Thermal Management Technologies (Heat Sinks): Market Research Report

Date: July 22, 2009
Pages: 678
Price:
US$ 3,950.00
Publisher: Global Industry Analysts, Inc
Report type: Strategic Report
Delivery: E-mail Delivery (PDF)
ID: T9C2780FE87EN
Leaflet:

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Thermal Management Technologies (Heat Sinks): Market Research Report
This report analyzes the worldwide markets for Thermal Management Technologies (Heat Sinks) in Millions of US$.

The report on ‘Thermal Management Technologies (Heat Sinks)’ analyzes the Heat Sinks market by the following product segments: Metal Extruded Heat Sinks, Stamped Heat Sinks, Bonded or Fabricated Fin Heat Sinks, and Folded Fin Heat Sinks.

The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World.

Annual forecasts are provided for each region for the period of 2006 through 2015.

The report profiles 180 companies including many key and niche players worldwide such as Aavid Thermalloy, LLC, Aerocool Advanced Technologies Corp., ADDA Corp., Advanced Thermal Solutions, Inc., Ajigo Corp., Akasa Group, Alpha Company Ltd., Asia Vital Components Co.Ltd., ASUSTeK Computer Inc., Chaun Choung Technology Corp., Cooler Master Co.Ltd., Dynatron Corp., Enertron Inc., GlacialTech, Inc.. JMC Products, Inc., Melcor Corp., Neng Tyi Co.Ltd., Polo Tech Co.Ltd., R-Theta Thermal Solutions, Inc., Radian Heat Sinks, Sumitomo Electric Industries, Ltd., Swiftech, Taisol Electronics Co.Ltd., TennMax United, Thermal Integration Technology, Inc., Thermacore, Thermalright, Inc., Thermaltake Technology Co., Ltd., Titan Computer Co.Ltd., Verax Ventilatoren GmbH, Vette Corp., and Wakefield Thermal Solutions, Inc.

Market data and analytics are derived from primary and secondary research.

Company profiles are mostly extracted from URL research and reported select online sources.
I.INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS

Study Reliability and Reporting Limitations
Disclaimers
Data Interpretation & Reporting Level
Quantitative Techniques & Analytics
Product Definitions and Scope of Study
Metal Extruded Heat Sinks
Stamped Heat Sinks
Bonded or Fabricated Fin Heat sinks
Folded fin Heat Sinks
Computers
Telecommunication
Medical
Industrial Electronics
Aerospace/Military
Consumer Electronics
Automotive

II. EXECUTIVE SUMMARY

1. INDUSTRY OVERVIEW

Thermal Management – A Critical Function
Global Thermal Management Solutions Market: An Overview
Heat Sinks - Market Outlook
Heat Sinks Market Estimates and Forecasts by Region
Heat Sinks Market Estimates and Forecasts by Product Segment
Heat Sinks Market Estimates and Forecasts by End-use Segment

2. MARKET TRENDS AND ISSUES

Technological Advancements Drive Growth in Heat sink Market
PC Market Stimulates Growth
Pricing Trends in the Heat sinks Market
Hybrid Technologies Gaining Popularity Over Traditional Heat Sinks
Polymers: The Future in Heat Sink Technology
Liquid Cooling: The Next Big Thing in Thermal Technology

3. INNOVATIONS IN HEAT SINK TECHNOLOGY

New Aluminum Silicon Carbide (AlSiC) Heat Sinks
Heat sink System for Circuit Boards
Heat Sink BGA Package
New Mounting Assembly for Heat Sink
Dual Material Heat Sinks
New Heat Sink, Interfacing Multiple Components
Heat Sinks with Fins
New Fastening Structure Method For Heat Sinks
New Heat Sink Attached to the Module with Adhesive
New Method to Set Up Posts on Heat Sinks
New Heat Sink System for Circuit Boards Developed
New Bi-level Heat Sinks
New Ceramic-based Heat Sink
Heat Sink Attached to Two Separate PCBs
New Heat Sink Bonds with Dielectric Material

4. PRODUCT OVERVIEW

Heat Sinks
Composition and Structure of a Heat Sink:
Comparison between Aluminum and Copper by Physical Parameters – Thermal Conductivity, Cost, Weight, Production Method and Pressure on mounting devise
Usage Criteria for a Heat sink
Necessity of a Heat Sink:
Characteristics of an Ideal Heat Sink
Measuring and Boosting the Thermal Performance of a Heat Sink
Classification of Heat Sinks
Active Heat Sink
Characteristics of an active Heat Sink
Passive Heat Sink
Extruded Heat Sinks
Stamped Heat sinks
Bonded or Fabricated Fins
Folded Fins
Castings
Comparing Active and Passive Heat Sinks

5. END USE APPLICATIONS OF HEAT SINKS

Computers
Telecommunication
Medical
Industrial Electronics
Aerospace/Military
Consumer Electronics
Automotive

6. THERMAL MANAGEMENT PRODUCTS - CLASSIFICATION

Hardware
Heat Pipes
Micro Channels
Spray Cooling
Electronic Cooling Fans
Metal Backplanes
BGAs

Table 1. Leading Players in the Worldwide Thermal Management Hardware Market (2006 & 2007) - Percentage Share Breakdown by Value Sales for Aavid Thermalloy, Thermacore, Lytron, and Others (includes corresponding Graph/Chart)

Software
Computational Methods of Heat Transfer (CHT) and Fluid Dynamics (CFD)
Electronic Design Automation (EDA) Software, Electronic Computer Aided Design (ECAD) Software, and Technology Computer Aided Design (TCAD) Software
Interfaces and Substrates
Thermal Compounds and Thermal Interface Materials

7.RECENT INDUSTRY ACTIVITY

Thermacore Awarded Research Contract by DARPA (US)
Celsia Technologies Inks Strategic Deal with Thermapower (Taiwan)
Modine to Shut Down Pemberville and Other Manufacturing Unit (USA)
Modine Sells Thermacore (USA)
Furukawa America to Merge with Furukawa Electric (USA)
Alexandria Extrusion Takes Over M&M Metals (USA)
Waytronx Takes Over CUI (USA)
Avnet Electronics Enters into Agreement with Nuventix (America)
Graphics Product and Celsia Form Partnership (US)
Modine Sets up Production Unit (India)
Wakefield Acquires Simon Industries (NA)
Celsia Launches Next Generation NanoSpreader (USA)
ATS Launched the New Star™ Series Heat Sinks (USA)
New Improved Heat Sinks from Hitachi (Japan)
Honeywell to Extend Its Research and Development Center (USA)
Vette Corp. Forms Allies with Asia Aluminum (China)
OnScreen Inks a Licensing and Royalty Deal with Thermaltake Technologies (Taiwan)
ONSC Inks a Licensing Deal with CUI (US)
Modine to Construct Second Facility (Hungary)
Onscreen Technologies Revamps Business Strategy (US)
Digi-Key Inks Global Distribution Agreement with ATS
Mouser Signs Distribution Agreement with Comair Rotron (US)
Laird Expands Distribution Agreement with Sager (US)
Denki Kagaku Plans Capacity Expansion for Ceramic Heat Sinks (Japan)
Vette Corp Announces Production Expansion (North America)
ANSYS, Inc to acquire Aavid Thermal Technologies (US)
Celsia Technologies Enters Into a Collaboration Yeh- Chiang Technology (Taiwan)
CPS Enters Into Partnership with Diamond Technologies (US)
Vette Takes Over ERM Thermal Technologies (USA)
Celsia Technologies Sign Strategic Contract with Kubo Kinzoku (Japan)
OnScreen™ Acquires Proprietary Rights for WayCool™ (US)
iCurie Re-named as Celsia Technologies (US)
AET Receives Approval on HS-400 Heat Sink Design (US)
Thermal Solutions Acquires Woven Electronics (USA)
Laird Announces Acquisition of Supercool (Sweden)
Intel Acquires 5% Stake in Neng Tyi (Taiwan)
Modine Acquires Radiadores (Brazil)
Celsia Unveils Web Portal
AET’s eGRAF® HS-400 Heat Sinks to Feature in LS/X Supercomputer (USA)
Vette Announces New BGA Thermal Solutions for Integrated Circuits (US)
Vette Acquires EUMAX (China)
Wakefield Extends Bonded Fin Heat Sink Line (US)
Wakefield Expands DC/DC Converter Heat Sink Line (US)

8. HEAT SINKS AND RELATED PRODUCT LAUNCHES AND DEVELOPMENTS

Thermalright Unveils T-RAD2 (US)
Alpha Launches FS/FSR Series Active Heat Sinks (Japan)
Alpha Unveils Heat Sinks with 3.45mm Attachment Holes (Japan)
Alpha Releases New Push Pin Tabs Integrated Heat Sinks (Japan)
Alpha Launches Low Profile LPD Series Heat Sinks (Japan)
Alpha Unveils Heat Sinks with Incorporated Attachment Tabs (Japan)
Alpha Releases UB13070 Heat Sink (Japan)
Alpha Expands LPD Series Heat Sinks with LPD90 (Japan)
ASUS Expands Triton Family with New Triton 81 CPU Coolers (Taiwan)
Vantec Unveils New AeroFlow FX Series CPU Coolers (US)
Thermalright Launches HR-09 Type 4 Mosfet Cooler (US)
Thermalright Rolls Out TRUE Copper (US)
Spire Announced Plans to Launch New Thermax Cooling Solutions (US)
ATS Offers Two New Heat Sinks for BGA Packages (US)
ATS Launches ATS-552 Heat Sink Cooling Solution for Freescale Processors (US)
ATS Offers New Heat Sink Cooling Solutions for Linear LED Lighting Products (US)
Ohmite Offers Heat Sinks to Combat Overtorque Issues (US)
ASUS Launches Silent Cooling Solutions (Taiwan)
Alpha Replaces SB Series Heat Sinks with LT Series Heat Sinks (Japan)
Alpha Launches ST Series Heat Sinks (Japan)
Thermalright Launches HR-03 GT VGA Cooler (US)
Thermalright Announces Availability of HR-03 Plus VGA Cooler (US)
Thermalright Unveils HR-07 Duo Ram Cooler (US)
Thermalright Launches HR-01 X CPU Cooler (US)
Thermalright Launches HR-11 Backside Cooler (US)
Thermalright Rolls Out IFX-14 CPU Cooler (US)
Thermalright Unveils HR-09 Mosfet Cooler (US)
ATS Rolls out maxiFLOW Heat Sinks (US)
ATS’s maxiGRIP™ Clears Stringent Military Testing (US)
ATS Offers Passive and Active Heat Sinks for Freescale’s Processors (US)
MEC International to Offer Heat sinks From Seifert (UK)
New Heatsink from Advanced Thermal for BGA Components (US)
Tyco Launches CardBus Connector Technology Integrated Heatsink (US)
Schaffner Expands Product Line with Seifert Electronics Products (Switzerland)
ATS Unveils New Thermal Management Design Kit (US)
Andigilog® Unveils New Thermal Management System Controllers (US)
THERMALTAKE Presents Two Turion CPU Coolers (US)
GlacialTech Rolls Out Igloo 7210 M CPU Coolers (US)
ATS Launches HFC-100™ Heat Flux Controller (US)
ATS Offers Online Tutorials for Thermal Management (US)
Cooler Master Unveils New Hyper Z600 CPU Cooler (Taiwan)
Advanced Thermal Solutions (ATS) Launches New Three Devices (US)
Emulation Technology Launches Heat Sinks with Elliptical Fin BGA Chipset (US)
Advanced Thermal Solutions Launches blackDIAMOND Heat Sink (US)

9. FOCUS ON SELECT GLOBAL PLAYERS

Aavid Thermalloy, LLC (USA)
Aerocool Advanced Technologies Corp. (Taiwan)
ADDA Corp. (Taiwan)
Advanced Thermal Solutions, Inc. (USA)
Ajigo Corp. (USA)
Akasa Group (UK)
Alpha Company Ltd. (Japan)
Asia Vital Components Co. Ltd. (Taiwan)
ASUSTeK Computer Inc. (Taiwan)
Chaun Choung Technology Corp. (Taiwan)
Cooler Master Co. Ltd. (Taiwan)
Dynatron Corp. (USA)
Enertron Inc. (USA)
GlacialTech, Inc. (Taiwan)
JMC Products, Inc. (USA)
Melcor Corp. (USA)
Neng Tyi Co. Ltd (Taiwan)
Polo Tech Co. Ltd. (Taiwan)
R-Theta Thermal Solutions, Inc. (Canada)
Radian Heat Sinks (US)
Sumitomo Electric Industries, Ltd. (Japan)
Swiftech (US)
Taisol Electronics Co. Ltd. (China)
TennMax United (USA)
Thermal Integration Technology, Inc (Taiwan)
Thermacore (USA)
Thermalright, Inc. (USA)
Thermaltake Technology Co., Ltd (Taiwan)
Titan Computer Co. Ltd (Taiwan)
Verax Ventilatoren GmbH (Germany)
Vette Corp. (USA)
Wakefield Thermal Solutions, Inc. (US)

10. GLOBAL MARKET PERSPECTIVE

Table 2. World Recent Past, Current & Future Analysis for Heat Sinks Market by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)
Table 3. World 10-year Perspective for Heat Sinks Market by Geographic Region – Percentage Share of Dollar Sales for North America, Japan, Europe, Asia-Pacific and Rest of World for 2006, 2009, and 2015 (includes corresponding Graph/Chart)

Analysis by Product Segment

Table 4. World Recent Past, Current & Future Analysis for Metal Extruded Heat Sinks Market by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)
Table 5. World 10-year Perspective for Metal Extruded Heat Sinks Market by Geographic Region – Percentage Share Breakdown of Dollar Sales for North America, Japan, Europe, Asia-Pacific and Rest of World for 2006, 2009, and 2015 (includes corresponding Graph/Chart)
Table 6. World Recent Past, Current & Future Analysis for Stamped Heat Sinks Market by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)
Table 7. World 10-year Perspective for Stamped Heat Sinks Market by Geographic Region – Percentage Share Breakdown of Dollar Sales for North America, Japan, Europe, Asia-Pacific and Rest of World for 2006, 2009, and 2015 (includes corresponding Graph/Chart)
Table 8. World Recent Past, Current & Future Analysis for Bonded Fins Heat Sinks Market by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)
Table 9. World 10-year Perspective for Bonded Fins Heat Sinks Market by Geographic Region – Percentage Share Breakdown of Dollar Sales for North America, Japan, Europe, Asia-Pacific and Rest of World for 2006, 2009, and 2015 2015 (includes corresponding Graph/Chart)
Table 10. World Recent Past, Current & Future Analysis for Folded Fins Heat Sinks Market by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)
Table 11. World 10-year Perspective for Folded Fins Heat Sinks Market by Geographic Region – Percentage Share Breakdown of Dollar Sales for North America, Japan, Europe, Asia-Pacific and Rest of World for 2006, 2009, and 2015 2015 (includes corresponding Graph/Chart)

Analysis By End-Use Market

Table 12. World Recent Past, Current & Future Analysis for Heat Sinks in Computers Sector by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)
Table 13. World 10-year Perspective for Heat Sinks in Computers Sector by Geographic Region – Percentage Share of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets for 2006, 2009 & 2015 (includes corresponding Graph/Chart)
Table 14. World Recent Past, Current & Future Analysis for Heat Sinks in Telecom Sector by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)
Table 15. World 10-year Perspective for Heat Sinks in Telecom Sector by Geographic Region – Percentage Share of Dollar Sales for US, Canada, Japan, Europe, Asia- Pacific and Rest of World Markets for 2006, 2009 & 2015 (includes corresponding Graph/Chart)
Table 16. World Recent Past, Current & Future Analysis for Heat Sinks in Consumer Electronics Sector by Geographic Region – US, Canada, Japan, Europe, Asia- Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)
Table 17. World 10-year Perspective for Heat Sinks in Consumer Electronics Sector by Geographic Region – Percentage Share of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets for 2006, 2009 & 2015 (includes corresponding Graph/Chart)
Table 18. World Recent Past, Current & Future Analysis for Heat Sinks in Medical Electronics and Office Equipment Sectors by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)
Table 19. World 10-year Perspective for Heat Sinks in Medical and Office Equipment Sectors by Geographic Region – Percentage Share of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets for 2006, 2009 & 2015 (includes corresponding Graph/Chart)
Table 20. World Recent Past, Current & Future Analysis for Heat Sinks in Industrial and Military Sector by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)
Table 21. World 10-year Perspective for Heat Sinks in Industrial and Military Sector by Geographic Region – Percentage Share of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets for 2006, 2009 & 2015 (includes corresponding Graph/Chart)
Table 22. World Recent Past, Current & Future Analysis for Heat Sinks in Automotive Sector by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)
Table 23. World 10-year Perspective for Heat Sinks in Automotive Sector by Geographic Region – Percentage Share of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets for 2006, 2009 & 2015 (includes corresponding Graph/Chart)

III. MARKET

1. THE UNITED STATES

A. MARKET ANALYSIS

Market Overview
Product Innovations
Product Launches/Developments
Strategic Corporate Developments
Select Players
Aavid Thermalloy, LLC (USA)
Advanced Thermal Solutions, Inc. (USA)
Ajigo Corp. (USA)
CTS Corp. (USA)
Cool Innovations, Inc. (USA)
Dynatron Corp. (USA)
Enertron, Inc. (USA)
JMC Products, Inc. (USA)
Melcor Corp. (USA)
Radian Heat sinks (US)
Swiftech (US)
Tennmax United (USA)
Thermacore (USA)
Thermalright, Inc. (USA)
United Thermal Engineering Corp. (USA)
Vantec Thermal Technologies, Inc. (US)
Vette Corp. (USA)
Wakefield Thermal Solutions, Inc. (US)

B. MARKET ANALYTICS

Table 24. US Recent Past, Current & Future Analysis for Heat Sinks Market by Product Segment – Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat Sinks Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)
Table 25. US 10-year Perspective for Heat Sinks Market by Product Segment – Percentage Share Breakdown of Dollar Sales for Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat Sinks for 2006, 2009, and 2015 (includes corresponding Graph/Chart)
Table 26. US Recent Past, Current & Future Analysis for Heat Sinks by End-Use Sector – Computers, Telecom, Consumer Electronics, Medical and Office Equipment, Industrial and Military, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)
Table 27. US 10-Year Perspective for Heat Sinks by End-Use Sector: Percentage Share Breakdown of Dollar Sales for Computers, Telecom, Consumer Electronics, Medical and Office Equipment, Industrial and Military and Automotive Markets for 2006, 2009 & 2015 (includes corresponding Graph/Chart)

2. CANADA

A. MARKET ANALYSIS

Current and Future Analysis
Select Player

B. MARKET ANALYTICS

Table 28. Canadian Recent Past, Current & Future Analysis for Heat Sinks Market by Product Segment – Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat Sinks Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)
Table 29. Canadian 10-year Perspective for Thermal Management Heat Sinks Market by Product Segment – Percentage Share Breakdown of Dollar Sales for Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat Sinks for 2006, 2009, and 2015 (includes corresponding Graph/Chart)
Table 30. Canadian Recent Past, Current & Future Analysis for Heat Sinks by End-Use Sector – Computers, Telecom, Consumer Electronics, Medical/Office Equipment, Industrial and Military, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)
Table 31. Canadian 10-Year Perspective for Heat Sinks by End-Use Sector: Percentage Share Breakdown of Dollar Sales for Computers, Telecom, Consumer Electronics, Medical and Office Equipment, Industrial/ Military, and Automotive Markets for 2006, 2009 & 2015 (includes corresponding Graph/Chart)

3. JAPAN

A. MARKET ANALYSIS

Current and Future Analysis
Product Innovations
Strategic Corporate Developments
Select Players
Alpha Company Ltd. (Japan)
Sumitomo Electric Industries, Ltd. (Japan)

B. MARKET ANALYTICS

Table 32. Japanese Recent Past, Current & Future Analysis for Thermal Management Heat sinks Market by Product Segment – Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat Sinks Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)
Table 33. Japanese 10-year Perspective for Heat Sinks Market by Product Segment – Percentage Share Breakdown of Dollar Sales for Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat Sinks for 2006, 2009, and 2015 (includes corresponding Graph/Chart)
Table 34. Japanese Recent Past, Current & Future Analysis for Heat Sinks by End-Use Sector – Computers, Telecom, Consumer Electronics, Medical/Office Equipment, Industrial and Military, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)
Table 35. Japanese 10-Year Perspective for Heat Sinks by End-Use Segment – Percentage Share Breakdown of Dollar Sales for Computers, Telecom, Consumer Electronics, Medical and Office Equipment, Industrial and Military, and Automotive Markets for 2006, 2009 & 2015 (includes corresponding Graph/Chart)

4. EUROPE

A. MARKET ANALYSIS

Current and Future Analysis
Product Launches/Developments
Strategic Corporate Developments
Select Players
Akasa Group (UK)
Verax Ventilatoren GmbH (Germany)

B. MARKET ANALYTICS

Table 36. European Recent Past, Current & Future Analysis for Heat Sinks Market by Product Segment – Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat Sinks Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)
Table 37. European 10-year Perspective for Heat Sinks Market by Product Segment – Percentage Share Breakdown of Dollar Sales for Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat Sinks for 2006, 2009, and 2015 (includes corresponding Graph/Chart)
Table 38. European Recent Past, Current & Future Analysis for Heat Sinks by End-Use Sector – Computers, Telecom, Consumer Electronics, Medical/Office Equipment, Industrial and Military, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)
Table 39. European 10-Year Perspective for Heat Sinks by End-Use Sector: Percentage Share Breakdown of Dollar Sales for Computers, Telecom, Consumer Electronics, Medical and Office Equipment, Industrial/ Military, and Automotive Markets for 2006, 2009 & 2015 (includes corresponding Graph/Chart)

5. ASIA PACIFIC

A. MARKET ANALYSIS

Current and Future Analysis
Mainland China Heat Sinks Market
Taiwan Market Scenario
Product Innovations
Product Launches/Developments
Strategic Corporate Developments
Select Players
Act-Rx Technology Corp. (Taiwan)
Aerocool Advanced Technologies Corp. (Taiwan)
ADDA Corp. (Taiwan)
Arkua Technology Co., Ltd (Taiwan)
Asia Vital Components Co. Ltd. (Taiwan)
ASUSTeK Computer, Inc. (Taiwan)
Chaun Choung Technology Corp. (Taiwan)
Cooler Master Co. Ltd. (Taiwan)
EVERCOOL Thermal Co., Ltd. (Taiwan)
GlacialTech, Inc. (Taiwan)
Kuang Thousand Technology Co., Ltd. (Taiwan)
Neng Tyi Co. Ltd (Taiwan)
Polo Tech Co. Ltd (Taiwan)
Taisol Electronics Co. Ltd. (China)
Thermal Integration Technology, Inc (Taiwan)
Thermaltake Technology Co., Ltd (Taiwan)
Titan Computer Co. Ltd. (Taiwan)

B. MARKET ANALYTICS

Table 40. Asia Pacific Recent Past, Current & Future Analysis for Heat Sinks Market by Product Segment – Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat Sinks Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)
Table 41. Asia Pacific 10-year Perspective for Heat Sinks Market by Product Segment – Percentage Share Breakdown of Dollar Sales for Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat Sinks for 2006, 2009, and 2015 (includes corresponding Graph/Chart)
Table 42. Asia Pacific Recent Past, Current & Future Analysis for Heat Sinks by End-Use Sector – Computers, Telecom, Consumer Electronics, Medical/Office Equipment, Industrial and Military, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)
Table 43. Asia Pacific 10-Year Perspective for Heat Sinks by End-Use Sector: Percentage Share Breakdown of Dollar Sales for Computers, Telecom, Consumer Electronics, Medical and Office Equipment, Industrial/ Military, and Automotive Markets for 2006, 2009 & 2015 (includes corresponding Graph/Chart)

6. REST OF WORLD

A. MARKET ANALYSIS

Current and Future Analysis
Strategic Corporate Developments

B. MARKET ANALYTICS

Table 44. Rest of World Recent Past, Current & Future Analysis for Heat Sinks Market by Product Segment – Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat Sinks Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)
Table 45. Rest of World 10-year Perspective for Heat Sinks Market by Product Segment – Percentage Share Breakdown of Dollar Sales for Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat Sinks for 2006, 2009, and 2015 (includes corresponding Graph/Chart)
Table 46. Rest of World Recent Past, Current & Future Analysis for Heat Sinks by End-Use Sector – Computers, Telecom, Consumer Electronics, Medical/ Office Equipment, Industrial and Military, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)
Table 47. Rest of World 10-Year Perspective for Heat Sinks by End-Use Sector: Percentage Share Breakdown of Dollar Sales for Computers, Telecom, Consumer Electronics, Medical and Office Equipment, Industrial/ Military, and Automotive Markets for 2006, 2009 & 2015 (includes corresponding Graph/Chart)

IV. COMPETITIVE LANDSCAPE

Total Companies Profiled: 180 (including Divisions/Subsidiaries - 207)
Region/CountryPlayers
The United States
Canada
Japan
Europe
France
Germany
The United Kingdom
Italy
Spain
Rest of Europe
Asia-Pacific (Excluding Japan)
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Electronic Thermal Management: Market Research Report US$ 4,950.00 Oct, 2010 · 557 pages

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