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Advanced Semiconductor Engineering Inc. Fundamental Company Report Including Financial, SWOT, Competitors and Industry Analysis

June 2024 | 50 pages | ID: A1CFC822266BEN
BAC Reports

US$ 499.00

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Advanced Semiconductor Engineering Inc. Fundamental Company Report provides a complete overview of the company’s affairs. All available data is presented in a comprehensive and easily accessed format. The report includes financial and SWOT information, industry analysis, opinions, estimates, plus annual and quarterly forecasts made by stock market experts. The report also enables direct comparison to be made between Advanced Semiconductor Engineering Inc. and its competitors. This provides our Clients with a clear understanding of Advanced Semiconductor Engineering Inc. position in the Semiconductor Industry.

  • The report contains detailed information about Advanced Semiconductor Engineering Inc. that gives an unrivalled in-depth knowledge about internal business-environment of the company: data about the owners, senior executives, locations, subsidiaries, markets, products, and company history.
  • Another part of the report is a SWOT-analysis carried out for Advanced Semiconductor Engineering Inc.. It involves specifying the objective of the company's business and identifies the different factors that are favorable and unfavorable to achieving that objective. SWOT-analysis helps to understand company’s strengths, weaknesses, opportunities, and possible threats against it.
  • The Advanced Semiconductor Engineering Inc. financial analysis covers the income statement and ratio trend-charts with balance sheets and cash flows presented on an annual and quarterly basis. The report outlines the main financial ratios pertaining to profitability, margin analysis, asset turnover, credit ratios, and company’s long-term solvency. This sort of company's information will assist and strengthen your company’s decision-making processes.
  • In the part that describes Advanced Semiconductor Engineering Inc. competitors and the industry in whole, the information about company's financial ratios is compared to those of its competitors and to the industry. The unique analysis of the market and company’s competitors along with detailed information about the internal and external factors affecting the relevant industry will help to manage your business environment. Your company’s business and sales activities will be boosted by gaining an insight into your competitors’ businesses.
  • Also the report provides relevant news, an analysis of PR-activity, and stock price movements. The latter are correlated with pertinent news and press releases, and annual and quarterly forecasts are given by a variety of experts and market research firms. Such information creates your awareness about principal trends of Advanced Semiconductor Engineering Inc. business.

About Advanced Semiconductor Engineering Inc.

Advanced Semiconductor Engineering, Inc. provides semiconductor packaging and testing services. The company’s services include semiconductor packaging, production of interconnect materials, front-end engineering testing, wafer probing, and final testing services.

The company, through Universal Scientific Industrial Co., Ltd., also provides integrated solutions for electronics manufacturing services in relation to computers, peripherals, communications, industrial, automotive, and storage and server applications.

Products and Services

The company offers a range of advanced and legacy semiconductor packaging and testing services. Its package types employ either leadframes or substrates as interconnect materials. The semiconductors the company packages are used in a range of end-use applications, including communications, computers, consumer electronics, industrial, automotive, and other applications. The company’s testing services include front-end engineering testing, which is performed during and following the initial circuit design stage of the semiconductor manufacturing process, wafer probe, final testing, and other related semiconductor testing services. It focuses on packaging and testing logic semiconductors. The company offers its customers services which consist of packaging, testing, and direct shipment of semiconductors to end users designated by its customers.

Packaging Services

The company offers a range of package types to meet the requirements of its customers, with a focus on packaging solutions. Within its portfolio of package types, the company focuses on the packaging of semiconductors, including leadframe-based package types, such as quad flat packages (QFP), thin quad flat packages (TQFP), bump chip carrier (BCC) and quad flat no-lead (QFN) packages, aQFN (advanced QFN) and package types based on substrates, such as flip-chip ball grid array (BGA), flip-chip CSP, and other BGA types, as well as other packages, such as wafer-level products, aCSP (advanced chip scale packages) and aWLP (advanced wafer level packages, fan-out). The company also provides copper wire bonding solutions which can be applied to gold wire products and flip-chip packages (a-fcCSP) solutions for its customers. It also provides packages, such as MAP POP (package on package) and aMAP POP (advanced laser ablation type).

Leadframe-Based Packages: Leadframe-based packages are packaged by connecting the die, using wire bonders, to the leadframe with gold wire. Packages have evolved from the lower pin-count plastic dual in-line packages to higher pin-count quad flat packages. Its principal leadframe-based packages include advanced quad flat no-lead package (aQFN); quad flat package (QFP)/ thin quad flat package (TQFP); quad flat no-lead package (QFN)/microchip carrier (MCC); bump chip carrier (BCC); small outline plastic package (SOP)/thin small outline plastic package (TSOP); small outline plastic J-bend package (SOJ); plastic leaded chip carrier (PLCC); and plastic dual in-line package (PDIP).

Substrate-Based Packages: Substrate-based packages generally employ the BGA design, which utilizes a substrate rather than a leadframe. The BGA package type places the electrical connection at the bottom of the package surface in the form of small bumps or balls. As an extension to stacked-die BGA, the company also assembles system-in-a-package (SiP) products, which involve the integration of approximately one chip into the same package. Its principal substrate-based packages include flip-chip chip scale package (FC-CSP, a-fcCSP); package-on-package (POP, aMAP POP); plastic BGA; cavity down BGA; stacked-die BGA; flip-chip BGA; hybrid (flip-chip and wire bumping); and land grid array (LGA).

Wafer-Level Packages: Wafer-level packages have an area of approximately 1.2 times of silicon die. Its principal wafer-level packaging products include wafer level chip scale package (aCSP) and advanced wafer level package (aWLP).

Module Assembly: The company also offers module assembly services, which combine packaged semiconductors with other components in an integrated module to enable functionality, typically using automated surf

The above Company Fundamental Report is a half-ready report and contents are subject to change.
It means that we have all necessary data in our database to prepare the report but need 2-3 days to complete it. During this time we are also updating the report with respect to the current moment. So, you can get all the most recent data available for the same price. Please note that preparation of additional types of analyses requires extra time.




1.1. Key facts
1.2. Financial Performance
1.3. Key Executives
1.4. Ownership and Major Holders
1.5. Company History


2.1. Business Description
2.2. Major Products and Services
2.3. Markets and Sales Activities
2.4. Locations, Subsidiaries, Operating Units


3.1. Overview
3.2. Strengths
3.3. Weaknesses
3.4. Opportunities
3.5. Threats


4.1. Financial Statements
4.1.1. Income Statement
4.1.2. Balance Sheet
4.1.3. Cash Flow
4.2. Financial Ratios
4.2.1. Profitability
4.2.2. Margin Analysis
4.2.3. Asset Turnover
4.2.4. Credit Ratios
4.2.5. Long-Term Solvency
4.2.6. Growth Over Prior Year
4.2.7. Financial Ratios Charts
4.3. Stock Market Snapshot


5.1. Advanced Semiconductor Engineering Inc. Direct Competitors
5.2. Comparison of Advanced Semiconductor Engineering Inc. and Direct Competitors Financial Ratios
5.3. Comparison of Advanced Semiconductor Engineering Inc. and Direct Competitors Stock Charts
5.4. Advanced Semiconductor Engineering Inc. Industry Analysis
5.4.1. Semiconductor Industry Snapshot
  5.4.2. Advanced Semiconductor Engineering Inc. Industry Position Analysis


6.1. News & PR Activity Analysis
6.2. IR Corporate News
6.3. Marketing News
6.4. Corporate Events


7.1. Experts Consensus
7.2. Experts Revisions



9.1. Political Factors
9.2. Economic Factors
9.3. Social Factors
9.4. Technological Factors
9.5. Environmental Factors
9.6. Legal Factors


10.1. Internal Factor Evaluation Matrix
10.2. External Factor Evaluation Matrix
10.3. Internal External Matrix





Advanced Semiconductor Engineering Inc. Annual Revenues in Comparison with Cost of Goods Sold and Gross Profit
Profit Margin Chart
Operating Margin Chart
Return on Equity (ROE) Chart
Return on Assets (ROA) Chart
Debt to Equity Chart
Current Ratio Chart
Advanced Semiconductor Engineering Inc. 1-year Stock Charts
Advanced Semiconductor Engineering Inc. 5-year Stock Charts
Advanced Semiconductor Engineering Inc. vs. Main Indexes 1-year Stock Chart
Advanced Semiconductor Engineering Inc. vs. Direct Competitors 1-year Stock Charts
Advanced Semiconductor Engineering Inc. Article Density Chart

1 – Data availability depends on company’s security policy.
2 – These sections are available only when you purchase a report with appropriate additional types of analyses.
The complete financial data is available for publicly traded companies.


Advanced Semiconductor Engineering Inc. Key Facts
Management Effectiveness
Income Statement Key Figures
Balance Sheet Key Figures
Cash Flow Statement Key Figures
Financial Performance Abbreviation Guide
Advanced Semiconductor Engineering Inc. Key Executives
Advanced Semiconductor Engineering Inc. Major Shareholders
Advanced Semiconductor Engineering Inc. History
Advanced Semiconductor Engineering Inc. Products
Revenues by Segment
Revenues by Region
Advanced Semiconductor Engineering Inc. Offices and Representations
Advanced Semiconductor Engineering Inc. SWOT Analysis
Yearly Income Statement Including Trends
Income Statement Latest 4 Quarters Including Trends
Yearly Balance Sheet Including Trends
Balance Sheet Latest 4 Quarters Including Trends
Yearly Cash Flow Including Trends
Cash Flow Latest 4 Quarters Including Trends
Advanced Semiconductor Engineering Inc. Profitability Ratios
Margin Analysis Ratios
Asset Turnover Ratios
Credit Ratios
Long-Term Solvency Ratios
Financial Ratios Growth Over Prior Year
Advanced Semiconductor Engineering Inc. Capital Market Snapshot
Advanced Semiconductor Engineering Inc. Direct Competitors Key Facts
Direct Competitors Profitability Ratios
Direct Competitors Margin Analysis Ratios
Direct Competitors Asset Turnover Ratios
Direct Competitors Credit Ratios
Direct Competitors Long-Term Solvency Ratios
Semiconductor Industry Statistics
Advanced Semiconductor Engineering Inc. Industry Position
Company vs. Industry Income Statement Analysis
Company vs. Industry Balance Sheet Analysis
Company vs. Industry Cash Flow Analysis
Company vs. Industry Ratios Comparison
Advanced Semiconductor Engineering Inc. Consensus Recommendations1
Analyst Recommendation Summary1
Price Target Summary1
Experts Recommendation Trends1
Revenue Estimates Analysis1
Earnings Estimates Analysis1
Historical Surprises1
Revenue Estimates Trend1
Earnings Estimates Trend1
Revenue Revisions1

SWOT Analysis

SWOT, which stands for Strengths, Weaknesses, Opportunities and Threats, is an analytical framework that identifies the internal and external factors that are favorable and unfavorable for a company.

Enhanced SWOT Analysis

Enhanced SWOT is a 3×3 grid that arranges strengths, weaknesses, opportunities and threats into one scheme:

  • How to use the strengths to take advantage of the opportunities?
  • How to use the strengths to reduce likelihood and impact of the threats?
  • How to overcome the weaknesses that obstruct taking advantage of the opportunities?
  • How to overcome the weaknesses that can make the threats a reality?

Upon answering these questions a company can develop a project plan to improve its business performance.

PESTEL Analysis

PESTEL (also termed as PESTLE) is an ideal tool to strategically analyze what influence different outside factors – political, economic, sociocultural, technological, environmental and legal – exert on a business to later chart its long term targets.

Being part of the external analysis when carrying out a strategic assessment or performing a market study, PESTEL gives an overview of diverse macro-environmental factors that any company should thoughtfully consider. By perceiving these outside environments, businesses can maximally benefit from the opportunities while minimizing the threats to the organization.

Key Factors Examined by PESTEL Analysis:

  • Political – What opportunities and pressures are brought by political bodies and what is the degree of public regulations’ impact on the business?
  • Economic – What economic policies, trends and structures are expected to affect the organization, what is this influence’s degree?
  • Sociological – What cultural and societal aspects will work upon the demand for the business’s products and operations?
  • Technological – What impact do the technological aspects, innovations, incentives and barriers have on the organization?
  • Environmental – What environmental and ecological facets, both locally and farther afield, are likely to predetermine the business?
  • Legal – What laws and legislation will exert influence on the style the business is carried out?

IFE, EFE, IE Matrices

The Internal Factor Evaluation matrix (IFE matrix) is a strategic management tool helping audit or evaluate major weaknesses and strengths in a business’s functional areas. In addition, IFE matrix serves as a basis for identifying and assessing relationships amongst those areas. The IFE matrix is utilised in strategy formulation.

The External Factor Evaluation matrix (EFE matrix) is a tool of strategic management that is typically utilised to assess current market conditions. It is an ideal instrument for visualising and prioritising the threats and opportunities a firm is facing.

The essential difference between the above mentioned matrices lies in the type of factors incorporated in the model; whilst the latter is engaged in internal factors, the former deals exceptionally with external factors – those exposed to social, political, economic, legal, etc. external forces.

Being a continuation of the EFE matrix and IFE matrix models, the Internal External matrix (IE matrix) rests upon an investigation of external and internal business factors integrated into one suggestive model.

Porter Five Forces Analysis

The Porter’s five forces analysis studies the industry of operation and helps the company find new sources of competitive advantage. The analysis surveys an industry through five major questions:

  1. What composes a threat of substitute products and services?
  2. Is there a threat of new competitors entering the market?
  3. What is the intensity of competitive rivalry?
  4. How big is the bargaining power of buyers?
  5. How significant is the bargaining power of suppliers?

VRIO Analysis

VRIO stands for Value, Rarity, Imitability, Organization. This analysis helps to evaluate all company’s resources and capabilities and bring them together into one aggregate table that includes:

  • Tangible resources
    • Financial
    • Physical
    • Technological
    • Organizational
  • Intangible resources
    • Human
    • Innovation and Creativity
    • Reputation
  • Organizational capabilities

The result of the analysis gives a clear picture of company’s competitive and economic implications, answering the questions if the resources mentioned above are:

  • Valuable?
  • Rare?
  • Costly to imitate?
  • Organized properly?

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