IC Substrate in the Global PCB Market: Trends, Opportunities and Competitive Analysis [2023-2028]
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IC Substrate in PCB Market Trends and Forecast
The future of the global IC substrate in the global PCB market looks promising with opportunities in the tablet PC, smartphone, laptop, and wearable device applications. The global PCB market in terms of IC substrate usage is expected to reach an estimated $15.3 billion by 2028 with a CAGR of 14.2% from 2023 to 2028. The major drivers for this market are increasing acceptance of advanced packaging technologies, such as wafer-level packaging and flip-chip packaging, increasing popularity of smart wearable, like smart watches and fitness bands, and growing trend of miniaturization.
IC Substrate in PCB Market
A more than 150-page report is developed to help in your business decisions. A sample figure with some insights is shown below.
IC Substrate in PCB Market by Segments
IC Substrate in PCB Market by Segment
The study includes trends and forecast for IC substrate in the global PCB market by type, application, and region, as follows:
IC Substrate in PCB Market by Type [Value ($B) Shipment Analysis from 2017 to 2028]:
FC BGA
FC CSP
IC Substrate in PCB Market by Application [Value ($B) Shipment Analysis from 2017 to 2028]:
Tablet PC
Smart Phones
Laptops
Wearable Devices
Others
IC Substrate in PCB Market by Region [Value ($B) Shipment Analysis from 2017 to 2028]:
North America
Europe
Asia Pacific
The Rest of the World
List of IC Substrate in PCB Companies
Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies, IC substrate companies in the PCB market cater to increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of IC substrate companies in the PCB market profiled in this report include-
ASE Group
TTM Technologies
Simmtech
Fujitsu Limited
Ibiden
JCET Group
Kinsus Interconnect Technology
Korea Circuit
KYOCERA Corporation
LG Innotek
IC Substrate in PCB Market Insights
Lucintel forecasts that FC BGA is expected to remain the larger type segment over the forecast period due to its capability of routing density and ability to be customized for maximum electrical performance.
Within this market, smartphones are expected to remain the largest segment over the forecast period due to rising demand for high-performance mobile devices and increasing penetration of advanced technologies.
APAC will remain the largest region due to significantly growing electronics industry, increasing trend of advanced packaging technologies, and presence of the well-established semiconductor and electronics players in the region.
Features of IC Substrate in PCB Market
Market Size Estimates: IC substrate in the global PCB market size estimation in terms of value ($B)
Trend And Forecast Analysis: Market trends (2017-2022) and forecast (2023-2028) by various segments and regions.
Segmentation Analysis: IC substrate in the global PCB market size by various segments, such as by raw material usage, end use industry, and region
Regional Analysis: IC substrate in the global PCB market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
Growth Opportunities: Analysis on growth opportunities in different raw material usages, end use industries, and regions for IC substrate in PCB market.
Strategic Analysis: This includes M&A, new product development, and competitive landscape for IC substrate in PCB market.
Analysis of competitive intensity of the industry based on Porter’s Five Forces model.
FAQ
Q1. What is IC substrate in PCB market size?
Answer: The global PCB market in terms of IC substrate usage is expected to reach an estimated $15.3 billion by 2028.
Q2. What is the growth forecast for IC substrate in PCB market?
Answer: The global PCB market in terms of IC substrate usage is expected to grow with a CAGR of 14.2% from 2023 to 2028.
Q3. What are the major drivers influencing the growth of IC substrate in PCB market?
Answer: The major drivers for this market are increasing acceptance of advanced packaging technologies, such as wafer-level packaging and flip-chip packaging, increasing popularity of smart wearable’s like smart watches and fitness bands, and growing trend of miniaturization.
Q4. What are the major segments for IC substrate in PCB market?
Answer: The future of IC substrate in the global PCB market looks promising with opportunities in the tablet PC, smartphone, laptop, and wearable device markets.
Q5. Who is the key IC substrate in PCB companies?
Answer: Some of the key IC substrate in PCB companies are as follows:
ASE Group
TTM Technologies
Simmtech
Fujitsu Limited
Ibiden
JCET Group
Kinsus Interconnect Technology
Korea Circuit
KYOCERA Corporation
LG Innotek
Q6. Which IC substrate in PCB segment will be the largest in future?
Answer:Lucintel forecasts that FC BGA is expected to remain the larger type segment over the forecast period due to its capability of routing density and ability to be customized for maximum electrical performance.
Q7. In IC substrate in PCB market, which region is expected to be the largest in next 5 years?
Answer: APAC will remain the largest region due to significantly growing electronics industry, increasing trend of advanced packaging technologies, and presence of the well-established semiconductor and electronics players in the region.
Q8. Do we receive customization in this report?
Answer: Yes, Lucintel provides 10% Customization Without any Additional Cost.
This report answers following 11 key questions
Q.1. What are some of the most promising, high-growth opportunities for IC substrate in the global PCB market by type (FC BGA and FC CSP), application (tablet PC, smartphones, laptops, wearable devices, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
Q.2. Which segments will grow at a faster pace and why?
Q.3. Which region will grow at a faster pace and why?
Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
Q.5. What are the business risks and competitive threats in this market?
Q.6. What are the emerging trends in this market and the reasons behind them?
Q.7. What are some of the changing demands of customers in the market?
Q.8. What are the new developments in the market? Which companies are leading these developments?
Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
Q.11. What M&A activity has occurred in the last five years and what has its impact been on the industry?
For any questions related to IC substrate in the global PCB market or related to IC substrate in the global PCB companies, IC substrate in the global PCB market size, IC substrate in the global PCB market share, IC substrate in the global PCB analysis, IC substrate in the global PCB market growth, IC substrate in the global PCB market research, write Lucintel analyst at email: [email protected] we will be glad to get back to you soon.
IC Substrate in PCB Market Trends and Forecast
The future of the global IC substrate in the global PCB market looks promising with opportunities in the tablet PC, smartphone, laptop, and wearable device applications. The global PCB market in terms of IC substrate usage is expected to reach an estimated $15.3 billion by 2028 with a CAGR of 14.2% from 2023 to 2028. The major drivers for this market are increasing acceptance of advanced packaging technologies, such as wafer-level packaging and flip-chip packaging, increasing popularity of smart wearable, like smart watches and fitness bands, and growing trend of miniaturization.
IC Substrate in PCB Market
A more than 150-page report is developed to help in your business decisions. A sample figure with some insights is shown below.
IC Substrate in PCB Market by Segments
IC Substrate in PCB Market by Segment
The study includes trends and forecast for IC substrate in the global PCB market by type, application, and region, as follows:
IC Substrate in PCB Market by Type [Value ($B) Shipment Analysis from 2017 to 2028]:
FC BGA
FC CSP
IC Substrate in PCB Market by Application [Value ($B) Shipment Analysis from 2017 to 2028]:
Tablet PC
Smart Phones
Laptops
Wearable Devices
Others
IC Substrate in PCB Market by Region [Value ($B) Shipment Analysis from 2017 to 2028]:
North America
Europe
Asia Pacific
The Rest of the World
List of IC Substrate in PCB Companies
Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies, IC substrate companies in the PCB market cater to increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of IC substrate companies in the PCB market profiled in this report include-
ASE Group
TTM Technologies
Simmtech
Fujitsu Limited
Ibiden
JCET Group
Kinsus Interconnect Technology
Korea Circuit
KYOCERA Corporation
LG Innotek
IC Substrate in PCB Market Insights
Lucintel forecasts that FC BGA is expected to remain the larger type segment over the forecast period due to its capability of routing density and ability to be customized for maximum electrical performance.
Within this market, smartphones are expected to remain the largest segment over the forecast period due to rising demand for high-performance mobile devices and increasing penetration of advanced technologies.
APAC will remain the largest region due to significantly growing electronics industry, increasing trend of advanced packaging technologies, and presence of the well-established semiconductor and electronics players in the region.
Features of IC Substrate in PCB Market
Market Size Estimates: IC substrate in the global PCB market size estimation in terms of value ($B)
Trend And Forecast Analysis: Market trends (2017-2022) and forecast (2023-2028) by various segments and regions.
Segmentation Analysis: IC substrate in the global PCB market size by various segments, such as by raw material usage, end use industry, and region
Regional Analysis: IC substrate in the global PCB market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
Growth Opportunities: Analysis on growth opportunities in different raw material usages, end use industries, and regions for IC substrate in PCB market.
Strategic Analysis: This includes M&A, new product development, and competitive landscape for IC substrate in PCB market.
Analysis of competitive intensity of the industry based on Porter’s Five Forces model.
FAQ
Q1. What is IC substrate in PCB market size?
Answer: The global PCB market in terms of IC substrate usage is expected to reach an estimated $15.3 billion by 2028.
Q2. What is the growth forecast for IC substrate in PCB market?
Answer: The global PCB market in terms of IC substrate usage is expected to grow with a CAGR of 14.2% from 2023 to 2028.
Q3. What are the major drivers influencing the growth of IC substrate in PCB market?
Answer: The major drivers for this market are increasing acceptance of advanced packaging technologies, such as wafer-level packaging and flip-chip packaging, increasing popularity of smart wearable’s like smart watches and fitness bands, and growing trend of miniaturization.
Q4. What are the major segments for IC substrate in PCB market?
Answer: The future of IC substrate in the global PCB market looks promising with opportunities in the tablet PC, smartphone, laptop, and wearable device markets.
Q5. Who is the key IC substrate in PCB companies?
Answer: Some of the key IC substrate in PCB companies are as follows:
ASE Group
TTM Technologies
Simmtech
Fujitsu Limited
Ibiden
JCET Group
Kinsus Interconnect Technology
Korea Circuit
KYOCERA Corporation
LG Innotek
Q6. Which IC substrate in PCB segment will be the largest in future?
Answer:Lucintel forecasts that FC BGA is expected to remain the larger type segment over the forecast period due to its capability of routing density and ability to be customized for maximum electrical performance.
Q7. In IC substrate in PCB market, which region is expected to be the largest in next 5 years?
Answer: APAC will remain the largest region due to significantly growing electronics industry, increasing trend of advanced packaging technologies, and presence of the well-established semiconductor and electronics players in the region.
Q8. Do we receive customization in this report?
Answer: Yes, Lucintel provides 10% Customization Without any Additional Cost.
This report answers following 11 key questions
Q.1. What are some of the most promising, high-growth opportunities for IC substrate in the global PCB market by type (FC BGA and FC CSP), application (tablet PC, smartphones, laptops, wearable devices, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
Q.2. Which segments will grow at a faster pace and why?
Q.3. Which region will grow at a faster pace and why?
Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
Q.5. What are the business risks and competitive threats in this market?
Q.6. What are the emerging trends in this market and the reasons behind them?
Q.7. What are some of the changing demands of customers in the market?
Q.8. What are the new developments in the market? Which companies are leading these developments?
Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
Q.11. What M&A activity has occurred in the last five years and what has its impact been on the industry?
For any questions related to IC substrate in the global PCB market or related to IC substrate in the global PCB companies, IC substrate in the global PCB market size, IC substrate in the global PCB market share, IC substrate in the global PCB analysis, IC substrate in the global PCB market growth, IC substrate in the global PCB market research, write Lucintel analyst at email: [email protected] we will be glad to get back to you soon.
1. EXECUTIVE SUMMARY
2. IC SUBSTRATE IN THE GLOBAL PCB MARKET: MARKET DYNAMICS
2.1: Introduction, Background, and Classifications
2.2: Supply Chain
2.3: Industry Drivers and Challenges
3. MARKET TRENDS AND FORECAST ANALYSIS FROM 2017 TO 2028
3.1: Macroeconomic Trends (2017-2022) and Forecast (2023-2028)
3.2: IC Substrate in the Global PCB Market Trends (2017-2022) and Forecast (2023-2028)
3.3: IC Substrate in the Global PCB Market by Type
3.3.1: FC BGA
3.3.2: FC CSP
3.4: IC Substrate in the Global PCB Market by Application
3.4.1: Tablet PC
3.4.2: Smart Phones
3.4.3: Laptops
3.4.4: Wearable Devices
3.4.5: Others
4. MARKET TRENDS AND FORECAST ANALYSIS BY REGION FROM 2017 TO 2028
4.1: IC Substrate in the Global PCB Market by Region
4.2: IC Substrate in the North American PCB Market
4.2.1: IC Substrate in the North American PCB Market by Type: FC BGA and FC CSP
4.2.2: IC Substrate in the North American PCB Market by Application: Tablet PC, Smartphones, Laptops, Wearable Devices, and Others
4.3: IC Substrate in the European PCB Market
4.3.1: IC Substrate in the European PCB Market by Type: FC BGA and FC CSP
4.3.2: IC Substrate in the European PCB Market by Application: Tablet PC, Smartphones, Laptops, Wearable Devices, and Others
4.4: IC Substrate in the APAC PCB Market
4.4.1: IC Substrate in the APAC PCB Market by Type: FC BGA and FC CSP
4.4.2: IC Substrate in the APAC PCB Market by Application: Tablet PC, Smartphones, Laptops, Wearable Devices, and Others
4.5: IC Substrate in the ROW PCB Market
4.5.1: IC Substrate in the ROW PCB Market by Type: FC BGA and FC CSP
4.5.2: IC Substrate in the ROW PCB Market by Application: Tablet PC, Smartphones, Laptops, Wearable Devices, and Others
5. COMPETITOR ANALYSIS
5.1: Product Portfolio Analysis
5.2: Operational Integration
5.3: Porter’s Five Forces Analysis
6. GROWTH OPPORTUNITIES AND STRATEGIC ANALYSIS
6.1: Growth Opportunity Analysis
6.1.1: Growth Opportunities for IC Substrate in the Global PCB Market by Type
6.1.2: Growth Opportunities for IC Substrate in the Global PCB Market by Application
6.1.3: Growth Opportunities for IC Substrate in the Global PCB Market by Region
6.2: Emerging Trends for IC Substrate in the Global PCB Market
6.3: Strategic Analysis
6.3.1: New Product Development
6.3.2: Capacity Expansion of IC Substrate in the Global PCB Market
6.3.3: Mergers, Acquisitions, and Joint Ventures of IC Substrate in the Global PCB Market
6.3.4: Certification and Licensing
7. COMPANY PROFILES OF LEADING PLAYERS
7.1: ASE Group
7.2: TTM Technologies
7.3: Simmtech
7.4: Fujitsu Limited
7.5: Ibiden
7.6: JCET Group
7.7: Kinsus Interconnect Technology
7.8: Korea Circuit
7.9: KYOCERA Corporation
7.10: LG Innotek
2. IC SUBSTRATE IN THE GLOBAL PCB MARKET: MARKET DYNAMICS
2.1: Introduction, Background, and Classifications
2.2: Supply Chain
2.3: Industry Drivers and Challenges
3. MARKET TRENDS AND FORECAST ANALYSIS FROM 2017 TO 2028
3.1: Macroeconomic Trends (2017-2022) and Forecast (2023-2028)
3.2: IC Substrate in the Global PCB Market Trends (2017-2022) and Forecast (2023-2028)
3.3: IC Substrate in the Global PCB Market by Type
3.3.1: FC BGA
3.3.2: FC CSP
3.4: IC Substrate in the Global PCB Market by Application
3.4.1: Tablet PC
3.4.2: Smart Phones
3.4.3: Laptops
3.4.4: Wearable Devices
3.4.5: Others
4. MARKET TRENDS AND FORECAST ANALYSIS BY REGION FROM 2017 TO 2028
4.1: IC Substrate in the Global PCB Market by Region
4.2: IC Substrate in the North American PCB Market
4.2.1: IC Substrate in the North American PCB Market by Type: FC BGA and FC CSP
4.2.2: IC Substrate in the North American PCB Market by Application: Tablet PC, Smartphones, Laptops, Wearable Devices, and Others
4.3: IC Substrate in the European PCB Market
4.3.1: IC Substrate in the European PCB Market by Type: FC BGA and FC CSP
4.3.2: IC Substrate in the European PCB Market by Application: Tablet PC, Smartphones, Laptops, Wearable Devices, and Others
4.4: IC Substrate in the APAC PCB Market
4.4.1: IC Substrate in the APAC PCB Market by Type: FC BGA and FC CSP
4.4.2: IC Substrate in the APAC PCB Market by Application: Tablet PC, Smartphones, Laptops, Wearable Devices, and Others
4.5: IC Substrate in the ROW PCB Market
4.5.1: IC Substrate in the ROW PCB Market by Type: FC BGA and FC CSP
4.5.2: IC Substrate in the ROW PCB Market by Application: Tablet PC, Smartphones, Laptops, Wearable Devices, and Others
5. COMPETITOR ANALYSIS
5.1: Product Portfolio Analysis
5.2: Operational Integration
5.3: Porter’s Five Forces Analysis
6. GROWTH OPPORTUNITIES AND STRATEGIC ANALYSIS
6.1: Growth Opportunity Analysis
6.1.1: Growth Opportunities for IC Substrate in the Global PCB Market by Type
6.1.2: Growth Opportunities for IC Substrate in the Global PCB Market by Application
6.1.3: Growth Opportunities for IC Substrate in the Global PCB Market by Region
6.2: Emerging Trends for IC Substrate in the Global PCB Market
6.3: Strategic Analysis
6.3.1: New Product Development
6.3.2: Capacity Expansion of IC Substrate in the Global PCB Market
6.3.3: Mergers, Acquisitions, and Joint Ventures of IC Substrate in the Global PCB Market
6.3.4: Certification and Licensing
7. COMPANY PROFILES OF LEADING PLAYERS
7.1: ASE Group
7.2: TTM Technologies
7.3: Simmtech
7.4: Fujitsu Limited
7.5: Ibiden
7.6: JCET Group
7.7: Kinsus Interconnect Technology
7.8: Korea Circuit
7.9: KYOCERA Corporation
7.10: LG Innotek
