Electronic Thermal Management: Market Research Report

Date: October 22, 2010
Pages: 557
Price:
US$ 4,950.00
Publisher: Global Industry Analysts, Inc
Report type: Strategic Report
Delivery: E-mail Delivery (PDF)
ID: E6F6DA01EE7EN
Leaflet:

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Electronic Thermal Management: Market Research Report
This report analyzes the worldwide markets for Electronic Thermal Management in US$ Million by the following end-use segments: Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive.

Also, the report provides market analytics for the Global and US market for the product segments - Hardware, Software, and Interfaces & Substrates.

Annual estimates and forecasts are provided for the period 2007 through 2015.

A six-year historic analysis is also provided for these markets.

The report profiles 158 companies including many key and niche players such as II-VI, Incorporated, Marlow Industries, Aavid Thermalloy, LLC, Advanced Thermal Solutions, Inc., Alcoa, Inc., Alpha Metals, Alpha Technologies Group, Inc., Ametek, Inc., Amkor Technology, Inc., Ansys, Inc., Ansoft Corporation, Fluent, Inc., ASAT Holdings Ltd., Brush Engineered Materials, Inc., Ceramics Process Systems Corporation, Chomerics, Comair Rotron, Inc., Cookson Electronics Assembly Materials, Cool Innovations, Inc., Cooler Master Co., Ltd., C-Therm Technologies Ltd., CTS Corporation, Daat Research Corp., Degree Controls, Inc., Dow Corning Corporation, Dynatron Corporation, Enertron, Inc., Ferraz Shawmut, LLC, Fujikura Ltd., Henkel Loctite Corporation, Honeywell Electronic Materials, Intricast Company Inc., ITW Vortec, JARO Components, Inc., Kooltronic, Inc., Kyocera Corporation, Laird Technologies, Liebert Corporation, Lord Corporation, Lytron Incorporated, Mentor Graphics Corporation, Metal Matrix Cast Composites, LLC, Micronel U.S., Netzsch Instruments, Inc.., Netzsch Thermal Analysis, NMB Technologies Corporation, Noren Products, Inc.., Orient Semiconductor Electronics Ltd., PC Power & Cooling, Inc.., Pfannenberg, Inc., PLANSEE Thermal Management Solutions, Sumitomo Electric Industries, Ltd., Tech Spray, L. P., Tellurex Corp., Tennmax United, The Bergquist Company, The Filter Factory, Inc., Thermacore, Transene Company, Inc., U.S. Toyo Fan Corporation, United Thermal Engineering Corporation, Vette Corp., and Wakefield Thermal Solutions, Inc.

Market data and analytics are derived from primary and secondary research.

Company profiles are mostly extracted from URL research and reported select online sources.
1.INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS

Study Reliability and Reporting Limitations
Disclaimers
Data Interpretation & Reporting Level
Quantitative Techniques & Analytics
Product Definitions and Scope of Study
End-Use Segments

1. COMPUTERS

2. TELECOM

3. MEDICAL/OFFICE EQUIPMENT

4. INDUSTRIAL/MILITARY

5. CONSUMER ELECTRONICS

6. AUTOMOTIVE

Product Segments

1. HARDWARE

2. SOFTWARE

3. INTERFACES AND SUBSTRATES

2.INDUSTRY OVERVIEW

Sophisticated Technology Needs Effective Thermal Management
Current and Future Analysis
Regional Perspective
End-Use Perspective
Product Segment Perspective

3.MARKET TRENDS

Recession Impacts the Market
Rising Complexities Present Lucrative Opportunities for Electronic Thermal Management
PC Market Stimulates Growth
Thermal Management Subsystems Set for Robust Growth
New Technologies Under Development
Liquid Cooling Gaining Foothold
Semiconductor Manufacturers Look for Thermal Management Technology
Heat Pipe Gains Popularity among PC Manufacturers
Imminent Growth for ICs

4.PRODUCT OVERVIEW

Thermal Management – A Critical Function
Electronic Thermal Management Products
Hardware
Heat Sinks
Heat Pipes
Micro Channels
Spray Cooling
Electronic Cooling Fans
Metal Backplanes
BGAs
Software
Computational Methods of Heat Transfer (CHT) and Fluid Dynamics (CFD)
Electronic Design Automation (EDA) Software, Electronic Computer Aided Design (ECAD) Software, and Technology Computer Aided Design (TCAD) Software
Interfaces and Substrates
Thermal Compounds and Thermal Interface Materials
Thermal Management Applications
Computers
Notebooks/Laptops
Servers
Embedded PCs
Telecom
Medical
Industrial Electronics
Aerospace/Military
Consumer Electronics
Automotive

5.COMPETITIVE ENVIRONMENT IN RECENT PAST

Thermal Management - A Fragmented Market

Table 1. Leading Vendors in the Worldwide Thermal Management Market (2006 & 2007) - Percentage Breakdown by Value Sales for Amkor, Aavid Thermalloy, Fluent, Chomerics, Kyocera, and Others (includes corresponding Graph/Chart)

Thermal Management Hardware Market

Table 2. Leading Players in the Worldwide Thermal Management Hardware Market (2006 & 2007) - Percentage Breakdown by Value Sales for Aavid Thermalloy, Thermacore, Lytron, and Others (includes corresponding Graph/Chart)

Fluent – The Undisputed Thermal Management S/W Market Leader

Table 3. Leading Players in the Worldwide Thermal Management Software Market (2006 & 2007) - Percentage Breakdown by Value Sales for Fluent, Ansys, Flomerics, Daat, and Others (includes corresponding Graph/Chart)

Chomerics and Bergquist Lead Thermal Management Interface Market

Table 4. Leading Players in the Worldwide Thermal Management Interface Market (2006 & 2007) - Percentage Breakdown by Value Sales for Chomerics, Bergquist, Aavid Thermalloy, Lytron, and Others (includes corresponding Graph/Chart)

Amkor Dominates Thermal Management Substrate Market

Table 5. Leading Players in the Worldwide Thermal Management Substrate Market (2006 & 2007) - Percentage Breakdown by Value Sales for Amkor, Kyocera, ST ChipPAC, OSE, ASAT, and Others (includes corresponding Graph/Chart)

6.PRODUCT INTRODUCTIONS/INNOVATIONS

LORD Unveils MT-815 Low Modulus Increased Thermal Conductivity Adhesive
Thermaltake Introduces Thermaltake SlimX3
Honeywell Electronic Materials Launches Honeywell PCM45M-SP
AdaptivCool Develops HotSpotr HT-510
Nuventix Introduces SynJet Spot Light Cooler
DSM Engineering Plastics Unveils Thermally Conductive PA46 Material
Micropelt Launches MPC-D40x Thermoelectric Coolers
Pfannenberg Unveils New DTS 3000 Side-Mount Cooling Units
California Micro Devices Launches LuxGuard™ CM1771
Honeywell Unveils Pb-free Die Attach Solder
Nuventix Introduces New Line of SynJet Coolers
Indium Launches Heat-Spring® Thermal Interface Material
Parker Hannifin Launches Two-Phase Liquid Cooling System
Nuventix and National Semiconductor Launch Electronic Drive and Reference Design
Honeywell International Unveils Honeywell PTM 3180
RS Components Unveils New Thermal Management Solutions
Arun Components Launches Alutronic Line of Heatsink Systems
Nextreme Thermal Solutions Introduces New Series of OptoCooler High Voltage Modules
Vette Introduces Aluma-Cop Liquid Cooling
SprayCool Launches Multi-Platform Enclosure
Celsia Technologies Unveils Advanced NanoSpreader
STABLCOR Introduces ST10-LC909 Products

7.PRODUCT INNOVATIONS/LAUNCHES IN RECENT PAST – A PERSPECTIVE BUILDER

SMART Releases Liquid-Cooled VLP DDR2 Registered DIMMs
LORD Develops Materials for Thermal Management
Dow Corning Introduces New Thermally Conductive Compound
Astrosyn Unveils a Range of Slide-fit Heatsink Enclosures
Dell Develops a Liquid-Cooled Heat Sink
Fujipoly America Develops an Innovative Thermal Interface Material
Flomerics to Offer T3Ster Thermal Testing System
Andigilog® Develops ThermalEdge™ Cooling Technology
Andigilog® Introduces Thermal Management Solutions
Celsia Releases MicroSpreader™
Sunon Develops Liquid Circulation Cooling System
EBM-PAPST Develops Advanced Liquid Cooling System
EBM-PAPST Introduces New Fan-Cooling Technology
Hybricon Introduces Liquid-Cooled ATR Chassis
Ansoft Launches Latest Version of ePhysics as ePhysics v2
CTS Launches New Line of Low-Profile Forged Heat Sinks
Honeywell Introduces Screen Printable Phase Change Material in Chip Manufacture
Laird Launches Thermally Conductive, Electrically Insulating T-preg™ HTD for PCBs
Laird Introduces Deep Drawing Capability for Shielding Applications
Laird Introduces Low-Cost T-Gard™ for SMPS Devices
Laird Introduces T-Gard™ 500 High Performance Insulator for Automotive Industry
Jaro Develops 450 CFM AC Cooling Fan for Industrial Use
Jaro Develops IC Cooling Fan With High Flow and Cooling Value
Mathis Develops Mathis TCi™ For Improved Thermal Conductivity Testing
Melcor Introduces Extrusion Heat Sinks With Improved Performance
Fluent Launches New Environmental Thermal Audit Solution for Data Centers
Kooltronic Introduces Advanced Enclosure Accessories
Pfannerberg Develops Filterfan®

8.RECENT INDUSTRY ACTIVITY

Thermacore Snaps Up Pittsburgh Materials Technology
Parker Hannifin Takes Over SprayCool
Dow Kokam Acquires Societe de Vehicles Electriques
BorgWarner Establishes Manufacturing Plant
MAHLE Acquires Majority Stake in BEHR Industry
CoolIT Systems Takes Over Assets of Delphi Thermal Liquid Cooling
Curtiss-Wright Snaps Up EST Group
Arlington Capital Partners Acquires J.A. Reinhardt
Thermacore Takes Over k Technology
IBM Collaborates with Vette
Bias Power Collaborates with Nuventix
Roal Electronics Collaborates with Nuventix
Electronic Environments Inks Partnership Agreement with AdaptivCool
Asetek Forms Alliance with Corsair
AdaptivCool and Yamatake Sign Agreement
Toyal America forms Alliance with E.W. Kaufmann
Stablcor and Elvia PCB Group Ink Licensing Agreement
Weidmann Electrical Technology and LumaSense Technologies Ink Strategic Partnership Agreement
Thermacore Bags Contract from Defense Advanced Research Projects Agency
Waytronx Takes Over CUI
Photochemie Signs Licensing Agreement with Stablcor
ON Semiconductor Establishes Research and Development Centre
Stablcor and Graphic Ink Licensing Agreement
Texas Instruments Takes Over Commergy Technologies
Thermal Energy International Takes Over Gardner Energy Management
nCoat Inks Agreement with BSR Solar Technologies and Sunvention USA
CSP Inc. MultiComputer Division Signs Agreement with SprayCool® Technologies
Mentor Graphics Takes Over Flomerics Group
Modine Divests Thermacore

9.CORPORATE ACTIVITY IN RECENT PAST – A PERSPECTIVE BUILDER

Moog Takes Over Thermal Control Products
Rensselaer Teams Up with Varsities to Develop Cooling Techniques
Laird Partners with Sager Electronics
Honeywell to Expand R&D Facility
Vette Adds ERM
Laird Takes Over Supercool
Arlington Capital Acquires Woven Electronics Through Thermal Solutions
Parker Hannifin Purchases Acofab and Adecem
Ametek Adds Land Instruments
Lytron Adds Lockhart Industries
Seki Technotron Purchases 10% Interest in sp3 Inc.
OnScreen Purchases Patent of WayCool Thermal Cooling Technology
Flomerics Acquires NIKA
Aavid Merges with Ansys and Spins-Off Thermal Management Business
Celsia and Yeh-Chiang Sign Agreement
Nextreme Inks License Deal with Caltech
Celsia Signs Sales & Development Pact with Lighting Science
Celsia Contracts with Kubo to Expand in Japan
Hybricon and Parker Hannifin Sign Pact for Cooling Solutions
Rogers and Thermal Transfer Composites Partner
sp3 Partners with CPS
Celsia Teams Up with AET
Mathis Forms Distribution Partnership with Setaram Instrumentation

10.FOCUS ON SELECT PLAYERS

II-VI, Incorporated (US)
Marlow Industries (US)
Aavid Thermalloy, LLC (US)
Advanced Thermal Solutions, Inc. (US)
Alcoa, Inc. (US)
Alpha Technologies, Inc. (US)
Ametek, Inc. (US)
Amkor Technology, Inc. (US)
Ansys, Inc. (US)
Ansoft Corporation (US)
Fluent, Inc. (US)
ASAT Holdings Ltd. (Hong Kong)
Brush Engineered Materials, Inc. (US)
Ceramics Process Systems Corporation (US)
Chomerics (US)
Comair Rotron, Inc. (US)
Cookson Electronics Assembly Materials (US)
Cool Innovations, Inc. (US)
Cooler Master Co., Ltd. (UK)
C-Therm Technologies Ltd. (Canada)
CTS Corporation (US)
Daat Research Corp. (US)
Degree Controls, Inc. (US)
Dow Corning Corporation (US)
Dynatron Corporation (US)
Enertron, Inc. (US)
Ferraz Shawmut, LLC (Canada)
Fujikura Ltd. (Japan)
Henkel Loctite Corporation (US)
Honeywell Electronic Materials (US)
Intricast Company Inc (US)
ITW Vortec (US)
JARO Components, Inc. (US)
Kooltronic, Inc. (US)
Kyocera Corporation (Japan)
Laird Technologies (US)
Liebert Corporation (US)
Lord Corporation (US)
Lytron Incorporated (US)
Mentor Graphics Corporation (US)
Metal Matrix Cast Composites, LLC (US)
Micronel U.S. (US)
Netzsch Instruments, Inc. (US)
Netzsch Thermal Analysis (Germany)
NMB Technologies Corporation (US)
Noren Products, Inc. (US)
Orient Semiconductor Electronics Ltd. (Taiwan)
PC Power & Cooling, Inc. (US)
Pfannenberg, Inc. (US)
PLANSEE Thermal Management Solutions (US)
Sumitomo Electric Industries, Ltd. (Japan)
Tech Spray, L. P. (UK)
Tellurex Corp. (US)
Tennmax United (US)
The Bergquist Company (US)
The Filter Factory, Inc. (US)
Thermacore (US)
Transene Company, Inc. (US)
U.S. Toyo Fan Corporation (US)
United Thermal Engineering Corporation (US)
Vette Corp. (US)
Wakefield Thermal Solutions, Inc. (US)

11.GLOBAL MARKET PERSPECTIVE

Table 6. World Recent Past, Current & Future Analysis for Electronic Thermal Management by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart)
Table 7. World Historic Review for Electronic Thermal Management by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart)
Table 8. World 11-Year Perspective for Electronic Thermal Management by Geographic Region – Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Markets for Years 2005, 2010 & 2015 (includes corresponding Graph/Chart)
Table 9. World Recent Past, Current & Future Analysis for Electronic Thermal Management by Product Segment– Hardware, Software, and Interfaces & Substrates Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart)
Table 10. World Historic Review for Electronic Thermal Management by Product Segment – Hardware, Software, and Interfaces & Substrates Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart)
Table 11. World 11-Year Perspective for Electronic Thermal Management by Product Segment – Percentage Breakdown of Dollar Sales for Hardware, Software, and Interfaces & Substrates Markets for Years 2005, 2010 & 2015 (includes corresponding Graph/Chart)
Table 12. World Recent Past, Current & Future Analysis for Electronic Thermal Management in Computers by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart)
Table 13. World Historic Review for Electronic Thermal Management in Computers by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart)
Table 14. World 11-Year Perspective for Electronic Thermal Management in Computers by Geographic Region – Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Markets for Years 2005, 2010 & 2015 (includes corresponding Graph/Chart)
Table 15. World Recent Past, Current & Future Analysis for Electronic Thermal Management in Telecom by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart)
Table 16. World Historic Review for Electronic Thermal Management in Telecom by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart)
Table 17. World 11-Year Perspective for Electronic Thermal Management in Telecom by Geographic Region – Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Markets for Years 2005, 2010 & 2015 (includes corresponding Graph/Chart)
Table 18. World Recent Past, Current & Future Analysis for Electronic Thermal Management in Medical/ Office Equipment by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart)
Table 19. World Historic Review for Electronic Thermal Management in Medical/Office Equipment by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart)
Table 20. World 11-Year Perspective for Electronic Thermal Management in Medical/Office Equipment by Geographic Region – Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Markets for Years 2005, 2010 & 2015 (includes corresponding Graph/Chart)
Table 21. World Recent Past, Current & Future Analysis for Electronic Thermal Management in Industrial/Military by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart)
Table 22. World Historic Review for Electronic Thermal Management in Industrial/Military by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart)
Table 23. World 11-Year Perspective for Electronic Thermal Management in Industrial/Military by Geographic Region – Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Markets for Years 2005, 2010 & 2015 (includes corresponding Graph/Chart)
Table 24. World Recent Past, Current & Future Analysis for Electronic Thermal Management in Consumer Electronics by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart)
Table 25. World Historic Review for Electronic Thermal Management in Consumer Electronics by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart)
Table 26. World 11-Year Perspective for Electronic Thermal Management in Consumer Electronics by Geographic Region – Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Markets for Years 2005, 2010 & 2015 (includes corresponding Graph/Chart)
Table 27. World Recent Past, Current & Future Analysis for Electronic Thermal Management in Automotive by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart)
Table 28. World Historic Review for Electronic Thermal Management in Automotive by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart)
Table 29. World 11-Year Perspective for Electronic Thermal Management in Automotive by Geographic Region – Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Markets for Years 2005, 2010 & 2015 (includes corresponding Graph/Chart)

12.UNITED STATES

A. MARKET ANALYSIS

Current and Future Analysis
By End-Use Segment
By Product Segment
Rising Complexities Present Lucrative Opportunities for Electronic Thermal Management
Price Pressures and Shifting of Manufacturing to Asia to Restrain Growth

B. MARKET ANALYTICS

Table 30. US Recent Past, Current & Future Analysis for Electronic Thermal Management by Product Segment – Hardware, Software, and Interfaces & Substrates Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart)
Table 31. US Historic Review for Electronic Thermal Management by Product Segment – Hardware, Software, and Interfaces & Substrates Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart)
Table 32. US 11-Year Perspective for Electronic Thermal Management by Product Segment – Percentage Breakdown of Dollar Sales for Hardware, Software, and Interfaces & Substrates Markets for Years 2005, 2010 & 2015 (includes corresponding Graph/Chart)
Table 33. US Recent Past, Current & Future Analysis for Electronic Thermal Management by End-Use Segment – Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart)
Table 34. US Historic Review for Electronic Thermal Management by End-Use Segment – Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart)
Table 35. US 11-Year Perspective for Electronic Thermal Management by End-Use Segment – Percentage Breakdown of Dollar Sales for Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets for 2005, 2010 & 2015 (includes corresponding Graph/Chart)

13.CANADA

Market Analysis

Table 36. Canadian Recent Past, Current & Future Analysis for Electronic Thermal Management by End-Use Segment – Computers, Telecom, Medical/ Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart)
Table 37. Canadian Historic Review for Electronic Thermal Management by End-Use Segment – Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart)
Table 38. Canadian 11-Year Perspective for Electronic Thermal Management by End-Use Segment – Percentage Breakdown of Dollar Sales for Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets for 2005, 2010 & 2015 (includes corresponding Graph/Chart)

14.JAPAN

Market Analysis

Table 39. Japanese Recent Past, Current & Future Analysis for Electronic Thermal Management by End-Use Segment – Computers, Telecom, Medical/ Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart)
Table 40. Japanese Historic Review for Electronic Thermal Management by End-Use Segment – Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart)
Table 41. Japanese 11-Year Perspective for Electronic Thermal Management by End-Use Segment – Percentage Breakdown of Dollar Sales for Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets for 2005, 2010 & 2015 (includes corresponding Graph/Chart)

15.EUROPE

Market Analysis

Table 42. European Recent Past, Current & Future Analysis for Electronic Thermal Management by End-Use Segment – Computers, Telecom, Medical/ Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart)
Table 43. European Historic Review for Electronic Thermal Management by End-Use Segment – Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart)
Table 44. European 11-Year Perspective for Electronic Thermal Management by End-Use Segment – Percentage Breakdown of Dollar Sales for Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets for 2005, 2010 & 2015 (includes corresponding Graph/Chart)

16.ASIA-PACIFIC

A. MARKET ANALYSIS

Current and Future Analysis
Taiwan Market Scenario

B. MARKET ANALYTICS

Table 45. Asia-Pacific Recent Past, Current & Future Analysis for Electronic Thermal Management by End-Use Segment – Computers, Telecom, Medical/Office Equipment, Industrial/ Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart)
Table 46. Asia-Pacific Historic Review for Electronic Thermal Management by End-Use Segment – Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart)
Table 47. Asia-Pacific 11-Year Perspective for Electronic Thermal Management by End-Use Segment – Percentage Breakdown of Dollar Sales for Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets for 2005, 2010 & 2015 (includes corresponding Graph/Chart)

17.REST OF WORLD

Market Analysis

Table 48. Rest of World Recent Past, Current & Future Analysis for Electronic Thermal Management by End-Use Segment – Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart)
Table 49. Rest of World Historic Review for Electronic Thermal Management by End-Use Segment – Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart)
Table 50. Rest of World 11-Year Perspective for Electronic Thermal Management by End-Use Segment – Percentage Breakdown of Dollar Sales for Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets for 2005, 2010 & 2015 (includes corresponding Graph/Chart)

Total Companies Profiled: 158 (including Divisions/Subsidiaries - 178)
Region/CountryPlayers
The United States
Canada
Japan
Europe
France
Germany
The United Kingdom
Italy
Spain
Rest of Europe
Asia-Pacific (Excluding Japan)
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