E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Report: Trends, Forecast and Competitive Analysis to 2030

October 2023 | 150 pages | ID: E10B01173A05EN
Lucintel

Abstracts

Lucintel has been in the business of market research and management consulting since 2000 and has published over 1000 market intelligence reports in various markets / applications and served over 1,000 clients worldwide. This study is a culmination of four months of full-time effort performed by Lucintel's analyst team. The analysts used the following sources for the creation and completion of this valuable report:
In-depth interviews of the major players in this market
Detailed secondary research from competitors’ financial statements and published data
Extensive searches of published works, market, and database information pertaining to industry news, company press releases, and customer intentions
A compilation of the experiences, judgments, and insights of Lucintel’s professionals, who have analyzed and tracked this market over the years.
Extensive research and interviews are conducted across the supply chain of this market to estimate market share, market size, trends, drivers, challenges, and forecasts. Below is a brief summary of the primary interviews that were conducted by job function for this report.


Thus, Lucintel compiles vast amounts of data from numerous sources, validates the integrity of that data, and performs a comprehensive analysis. Lucintel then organizes the data, its findings, and insights into a concise report designed to support the strategic decision-making process. The figure below is a graphical representation of Lucintel’s research process.

Contents

1. EXECUTIVE SUMMARY


2. GLOBAL E-SCRAP AND PRINTED CIRCUIT BOARD (PCB) E-SCRAP MARKET : MARKET DYNAMICS

2.1: Introduction, Background, and Classifications
2.2: Supply Chain
2.3: Industry Drivers and Challenges

3. MARKET TRENDS AND FORECAST ANALYSIS FROM 2018 TO 2030

3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
3.2. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Trends (2018-2023) and Forecast (2024-2030)
3.3: Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Process Type
  3.3.1: E-waste Collection
  3.3.2: E-waste Management
  3.3.3: E-waste Recycling
3.4: Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Material
  3.4.1: Plastics
  3.4.2: Glass
  3.4.3: Metals
  3.4.4: Ferrous Components
  3.4.5: Precious Metals
  3.4.6: Rare Metals
3.5: Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Source
  3.5.1: Household Appliances
  3.5.2: IT & Telecommunication
  3.5.3: Entertainment Devices
  3.5.4: Smartphone & Tablets
  3.5.5: Computers & Laptops
  3.5.6: Others
3.6: Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by

4. MARKET TRENDS AND FORECAST ANALYSIS BY REGION FROM 2018 TO 2030

4.1: Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Region
4.2: North American E-Scrap and Printed Circuit Board (PCB) E-Scrap Market
  4.2.2: North American E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Source: Household Appliances, IT & Telecommunication, Entertainment Devices, Smartphone & Tablets, Computers & Laptops, and Others
4.3: European E-Scrap and Printed Circuit Board (PCB) E-Scrap Market
  4.3.1: European E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Process Type: E-waste Collection, E-waste Management, and E-waste Recycling
  4.3.2: European E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Source: Household Appliances, IT & Telecommunication, Entertainment Devices, Smartphone & Tablets, Computers & Laptops, and Others
4.4: APAC E-Scrap and Printed Circuit Board (PCB) E-Scrap Market
  4.4.1: APAC E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Process Type: E-waste Collection, E-waste Management, and E-waste Recycling
  4.4.2: APAC E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Source: Household Appliances, IT & Telecommunication, Entertainment Devices, Smartphone & Tablets, Computers & Laptops, and Others
4.5: ROW E-Scrap and Printed Circuit Board (PCB) E-Scrap Market
  4.5.1: ROW E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Process Type: E-waste Collection, E-waste Management, and E-waste Recycling
  4.5.2: ROW E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Source: Household Appliances, IT & Telecommunication, Entertainment Devices, Smartphone & Tablets, Computers & Laptops, and Others

5. COMPETITOR ANALYSIS

5.1: Product Portfolio Analysis
5.2: Operational Integration
5.3: Porter’s Five Forces Analysis

6. GROWTH OPPORTUNITIES AND STRATEGIC ANALYSIS

6.1: Growth Opportunity Analysis
  6.1.1: Growth Opportunities for the Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Process Type
  6.1.2: Growth Opportunities for the Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Material
  6.1.3: Growth Opportunities for the Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Source
  6.1.4: Growth Opportunities for the Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Region
6.2: Emerging Trends in the Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market
6.3: Strategic Analysis
  6.3.1: New Product Development
  6.3.2: CAPACity Expansion of the Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market
  6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market
  6.3.4: Certification and Licensing

7. COMPANY PROFILES OF LEADING PLAYERS

7.1: Boliden Dowa
7.2: Holdings
7.3: Escrap
7.4: Greentec
7.5: MAIREC Edelmetallgesellschaft
7.6: MIS Eletronics
7.7: Umicore
7.8: URT Recycling Technology
7.9: Freeco International
7.10: Qizheng