IC Sockets: Market Research Report
This report analyzes the Global market for IC Sockets in US$ Million by the following product segments: Dual In-Line Memory Module Sockets, Production Sockets, Test/Burn-in Sockets, and Others.
Regional IC Sockets markets are analyzed as a consolidated whole with no granular level breakup offered by product group/segment.
Annual estimates and forecasts are provided for the period 2006 through 2015.
The report profiles 44 companies including many key and niche players such as 3M Company, Aries Electronics, Inc., Chupond Precision Co., Ltd., Enplas Corporation, FCI, Foxconn Technology Group, Johnstech International Corporation, Loranger International Corporation, Mill-Max Mfg. Corporation, Molex, Inc., Plastronics Socket Company, Inc., Sensata Technologies B.V., Tyco Electronics Ltd., Win Way Technology Co., Ltd., and Yamaichi Electronics Co., Ltd.
Market data and analytics are derived from primary and secondary research.
Company profiles are mostly extracted from URL research and reported select online sources.
Regional IC Sockets markets are analyzed as a consolidated whole with no granular level breakup offered by product group/segment.
Annual estimates and forecasts are provided for the period 2006 through 2015.
The report profiles 44 companies including many key and niche players such as 3M Company, Aries Electronics, Inc., Chupond Precision Co., Ltd., Enplas Corporation, FCI, Foxconn Technology Group, Johnstech International Corporation, Loranger International Corporation, Mill-Max Mfg. Corporation, Molex, Inc., Plastronics Socket Company, Inc., Sensata Technologies B.V., Tyco Electronics Ltd., Win Way Technology Co., Ltd., and Yamaichi Electronics Co., Ltd.
Market data and analytics are derived from primary and secondary research.
Company profiles are mostly extracted from URL research and reported select online sources.
I.INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS
Study Reliability and Reporting Limitations
Disclaimers
Data Interpretation & Reporting Level
Quantitative Techniques & Analytics
Product Definitions and Scope of Study
IC Sockets
1. DUAL IN-LINE MEMORY MODULE (DIMM) SOCKETS
2. PRODUCTION SOCKETS
3. TEST/BURN-IN SOCKETS
4. OTHER SOCKETS
II. EXECUTIVE SUMMARY
1.INDUSTRY OVERVIEW
Preface
Global Outlook
Analysis by Region
Analysis by Product Segment
Impact of Recession on IC Sockets Market
Changing Market Dynamics
Evolving IC Sockets Market
Evolving Production IC Sockets Segment
Test and Burn-In Sockets Segment to Witness New Developments
IC Socket Industry Witnesses Growth of EMS Companies
Connector Industry
2.PRODUCT OVERVIEW
Introduction
IC Sockets
Performance Specifications
Components of IC Socket
Contact Designs Used in IC Sockets
Types of IC Sockets
Dual In-Line Memory Module (DIMM) Sockets
Production Sockets
Plastic Leaded Chip Carrier (PLCC) Socket
Pin Grid Array (PGA) Socket
Land Grid Array (LGA) Socket
Test/Burn-in Sockets
Other Sockets
Dual In-Line Package (DIP) Socket
Ball Grid Array (BGA) Socket
Specialty Socket
Interposer
Advantages of IC Sockets
Cost Savings
Component Repair and Replacement
Avoidance of Direct Soldering
Flexibility in Assembly, IC Design, and Supply-Chain Management
Component Exchange and Upgrade
Component Burn-in and Test
Disadvantages of IC Sockets
End-Use Applications of IC Sockets
Services and Products Associated with IC Sockets
IC Sockets and Interconnect Components
IC Package Converters and Adapters
PCB Pins and Receptacles
IC Pin Probes
3.PRODUCT INTRODUCTIONS/INNOVATIONS
Ironwood Electronics Launches a Range of New BGA Sockets
Ironwood Electronics Introduces New QFN Socket
Ironwood Electronics Launches High Performance BGA Socket
Aries Electronics Expands CSP/µBGA Test/Burn- in Sockets Range
Plastronics Launches ES Socket System
Thermaltake Unveils New CPU Cooler with Multiple Sockets
Fujitsu Launches SMT DDR2 DIMM Socket
Emulation Unveils Novel Socket System
MIPS Technologies Unveils Novel Instruction Set and Cores
Aries Electronics Launches CSP/BallNest Hybrid Socket
MiniATE Systems Introduces ET 2300 Socket System
Sullins Connector Solutions Extends Insulation Displacement Connector Portfolio
Fujitsu Asia Introduces PRIMERGY Dual Socket S5 Series
Intel Launches Nehalem Based Processors and LGA Sockets
Quadrant Rolls Out Semitron® MDS 100
Atmel Introduces New Expansion, Routing and Socket Cards
Tyco Electronics Introduces New Range of RFI Filter Connectors
4.RECENT INDUSTRY ACTIVITY
Molex Sockets Earn Intel® Validation
Semiconductor Test Group Merges with Multitest elektronische Systeme and Harbor Electronics
KLA Tencor Acquires ICOS Vision Systems
5.FOCUS ON SELECT GLOBAL PLAYERS
3M COMPANY (US)
Aries Electronics, Inc. (US)
Chupond Precision Co., Ltd. (Taiwan)
Enplas Corporation (Japan)
FCI (France)
Foxconn Technology Group (Taiwan)
Johnstech International Corporation (US)
Loranger International Corporation (US)
Mill-Max Mfg. Corporation (US)
Molex, Inc. (US)
Plastronics Socket Company, Inc. (US)
Sensata Technologies B.V. (The Netherlands)
Tyco Electronics Ltd. (Switzerland)
Win Way Technology Co., Ltd. (Taiwan)
Yamaichi Electronics Co., Ltd. (Japan)
6.GLOBAL MARKET PERSPECTIVE
III. MARKET
1.NORTH AMERICA
A. MARKET ANALYSIS
Current and Future Analysis
Impact of Recession on IC Sockets Market
Product Launches/Developments
Strategic Corporate Developments
Select US Players
B. MARKET ANALYTICS
2.JAPAN
A. MARKET ANALYSIS
Current and Future Analysis
Select Players
B. MARKET ANALYTICS
3.EUROPE
A. MARKET ANALYSIS
Current and Future Analysis
Product Launch
Strategic Corporate Development
Select Players
B. MARKET ANALYTICS
4.ASIA-PACIFIC
A. MARKET ANALYSIS
Current and Future Analysis
Product Launches/Developments
Select Players
B. MARKET ANALYTICS
5.REST OF WORLD
Market Analysis
IV. COMPETITIVE LANDSCAPE
Total Companies Profiled: 44 (including Divisions/Subsidiaries - 46)
Region/CountryPlayers
The United States
Japan
Europe
France
Germany
The United Kingdom
Rest of Europe
Asia-Pacific (Excluding Japan)
Study Reliability and Reporting Limitations
Disclaimers
Data Interpretation & Reporting Level
Quantitative Techniques & Analytics
Product Definitions and Scope of Study
IC Sockets
1. DUAL IN-LINE MEMORY MODULE (DIMM) SOCKETS
2. PRODUCTION SOCKETS
3. TEST/BURN-IN SOCKETS
4. OTHER SOCKETS
II. EXECUTIVE SUMMARY
1.INDUSTRY OVERVIEW
Preface
Global Outlook
Analysis by Region
Analysis by Product Segment
Impact of Recession on IC Sockets Market
Changing Market Dynamics
Evolving IC Sockets Market
Evolving Production IC Sockets Segment
Test and Burn-In Sockets Segment to Witness New Developments
IC Socket Industry Witnesses Growth of EMS Companies
Connector Industry
2.PRODUCT OVERVIEW
Introduction
IC Sockets
Performance Specifications
Components of IC Socket
Contact Designs Used in IC Sockets
Types of IC Sockets
Dual In-Line Memory Module (DIMM) Sockets
Production Sockets
Plastic Leaded Chip Carrier (PLCC) Socket
Pin Grid Array (PGA) Socket
Land Grid Array (LGA) Socket
Test/Burn-in Sockets
Other Sockets
Dual In-Line Package (DIP) Socket
Ball Grid Array (BGA) Socket
Specialty Socket
Interposer
Advantages of IC Sockets
Cost Savings
Component Repair and Replacement
Avoidance of Direct Soldering
Flexibility in Assembly, IC Design, and Supply-Chain Management
Component Exchange and Upgrade
Component Burn-in and Test
Disadvantages of IC Sockets
End-Use Applications of IC Sockets
Services and Products Associated with IC Sockets
IC Sockets and Interconnect Components
IC Package Converters and Adapters
PCB Pins and Receptacles
IC Pin Probes
3.PRODUCT INTRODUCTIONS/INNOVATIONS
Ironwood Electronics Launches a Range of New BGA Sockets
Ironwood Electronics Introduces New QFN Socket
Ironwood Electronics Launches High Performance BGA Socket
Aries Electronics Expands CSP/µBGA Test/Burn- in Sockets Range
Plastronics Launches ES Socket System
Thermaltake Unveils New CPU Cooler with Multiple Sockets
Fujitsu Launches SMT DDR2 DIMM Socket
Emulation Unveils Novel Socket System
MIPS Technologies Unveils Novel Instruction Set and Cores
Aries Electronics Launches CSP/BallNest Hybrid Socket
MiniATE Systems Introduces ET 2300 Socket System
Sullins Connector Solutions Extends Insulation Displacement Connector Portfolio
Fujitsu Asia Introduces PRIMERGY Dual Socket S5 Series
Intel Launches Nehalem Based Processors and LGA Sockets
Quadrant Rolls Out Semitron® MDS 100
Atmel Introduces New Expansion, Routing and Socket Cards
Tyco Electronics Introduces New Range of RFI Filter Connectors
4.RECENT INDUSTRY ACTIVITY
Molex Sockets Earn Intel® Validation
Semiconductor Test Group Merges with Multitest elektronische Systeme and Harbor Electronics
KLA Tencor Acquires ICOS Vision Systems
5.FOCUS ON SELECT GLOBAL PLAYERS
3M COMPANY (US)
Aries Electronics, Inc. (US)
Chupond Precision Co., Ltd. (Taiwan)
Enplas Corporation (Japan)
FCI (France)
Foxconn Technology Group (Taiwan)
Johnstech International Corporation (US)
Loranger International Corporation (US)
Mill-Max Mfg. Corporation (US)
Molex, Inc. (US)
Plastronics Socket Company, Inc. (US)
Sensata Technologies B.V. (The Netherlands)
Tyco Electronics Ltd. (Switzerland)
Win Way Technology Co., Ltd. (Taiwan)
Yamaichi Electronics Co., Ltd. (Japan)
6.GLOBAL MARKET PERSPECTIVE
Table 1. World Recent Past, Current and Future Analysis for IC Sockets by Geographic Region – North America, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)
Table 2. World 10-Year Perspective for IC Sockets by Geographic Region – Percentage Breakdown of Dollar Sales for North America, Japan, Europe, Asia-Pacific and Rest of World Markets for Years 2006, 2009 and 2015 (includes corresponding Graph/Chart)
Table 3. World Recent Past, Current & Future Analysis for IC Sockets by Product Segment – Dual In-Line Memory Module Sockets, Production Sockets, Test/Burn-in Sockets, and Other IC Socket Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)
Table 4. World 10-Year Perspective for IC Sockets by Product Segment – Percentage Breakdown of Dollar Sales for Dual In-Line Memory Module Sockets, Production Sockets, Test/Burn-in Sockets, and Other IC Socket Markets for Years 2006, 2009 & 2015 (includes corresponding Graph/Chart)
III. MARKET
1.NORTH AMERICA
A. MARKET ANALYSIS
Current and Future Analysis
Impact of Recession on IC Sockets Market
Product Launches/Developments
Strategic Corporate Developments
Select US Players
B. MARKET ANALYTICS
Table 5. North American Recent Past, Current and Future Analysis for IC Sockets with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)
2.JAPAN
A. MARKET ANALYSIS
Current and Future Analysis
Select Players
B. MARKET ANALYTICS
Table 6. Japanese Recent Past, Current and Future Analysis for IC Sockets with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)
3.EUROPE
A. MARKET ANALYSIS
Current and Future Analysis
Product Launch
Strategic Corporate Development
Select Players
B. MARKET ANALYTICS
Table 7. European Recent Past, Current and Future Analysis for IC Sockets with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)
4.ASIA-PACIFIC
A. MARKET ANALYSIS
Current and Future Analysis
Product Launches/Developments
Select Players
B. MARKET ANALYTICS
Table 8. Asia-Pacific Recent Past, Current and Future Analysis for IC Sockets by Geographic Region – China and Rest of Asia-Pacific Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)
Table 9. Asia-Pacific 10-Year Perspective for IC Sockets by Geographic Region – Percentage Breakdown of Dollar Sales for China and Rest of Asia-Pacific Markets for Years 2006, 2009 and 2015
5.REST OF WORLD
Market Analysis
Table 10. Rest of World Recent Past, Current and Future Analysis for IC Sockets with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)
IV. COMPETITIVE LANDSCAPE
Total Companies Profiled: 44 (including Divisions/Subsidiaries - 46)
Region/CountryPlayers
The United States
Japan
Europe
France
Germany
The United Kingdom
Rest of Europe
Asia-Pacific (Excluding Japan)
