.7. Key strategic moves and developments
8.4. Infineon Technologies AG
8.4.1. Company overview
8.4.2. Key executives
8.4.3. Company snapshot
8.4.4. Operating business segments
8.4.5. Product portfolio
8.4.6. Business performance
8.4.7. Key strategic moves and developments
8.5. ON SEMICONDUCTOR CORPORATION
8.5.1. Company overview
8.5.2. Key executives
8.5.3. Company snapshot
8.5.4. Operating business segments
8.5.5. Product portfolio
8.5.6. Business performance
8.5.7. Key strategic moves and developments
8.6. Panasonic Corporation
8.6.1. Company overview
8.6.2. Key executives
8.6.3. Company snapshot
8.6.4. Operating business segments
8.6.5. Product portfolio
8.6.6. Business performance
8.6.7. Key strategic moves and developments
8.7. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8.7.1. Company overview
8.7.2. Key executives
8.7.3. Company snapshot
8.7.4. Operating business segments
8.7.5. Product portfolio
8.7.6. Business performance
8.7.7. Key strategic moves and developments
8.8. TEXAS INSTRUMENTS INC.
8.8.1. Company overview
8.8.2. Key executives
8.8.3. Company snapshot
8.8.4. Operating business segments
8.8.5. Product portfolio
8.8.6. Business performance
8.8.7. Key strategic moves and developments
8.9. Toshiba Corporation
8.9.1. Company overview
8.9.2. Key executives
8.9.3. Company snapshot
8.9.4. Operating business segments
8.9.5. Product portfolio
8.9.6. Business performance
8.9.7. Key strategic moves and developments
8.10. VISIC TECHNOLOGIES LTD
8.10.1. Company overview
8.10.2. Key executives
8.10.3. Company snapshot
8.10.4. Operating business segments
8.10.5. Product portfolio
8.10.6. Business performance
8.10.7. Key strategic moves and developments
