Embedded Chip Packaging Market Report: Trends, Forecast and Competitive Analysis to 2030
Lucintel has been in the business of market research and management consulting since 2000 and has published over 1000 market intelligence reports in various markets / applications and served over 1,000 clients worldwide. This study is a culmination of four months of full-time effort performed by Lucintel's analyst team. The analysts used the following sources for the creation and completion of this valuable report:
In-depth interviews of the major players in this market
Detailed secondary research from competitors’ financial statements and published data
Extensive searches of published works, market, and database information pertaining to industry news, company press releases, and customer intentions
A compilation of the experiences, judgments, and insights of Lucintel’s professionals, who have analyzed and tracked this market over the years.
Extensive research and interviews are conducted across the supply chain of this market to estimate market share, market size, trends, drivers, challenges, and forecasts. Below is a brief summary of the primary interviews that were conducted by job function for this report.
Thus, Lucintel compiles vast amounts of data from numerous sources, validates the integrity of that data, and performs a comprehensive analysis. Lucintel then organizes the data, its findings, and insights into a concise report designed to support the strategic decision-making process. The figure below is a graphical representation of Lucintel’s research process.
In-depth interviews of the major players in this market
Detailed secondary research from competitors’ financial statements and published data
Extensive searches of published works, market, and database information pertaining to industry news, company press releases, and customer intentions
A compilation of the experiences, judgments, and insights of Lucintel’s professionals, who have analyzed and tracked this market over the years.
Extensive research and interviews are conducted across the supply chain of this market to estimate market share, market size, trends, drivers, challenges, and forecasts. Below is a brief summary of the primary interviews that were conducted by job function for this report.
Thus, Lucintel compiles vast amounts of data from numerous sources, validates the integrity of that data, and performs a comprehensive analysis. Lucintel then organizes the data, its findings, and insights into a concise report designed to support the strategic decision-making process. The figure below is a graphical representation of Lucintel’s research process.
1. EXECUTIVE SUMMARY
2. GLOBAL EMBEDDED CHIP PACKAGING MARKET : MARKET DYNAMICS
2.1: Introduction, Background, and Classifications
2.2: Supply Chain
2.3: Industry Drivers and Challenges
3. MARKET TRENDS AND FORECAST ANALYSIS FROM 2018 TO 2030
3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
3.2. Global Embedded Chip Packaging Market Trends (2018-2023) and Forecast (2024-2030)
3.3: Global Embedded Chip Packaging Market by Type
3.3.1: Single Chip
3.3.2: Multichip
3.3.3: MEMS
3.3.4: Passive Components
3.3.5: Others
3.4: Global Embedded Chip Packaging Market by Application
3.4.1: Tiny Package
3.4.2: System-In-Boards
3.4.3: Others
4. MARKET TRENDS AND FORECAST ANALYSIS BY REGION FROM 2018 TO 2030
4.1: Global Embedded Chip Packaging Market by Region
4.2: North American Embedded Chip Packaging Market
4.2.2: North American Embedded Chip Packaging Market by Application: Tiny Package, System-In-Boards, and Others
4.3: European Embedded Chip Packaging Market
4.3.1: European Embedded Chip Packaging Market by Type: Single Chip, Multichip, MEMS, Passive Components, and Others
4.3.2: European Embedded Chip Packaging Market by Application: Tiny Package, System-In-Boards, and Others
4.4: APAC Embedded Chip Packaging Market
4.4.1: APAC Embedded Chip Packaging Market by Type: Single Chip, Multichip, MEMS, Passive Components, and Others
4.4.2: APAC Embedded Chip Packaging Market by Application: Tiny Package, System-In-Boards, and Others
4.5: ROW Embedded Chip Packaging Market
4.5.1: ROW Embedded Chip Packaging Market by Type: Single Chip, Multichip, MEMS, Passive Components, and Others
4.5.2: ROW Embedded Chip Packaging Market by Application: Tiny Package, System-In-Boards, and Others
5. COMPETITOR ANALYSIS
5.1: Product Portfolio Analysis
5.2: Operational Integration
5.3: Porter’s Five Forces Analysis
6. GROWTH OPPORTUNITIES AND STRATEGIC ANALYSIS
6.1: Growth Opportunity Analysis
6.1.1: Growth Opportunities for the Global Embedded Chip Packaging Market by Type
6.1.2: Growth Opportunities for the Global Embedded Chip Packaging Market by Application
6.1.3: Growth Opportunities for the Global Embedded Chip Packaging Market by Region
6.2: Emerging Trends in the Global Embedded Chip Packaging Market
6.3: Strategic Analysis
6.3.1: New Product Development
6.3.2: Capacity Expansion of the Global Embedded Chip Packaging Market
6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Embedded Chip Packaging Market
6.3.4: Certification and Licensing
7. COMPANY PROFILES OF LEADING PLAYERS
7.1: ASE
7.2: ATS
7.3: GE
7.4: Shinko
7.5: Taiyo Yuden
7.6: TDK
7.7: Wьrth Elektronik
7.8: Texas Instruments
7.9: Siemens
7.10: Infineon
2. GLOBAL EMBEDDED CHIP PACKAGING MARKET : MARKET DYNAMICS
2.1: Introduction, Background, and Classifications
2.2: Supply Chain
2.3: Industry Drivers and Challenges
3. MARKET TRENDS AND FORECAST ANALYSIS FROM 2018 TO 2030
3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
3.2. Global Embedded Chip Packaging Market Trends (2018-2023) and Forecast (2024-2030)
3.3: Global Embedded Chip Packaging Market by Type
3.3.1: Single Chip
3.3.2: Multichip
3.3.3: MEMS
3.3.4: Passive Components
3.3.5: Others
3.4: Global Embedded Chip Packaging Market by Application
3.4.1: Tiny Package
3.4.2: System-In-Boards
3.4.3: Others
4. MARKET TRENDS AND FORECAST ANALYSIS BY REGION FROM 2018 TO 2030
4.1: Global Embedded Chip Packaging Market by Region
4.2: North American Embedded Chip Packaging Market
4.2.2: North American Embedded Chip Packaging Market by Application: Tiny Package, System-In-Boards, and Others
4.3: European Embedded Chip Packaging Market
4.3.1: European Embedded Chip Packaging Market by Type: Single Chip, Multichip, MEMS, Passive Components, and Others
4.3.2: European Embedded Chip Packaging Market by Application: Tiny Package, System-In-Boards, and Others
4.4: APAC Embedded Chip Packaging Market
4.4.1: APAC Embedded Chip Packaging Market by Type: Single Chip, Multichip, MEMS, Passive Components, and Others
4.4.2: APAC Embedded Chip Packaging Market by Application: Tiny Package, System-In-Boards, and Others
4.5: ROW Embedded Chip Packaging Market
4.5.1: ROW Embedded Chip Packaging Market by Type: Single Chip, Multichip, MEMS, Passive Components, and Others
4.5.2: ROW Embedded Chip Packaging Market by Application: Tiny Package, System-In-Boards, and Others
5. COMPETITOR ANALYSIS
5.1: Product Portfolio Analysis
5.2: Operational Integration
5.3: Porter’s Five Forces Analysis
6. GROWTH OPPORTUNITIES AND STRATEGIC ANALYSIS
6.1: Growth Opportunity Analysis
6.1.1: Growth Opportunities for the Global Embedded Chip Packaging Market by Type
6.1.2: Growth Opportunities for the Global Embedded Chip Packaging Market by Application
6.1.3: Growth Opportunities for the Global Embedded Chip Packaging Market by Region
6.2: Emerging Trends in the Global Embedded Chip Packaging Market
6.3: Strategic Analysis
6.3.1: New Product Development
6.3.2: Capacity Expansion of the Global Embedded Chip Packaging Market
6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Embedded Chip Packaging Market
6.3.4: Certification and Licensing
7. COMPANY PROFILES OF LEADING PLAYERS
7.1: ASE
7.2: ATS
7.3: GE
7.4: Shinko
7.5: Taiyo Yuden
7.6: TDK
7.7: Wьrth Elektronik
7.8: Texas Instruments
7.9: Siemens
7.10: Infineon
