Thin Wafers Temporary Bonding Equipment and Materials Market, Global Outlook and Forecast 2022-2028
Thin wafer handling will enjoy increased importance in the coming years, but as chips get thinner and wafer diameter increases, thinning/handling procedures are required. This implies development in wafer thinning, wafer dicing and wafer temporary bonding. Temporary bonding implies know-how in process and chemistry, and an understanding of the final application requirements. Temporary bonding is a complex technology, requiring an interface material (sometimes called the “Magic” material) that is strong enough to withstand post-processing but which can be easily removed afterwards. As the main concern for temporary bonding materials (wax, tape or glue) is temperature stability, the material must be strong enough to withstand processing steps (metallization, etching, grinding). Another issue is the choice of carrier material. Carrier lifetime depends on its capability to withstand steps such as grinding, etc., and carrier lifetime should be at least tens of times.
This report contains market size and forecasts of Thin Wafers Temporary Bonding Equipment and Materials in Global, including the following market information:
Global Thin Wafers Temporary Bonding Equipment and Materials Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global top five companies in 2021 (%)
The global Thin Wafers Temporary Bonding Equipment and Materials market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Chemical Debonding Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Thin Wafers Temporary Bonding Equipment and Materials include 3M, ABB, Accretech, AGC, AMD, Cabot, Corning, Crystal Solar and Dalsa, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Thin Wafers Temporary Bonding Equipment and Materials companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Thin Wafers Temporary Bonding Equipment and Materials Market, by Type, 2017-2022, 2023-2028 ($ millions)
Global Thin Wafers Temporary Bonding Equipment and Materials Market Segment Percentages, by Type, 2021 (%)
Global Thin Wafers Temporary Bonding Equipment and Materials Market Segment Percentages, by Application, 2021 (%)
Global Thin Wafers Temporary Bonding Equipment and Materials Market Segment Percentages, By Region and Country, 2021 (%)
The report also provides analysis of leading market participants including:
Key companies Thin Wafers Temporary Bonding Equipment and Materials revenues in global market, 2017-2022 (estimated), ($ millions)
Key companies Thin Wafers Temporary Bonding Equipment and Materials revenues share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
This report contains market size and forecasts of Thin Wafers Temporary Bonding Equipment and Materials in Global, including the following market information:
Global Thin Wafers Temporary Bonding Equipment and Materials Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global top five companies in 2021 (%)
The global Thin Wafers Temporary Bonding Equipment and Materials market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Chemical Debonding Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Thin Wafers Temporary Bonding Equipment and Materials include 3M, ABB, Accretech, AGC, AMD, Cabot, Corning, Crystal Solar and Dalsa, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Thin Wafers Temporary Bonding Equipment and Materials companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Thin Wafers Temporary Bonding Equipment and Materials Market, by Type, 2017-2022, 2023-2028 ($ millions)
Global Thin Wafers Temporary Bonding Equipment and Materials Market Segment Percentages, by Type, 2021 (%)
- Chemical Debonding
- Hot Sliding Debonding
- Mechanical Debonding
- Laser Debonding
Global Thin Wafers Temporary Bonding Equipment and Materials Market Segment Percentages, by Application, 2021 (%)
- < 100 µm Wafers
- below 40µm Wafers
Global Thin Wafers Temporary Bonding Equipment and Materials Market Segment Percentages, By Region and Country, 2021 (%)
- North America
- US
- Canada
- Mexico
- Europe
- Germany
- France
- U.K.
- Italy
- Russia
- Nordic Countries
- Benelux
- Rest of Europe
- Asia
- China
- Japan
- South Korea
- Southeast Asia
- India
- Rest of Asia
- South America
- Brazil
- Argentina
- Rest of South America
- Middle East & Africa
- Turkey
- Israel
- Saudi Arabia
- UAE
- Rest of Middle East & Africa
The report also provides analysis of leading market participants including:
Key companies Thin Wafers Temporary Bonding Equipment and Materials revenues in global market, 2017-2022 (estimated), ($ millions)
Key companies Thin Wafers Temporary Bonding Equipment and Materials revenues share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
- 3M
- ABB
- Accretech
- AGC
- AMD
- Cabot
- Corning
- Crystal Solar
- Dalsa
- DoubleCheck Semiconductors
- 1366 Technologies
- Ebara
- ERS
- Hamamatsu
- IBM
- Intel
- LG Innotek
- Mitsubishi Electric
- Qualcomm
- Robert Bosch
- Samsung
- Sumitomo Chemical
1 INTRODUCTION TO RESEARCH & ANALYSIS REPORTS
1.1 Thin Wafers Temporary Bonding Equipment and Materials Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global Thin Wafers Temporary Bonding Equipment and Materials Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 GLOBAL THIN WAFERS TEMPORARY BONDING EQUIPMENT AND MATERIALS OVERALL MARKET SIZE
2.1 Global Thin Wafers Temporary Bonding Equipment and Materials Market Size: 2021 VS 2028
2.2 Global Thin Wafers Temporary Bonding Equipment and Materials Market Size, Prospects & Forecasts: 2017-2028
2.3 Key Market Trends, Opportunity, Drivers and Restraints
2.3.1 Market Opportunities & Trends
2.3.2 Market Drivers
2.3.3 Market Restraints
3 COMPANY LANDSCAPE
3.1 Top Thin Wafers Temporary Bonding Equipment and Materials Players in Global Market
3.2 Top Global Thin Wafers Temporary Bonding Equipment and Materials Companies Ranked by Revenue
3.3 Global Thin Wafers Temporary Bonding Equipment and Materials Revenue by Companies
3.4 Top 3 and Top 5 Thin Wafers Temporary Bonding Equipment and Materials Companies in Global Market, by Revenue in 2021
3.5 Global Companies Thin Wafers Temporary Bonding Equipment and Materials Product Type
3.6 Tier 1, Tier 2 and Tier 3 Thin Wafers Temporary Bonding Equipment and Materials Players in Global Market
3.6.1 List of Global Tier 1 Thin Wafers Temporary Bonding Equipment and Materials Companies
3.6.2 List of Global Tier 2 and Tier 3 Thin Wafers Temporary Bonding Equipment and Materials Companies
4 MARKET SIGHTS BY PRODUCT
4.1 Overview
4.1.1 by Type - Global Thin Wafers Temporary Bonding Equipment and Materials Market Size Markets, 2021 & 2028
4.1.2 Chemical Debonding
4.1.3 Hot Sliding Debonding
4.1.4 Mechanical Debonding
4.1.5 Laser Debonding
4.2 By Type - Global Thin Wafers Temporary Bonding Equipment and Materials Revenue & Forecasts
4.2.1 By Type - Global Thin Wafers Temporary Bonding Equipment and Materials Revenue, 2017-2022
4.2.2 By Type - Global Thin Wafers Temporary Bonding Equipment and Materials Revenue, 2023-2028
4.2.3 By Type - Global Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share, 2017-2028
5 SIGHTS BY APPLICATION
5.1 Overview
5.1.1 By Application - Global Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2021 & 2028
5.1.2 < 100 µm Wafers
5.1.3 below 40µm Wafers
5.2 By Application - Global Thin Wafers Temporary Bonding Equipment and Materials Revenue & Forecasts
5.2.1 By Application - Global Thin Wafers Temporary Bonding Equipment and Materials Revenue, 2017-2022
5.2.2 By Application - Global Thin Wafers Temporary Bonding Equipment and Materials Revenue, 2023-2028
5.2.3 By Application - Global Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share, 2017-2028
6 SIGHTS BY REGION
6.1 By Region - Global Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2021 & 2028
6.2 By Region - Global Thin Wafers Temporary Bonding Equipment and Materials Revenue & Forecasts
6.2.1 By Region - Global Thin Wafers Temporary Bonding Equipment and Materials Revenue, 2017-2022
6.2.2 By Region - Global Thin Wafers Temporary Bonding Equipment and Materials Revenue, 2023-2028
6.2.3 By Region - Global Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share, 2017-2028
6.3 North America
6.3.1 By Country - North America Thin Wafers Temporary Bonding Equipment and Materials Revenue, 2017-2028
6.3.2 US Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2017-2028
6.3.3 Canada Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2017-2028
6.3.4 Mexico Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2017-2028
6.4 Europe
6.4.1 By Country - Europe Thin Wafers Temporary Bonding Equipment and Materials Revenue, 2017-2028
6.4.2 Germany Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2017-2028
6.4.3 France Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2017-2028
6.4.4 U.K. Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2017-2028
6.4.5 Italy Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2017-2028
6.4.6 Russia Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2017-2028
6.4.7 Nordic Countries Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2017-2028
6.4.8 Benelux Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2017-2028
6.5 Asia
6.5.1 By Region - Asia Thin Wafers Temporary Bonding Equipment and Materials Revenue, 2017-2028
6.5.2 China Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2017-2028
6.5.3 Japan Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2017-2028
6.5.4 South Korea Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2017-2028
6.5.5 Southeast Asia Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2017-2028
6.5.6 India Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2017-2028
6.6 South America
6.6.1 By Country - South America Thin Wafers Temporary Bonding Equipment and Materials Revenue, 2017-2028
6.6.2 Brazil Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2017-2028
6.6.3 Argentina Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2017-2028
6.7 Middle East & Africa
6.7.1 By Country - Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Revenue, 2017-2028
6.7.2 Turkey Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2017-2028
6.7.3 Israel Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2017-2028
6.7.4 Saudi Arabia Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2017-2028
6.7.5 UAE Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2017-2028
7 PLAYERS PROFILES
7.1 3M
7.1.1 3M Corporate Summary
7.1.2 3M Business Overview
7.1.3 3M Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.1.4 3M Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.1.5 3M Key News
7.2 ABB
7.2.1 ABB Corporate Summary
7.2.2 ABB Business Overview
7.2.3 ABB Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.2.4 ABB Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.2.5 ABB Key News
7.3 Accretech
7.3.1 Accretech Corporate Summary
7.3.2 Accretech Business Overview
7.3.3 Accretech Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.3.4 Accretech Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.3.5 Accretech Key News
7.4 AGC
7.4.1 AGC Corporate Summary
7.4.2 AGC Business Overview
7.4.3 AGC Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.4.4 AGC Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.4.5 AGC Key News
7.5 AMD
7.5.1 AMD Corporate Summary
7.5.2 AMD Business Overview
7.5.3 AMD Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.5.4 AMD Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.5.5 AMD Key News
7.6 Cabot
7.6.1 Cabot Corporate Summary
7.6.2 Cabot Business Overview
7.6.3 Cabot Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.6.4 Cabot Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.6.5 Cabot Key News
7.7 Corning
7.7.1 Corning Corporate Summary
7.7.2 Corning Business Overview
7.7.3 Corning Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.7.4 Corning Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.7.5 Corning Key News
7.8 Crystal Solar
7.8.1 Crystal Solar Corporate Summary
7.8.2 Crystal Solar Business Overview
7.8.3 Crystal Solar Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.8.4 Crystal Solar Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.8.5 Crystal Solar Key News
7.9 Dalsa
7.9.1 Dalsa Corporate Summary
7.9.2 Dalsa Business Overview
7.9.3 Dalsa Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.9.4 Dalsa Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.9.5 Dalsa Key News
7.10 DoubleCheck Semiconductors
7.10.1 DoubleCheck Semiconductors Corporate Summary
7.10.2 DoubleCheck Semiconductors Business Overview
7.10.3 DoubleCheck Semiconductors Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.10.4 DoubleCheck Semiconductors Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.10.5 DoubleCheck Semiconductors Key News
7.11 1366 Technologies
7.11.1 1366 Technologies Corporate Summary
7.11.2 1366 Technologies Business Overview
7.11.3 1366 Technologies Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.11.4 1366 Technologies Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.11.5 1366 Technologies Key News
7.12 Ebara
7.12.1 Ebara Corporate Summary
7.12.2 Ebara Business Overview
7.12.3 Ebara Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.12.4 Ebara Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.12.5 Ebara Key News
7.13 ERS
7.13.1 ERS Corporate Summary
7.13.2 ERS Business Overview
7.13.3 ERS Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.13.4 ERS Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.13.5 ERS Key News
7.14 Hamamatsu
7.14.1 Hamamatsu Corporate Summary
7.14.2 Hamamatsu Business Overview
7.14.3 Hamamatsu Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.14.4 Hamamatsu Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.14.5 Hamamatsu Key News
7.15 IBM
7.15.1 IBM Corporate Summary
7.15.2 IBM Business Overview
7.15.3 IBM Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.15.4 IBM Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.15.5 IBM Key News
7.16 Intel
7.16.1 Intel Corporate Summary
7.16.2 Intel Business Overview
7.16.3 Intel Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.16.4 Intel Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.16.5 Intel Key News
7.17 LG Innotek
7.17.1 LG Innotek Corporate Summary
7.17.2 LG Innotek Business Overview
7.17.3 LG Innotek Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.17.4 LG Innotek Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.17.5 LG Innotek Key News
7.18 Mitsubishi Electric
7.18.1 Mitsubishi Electric Corporate Summary
7.18.2 Mitsubishi Electric Business Overview
7.18.3 Mitsubishi Electric Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.18.4 Mitsubishi Electric Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.18.5 Mitsubishi Electric Key News
7.19 Qualcomm
7.19.1 Qualcomm Corporate Summary
7.19.2 Qualcomm Business Overview
7.19.3 Qualcomm Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.19.4 Qualcomm Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.19.5 Qualcomm Key News
7.20 Robert Bosch
7.20.1 Robert Bosch Corporate Summary
7.20.2 Robert Bosch Business Overview
7.20.3 Robert Bosch Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.20.4 Robert Bosch Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.20.5 Robert Bosch Key News
7.21 Samsung
7.21.1 Samsung Corporate Summary
7.21.2 Samsung Business Overview
7.21.3 Samsung Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.21.4 Samsung Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.21.5 Samsung Key News
7.22 Sumitomo Chemical
7.22.1 Sumitomo Chemical Corporate Summary
7.22.2 Sumitomo Chemical Business Overview
7.22.3 Sumitomo Chemical Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.22.4 Sumitomo Chemical Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.22.5 Sumitomo Chemical Key News
8 CONCLUSION
9 APPENDIX
9.1 Note
9.2 Examples of Clients
9.3 Disclaimer
1.1 Thin Wafers Temporary Bonding Equipment and Materials Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global Thin Wafers Temporary Bonding Equipment and Materials Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 GLOBAL THIN WAFERS TEMPORARY BONDING EQUIPMENT AND MATERIALS OVERALL MARKET SIZE
2.1 Global Thin Wafers Temporary Bonding Equipment and Materials Market Size: 2021 VS 2028
2.2 Global Thin Wafers Temporary Bonding Equipment and Materials Market Size, Prospects & Forecasts: 2017-2028
2.3 Key Market Trends, Opportunity, Drivers and Restraints
2.3.1 Market Opportunities & Trends
2.3.2 Market Drivers
2.3.3 Market Restraints
3 COMPANY LANDSCAPE
3.1 Top Thin Wafers Temporary Bonding Equipment and Materials Players in Global Market
3.2 Top Global Thin Wafers Temporary Bonding Equipment and Materials Companies Ranked by Revenue
3.3 Global Thin Wafers Temporary Bonding Equipment and Materials Revenue by Companies
3.4 Top 3 and Top 5 Thin Wafers Temporary Bonding Equipment and Materials Companies in Global Market, by Revenue in 2021
3.5 Global Companies Thin Wafers Temporary Bonding Equipment and Materials Product Type
3.6 Tier 1, Tier 2 and Tier 3 Thin Wafers Temporary Bonding Equipment and Materials Players in Global Market
3.6.1 List of Global Tier 1 Thin Wafers Temporary Bonding Equipment and Materials Companies
3.6.2 List of Global Tier 2 and Tier 3 Thin Wafers Temporary Bonding Equipment and Materials Companies
4 MARKET SIGHTS BY PRODUCT
4.1 Overview
4.1.1 by Type - Global Thin Wafers Temporary Bonding Equipment and Materials Market Size Markets, 2021 & 2028
4.1.2 Chemical Debonding
4.1.3 Hot Sliding Debonding
4.1.4 Mechanical Debonding
4.1.5 Laser Debonding
4.2 By Type - Global Thin Wafers Temporary Bonding Equipment and Materials Revenue & Forecasts
4.2.1 By Type - Global Thin Wafers Temporary Bonding Equipment and Materials Revenue, 2017-2022
4.2.2 By Type - Global Thin Wafers Temporary Bonding Equipment and Materials Revenue, 2023-2028
4.2.3 By Type - Global Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share, 2017-2028
5 SIGHTS BY APPLICATION
5.1 Overview
5.1.1 By Application - Global Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2021 & 2028
5.1.2 < 100 µm Wafers
5.1.3 below 40µm Wafers
5.2 By Application - Global Thin Wafers Temporary Bonding Equipment and Materials Revenue & Forecasts
5.2.1 By Application - Global Thin Wafers Temporary Bonding Equipment and Materials Revenue, 2017-2022
5.2.2 By Application - Global Thin Wafers Temporary Bonding Equipment and Materials Revenue, 2023-2028
5.2.3 By Application - Global Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share, 2017-2028
6 SIGHTS BY REGION
6.1 By Region - Global Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2021 & 2028
6.2 By Region - Global Thin Wafers Temporary Bonding Equipment and Materials Revenue & Forecasts
6.2.1 By Region - Global Thin Wafers Temporary Bonding Equipment and Materials Revenue, 2017-2022
6.2.2 By Region - Global Thin Wafers Temporary Bonding Equipment and Materials Revenue, 2023-2028
6.2.3 By Region - Global Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share, 2017-2028
6.3 North America
6.3.1 By Country - North America Thin Wafers Temporary Bonding Equipment and Materials Revenue, 2017-2028
6.3.2 US Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2017-2028
6.3.3 Canada Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2017-2028
6.3.4 Mexico Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2017-2028
6.4 Europe
6.4.1 By Country - Europe Thin Wafers Temporary Bonding Equipment and Materials Revenue, 2017-2028
6.4.2 Germany Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2017-2028
6.4.3 France Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2017-2028
6.4.4 U.K. Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2017-2028
6.4.5 Italy Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2017-2028
6.4.6 Russia Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2017-2028
6.4.7 Nordic Countries Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2017-2028
6.4.8 Benelux Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2017-2028
6.5 Asia
6.5.1 By Region - Asia Thin Wafers Temporary Bonding Equipment and Materials Revenue, 2017-2028
6.5.2 China Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2017-2028
6.5.3 Japan Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2017-2028
6.5.4 South Korea Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2017-2028
6.5.5 Southeast Asia Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2017-2028
6.5.6 India Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2017-2028
6.6 South America
6.6.1 By Country - South America Thin Wafers Temporary Bonding Equipment and Materials Revenue, 2017-2028
6.6.2 Brazil Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2017-2028
6.6.3 Argentina Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2017-2028
6.7 Middle East & Africa
6.7.1 By Country - Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Revenue, 2017-2028
6.7.2 Turkey Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2017-2028
6.7.3 Israel Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2017-2028
6.7.4 Saudi Arabia Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2017-2028
6.7.5 UAE Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2017-2028
7 PLAYERS PROFILES
7.1 3M
7.1.1 3M Corporate Summary
7.1.2 3M Business Overview
7.1.3 3M Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.1.4 3M Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.1.5 3M Key News
7.2 ABB
7.2.1 ABB Corporate Summary
7.2.2 ABB Business Overview
7.2.3 ABB Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.2.4 ABB Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.2.5 ABB Key News
7.3 Accretech
7.3.1 Accretech Corporate Summary
7.3.2 Accretech Business Overview
7.3.3 Accretech Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.3.4 Accretech Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.3.5 Accretech Key News
7.4 AGC
7.4.1 AGC Corporate Summary
7.4.2 AGC Business Overview
7.4.3 AGC Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.4.4 AGC Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.4.5 AGC Key News
7.5 AMD
7.5.1 AMD Corporate Summary
7.5.2 AMD Business Overview
7.5.3 AMD Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.5.4 AMD Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.5.5 AMD Key News
7.6 Cabot
7.6.1 Cabot Corporate Summary
7.6.2 Cabot Business Overview
7.6.3 Cabot Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.6.4 Cabot Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.6.5 Cabot Key News
7.7 Corning
7.7.1 Corning Corporate Summary
7.7.2 Corning Business Overview
7.7.3 Corning Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.7.4 Corning Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.7.5 Corning Key News
7.8 Crystal Solar
7.8.1 Crystal Solar Corporate Summary
7.8.2 Crystal Solar Business Overview
7.8.3 Crystal Solar Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.8.4 Crystal Solar Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.8.5 Crystal Solar Key News
7.9 Dalsa
7.9.1 Dalsa Corporate Summary
7.9.2 Dalsa Business Overview
7.9.3 Dalsa Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.9.4 Dalsa Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.9.5 Dalsa Key News
7.10 DoubleCheck Semiconductors
7.10.1 DoubleCheck Semiconductors Corporate Summary
7.10.2 DoubleCheck Semiconductors Business Overview
7.10.3 DoubleCheck Semiconductors Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.10.4 DoubleCheck Semiconductors Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.10.5 DoubleCheck Semiconductors Key News
7.11 1366 Technologies
7.11.1 1366 Technologies Corporate Summary
7.11.2 1366 Technologies Business Overview
7.11.3 1366 Technologies Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.11.4 1366 Technologies Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.11.5 1366 Technologies Key News
7.12 Ebara
7.12.1 Ebara Corporate Summary
7.12.2 Ebara Business Overview
7.12.3 Ebara Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.12.4 Ebara Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.12.5 Ebara Key News
7.13 ERS
7.13.1 ERS Corporate Summary
7.13.2 ERS Business Overview
7.13.3 ERS Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.13.4 ERS Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.13.5 ERS Key News
7.14 Hamamatsu
7.14.1 Hamamatsu Corporate Summary
7.14.2 Hamamatsu Business Overview
7.14.3 Hamamatsu Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.14.4 Hamamatsu Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.14.5 Hamamatsu Key News
7.15 IBM
7.15.1 IBM Corporate Summary
7.15.2 IBM Business Overview
7.15.3 IBM Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.15.4 IBM Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.15.5 IBM Key News
7.16 Intel
7.16.1 Intel Corporate Summary
7.16.2 Intel Business Overview
7.16.3 Intel Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.16.4 Intel Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.16.5 Intel Key News
7.17 LG Innotek
7.17.1 LG Innotek Corporate Summary
7.17.2 LG Innotek Business Overview
7.17.3 LG Innotek Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.17.4 LG Innotek Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.17.5 LG Innotek Key News
7.18 Mitsubishi Electric
7.18.1 Mitsubishi Electric Corporate Summary
7.18.2 Mitsubishi Electric Business Overview
7.18.3 Mitsubishi Electric Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.18.4 Mitsubishi Electric Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.18.5 Mitsubishi Electric Key News
7.19 Qualcomm
7.19.1 Qualcomm Corporate Summary
7.19.2 Qualcomm Business Overview
7.19.3 Qualcomm Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.19.4 Qualcomm Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.19.5 Qualcomm Key News
7.20 Robert Bosch
7.20.1 Robert Bosch Corporate Summary
7.20.2 Robert Bosch Business Overview
7.20.3 Robert Bosch Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.20.4 Robert Bosch Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.20.5 Robert Bosch Key News
7.21 Samsung
7.21.1 Samsung Corporate Summary
7.21.2 Samsung Business Overview
7.21.3 Samsung Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.21.4 Samsung Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.21.5 Samsung Key News
7.22 Sumitomo Chemical
7.22.1 Sumitomo Chemical Corporate Summary
7.22.2 Sumitomo Chemical Business Overview
7.22.3 Sumitomo Chemical Thin Wafers Temporary Bonding Equipment and Materials Major Product Offerings
7.22.4 Sumitomo Chemical Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global Market (2017-2022)
7.22.5 Sumitomo Chemical Key News
8 CONCLUSION
9 APPENDIX
9.1 Note
9.2 Examples of Clients
9.3 Disclaimer
LIST OF TABLES
Table 1. Thin Wafers Temporary Bonding Equipment and Materials Market Opportunities & Trends in Global Market
Table 2. Thin Wafers Temporary Bonding Equipment and Materials Market Drivers in Global Market
Table 3. Thin Wafers Temporary Bonding Equipment and Materials Market Restraints in Global Market
Table 4. Key Players of Thin Wafers Temporary Bonding Equipment and Materials in Global Market
Table 5. Top Thin Wafers Temporary Bonding Equipment and Materials Players in Global Market, Ranking by Revenue (2021)
Table 6. Global Thin Wafers Temporary Bonding Equipment and Materials Revenue by Companies, (US$, Mn), 2017-2022
Table 7. Global Thin Wafers Temporary Bonding Equipment and Materials Revenue Share by Companies, 2017-2022
Table 8. Global Companies Thin Wafers Temporary Bonding Equipment and Materials Product Type
Table 9. List of Global Tier 1 Thin Wafers Temporary Bonding Equipment and Materials Companies, Revenue (US$, Mn) in 2021 and Market Share
Table 10. List of Global Tier 2 and Tier 3 Thin Wafers Temporary Bonding Equipment and Materials Companies, Revenue (US$, Mn) in 2021 and Market Share
Table 11. By Type – Global Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2021 & 2028
Table 12. By Type - Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global (US$, Mn), 2017-2022
Table 13. By Type - Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global (US$, Mn), 2023-2028
Table 14. By Application – Global Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2021 & 2028
Table 15. By Application - Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global (US$, Mn), 2017-2022
Table 16. By Application - Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global (US$, Mn), 2023-2028
Table 17. By Region – Global Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2021 & 2028
Table 18. By Region - Global Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), 2017-2022
Table 19. By Region - Global Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), 2023-2028
Table 20. By Country - North America Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2022
Table 21. By Country - North America Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2023-2028
Table 22. By Country - Europe Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2022
Table 23. By Country - Europe Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2023-2028
Table 24. By Region - Asia Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2022
Table 25. By Region - Asia Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2023-2028
Table 26. By Country - South America Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2022
Table 27. By Country - South America Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2023-2028
Table 28. By Country - Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2022
Table 29. By Country - Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2023-2028
Table 30. 3M Corporate Summary
Table 31. 3M Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 32. 3M Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 33. ABB Corporate Summary
Table 34. ABB Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 35. ABB Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 36. Accretech Corporate Summary
Table 37. Accretech Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 38. Accretech Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 39. AGC Corporate Summary
Table 40. AGC Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 41. AGC Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 42. AMD Corporate Summary
Table 43. AMD Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 44. AMD Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 45. Cabot Corporate Summary
Table 46. Cabot Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 47. Cabot Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 48. Corning Corporate Summary
Table 49. Corning Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 50. Corning Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 51. Crystal Solar Corporate Summary
Table 52. Crystal Solar Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 53. Crystal Solar Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 54. Dalsa Corporate Summary
Table 55. Dalsa Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 56. Dalsa Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 57. DoubleCheck Semiconductors Corporate Summary
Table 58. DoubleCheck Semiconductors Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 59. DoubleCheck Semiconductors Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 60. 1366 Technologies Corporate Summary
Table 61. 1366 Technologies Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 62. 1366 Technologies Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 63. Ebara Corporate Summary
Table 64. Ebara Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 65. Ebara Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 66. ERS Corporate Summary
Table 67. ERS Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 68. ERS Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 69. Hamamatsu Corporate Summary
Table 70. Hamamatsu Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 71. Hamamatsu Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 72. IBM Corporate Summary
Table 73. IBM Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 74. IBM Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 75. Intel Corporate Summary
Table 76. Intel Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 77. Intel Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 78. LG Innotek Corporate Summary
Table 79. LG Innotek Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 80. LG Innotek Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 81. Mitsubishi Electric Corporate Summary
Table 82. Mitsubishi Electric Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 83. Mitsubishi Electric Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 84. Qualcomm Corporate Summary
Table 85. Qualcomm Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 86. Qualcomm Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 87. Robert Bosch Corporate Summary
Table 88. Robert Bosch Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 89. Robert Bosch Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 90. Samsung Corporate Summary
Table 91. Samsung Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 92. Samsung Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 93. Sumitomo Chemical Corporate Summary
Table 94. Sumitomo Chemical Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 95. Sumitomo Chemical Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 1. Thin Wafers Temporary Bonding Equipment and Materials Market Opportunities & Trends in Global Market
Table 2. Thin Wafers Temporary Bonding Equipment and Materials Market Drivers in Global Market
Table 3. Thin Wafers Temporary Bonding Equipment and Materials Market Restraints in Global Market
Table 4. Key Players of Thin Wafers Temporary Bonding Equipment and Materials in Global Market
Table 5. Top Thin Wafers Temporary Bonding Equipment and Materials Players in Global Market, Ranking by Revenue (2021)
Table 6. Global Thin Wafers Temporary Bonding Equipment and Materials Revenue by Companies, (US$, Mn), 2017-2022
Table 7. Global Thin Wafers Temporary Bonding Equipment and Materials Revenue Share by Companies, 2017-2022
Table 8. Global Companies Thin Wafers Temporary Bonding Equipment and Materials Product Type
Table 9. List of Global Tier 1 Thin Wafers Temporary Bonding Equipment and Materials Companies, Revenue (US$, Mn) in 2021 and Market Share
Table 10. List of Global Tier 2 and Tier 3 Thin Wafers Temporary Bonding Equipment and Materials Companies, Revenue (US$, Mn) in 2021 and Market Share
Table 11. By Type – Global Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2021 & 2028
Table 12. By Type - Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global (US$, Mn), 2017-2022
Table 13. By Type - Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global (US$, Mn), 2023-2028
Table 14. By Application – Global Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2021 & 2028
Table 15. By Application - Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global (US$, Mn), 2017-2022
Table 16. By Application - Thin Wafers Temporary Bonding Equipment and Materials Revenue in Global (US$, Mn), 2023-2028
Table 17. By Region – Global Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2021 & 2028
Table 18. By Region - Global Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), 2017-2022
Table 19. By Region - Global Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), 2023-2028
Table 20. By Country - North America Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2022
Table 21. By Country - North America Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2023-2028
Table 22. By Country - Europe Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2022
Table 23. By Country - Europe Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2023-2028
Table 24. By Region - Asia Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2022
Table 25. By Region - Asia Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2023-2028
Table 26. By Country - South America Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2022
Table 27. By Country - South America Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2023-2028
Table 28. By Country - Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2022
Table 29. By Country - Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2023-2028
Table 30. 3M Corporate Summary
Table 31. 3M Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 32. 3M Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 33. ABB Corporate Summary
Table 34. ABB Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 35. ABB Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 36. Accretech Corporate Summary
Table 37. Accretech Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 38. Accretech Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 39. AGC Corporate Summary
Table 40. AGC Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 41. AGC Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 42. AMD Corporate Summary
Table 43. AMD Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 44. AMD Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 45. Cabot Corporate Summary
Table 46. Cabot Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 47. Cabot Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 48. Corning Corporate Summary
Table 49. Corning Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 50. Corning Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 51. Crystal Solar Corporate Summary
Table 52. Crystal Solar Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 53. Crystal Solar Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 54. Dalsa Corporate Summary
Table 55. Dalsa Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 56. Dalsa Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 57. DoubleCheck Semiconductors Corporate Summary
Table 58. DoubleCheck Semiconductors Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 59. DoubleCheck Semiconductors Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 60. 1366 Technologies Corporate Summary
Table 61. 1366 Technologies Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 62. 1366 Technologies Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 63. Ebara Corporate Summary
Table 64. Ebara Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 65. Ebara Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 66. ERS Corporate Summary
Table 67. ERS Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 68. ERS Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 69. Hamamatsu Corporate Summary
Table 70. Hamamatsu Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 71. Hamamatsu Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 72. IBM Corporate Summary
Table 73. IBM Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 74. IBM Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 75. Intel Corporate Summary
Table 76. Intel Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 77. Intel Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 78. LG Innotek Corporate Summary
Table 79. LG Innotek Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 80. LG Innotek Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 81. Mitsubishi Electric Corporate Summary
Table 82. Mitsubishi Electric Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 83. Mitsubishi Electric Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 84. Qualcomm Corporate Summary
Table 85. Qualcomm Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 86. Qualcomm Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 87. Robert Bosch Corporate Summary
Table 88. Robert Bosch Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 89. Robert Bosch Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 90. Samsung Corporate Summary
Table 91. Samsung Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 92. Samsung Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
Table 93. Sumitomo Chemical Corporate Summary
Table 94. Sumitomo Chemical Thin Wafers Temporary Bonding Equipment and Materials Product Offerings
Table 95. Sumitomo Chemical Thin Wafers Temporary Bonding Equipment and Materials Revenue (US$, Mn), (2017-2022)
LIST OF FIGURES
Figure 1. Thin Wafers Temporary Bonding Equipment and Materials Segment by Type in 2021
Figure 2. Thin Wafers Temporary Bonding Equipment and Materials Segment by Application in 2021
Figure 3. Global Thin Wafers Temporary Bonding Equipment and Materials Market Overview: 2021
Figure 4. Key Caveats
Figure 5. Global Thin Wafers Temporary Bonding Equipment and Materials Market Size: 2021 VS 2028 (US$, Mn)
Figure 6. Global Thin Wafers Temporary Bonding Equipment and Materials Revenue, 2017-2028 (US$, Mn)
Figure 7. The Top 3 and 5 Players Market Share by Thin Wafers Temporary Bonding Equipment and Materials Revenue in 2021
Figure 8. By Type - Global Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share, 2017-2028
Figure 9. By Application - Global Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share, 2017-2028
Figure 10. By Region - Global Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share, 2017-2028
Figure 11. By Country - North America Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share, 2017-2028
Figure 12. US Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2028
Figure 13. Canada Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2028
Figure 14. Mexico Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2028
Figure 15. By Country - Europe Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share, 2017-2028
Figure 16. Germany Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2028
Figure 17. France Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2028
Figure 18. U.K. Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2028
Figure 19. Italy Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2028
Figure 20. Russia Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2028
Figure 21. Nordic Countries Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2028
Figure 22. Benelux Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2028
Figure 23. By Region - Asia Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share, 2017-2028
Figure 24. China Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2028
Figure 25. Japan Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2028
Figure 26. South Korea Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2028
Figure 27. Southeast Asia Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2028
Figure 28. India Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2028
Figure 29. By Country - South America Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share, 2017-2028
Figure 30. Brazil Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2028
Figure 31. Argentina Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2028
Figure 32. By Country - Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share, 2017-2028
Figure 33. Turkey Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2028
Figure 34. Israel Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2028
Figure 35. Saudi Arabia Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2028
Figure 36. UAE Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2028
Figure 37. 3M Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 38. ABB Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 39. Accretech Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 40. AGC Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 41. AMD Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 42. Cabot Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 43. Corning Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 44. Crystal Solar Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 45. Dalsa Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 46. DoubleCheck Semiconductors Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 47. 1366 Technologies Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 48. Ebara Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 49. ERS Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 50. Hamamatsu Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 51. IBM Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 52. Intel Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 53. LG Innotek Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 54. Mitsubishi Electric Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 55. Qualcomm Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 56. Robert Bosch Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 57. Samsung Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 58. Sumitomo Chemical Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 1. Thin Wafers Temporary Bonding Equipment and Materials Segment by Type in 2021
Figure 2. Thin Wafers Temporary Bonding Equipment and Materials Segment by Application in 2021
Figure 3. Global Thin Wafers Temporary Bonding Equipment and Materials Market Overview: 2021
Figure 4. Key Caveats
Figure 5. Global Thin Wafers Temporary Bonding Equipment and Materials Market Size: 2021 VS 2028 (US$, Mn)
Figure 6. Global Thin Wafers Temporary Bonding Equipment and Materials Revenue, 2017-2028 (US$, Mn)
Figure 7. The Top 3 and 5 Players Market Share by Thin Wafers Temporary Bonding Equipment and Materials Revenue in 2021
Figure 8. By Type - Global Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share, 2017-2028
Figure 9. By Application - Global Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share, 2017-2028
Figure 10. By Region - Global Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share, 2017-2028
Figure 11. By Country - North America Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share, 2017-2028
Figure 12. US Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2028
Figure 13. Canada Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2028
Figure 14. Mexico Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2028
Figure 15. By Country - Europe Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share, 2017-2028
Figure 16. Germany Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2028
Figure 17. France Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2028
Figure 18. U.K. Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2028
Figure 19. Italy Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2028
Figure 20. Russia Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2028
Figure 21. Nordic Countries Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2028
Figure 22. Benelux Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2028
Figure 23. By Region - Asia Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share, 2017-2028
Figure 24. China Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2028
Figure 25. Japan Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2028
Figure 26. South Korea Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2028
Figure 27. Southeast Asia Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2028
Figure 28. India Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2028
Figure 29. By Country - South America Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share, 2017-2028
Figure 30. Brazil Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2028
Figure 31. Argentina Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2028
Figure 32. By Country - Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share, 2017-2028
Figure 33. Turkey Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2028
Figure 34. Israel Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2028
Figure 35. Saudi Arabia Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2028
Figure 36. UAE Thin Wafers Temporary Bonding Equipment and Materials Revenue, (US$, Mn), 2017-2028
Figure 37. 3M Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 38. ABB Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 39. Accretech Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 40. AGC Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 41. AMD Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 42. Cabot Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 43. Corning Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 44. Crystal Solar Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 45. Dalsa Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 46. DoubleCheck Semiconductors Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 47. 1366 Technologies Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 48. Ebara Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 49. ERS Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 50. Hamamatsu Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 51. IBM Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 52. Intel Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 53. LG Innotek Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 54. Mitsubishi Electric Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 55. Qualcomm Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 56. Robert Bosch Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 57. Samsung Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 58. Sumitomo Chemical Thin Wafers Temporary Bonding Equipment and Materials Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
