Wafer Slicing Equipment Industry Research Report 2023
Highlights
The global Wafer Slicing Equipment market is projected to reach US$ million by 2029 from an estimated US$ million in 2022, at a CAGR of % during 2023 and 2029.
North American market for Wafer Slicing Equipment is estimated to increase from $ million in 2022 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Asia-Pacific market for Wafer Slicing Equipment is estimated to increase from $ million in 2022 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The major global companies of Wafer Slicing Equipment include DISCO, Tokyo Seimitsu, GL Tech Co Ltd, ASM, Synova, CETC Electronics Equipment Group Co., Ltd., Shenyang Heyan Technology Co., Ltd., Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. and Hi-TESI, etc. In 2022, the world's top three vendors accounted for approximately % of the revenue.
The global market for Wafer Slicing Equipment in Pure Foundry is estimated to increase from $ million in 2022 to $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Considering the economic change due to COVID-19 and Russia-Ukraine War Influence, Blade Cutting Machine, which accounted for % of the global market of Wafer Slicing Equipment in 2022, is expected to reach million US$ by 2029, growing at a revised CAGR of % from 2023 to 2029.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Wafer Slicing Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Slicing Equipment.
The Wafer Slicing Equipment market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Wafer Slicing Equipment market comprehensively. Regional market sizes, concerning products by types, by application, and by players, are also provided. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Wafer Slicing Equipment manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, product type, application, and regions.
Key Companies & Market Share Insights
In this section, the readers will gain an understanding of the key players competing. This report has studied the key growth strategies, such as innovative trends and developments, intensification of product portfolio, mergers and acquisitions, collaborations, new product innovation, and geographical expansion, undertaken by these participants to maintain their presence. Apart from business strategies, the study includes current developments and key financials. The readers will also get access to the data related to global revenue, price, and sales by manufacturers for the period 2018-2023. This all-inclusive report will certainly serve the clients to stay updated and make effective decisions in their businesses. Some of the prominent players reviewed in the research report include:
Global markets are presented by Wafer Slicing Equipment type, along with growth forecasts through 2029. Estimates on production and value are based on the price in the supply chain at which the Wafer Slicing Equipment are procured by the manufacturers.
This report has studied every segment and provided the market size using historical data. They have also talked about the growth opportunities that the segment may pose in the future. This study bestows production and revenue data by type, and during the historical period (2018-2023) and forecast period (2024-2029).
Wafer Slicing Equipment segment by Type
This report has provided the market size (production and revenue data) by application, during the historical period (2018-2023) and forecast period (2024-2029).
This report also outlines the market trends of each segment and consumer behaviors impacting the Wafer Slicing Equipment market and what implications these may have on the industry's future. This report can help to understand the relevant market and consumer trends that are driving the Wafer Slicing Equipment market.
Wafer Slicing Equipment segment by Application
This section of the report provides key insights regarding various regions and the key players operating in each region. Economic, social, environmental, technological, and political factors have been taken into consideration while assessing the growth of the particular region/country. The readers will also get their hands on the revenue and sales data of each region and country for the period 2018-2029.
The market has been segmented into various major geographies, including North America, Europe, Asia-Pacific, South America. Detailed analysis of major countries such as the USA, Germany, the U.K., Italy, France, China, Japan, South Korea, Southeast Asia, and India will be covered within the regional segment. For market estimates, data are going to be provided for 2022 because of the base year, with estimates for 2023 and forecast value for 2029.
High-impact rendering factors and drivers have been studied in this report to aid the readers to understand the general development. Moreover, the report includes restraints and challenges that may act as stumbling blocks on the way of the players. This will assist the users to be attentive and make informed decisions related to business. Specialists have also laid their focus on the upcoming business prospects.
COVID-19 and Russia-Ukraine War Influence Analysis
The readers in the section will understand how the Wafer Slicing Equipment market scenario changed across the globe during the pandemic, post-pandemic and Russia-Ukraine War. The study is done keeping in view the changes in aspects such as demand, consumption, transportation, consumer behavior, supply chain management, export and import, and production. The industry experts have also highlighted the key factors that will help create opportunities for players and stabilize the overall industry in the years to come.
Reasons to Buy This Report
This report will help the readers to understand the competition within the industries and strategies for the competitive environment to enhance the potential profit. The report also focuses on the competitive landscape of the global Wafer Slicing Equipment market, and introduces in detail the market share, industry ranking, competitor ecosystem, market performance, new product development, operation situation, expansion, and acquisition. etc. of the main players, which helps the readers to identify the main competitors and deeply understand the competition pattern of the market.
This report will help stakeholders to understand the global industry status and trends of Wafer Slicing Equipment and provides them with information on key market drivers, restraints, challenges, and opportunities.
This report will help stakeholders to understand competitors better and gain more insights to strengthen their position in their businesses. The competitive landscape section includes the market share and rank (in volume and value), competitor ecosystem, new product development, expansion, and acquisition.
This report stays updated with novel technology integration, features, and the latest developments in the market
This report helps stakeholders to understand the COVID-19 and Russia-Ukraine War Influence on the Wafer Slicing Equipment industry.
This report helps stakeholders to gain insights into which regions to target globally
This report helps stakeholders to gain insights into the end-user perception concerning the adoption of Wafer Slicing Equipment.
This report helps stakeholders to identify some of the key players in the market and understand their valuable contribution.
Core Chapters
Chapter 1: Research objectives, research methods, data sources, data cross-validation;
Chapter 2: Introduces the report scope of the report, executive summary of different market segments (by region, product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 3: Detailed analysis of Wafer Slicing Equipment manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 5: Production/output, value of Wafer Slicing Equipment by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 6: Consumption of Wafer Slicing Equipment in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 7: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 8: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 9: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 10: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 11: The main points and conclusions of the report.
The global Wafer Slicing Equipment market is projected to reach US$ million by 2029 from an estimated US$ million in 2022, at a CAGR of % during 2023 and 2029.
North American market for Wafer Slicing Equipment is estimated to increase from $ million in 2022 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Asia-Pacific market for Wafer Slicing Equipment is estimated to increase from $ million in 2022 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The major global companies of Wafer Slicing Equipment include DISCO, Tokyo Seimitsu, GL Tech Co Ltd, ASM, Synova, CETC Electronics Equipment Group Co., Ltd., Shenyang Heyan Technology Co., Ltd., Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. and Hi-TESI, etc. In 2022, the world's top three vendors accounted for approximately % of the revenue.
The global market for Wafer Slicing Equipment in Pure Foundry is estimated to increase from $ million in 2022 to $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Considering the economic change due to COVID-19 and Russia-Ukraine War Influence, Blade Cutting Machine, which accounted for % of the global market of Wafer Slicing Equipment in 2022, is expected to reach million US$ by 2029, growing at a revised CAGR of % from 2023 to 2029.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Wafer Slicing Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Slicing Equipment.
The Wafer Slicing Equipment market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Wafer Slicing Equipment market comprehensively. Regional market sizes, concerning products by types, by application, and by players, are also provided. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Wafer Slicing Equipment manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, product type, application, and regions.
Key Companies & Market Share Insights
In this section, the readers will gain an understanding of the key players competing. This report has studied the key growth strategies, such as innovative trends and developments, intensification of product portfolio, mergers and acquisitions, collaborations, new product innovation, and geographical expansion, undertaken by these participants to maintain their presence. Apart from business strategies, the study includes current developments and key financials. The readers will also get access to the data related to global revenue, price, and sales by manufacturers for the period 2018-2023. This all-inclusive report will certainly serve the clients to stay updated and make effective decisions in their businesses. Some of the prominent players reviewed in the research report include:
- DISCO
- Tokyo Seimitsu
- GL Tech Co Ltd
- ASM
- Synova
- CETC Electronics Equipment Group Co., Ltd.
- Shenyang Heyan Technology Co., Ltd.
- Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd.
- Hi-TESI
- Tensun
Global markets are presented by Wafer Slicing Equipment type, along with growth forecasts through 2029. Estimates on production and value are based on the price in the supply chain at which the Wafer Slicing Equipment are procured by the manufacturers.
This report has studied every segment and provided the market size using historical data. They have also talked about the growth opportunities that the segment may pose in the future. This study bestows production and revenue data by type, and during the historical period (2018-2023) and forecast period (2024-2029).
Wafer Slicing Equipment segment by Type
- Blade Cutting Machine
- Laser Cutting Machine
This report has provided the market size (production and revenue data) by application, during the historical period (2018-2023) and forecast period (2024-2029).
This report also outlines the market trends of each segment and consumer behaviors impacting the Wafer Slicing Equipment market and what implications these may have on the industry's future. This report can help to understand the relevant market and consumer trends that are driving the Wafer Slicing Equipment market.
Wafer Slicing Equipment segment by Application
- Pure Foundry
- IDM
- OSAT
- LED
- Photovoltaic
This section of the report provides key insights regarding various regions and the key players operating in each region. Economic, social, environmental, technological, and political factors have been taken into consideration while assessing the growth of the particular region/country. The readers will also get their hands on the revenue and sales data of each region and country for the period 2018-2029.
The market has been segmented into various major geographies, including North America, Europe, Asia-Pacific, South America. Detailed analysis of major countries such as the USA, Germany, the U.K., Italy, France, China, Japan, South Korea, Southeast Asia, and India will be covered within the regional segment. For market estimates, data are going to be provided for 2022 because of the base year, with estimates for 2023 and forecast value for 2029.
- North America
- United States
- Canada
- Europe
- Germany
- France
- U.K.
- Italy
- Russia
- Asia-Pacific
- China
- Japan
- South Korea
- India
- Australia
- China Taiwan
- Indonesia
- Thailand
- Malaysia
- Latin America
- Mexico
- Brazil
- Argentina
High-impact rendering factors and drivers have been studied in this report to aid the readers to understand the general development. Moreover, the report includes restraints and challenges that may act as stumbling blocks on the way of the players. This will assist the users to be attentive and make informed decisions related to business. Specialists have also laid their focus on the upcoming business prospects.
COVID-19 and Russia-Ukraine War Influence Analysis
The readers in the section will understand how the Wafer Slicing Equipment market scenario changed across the globe during the pandemic, post-pandemic and Russia-Ukraine War. The study is done keeping in view the changes in aspects such as demand, consumption, transportation, consumer behavior, supply chain management, export and import, and production. The industry experts have also highlighted the key factors that will help create opportunities for players and stabilize the overall industry in the years to come.
Reasons to Buy This Report
This report will help the readers to understand the competition within the industries and strategies for the competitive environment to enhance the potential profit. The report also focuses on the competitive landscape of the global Wafer Slicing Equipment market, and introduces in detail the market share, industry ranking, competitor ecosystem, market performance, new product development, operation situation, expansion, and acquisition. etc. of the main players, which helps the readers to identify the main competitors and deeply understand the competition pattern of the market.
This report will help stakeholders to understand the global industry status and trends of Wafer Slicing Equipment and provides them with information on key market drivers, restraints, challenges, and opportunities.
This report will help stakeholders to understand competitors better and gain more insights to strengthen their position in their businesses. The competitive landscape section includes the market share and rank (in volume and value), competitor ecosystem, new product development, expansion, and acquisition.
This report stays updated with novel technology integration, features, and the latest developments in the market
This report helps stakeholders to understand the COVID-19 and Russia-Ukraine War Influence on the Wafer Slicing Equipment industry.
This report helps stakeholders to gain insights into which regions to target globally
This report helps stakeholders to gain insights into the end-user perception concerning the adoption of Wafer Slicing Equipment.
This report helps stakeholders to identify some of the key players in the market and understand their valuable contribution.
Core Chapters
Chapter 1: Research objectives, research methods, data sources, data cross-validation;
Chapter 2: Introduces the report scope of the report, executive summary of different market segments (by region, product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 3: Detailed analysis of Wafer Slicing Equipment manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 5: Production/output, value of Wafer Slicing Equipment by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 6: Consumption of Wafer Slicing Equipment in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 7: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 8: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 9: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 10: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 11: The main points and conclusions of the report.
1 PREFACE
1.1 Scope of Report
1.2 Reasons for Doing This Study
1.3 Research Methodology
1.4 Research Process
1.5 Data Source
1.5.1 Secondary Sources
1.5.2 Primary Sources
2 MARKET OVERVIEW
2.1 Product Definition
2.2 Wafer Slicing Equipment by Type
2.2.1 Market Value Comparison by Type (2018 VS 2022 VS 2029) & (US$ Million)
1.2.2 Blade Cutting Machine
1.2.3 Laser Cutting Machine
2.3 Wafer Slicing Equipment by Application
2.3.1 Market Value Comparison by Application (2018 VS 2022 VS 2029) & (US$ Million)
2.3.2 Pure Foundry
2.3.3 IDM
2.3.4 OSAT
2.3.5 LED
2.3.6 Photovoltaic
2.4 Global Market Growth Prospects
2.4.1 Global Wafer Slicing Equipment Production Value Estimates and Forecasts (2018-2029)
2.4.2 Global Wafer Slicing Equipment Production Capacity Estimates and Forecasts (2018-2029)
2.4.3 Global Wafer Slicing Equipment Production Estimates and Forecasts (2018-2029)
2.4.4 Global Wafer Slicing Equipment Market Average Price (2018-2029)
3 MARKET COMPETITIVE LANDSCAPE BY MANUFACTURERS
3.1 Global Wafer Slicing Equipment Production by Manufacturers (2018-2023)
3.2 Global Wafer Slicing Equipment Production Value by Manufacturers (2018-2023)
3.3 Global Wafer Slicing Equipment Average Price by Manufacturers (2018-2023)
3.4 Global Wafer Slicing Equipment Industry Manufacturers Ranking, 2021 VS 2022 VS 2023
3.5 Global Wafer Slicing Equipment Key Manufacturers, Manufacturing Sites & Headquarters
3.6 Global Wafer Slicing Equipment Manufacturers, Product Type & Application
3.7 Global Wafer Slicing Equipment Manufacturers, Date of Enter into This Industry
3.8 Global Wafer Slicing Equipment Market CR5 and HHI
3.9 Global Manufacturers Mergers & Acquisition
4 MANUFACTURERS PROFILED
4.1 DISCO
4.1.1 DISCO Wafer Slicing Equipment Company Information
4.1.2 DISCO Wafer Slicing Equipment Business Overview
4.1.3 DISCO Wafer Slicing Equipment Production, Value and Gross Margin (2018-2023)
4.1.4 DISCO Product Portfolio
4.1.5 DISCO Recent Developments
4.2 Tokyo Seimitsu
4.2.1 Tokyo Seimitsu Wafer Slicing Equipment Company Information
4.2.2 Tokyo Seimitsu Wafer Slicing Equipment Business Overview
4.2.3 Tokyo Seimitsu Wafer Slicing Equipment Production, Value and Gross Margin (2018-2023)
4.2.4 Tokyo Seimitsu Product Portfolio
4.2.5 Tokyo Seimitsu Recent Developments
4.3 GL Tech Co Ltd
4.3.1 GL Tech Co Ltd Wafer Slicing Equipment Company Information
4.3.2 GL Tech Co Ltd Wafer Slicing Equipment Business Overview
4.3.3 GL Tech Co Ltd Wafer Slicing Equipment Production, Value and Gross Margin (2018-2023)
4.3.4 GL Tech Co Ltd Product Portfolio
4.3.5 GL Tech Co Ltd Recent Developments
4.4 ASM
4.4.1 ASM Wafer Slicing Equipment Company Information
4.4.2 ASM Wafer Slicing Equipment Business Overview
4.4.3 ASM Wafer Slicing Equipment Production, Value and Gross Margin (2018-2023)
4.4.4 ASM Product Portfolio
4.4.5 ASM Recent Developments
4.5 Synova
4.5.1 Synova Wafer Slicing Equipment Company Information
4.5.2 Synova Wafer Slicing Equipment Business Overview
4.5.3 Synova Wafer Slicing Equipment Production, Value and Gross Margin (2018-2023)
4.5.4 Synova Product Portfolio
4.5.5 Synova Recent Developments
4.6 CETC Electronics Equipment Group Co., Ltd.
4.6.1 CETC Electronics Equipment Group Co., Ltd. Wafer Slicing Equipment Company Information
4.6.2 CETC Electronics Equipment Group Co., Ltd. Wafer Slicing Equipment Business Overview
4.6.3 CETC Electronics Equipment Group Co., Ltd. Wafer Slicing Equipment Production, Value and Gross Margin (2018-2023)
4.6.4 CETC Electronics Equipment Group Co., Ltd. Product Portfolio
4.6.5 CETC Electronics Equipment Group Co., Ltd. Recent Developments
4.7 Shenyang Heyan Technology Co., Ltd.
4.7.1 Shenyang Heyan Technology Co., Ltd. Wafer Slicing Equipment Company Information
4.7.2 Shenyang Heyan Technology Co., Ltd. Wafer Slicing Equipment Business Overview
4.7.3 Shenyang Heyan Technology Co., Ltd. Wafer Slicing Equipment Production, Value and Gross Margin (2018-2023)
4.7.4 Shenyang Heyan Technology Co., Ltd. Product Portfolio
4.7.5 Shenyang Heyan Technology Co., Ltd. Recent Developments
4.8 Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd.
4.8.1 Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Wafer Slicing Equipment Company Information
4.8.2 Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Wafer Slicing Equipment Business Overview
4.8.3 Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Wafer Slicing Equipment Production, Value and Gross Margin (2018-2023)
4.8.4 Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Product Portfolio
4.8.5 Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Recent Developments
4.9 Hi-TESI
4.9.1 Hi-TESI Wafer Slicing Equipment Company Information
4.9.2 Hi-TESI Wafer Slicing Equipment Business Overview
4.9.3 Hi-TESI Wafer Slicing Equipment Production, Value and Gross Margin (2018-2023)
4.9.4 Hi-TESI Product Portfolio
4.9.5 Hi-TESI Recent Developments
4.10 Tensun
4.10.1 Tensun Wafer Slicing Equipment Company Information
4.10.2 Tensun Wafer Slicing Equipment Business Overview
4.10.3 Tensun Wafer Slicing Equipment Production, Value and Gross Margin (2018-2023)
4.10.4 Tensun Product Portfolio
4.10.5 Tensun Recent Developments
5 GLOBAL WAFER SLICING EQUIPMENT PRODUCTION BY REGION
5.1 Global Wafer Slicing Equipment Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
5.2 Global Wafer Slicing Equipment Production by Region: 2018-2029
5.2.1 Global Wafer Slicing Equipment Production by Region: 2018-2023
5.2.2 Global Wafer Slicing Equipment Production Forecast by Region (2024-2029)
5.3 Global Wafer Slicing Equipment Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
5.4 Global Wafer Slicing Equipment Production Value by Region: 2018-2029
5.4.1 Global Wafer Slicing Equipment Production Value by Region: 2018-2023
5.4.2 Global Wafer Slicing Equipment Production Value Forecast by Region (2024-2029)
5.5 Global Wafer Slicing Equipment Market Price Analysis by Region (2018-2023)
5.6 Global Wafer Slicing Equipment Production and Value, YOY Growth
5.6.1 North America Wafer Slicing Equipment Production Value Estimates and Forecasts (2018-2029)
5.6.2 Europe Wafer Slicing Equipment Production Value Estimates and Forecasts (2018-2029)
5.6.3 China Wafer Slicing Equipment Production Value Estimates and Forecasts (2018-2029)
5.6.4 Japan Wafer Slicing Equipment Production Value Estimates and Forecasts (2018-2029)
5.6.5 South Korea Wafer Slicing Equipment Production Value Estimates and Forecasts (2018-2029)
6 GLOBAL WAFER SLICING EQUIPMENT CONSUMPTION BY REGION
6.1 Global Wafer Slicing Equipment Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
6.2 Global Wafer Slicing Equipment Consumption by Region (2018-2029)
6.2.1 Global Wafer Slicing Equipment Consumption by Region: 2018-2029
6.2.2 Global Wafer Slicing Equipment Forecasted Consumption by Region (2024-2029)
6.3 North America
6.3.1 North America Wafer Slicing Equipment Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
6.3.2 North America Wafer Slicing Equipment Consumption by Country (2018-2029)
6.3.3 United States
6.3.4 Canada
6.4 Europe
6.4.1 Europe Wafer Slicing Equipment Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
6.4.2 Europe Wafer Slicing Equipment Consumption by Country (2018-2029)
6.4.3 Germany
6.4.4 France
6.4.5 U.K.
6.4.6 Italy
6.4.7 Russia
6.5 Asia Pacific
6.5.1 Asia Pacific Wafer Slicing Equipment Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
6.5.2 Asia Pacific Wafer Slicing Equipment Consumption by Country (2018-2029)
6.5.3 China
6.5.4 Japan
6.5.5 South Korea
6.5.6 China Taiwan
6.5.7 Southeast Asia
6.5.8 India
6.5.9 Australia
6.6 Latin America, Middle East & Africa
6.6.1 Latin America, Middle East & Africa Wafer Slicing Equipment Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
6.6.2 Latin America, Middle East & Africa Wafer Slicing Equipment Consumption by Country (2018-2029)
6.6.3 Mexico
6.6.4 Brazil
6.6.5 Turkey
6.6.5 GCC Countries
7 SEGMENT BY TYPE
7.1 Global Wafer Slicing Equipment Production by Type (2018-2029)
7.1.1 Global Wafer Slicing Equipment Production by Type (2018-2029) & (Units)
7.1.2 Global Wafer Slicing Equipment Production Market Share by Type (2018-2029)
7.2 Global Wafer Slicing Equipment Production Value by Type (2018-2029)
7.2.1 Global Wafer Slicing Equipment Production Value by Type (2018-2029) & (US$ Million)
7.2.2 Global Wafer Slicing Equipment Production Value Market Share by Type (2018-2029)
7.3 Global Wafer Slicing Equipment Price by Type (2018-2029)
8 SEGMENT BY APPLICATION
8.1 Global Wafer Slicing Equipment Production by Application (2018-2029)
8.1.1 Global Wafer Slicing Equipment Production by Application (2018-2029) & (Units)
8.1.2 Global Wafer Slicing Equipment Production by Application (2018-2029) & (Units)
8.2 Global Wafer Slicing Equipment Production Value by Application (2018-2029)
8.2.1 Global Wafer Slicing Equipment Production Value by Application (2018-2029) & (US$ Million)
8.2.2 Global Wafer Slicing Equipment Production Value Market Share by Application (2018-2029)
8.3 Global Wafer Slicing Equipment Price by Application (2018-2029)
9 VALUE CHAIN AND SALES CHANNELS ANALYSIS OF THE MARKET
9.1 Wafer Slicing Equipment Value Chain Analysis
9.1.1 Wafer Slicing Equipment Key Raw Materials
9.1.2 Raw Materials Key Suppliers
9.1.3 Wafer Slicing Equipment Production Mode & Process
9.2 Wafer Slicing Equipment Sales Channels Analysis
9.2.1 Direct Comparison with Distribution Share
9.2.2 Wafer Slicing Equipment Distributors
9.2.3 Wafer Slicing Equipment Customers
10 GLOBAL WAFER SLICING EQUIPMENT ANALYZING MARKET DYNAMICS
10.1 Wafer Slicing Equipment Industry Trends
10.2 Wafer Slicing Equipment Industry Drivers
10.3 Wafer Slicing Equipment Industry Opportunities and Challenges
10.4 Wafer Slicing Equipment Industry Restraints
11 REPORT CONCLUSION
12 DISCLAIMER
1.1 Scope of Report
1.2 Reasons for Doing This Study
1.3 Research Methodology
1.4 Research Process
1.5 Data Source
1.5.1 Secondary Sources
1.5.2 Primary Sources
2 MARKET OVERVIEW
2.1 Product Definition
2.2 Wafer Slicing Equipment by Type
2.2.1 Market Value Comparison by Type (2018 VS 2022 VS 2029) & (US$ Million)
1.2.2 Blade Cutting Machine
1.2.3 Laser Cutting Machine
2.3 Wafer Slicing Equipment by Application
2.3.1 Market Value Comparison by Application (2018 VS 2022 VS 2029) & (US$ Million)
2.3.2 Pure Foundry
2.3.3 IDM
2.3.4 OSAT
2.3.5 LED
2.3.6 Photovoltaic
2.4 Global Market Growth Prospects
2.4.1 Global Wafer Slicing Equipment Production Value Estimates and Forecasts (2018-2029)
2.4.2 Global Wafer Slicing Equipment Production Capacity Estimates and Forecasts (2018-2029)
2.4.3 Global Wafer Slicing Equipment Production Estimates and Forecasts (2018-2029)
2.4.4 Global Wafer Slicing Equipment Market Average Price (2018-2029)
3 MARKET COMPETITIVE LANDSCAPE BY MANUFACTURERS
3.1 Global Wafer Slicing Equipment Production by Manufacturers (2018-2023)
3.2 Global Wafer Slicing Equipment Production Value by Manufacturers (2018-2023)
3.3 Global Wafer Slicing Equipment Average Price by Manufacturers (2018-2023)
3.4 Global Wafer Slicing Equipment Industry Manufacturers Ranking, 2021 VS 2022 VS 2023
3.5 Global Wafer Slicing Equipment Key Manufacturers, Manufacturing Sites & Headquarters
3.6 Global Wafer Slicing Equipment Manufacturers, Product Type & Application
3.7 Global Wafer Slicing Equipment Manufacturers, Date of Enter into This Industry
3.8 Global Wafer Slicing Equipment Market CR5 and HHI
3.9 Global Manufacturers Mergers & Acquisition
4 MANUFACTURERS PROFILED
4.1 DISCO
4.1.1 DISCO Wafer Slicing Equipment Company Information
4.1.2 DISCO Wafer Slicing Equipment Business Overview
4.1.3 DISCO Wafer Slicing Equipment Production, Value and Gross Margin (2018-2023)
4.1.4 DISCO Product Portfolio
4.1.5 DISCO Recent Developments
4.2 Tokyo Seimitsu
4.2.1 Tokyo Seimitsu Wafer Slicing Equipment Company Information
4.2.2 Tokyo Seimitsu Wafer Slicing Equipment Business Overview
4.2.3 Tokyo Seimitsu Wafer Slicing Equipment Production, Value and Gross Margin (2018-2023)
4.2.4 Tokyo Seimitsu Product Portfolio
4.2.5 Tokyo Seimitsu Recent Developments
4.3 GL Tech Co Ltd
4.3.1 GL Tech Co Ltd Wafer Slicing Equipment Company Information
4.3.2 GL Tech Co Ltd Wafer Slicing Equipment Business Overview
4.3.3 GL Tech Co Ltd Wafer Slicing Equipment Production, Value and Gross Margin (2018-2023)
4.3.4 GL Tech Co Ltd Product Portfolio
4.3.5 GL Tech Co Ltd Recent Developments
4.4 ASM
4.4.1 ASM Wafer Slicing Equipment Company Information
4.4.2 ASM Wafer Slicing Equipment Business Overview
4.4.3 ASM Wafer Slicing Equipment Production, Value and Gross Margin (2018-2023)
4.4.4 ASM Product Portfolio
4.4.5 ASM Recent Developments
4.5 Synova
4.5.1 Synova Wafer Slicing Equipment Company Information
4.5.2 Synova Wafer Slicing Equipment Business Overview
4.5.3 Synova Wafer Slicing Equipment Production, Value and Gross Margin (2018-2023)
4.5.4 Synova Product Portfolio
4.5.5 Synova Recent Developments
4.6 CETC Electronics Equipment Group Co., Ltd.
4.6.1 CETC Electronics Equipment Group Co., Ltd. Wafer Slicing Equipment Company Information
4.6.2 CETC Electronics Equipment Group Co., Ltd. Wafer Slicing Equipment Business Overview
4.6.3 CETC Electronics Equipment Group Co., Ltd. Wafer Slicing Equipment Production, Value and Gross Margin (2018-2023)
4.6.4 CETC Electronics Equipment Group Co., Ltd. Product Portfolio
4.6.5 CETC Electronics Equipment Group Co., Ltd. Recent Developments
4.7 Shenyang Heyan Technology Co., Ltd.
4.7.1 Shenyang Heyan Technology Co., Ltd. Wafer Slicing Equipment Company Information
4.7.2 Shenyang Heyan Technology Co., Ltd. Wafer Slicing Equipment Business Overview
4.7.3 Shenyang Heyan Technology Co., Ltd. Wafer Slicing Equipment Production, Value and Gross Margin (2018-2023)
4.7.4 Shenyang Heyan Technology Co., Ltd. Product Portfolio
4.7.5 Shenyang Heyan Technology Co., Ltd. Recent Developments
4.8 Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd.
4.8.1 Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Wafer Slicing Equipment Company Information
4.8.2 Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Wafer Slicing Equipment Business Overview
4.8.3 Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Wafer Slicing Equipment Production, Value and Gross Margin (2018-2023)
4.8.4 Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Product Portfolio
4.8.5 Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Recent Developments
4.9 Hi-TESI
4.9.1 Hi-TESI Wafer Slicing Equipment Company Information
4.9.2 Hi-TESI Wafer Slicing Equipment Business Overview
4.9.3 Hi-TESI Wafer Slicing Equipment Production, Value and Gross Margin (2018-2023)
4.9.4 Hi-TESI Product Portfolio
4.9.5 Hi-TESI Recent Developments
4.10 Tensun
4.10.1 Tensun Wafer Slicing Equipment Company Information
4.10.2 Tensun Wafer Slicing Equipment Business Overview
4.10.3 Tensun Wafer Slicing Equipment Production, Value and Gross Margin (2018-2023)
4.10.4 Tensun Product Portfolio
4.10.5 Tensun Recent Developments
5 GLOBAL WAFER SLICING EQUIPMENT PRODUCTION BY REGION
5.1 Global Wafer Slicing Equipment Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
5.2 Global Wafer Slicing Equipment Production by Region: 2018-2029
5.2.1 Global Wafer Slicing Equipment Production by Region: 2018-2023
5.2.2 Global Wafer Slicing Equipment Production Forecast by Region (2024-2029)
5.3 Global Wafer Slicing Equipment Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
5.4 Global Wafer Slicing Equipment Production Value by Region: 2018-2029
5.4.1 Global Wafer Slicing Equipment Production Value by Region: 2018-2023
5.4.2 Global Wafer Slicing Equipment Production Value Forecast by Region (2024-2029)
5.5 Global Wafer Slicing Equipment Market Price Analysis by Region (2018-2023)
5.6 Global Wafer Slicing Equipment Production and Value, YOY Growth
5.6.1 North America Wafer Slicing Equipment Production Value Estimates and Forecasts (2018-2029)
5.6.2 Europe Wafer Slicing Equipment Production Value Estimates and Forecasts (2018-2029)
5.6.3 China Wafer Slicing Equipment Production Value Estimates and Forecasts (2018-2029)
5.6.4 Japan Wafer Slicing Equipment Production Value Estimates and Forecasts (2018-2029)
5.6.5 South Korea Wafer Slicing Equipment Production Value Estimates and Forecasts (2018-2029)
6 GLOBAL WAFER SLICING EQUIPMENT CONSUMPTION BY REGION
6.1 Global Wafer Slicing Equipment Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
6.2 Global Wafer Slicing Equipment Consumption by Region (2018-2029)
6.2.1 Global Wafer Slicing Equipment Consumption by Region: 2018-2029
6.2.2 Global Wafer Slicing Equipment Forecasted Consumption by Region (2024-2029)
6.3 North America
6.3.1 North America Wafer Slicing Equipment Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
6.3.2 North America Wafer Slicing Equipment Consumption by Country (2018-2029)
6.3.3 United States
6.3.4 Canada
6.4 Europe
6.4.1 Europe Wafer Slicing Equipment Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
6.4.2 Europe Wafer Slicing Equipment Consumption by Country (2018-2029)
6.4.3 Germany
6.4.4 France
6.4.5 U.K.
6.4.6 Italy
6.4.7 Russia
6.5 Asia Pacific
6.5.1 Asia Pacific Wafer Slicing Equipment Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
6.5.2 Asia Pacific Wafer Slicing Equipment Consumption by Country (2018-2029)
6.5.3 China
6.5.4 Japan
6.5.5 South Korea
6.5.6 China Taiwan
6.5.7 Southeast Asia
6.5.8 India
6.5.9 Australia
6.6 Latin America, Middle East & Africa
6.6.1 Latin America, Middle East & Africa Wafer Slicing Equipment Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
6.6.2 Latin America, Middle East & Africa Wafer Slicing Equipment Consumption by Country (2018-2029)
6.6.3 Mexico
6.6.4 Brazil
6.6.5 Turkey
6.6.5 GCC Countries
7 SEGMENT BY TYPE
7.1 Global Wafer Slicing Equipment Production by Type (2018-2029)
7.1.1 Global Wafer Slicing Equipment Production by Type (2018-2029) & (Units)
7.1.2 Global Wafer Slicing Equipment Production Market Share by Type (2018-2029)
7.2 Global Wafer Slicing Equipment Production Value by Type (2018-2029)
7.2.1 Global Wafer Slicing Equipment Production Value by Type (2018-2029) & (US$ Million)
7.2.2 Global Wafer Slicing Equipment Production Value Market Share by Type (2018-2029)
7.3 Global Wafer Slicing Equipment Price by Type (2018-2029)
8 SEGMENT BY APPLICATION
8.1 Global Wafer Slicing Equipment Production by Application (2018-2029)
8.1.1 Global Wafer Slicing Equipment Production by Application (2018-2029) & (Units)
8.1.2 Global Wafer Slicing Equipment Production by Application (2018-2029) & (Units)
8.2 Global Wafer Slicing Equipment Production Value by Application (2018-2029)
8.2.1 Global Wafer Slicing Equipment Production Value by Application (2018-2029) & (US$ Million)
8.2.2 Global Wafer Slicing Equipment Production Value Market Share by Application (2018-2029)
8.3 Global Wafer Slicing Equipment Price by Application (2018-2029)
9 VALUE CHAIN AND SALES CHANNELS ANALYSIS OF THE MARKET
9.1 Wafer Slicing Equipment Value Chain Analysis
9.1.1 Wafer Slicing Equipment Key Raw Materials
9.1.2 Raw Materials Key Suppliers
9.1.3 Wafer Slicing Equipment Production Mode & Process
9.2 Wafer Slicing Equipment Sales Channels Analysis
9.2.1 Direct Comparison with Distribution Share
9.2.2 Wafer Slicing Equipment Distributors
9.2.3 Wafer Slicing Equipment Customers
10 GLOBAL WAFER SLICING EQUIPMENT ANALYZING MARKET DYNAMICS
10.1 Wafer Slicing Equipment Industry Trends
10.2 Wafer Slicing Equipment Industry Drivers
10.3 Wafer Slicing Equipment Industry Opportunities and Challenges
10.4 Wafer Slicing Equipment Industry Restraints
11 REPORT CONCLUSION
12 DISCLAIMER
LIST OF TABLES
Table 1. Secondary Sources
Table 2. Primary Sources
Table 3. Market Value Comparison by Type (2018 VS 2022 VS 2029) & (US$ Million)
Table 4. Market Value Comparison by Application (2018 VS 2022 VS 2029) & (US$ Million)
Table 5. Global Wafer Slicing Equipment Production by Manufacturers (Units) & (2018-2023)
Table 6. Global Wafer Slicing Equipment Production Market Share by Manufacturers
Table 7. Global Wafer Slicing Equipment Production Value by Manufacturers (US$ Million) & (2018-2023)
Table 8. Global Wafer Slicing Equipment Production Value Market Share by Manufacturers (2018-2023)
Table 9. Global Wafer Slicing Equipment Average Price (US$/Unit) of Key Manufacturers (2018-2023)
Table 10. Global Wafer Slicing Equipment Industry Manufacturers Ranking, 2021 VS 2022 VS 2023
Table 11. Global Wafer Slicing Equipment Manufacturers, Product Type & Application
Table 12. Global Manufacturers Market Concentration Ratio (CR5 and HHI)
Table 13. Global Wafer Slicing Equipment by Manufacturers Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value of 2022)
Table 14. Manufacturers Mergers & Acquisitions, Expansion Plans)
Table 15. DISCO Wafer Slicing Equipment Company Information
Table 16. DISCO Business Overview
Table 17. DISCO Wafer Slicing Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 18. DISCO Product Portfolio
Table 19. DISCO Recent Developments
Table 20. Tokyo Seimitsu Wafer Slicing Equipment Company Information
Table 21. Tokyo Seimitsu Business Overview
Table 22. Tokyo Seimitsu Wafer Slicing Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 23. Tokyo Seimitsu Product Portfolio
Table 24. Tokyo Seimitsu Recent Developments
Table 25. GL Tech Co Ltd Wafer Slicing Equipment Company Information
Table 26. GL Tech Co Ltd Business Overview
Table 27. GL Tech Co Ltd Wafer Slicing Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 28. GL Tech Co Ltd Product Portfolio
Table 29. GL Tech Co Ltd Recent Developments
Table 30. ASM Wafer Slicing Equipment Company Information
Table 31. ASM Business Overview
Table 32. ASM Wafer Slicing Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 33. ASM Product Portfolio
Table 34. ASM Recent Developments
Table 35. Synova Wafer Slicing Equipment Company Information
Table 36. Synova Business Overview
Table 37. Synova Wafer Slicing Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 38. Synova Product Portfolio
Table 39. Synova Recent Developments
Table 40. CETC Electronics Equipment Group Co., Ltd. Wafer Slicing Equipment Company Information
Table 41. CETC Electronics Equipment Group Co., Ltd. Business Overview
Table 42. CETC Electronics Equipment Group Co., Ltd. Wafer Slicing Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 43. CETC Electronics Equipment Group Co., Ltd. Product Portfolio
Table 44. CETC Electronics Equipment Group Co., Ltd. Recent Developments
Table 45. Shenyang Heyan Technology Co., Ltd. Wafer Slicing Equipment Company Information
Table 46. Shenyang Heyan Technology Co., Ltd. Business Overview
Table 47. Shenyang Heyan Technology Co., Ltd. Wafer Slicing Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 48. Shenyang Heyan Technology Co., Ltd. Product Portfolio
Table 49. Shenyang Heyan Technology Co., Ltd. Recent Developments
Table 50. Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Wafer Slicing Equipment Company Information
Table 51. Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Business Overview
Table 52. Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Wafer Slicing Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 53. Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Product Portfolio
Table 54. Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Recent Developments
Table 55. Hi-TESI Wafer Slicing Equipment Company Information
Table 56. Hi-TESI Business Overview
Table 57. Hi-TESI Wafer Slicing Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 58. Hi-TESI Product Portfolio
Table 59. Hi-TESI Recent Developments
Table 60. Tensun Wafer Slicing Equipment Company Information
Table 61. Tensun Business Overview
Table 62. Tensun Wafer Slicing Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 63. Tensun Product Portfolio
Table 64. Tensun Recent Developments
Table 65. Global Wafer Slicing Equipment Production Comparison by Region: 2018 VS 2022 VS 2029 (Units)
Table 66. Global Wafer Slicing Equipment Production by Region (2018-2023) & (Units)
Table 67. Global Wafer Slicing Equipment Production Market Share by Region (2018-2023)
Table 68. Global Wafer Slicing Equipment Production Forecast by Region (2024-2029) & (Units)
Table 69. Global Wafer Slicing Equipment Production Market Share Forecast by Region (2024-2029)
Table 70. Global Wafer Slicing Equipment Production Value Comparison by Region: 2018 VS 2022 VS 2029 (US$ Million)
Table 71. Global Wafer Slicing Equipment Production Value by Region (2018-2023) & (US$ Million)
Table 72. Global Wafer Slicing Equipment Production Value Market Share by Region (2018-2023)
Table 73. Global Wafer Slicing Equipment Production Value Forecast by Region (2024-2029) & (US$ Million)
Table 74. Global Wafer Slicing Equipment Production Value Market Share Forecast by Region (2024-2029)
Table 75. Global Wafer Slicing Equipment Market Average Price (US$/Unit) by Region (2018-2023)
Table 76. Global Wafer Slicing Equipment Consumption Comparison by Region: 2018 VS 2022 VS 2029 (Units)
Table 77. Global Wafer Slicing Equipment Consumption by Region (2018-2023) & (Units)
Table 78. Global Wafer Slicing Equipment Consumption Market Share by Region (2018-2023)
Table 79. Global Wafer Slicing Equipment Forecasted Consumption by Region (2024-2029) & (Units)
Table 80. Global Wafer Slicing Equipment Forecasted Consumption Market Share by Region (2024-2029)
Table 81. North America Wafer Slicing Equipment Consumption Growth Rate by Country: 2018 VS 2022 VS 2029 (Units)
Table 82. North America Wafer Slicing Equipment Consumption by Country (2018-2023) & (Units)
Table 83. North America Wafer Slicing Equipment Consumption by Country (2024-2029) & (Units)
Table 84. Europe Wafer Slicing Equipment Consumption Growth Rate by Country: 2018 VS 2022 VS 2029 (Units)
Table 85. Europe Wafer Slicing Equipment Consumption by Country (2018-2023) & (Units)
Table 86. Europe Wafer Slicing Equipment Consumption by Country (2024-2029) & (Units)
Table 87. Asia Pacific Wafer Slicing Equipment Consumption Growth Rate by Country: 2018 VS 2022 VS 2029 (Units)
Table 88. Asia Pacific Wafer Slicing Equipment Consumption by Country (2018-2023) & (Units)
Table 89. Asia Pacific Wafer Slicing Equipment Consumption by Country (2024-2029) & (Units)
Table 90. Latin America, Middle East & Africa Wafer Slicing Equipment Consumption Growth Rate by Country: 2018 VS 2022 VS 2029 (Units)
Table 91. Latin America, Middle East & Africa Wafer Slicing Equipment Consumption by Country (2018-2023) & (Units)
Table 92. Latin America, Middle East & Africa Wafer Slicing Equipment Consumption by Country (2024-2029) & (Units)
Table 93. Global Wafer Slicing Equipment Production by Type (2018-2023) & (Units)
Table 94. Global Wafer Slicing Equipment Production by Type (2024-2029) & (Units)
Table 95. Global Wafer Slicing Equipment Production Market Share by Type (2018-2023)
Table 96. Global Wafer Slicing Equipment Production Market Share by Type (2024-2029)
Table 97. Global Wafer Slicing Equipment Production Value by Type (2018-2023) & (US$ Million)
Table 98. Global Wafer Slicing Equipment Production Value by Type (2024-2029) & (US$ Million)
Table 99. Global Wafer Slicing Equipment Production Value Market Share by Type (2018-2023)
Table 100. Global Wafer Slicing Equipment Production Value Market Share by Type (2024-2029)
Table 101. Global Wafer Slicing Equipment Price by Type (2018-2023) & (US$/Unit)
Table 102. Global Wafer Slicing Equipment Price by Type (2024-2029) & (US$/Unit)
Table 103. Global Wafer Slicing Equipment Production by Application (2018-2023) & (Units)
Table 104. Global Wafer Slicing Equipment Production by Application (2024-2029) & (Units)
Table 105. Global Wafer Slicing Equipment Production Market Share by Application (2018-2023)
Table 106. Global Wafer Slicing Equipment Production Market Share by Application (2024-2029)
Table 107. Global Wafer Slicing Equipment Production Value by Application (2018-2023) & (US$ Million)
Table 108. Global Wafer Slicing Equipment Production Value by Application (2024-2029) & (US$ Million)
Table 109. Global Wafer Slicing Equipment Production Value Market Share by Application (2018-2023)
Table 110. Global Wafer Slicing Equipment Production Value Market Share by Application (2024-2029)
Table 111. Global Wafer Slicing Equipment Price by Application (2018-2023) & (US$/Unit)
Table 112. Global Wafer Slicing Equipment Price by Application (2024-2029) & (US$/Unit)
Table 113. Key Raw Materials
Table 114. Raw Materials Key Suppliers
Table 115. Wafer Slicing Equipment Distributors List
Table 116. Wafer Slicing Equipment Customers List
Table 117. Wafer Slicing Equipment Industry Trends
Table 118. Wafer Slicing Equipment Industry Drivers
Table 119. Wafer Slicing Equipment Industry Restraints
Table 120. Authors List of This Report
Table 1. Secondary Sources
Table 2. Primary Sources
Table 3. Market Value Comparison by Type (2018 VS 2022 VS 2029) & (US$ Million)
Table 4. Market Value Comparison by Application (2018 VS 2022 VS 2029) & (US$ Million)
Table 5. Global Wafer Slicing Equipment Production by Manufacturers (Units) & (2018-2023)
Table 6. Global Wafer Slicing Equipment Production Market Share by Manufacturers
Table 7. Global Wafer Slicing Equipment Production Value by Manufacturers (US$ Million) & (2018-2023)
Table 8. Global Wafer Slicing Equipment Production Value Market Share by Manufacturers (2018-2023)
Table 9. Global Wafer Slicing Equipment Average Price (US$/Unit) of Key Manufacturers (2018-2023)
Table 10. Global Wafer Slicing Equipment Industry Manufacturers Ranking, 2021 VS 2022 VS 2023
Table 11. Global Wafer Slicing Equipment Manufacturers, Product Type & Application
Table 12. Global Manufacturers Market Concentration Ratio (CR5 and HHI)
Table 13. Global Wafer Slicing Equipment by Manufacturers Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value of 2022)
Table 14. Manufacturers Mergers & Acquisitions, Expansion Plans)
Table 15. DISCO Wafer Slicing Equipment Company Information
Table 16. DISCO Business Overview
Table 17. DISCO Wafer Slicing Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 18. DISCO Product Portfolio
Table 19. DISCO Recent Developments
Table 20. Tokyo Seimitsu Wafer Slicing Equipment Company Information
Table 21. Tokyo Seimitsu Business Overview
Table 22. Tokyo Seimitsu Wafer Slicing Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 23. Tokyo Seimitsu Product Portfolio
Table 24. Tokyo Seimitsu Recent Developments
Table 25. GL Tech Co Ltd Wafer Slicing Equipment Company Information
Table 26. GL Tech Co Ltd Business Overview
Table 27. GL Tech Co Ltd Wafer Slicing Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 28. GL Tech Co Ltd Product Portfolio
Table 29. GL Tech Co Ltd Recent Developments
Table 30. ASM Wafer Slicing Equipment Company Information
Table 31. ASM Business Overview
Table 32. ASM Wafer Slicing Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 33. ASM Product Portfolio
Table 34. ASM Recent Developments
Table 35. Synova Wafer Slicing Equipment Company Information
Table 36. Synova Business Overview
Table 37. Synova Wafer Slicing Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 38. Synova Product Portfolio
Table 39. Synova Recent Developments
Table 40. CETC Electronics Equipment Group Co., Ltd. Wafer Slicing Equipment Company Information
Table 41. CETC Electronics Equipment Group Co., Ltd. Business Overview
Table 42. CETC Electronics Equipment Group Co., Ltd. Wafer Slicing Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 43. CETC Electronics Equipment Group Co., Ltd. Product Portfolio
Table 44. CETC Electronics Equipment Group Co., Ltd. Recent Developments
Table 45. Shenyang Heyan Technology Co., Ltd. Wafer Slicing Equipment Company Information
Table 46. Shenyang Heyan Technology Co., Ltd. Business Overview
Table 47. Shenyang Heyan Technology Co., Ltd. Wafer Slicing Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 48. Shenyang Heyan Technology Co., Ltd. Product Portfolio
Table 49. Shenyang Heyan Technology Co., Ltd. Recent Developments
Table 50. Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Wafer Slicing Equipment Company Information
Table 51. Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Business Overview
Table 52. Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Wafer Slicing Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 53. Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Product Portfolio
Table 54. Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Recent Developments
Table 55. Hi-TESI Wafer Slicing Equipment Company Information
Table 56. Hi-TESI Business Overview
Table 57. Hi-TESI Wafer Slicing Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 58. Hi-TESI Product Portfolio
Table 59. Hi-TESI Recent Developments
Table 60. Tensun Wafer Slicing Equipment Company Information
Table 61. Tensun Business Overview
Table 62. Tensun Wafer Slicing Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 63. Tensun Product Portfolio
Table 64. Tensun Recent Developments
Table 65. Global Wafer Slicing Equipment Production Comparison by Region: 2018 VS 2022 VS 2029 (Units)
Table 66. Global Wafer Slicing Equipment Production by Region (2018-2023) & (Units)
Table 67. Global Wafer Slicing Equipment Production Market Share by Region (2018-2023)
Table 68. Global Wafer Slicing Equipment Production Forecast by Region (2024-2029) & (Units)
Table 69. Global Wafer Slicing Equipment Production Market Share Forecast by Region (2024-2029)
Table 70. Global Wafer Slicing Equipment Production Value Comparison by Region: 2018 VS 2022 VS 2029 (US$ Million)
Table 71. Global Wafer Slicing Equipment Production Value by Region (2018-2023) & (US$ Million)
Table 72. Global Wafer Slicing Equipment Production Value Market Share by Region (2018-2023)
Table 73. Global Wafer Slicing Equipment Production Value Forecast by Region (2024-2029) & (US$ Million)
Table 74. Global Wafer Slicing Equipment Production Value Market Share Forecast by Region (2024-2029)
Table 75. Global Wafer Slicing Equipment Market Average Price (US$/Unit) by Region (2018-2023)
Table 76. Global Wafer Slicing Equipment Consumption Comparison by Region: 2018 VS 2022 VS 2029 (Units)
Table 77. Global Wafer Slicing Equipment Consumption by Region (2018-2023) & (Units)
Table 78. Global Wafer Slicing Equipment Consumption Market Share by Region (2018-2023)
Table 79. Global Wafer Slicing Equipment Forecasted Consumption by Region (2024-2029) & (Units)
Table 80. Global Wafer Slicing Equipment Forecasted Consumption Market Share by Region (2024-2029)
Table 81. North America Wafer Slicing Equipment Consumption Growth Rate by Country: 2018 VS 2022 VS 2029 (Units)
Table 82. North America Wafer Slicing Equipment Consumption by Country (2018-2023) & (Units)
Table 83. North America Wafer Slicing Equipment Consumption by Country (2024-2029) & (Units)
Table 84. Europe Wafer Slicing Equipment Consumption Growth Rate by Country: 2018 VS 2022 VS 2029 (Units)
Table 85. Europe Wafer Slicing Equipment Consumption by Country (2018-2023) & (Units)
Table 86. Europe Wafer Slicing Equipment Consumption by Country (2024-2029) & (Units)
Table 87. Asia Pacific Wafer Slicing Equipment Consumption Growth Rate by Country: 2018 VS 2022 VS 2029 (Units)
Table 88. Asia Pacific Wafer Slicing Equipment Consumption by Country (2018-2023) & (Units)
Table 89. Asia Pacific Wafer Slicing Equipment Consumption by Country (2024-2029) & (Units)
Table 90. Latin America, Middle East & Africa Wafer Slicing Equipment Consumption Growth Rate by Country: 2018 VS 2022 VS 2029 (Units)
Table 91. Latin America, Middle East & Africa Wafer Slicing Equipment Consumption by Country (2018-2023) & (Units)
Table 92. Latin America, Middle East & Africa Wafer Slicing Equipment Consumption by Country (2024-2029) & (Units)
Table 93. Global Wafer Slicing Equipment Production by Type (2018-2023) & (Units)
Table 94. Global Wafer Slicing Equipment Production by Type (2024-2029) & (Units)
Table 95. Global Wafer Slicing Equipment Production Market Share by Type (2018-2023)
Table 96. Global Wafer Slicing Equipment Production Market Share by Type (2024-2029)
Table 97. Global Wafer Slicing Equipment Production Value by Type (2018-2023) & (US$ Million)
Table 98. Global Wafer Slicing Equipment Production Value by Type (2024-2029) & (US$ Million)
Table 99. Global Wafer Slicing Equipment Production Value Market Share by Type (2018-2023)
Table 100. Global Wafer Slicing Equipment Production Value Market Share by Type (2024-2029)
Table 101. Global Wafer Slicing Equipment Price by Type (2018-2023) & (US$/Unit)
Table 102. Global Wafer Slicing Equipment Price by Type (2024-2029) & (US$/Unit)
Table 103. Global Wafer Slicing Equipment Production by Application (2018-2023) & (Units)
Table 104. Global Wafer Slicing Equipment Production by Application (2024-2029) & (Units)
Table 105. Global Wafer Slicing Equipment Production Market Share by Application (2018-2023)
Table 106. Global Wafer Slicing Equipment Production Market Share by Application (2024-2029)
Table 107. Global Wafer Slicing Equipment Production Value by Application (2018-2023) & (US$ Million)
Table 108. Global Wafer Slicing Equipment Production Value by Application (2024-2029) & (US$ Million)
Table 109. Global Wafer Slicing Equipment Production Value Market Share by Application (2018-2023)
Table 110. Global Wafer Slicing Equipment Production Value Market Share by Application (2024-2029)
Table 111. Global Wafer Slicing Equipment Price by Application (2018-2023) & (US$/Unit)
Table 112. Global Wafer Slicing Equipment Price by Application (2024-2029) & (US$/Unit)
Table 113. Key Raw Materials
Table 114. Raw Materials Key Suppliers
Table 115. Wafer Slicing Equipment Distributors List
Table 116. Wafer Slicing Equipment Customers List
Table 117. Wafer Slicing Equipment Industry Trends
Table 118. Wafer Slicing Equipment Industry Drivers
Table 119. Wafer Slicing Equipment Industry Restraints
Table 120. Authors List of This Report
LIST OF FIGURES
Figure 1. Research Methodology
Figure 2. Research Process
Figure 3. Key Executives Interviewed
Figure 4. Wafer Slicing EquipmentProduct Picture
Figure 5. Market Value Comparison by Type (2018 VS 2022 VS 2029) & (US$ Million)
Figure 6. Blade Cutting Machine Product Picture
Figure 7. Laser Cutting Machine Product Picture
Figure 8. Pure Foundry Product Picture
Figure 9. IDM Product Picture
Figure 10. OSAT Product Picture
Figure 11. LED Product Picture
Figure 12. Photovoltaic Product Picture
Figure . Global Wafer Slicing Equipment Production Value (US$ Million), 2018 VS 2022 VS 2029
Figure 1. Global Wafer Slicing Equipment Production Value (2018-2029) & (US$ Million)
Figure 2. Global Wafer Slicing Equipment Production Capacity (2018-2029) & (Units)
Figure 3. Global Wafer Slicing Equipment Production (2018-2029) & (Units)
Figure 4. Global Wafer Slicing Equipment Average Price (US$/Unit) & (2018-2029)
Figure 5. Global Wafer Slicing Equipment Key Manufacturers, Manufacturing Sites & Headquarters
Figure 6. Global Wafer Slicing Equipment Manufacturers, Date of Enter into This Industry
Figure 7. Global Top 5 and 10 Wafer Slicing Equipment Players Market Share by Production Valu in 2022
Figure 8. Manufacturers Type (Tier 1, Tier 2, and Tier 3): 2018 VS 2022
Figure 9. Global Wafer Slicing Equipment Production Comparison by Region: 2018 VS 2022 VS 2029 (Units)
Figure 10. Global Wafer Slicing Equipment Production Market Share by Region: 2018 VS 2022 VS 2029
Figure 11. Global Wafer Slicing Equipment Production Value Comparison by Region: 2018 VS 2022 VS 2029 (US$ Million)
Figure 12. Global Wafer Slicing Equipment Production Value Market Share by Region: 2018 VS 2022 VS 2029
Figure 13. North America Wafer Slicing Equipment Production Value (US$ Million) Growth Rate (2018-2029)
Figure 14. Europe Wafer Slicing Equipment Production Value (US$ Million) Growth Rate (2018-2029)
Figure 15. China Wafer Slicing Equipment Production Value (US$ Million) Growth Rate (2018-2029)
Figure 16. Japan Wafer Slicing Equipment Production Value (US$ Million) Growth Rate (2018-2029)
Figure 17. South Korea Wafer Slicing Equipment Production Value (US$ Million) Growth Rate (2018-2029)
Figure 18. Global Wafer Slicing Equipment Consumption Comparison by Region: 2018 VS 2022 VS 2029 (Units)
Figure 19. Global Wafer Slicing Equipment Consumption Market Share by Region: 2018 VS 2022 VS 2029
Figure 20. North America Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 21. North America Wafer Slicing Equipment Consumption Market Share by Country (2018-2029)
Figure 22. United States Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 23. Canada Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 24. Europe Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 25. Europe Wafer Slicing Equipment Consumption Market Share by Country (2018-2029)
Figure 26. Germany Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 27. France Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 28. U.K. Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 29. Italy Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 30. Netherlands Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 31. Asia Pacific Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 32. Asia Pacific Wafer Slicing Equipment Consumption Market Share by Country (2018-2029)
Figure 33. China Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 34. Japan Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 35. South Korea Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 36. China Taiwan Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 37. Southeast Asia Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 38. India Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 39. Australia Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 40. Latin America, Middle East & Africa Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 41. Latin America, Middle East & Africa Wafer Slicing Equipment Consumption Market Share by Country (2018-2029)
Figure 42. Mexico Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 43. Brazil Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 44. Turkey Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 45. GCC Countries Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 46. Global Wafer Slicing Equipment Production Market Share by Type (2018-2029)
Figure 47. Global Wafer Slicing Equipment Production Value Market Share by Type (2018-2029)
Figure 48. Global Wafer Slicing Equipment Price (US$/Unit) by Type (2018-2029)
Figure 49. Global Wafer Slicing Equipment Production Market Share by Application (2018-2029)
Figure 50. Global Wafer Slicing Equipment Production Value Market Share by Application (2018-2029)
Figure 51. Global Wafer Slicing Equipment Price (US$/Unit) by Application (2018-2029)
Figure 52. Wafer Slicing Equipment Value Chain
Figure 53. Wafer Slicing Equipment Production Mode & Process
Figure 54. Direct Comparison with Distribution Share
Figure 55. Distributors Profiles
Figure 56. Wafer Slicing Equipment Industry Opportunities and Challenges
Highlights
The global Wafer Slicing Equipment market is projected to reach US$ million by 2028 from an estimated US$ million in 2022, at a CAGR of % during 2024 and 2029.
North American market for Wafer Slicing Equipment is estimated to increase from $ million in 2022 to reach $ million by 2028, at a CAGR of % during the forecast period of 2023 through 2028.
Asia-Pacific market for Wafer Slicing Equipment is estimated to increase from $ million in 2022 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The major global companies of Wafer Slicing Equipment include DISCO, Tokyo Seimitsu, GL Tech Co Ltd, ASM, Synova, CETC Electronics Equipment Group Co., Ltd., Shenyang Heyan Technology Co., Ltd., Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. and Hi-TESI, etc. In 2022, the world's top three vendors accounted for approximately % of the revenue.
The global market for Wafer Slicing Equipment in Pure Foundry is estimated to increase from $ million in 2023 to $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Considering the economic change due to COVID-19 and Russia-Ukraine War Influence, Blade Cutting Machine, which accounted for % of the global market of Wafer Slicing Equipment in 2022, is expected to reach million US$ by 2029, growing at a revised CAGR of % from 2023 to 2029.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Wafer Slicing Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Slicing Equipment.
The Wafer Slicing Equipment market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Wafer Slicing Equipment market comprehensively. Regional market sizes, concerning products by types, by application, and by players, are also provided. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Wafer Slicing Equipment manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, product type, application, and regions.
Key Companies & Market Share Insights
In this section, the readers will gain an understanding of the key players competing. This report has studied the key growth strategies, such as innovative trends and developments, intensification of product portfolio, mergers and acquisitions, collaborations, new product innovation, and geographical expansion, undertaken by these participants to maintain their presence. Apart from business strategies, the study includes current developments and key financials. The readers will also get access to the data related to global revenue, price, and sales by manufacturers for the period 2017-2022. This all-inclusive report will certainly serve the clients to stay updated and make effective decisions in their businesses. Some of the prominent players reviewed in the research report include:
DISCO
Tokyo Seimitsu
GL Tech Co Ltd
ASM
Synova
CETC Electronics Equipment Group Co., Ltd.
Shenyang Heyan Technology Co., Ltd.
Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd.
Hi-TESI
Figure 1. Research Methodology
Figure 2. Research Process
Figure 3. Key Executives Interviewed
Figure 4. Wafer Slicing EquipmentProduct Picture
Figure 5. Market Value Comparison by Type (2018 VS 2022 VS 2029) & (US$ Million)
Figure 6. Blade Cutting Machine Product Picture
Figure 7. Laser Cutting Machine Product Picture
Figure 8. Pure Foundry Product Picture
Figure 9. IDM Product Picture
Figure 10. OSAT Product Picture
Figure 11. LED Product Picture
Figure 12. Photovoltaic Product Picture
Figure . Global Wafer Slicing Equipment Production Value (US$ Million), 2018 VS 2022 VS 2029
Figure 1. Global Wafer Slicing Equipment Production Value (2018-2029) & (US$ Million)
Figure 2. Global Wafer Slicing Equipment Production Capacity (2018-2029) & (Units)
Figure 3. Global Wafer Slicing Equipment Production (2018-2029) & (Units)
Figure 4. Global Wafer Slicing Equipment Average Price (US$/Unit) & (2018-2029)
Figure 5. Global Wafer Slicing Equipment Key Manufacturers, Manufacturing Sites & Headquarters
Figure 6. Global Wafer Slicing Equipment Manufacturers, Date of Enter into This Industry
Figure 7. Global Top 5 and 10 Wafer Slicing Equipment Players Market Share by Production Valu in 2022
Figure 8. Manufacturers Type (Tier 1, Tier 2, and Tier 3): 2018 VS 2022
Figure 9. Global Wafer Slicing Equipment Production Comparison by Region: 2018 VS 2022 VS 2029 (Units)
Figure 10. Global Wafer Slicing Equipment Production Market Share by Region: 2018 VS 2022 VS 2029
Figure 11. Global Wafer Slicing Equipment Production Value Comparison by Region: 2018 VS 2022 VS 2029 (US$ Million)
Figure 12. Global Wafer Slicing Equipment Production Value Market Share by Region: 2018 VS 2022 VS 2029
Figure 13. North America Wafer Slicing Equipment Production Value (US$ Million) Growth Rate (2018-2029)
Figure 14. Europe Wafer Slicing Equipment Production Value (US$ Million) Growth Rate (2018-2029)
Figure 15. China Wafer Slicing Equipment Production Value (US$ Million) Growth Rate (2018-2029)
Figure 16. Japan Wafer Slicing Equipment Production Value (US$ Million) Growth Rate (2018-2029)
Figure 17. South Korea Wafer Slicing Equipment Production Value (US$ Million) Growth Rate (2018-2029)
Figure 18. Global Wafer Slicing Equipment Consumption Comparison by Region: 2018 VS 2022 VS 2029 (Units)
Figure 19. Global Wafer Slicing Equipment Consumption Market Share by Region: 2018 VS 2022 VS 2029
Figure 20. North America Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 21. North America Wafer Slicing Equipment Consumption Market Share by Country (2018-2029)
Figure 22. United States Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 23. Canada Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 24. Europe Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 25. Europe Wafer Slicing Equipment Consumption Market Share by Country (2018-2029)
Figure 26. Germany Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 27. France Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 28. U.K. Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 29. Italy Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 30. Netherlands Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 31. Asia Pacific Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 32. Asia Pacific Wafer Slicing Equipment Consumption Market Share by Country (2018-2029)
Figure 33. China Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 34. Japan Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 35. South Korea Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 36. China Taiwan Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 37. Southeast Asia Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 38. India Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 39. Australia Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 40. Latin America, Middle East & Africa Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 41. Latin America, Middle East & Africa Wafer Slicing Equipment Consumption Market Share by Country (2018-2029)
Figure 42. Mexico Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 43. Brazil Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 44. Turkey Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 45. GCC Countries Wafer Slicing Equipment Consumption and Growth Rate (2018-2029) & (Units)
Figure 46. Global Wafer Slicing Equipment Production Market Share by Type (2018-2029)
Figure 47. Global Wafer Slicing Equipment Production Value Market Share by Type (2018-2029)
Figure 48. Global Wafer Slicing Equipment Price (US$/Unit) by Type (2018-2029)
Figure 49. Global Wafer Slicing Equipment Production Market Share by Application (2018-2029)
Figure 50. Global Wafer Slicing Equipment Production Value Market Share by Application (2018-2029)
Figure 51. Global Wafer Slicing Equipment Price (US$/Unit) by Application (2018-2029)
Figure 52. Wafer Slicing Equipment Value Chain
Figure 53. Wafer Slicing Equipment Production Mode & Process
Figure 54. Direct Comparison with Distribution Share
Figure 55. Distributors Profiles
Figure 56. Wafer Slicing Equipment Industry Opportunities and Challenges
Highlights
The global Wafer Slicing Equipment market is projected to reach US$ million by 2028 from an estimated US$ million in 2022, at a CAGR of % during 2024 and 2029.
North American market for Wafer Slicing Equipment is estimated to increase from $ million in 2022 to reach $ million by 2028, at a CAGR of % during the forecast period of 2023 through 2028.
Asia-Pacific market for Wafer Slicing Equipment is estimated to increase from $ million in 2022 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The major global companies of Wafer Slicing Equipment include DISCO, Tokyo Seimitsu, GL Tech Co Ltd, ASM, Synova, CETC Electronics Equipment Group Co., Ltd., Shenyang Heyan Technology Co., Ltd., Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. and Hi-TESI, etc. In 2022, the world's top three vendors accounted for approximately % of the revenue.
The global market for Wafer Slicing Equipment in Pure Foundry is estimated to increase from $ million in 2023 to $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Considering the economic change due to COVID-19 and Russia-Ukraine War Influence, Blade Cutting Machine, which accounted for % of the global market of Wafer Slicing Equipment in 2022, is expected to reach million US$ by 2029, growing at a revised CAGR of % from 2023 to 2029.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Wafer Slicing Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Slicing Equipment.
The Wafer Slicing Equipment market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Wafer Slicing Equipment market comprehensively. Regional market sizes, concerning products by types, by application, and by players, are also provided. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Wafer Slicing Equipment manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, product type, application, and regions.
Key Companies & Market Share Insights
In this section, the readers will gain an understanding of the key players competing. This report has studied the key growth strategies, such as innovative trends and developments, intensification of product portfolio, mergers and acquisitions, collaborations, new product innovation, and geographical expansion, undertaken by these participants to maintain their presence. Apart from business strategies, the study includes current developments and key financials. The readers will also get access to the data related to global revenue, price, and sales by manufacturers for the period 2017-2022. This all-inclusive report will certainly serve the clients to stay updated and make effective decisions in their businesses. Some of the prominent players reviewed in the research report include:
DISCO
Tokyo Seimitsu
GL Tech Co Ltd
ASM
Synova
CETC Electronics Equipment Group Co., Ltd.
Shenyang Heyan Technology Co., Ltd.
Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd.
Hi-TESI
