IC Package Substrates Industry Research Report 2023
Highlights
The global IC Package Substrates market is projected to reach US$ million by 2029 from an estimated US$ million in 2022, at a CAGR of % during 2023 and 2029.
North American market for IC Package Substrates is estimated to increase from $ million in 2022 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Asia-Pacific market for IC Package Substrates is estimated to increase from $ million in 2022 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The major global companies of IC Package Substrates include Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect Technology, AT&S, Semco, Kyocera and TOPPAN, etc. In 2022, the world's top three vendors accounted for approximately % of the revenue.
The global market for IC Package Substrates in Smart Phone is estimated to increase from $ million in 2022 to $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Considering the economic change due to COVID-19 and Russia-Ukraine War Influence, FC-BGA, which accounted for % of the global market of IC Package Substrates in 2022, is expected to reach million US$ by 2029, growing at a revised CAGR of % from 2023 to 2029.
Report Scope
This report aims to provide a comprehensive presentation of the global market for IC Package Substrates, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding IC Package Substrates.
The IC Package Substrates market size, estimations, and forecasts are provided in terms of output/shipments (K Sqm) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global IC Package Substrates market comprehensively. Regional market sizes, concerning products by types, by application, and by players, are also provided. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the IC Package Substrates manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, product type, application, and regions.
Key Companies & Market Share Insights
In this section, the readers will gain an understanding of the key players competing. This report has studied the key growth strategies, such as innovative trends and developments, intensification of product portfolio, mergers and acquisitions, collaborations, new product innovation, and geographical expansion, undertaken by these participants to maintain their presence. Apart from business strategies, the study includes current developments and key financials. The readers will also get access to the data related to global revenue, price, and sales by manufacturers for the period 2018-2023. This all-inclusive report will certainly serve the clients to stay updated and make effective decisions in their businesses. Some of the prominent players reviewed in the research report include:
Global markets are presented by IC Package Substrates type, along with growth forecasts through 2029. Estimates on production and value are based on the price in the supply chain at which the IC Package Substrates are procured by the manufacturers.
This report has studied every segment and provided the market size using historical data. They have also talked about the growth opportunities that the segment may pose in the future. This study bestows production and revenue data by type, and during the historical period (2018-2023) and forecast period (2024-2029).
IC Package Substrates segment by Type
This report has provided the market size (production and revenue data) by application, during the historical period (2018-2023) and forecast period (2024-2029).
This report also outlines the market trends of each segment and consumer behaviors impacting the IC Package Substrates market and what implications these may have on the industry's future. This report can help to understand the relevant market and consumer trends that are driving the IC Package Substrates market.
IC Package Substrates segment by Application
This section of the report provides key insights regarding various regions and the key players operating in each region. Economic, social, environmental, technological, and political factors have been taken into consideration while assessing the growth of the particular region/country. The readers will also get their hands on the revenue and sales data of each region and country for the period 2018-2029.
The market has been segmented into various major geographies, including North America, Europe, Asia-Pacific, South America. Detailed analysis of major countries such as the USA, Germany, the U.K., Italy, France, China, Japan, South Korea, Southeast Asia, and India will be covered within the regional segment. For market estimates, data are going to be provided for 2022 because of the base year, with estimates for 2023 and forecast value for 2029.
High-impact rendering factors and drivers have been studied in this report to aid the readers to understand the general development. Moreover, the report includes restraints and challenges that may act as stumbling blocks on the way of the players. This will assist the users to be attentive and make informed decisions related to business. Specialists have also laid their focus on the upcoming business prospects.
COVID-19 and Russia-Ukraine War Influence Analysis
The readers in the section will understand how the IC Package Substrates market scenario changed across the globe during the pandemic, post-pandemic and Russia-Ukraine War. The study is done keeping in view the changes in aspects such as demand, consumption, transportation, consumer behavior, supply chain management, export and import, and production. The industry experts have also highlighted the key factors that will help create opportunities for players and stabilize the overall industry in the years to come.
Reasons to Buy This Report
This report will help the readers to understand the competition within the industries and strategies for the competitive environment to enhance the potential profit. The report also focuses on the competitive landscape of the global IC Package Substrates market, and introduces in detail the market share, industry ranking, competitor ecosystem, market performance, new product development, operation situation, expansion, and acquisition. etc. of the main players, which helps the readers to identify the main competitors and deeply understand the competition pattern of the market.
This report will help stakeholders to understand the global industry status and trends of IC Package Substrates and provides them with information on key market drivers, restraints, challenges, and opportunities.
This report will help stakeholders to understand competitors better and gain more insights to strengthen their position in their businesses. The competitive landscape section includes the market share and rank (in volume and value), competitor ecosystem, new product development, expansion, and acquisition.
This report stays updated with novel technology integration, features, and the latest developments in the market
This report helps stakeholders to understand the COVID-19 and Russia-Ukraine War Influence on the IC Package Substrates industry.
This report helps stakeholders to gain insights into which regions to target globally
This report helps stakeholders to gain insights into the end-user perception concerning the adoption of IC Package Substrates.
This report helps stakeholders to identify some of the key players in the market and understand their valuable contribution.
Core Chapters
Chapter 1: Research objectives, research methods, data sources, data cross-validation;
Chapter 2: Introduces the report scope of the report, executive summary of different market segments (by region, product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 3: Detailed analysis of IC Package Substrates manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 5: Production/output, value of IC Package Substrates by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 6: Consumption of IC Package Substrates in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 7: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 8: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 9: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 10: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 11: The main points and conclusions of the report.
The global IC Package Substrates market is projected to reach US$ million by 2029 from an estimated US$ million in 2022, at a CAGR of % during 2023 and 2029.
North American market for IC Package Substrates is estimated to increase from $ million in 2022 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Asia-Pacific market for IC Package Substrates is estimated to increase from $ million in 2022 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The major global companies of IC Package Substrates include Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect Technology, AT&S, Semco, Kyocera and TOPPAN, etc. In 2022, the world's top three vendors accounted for approximately % of the revenue.
The global market for IC Package Substrates in Smart Phone is estimated to increase from $ million in 2022 to $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Considering the economic change due to COVID-19 and Russia-Ukraine War Influence, FC-BGA, which accounted for % of the global market of IC Package Substrates in 2022, is expected to reach million US$ by 2029, growing at a revised CAGR of % from 2023 to 2029.
Report Scope
This report aims to provide a comprehensive presentation of the global market for IC Package Substrates, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding IC Package Substrates.
The IC Package Substrates market size, estimations, and forecasts are provided in terms of output/shipments (K Sqm) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global IC Package Substrates market comprehensively. Regional market sizes, concerning products by types, by application, and by players, are also provided. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the IC Package Substrates manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, product type, application, and regions.
Key Companies & Market Share Insights
In this section, the readers will gain an understanding of the key players competing. This report has studied the key growth strategies, such as innovative trends and developments, intensification of product portfolio, mergers and acquisitions, collaborations, new product innovation, and geographical expansion, undertaken by these participants to maintain their presence. Apart from business strategies, the study includes current developments and key financials. The readers will also get access to the data related to global revenue, price, and sales by manufacturers for the period 2018-2023. This all-inclusive report will certainly serve the clients to stay updated and make effective decisions in their businesses. Some of the prominent players reviewed in the research report include:
- Unimicron
- Ibiden
- Nan Ya PCB
- Shinko Electric Industries
- Kinsus Interconnect Technology
- AT&S
- Semco
- Kyocera
- TOPPAN
- Zhen Ding Technology
- Daeduck Electronics
- ASE Material
- LG InnoTek
- Simmtech
- Shennan Circuit
- Shenzhen Fastprint Circuit Tech
- ACCESS
- Suntak Technology
- National Center for Advanced Packaging (NCAP China)
- Huizhou China Eagle Electronic Technology
- DSBJ
- Shenzhen Kinwong Electronic
- AKM Meadville
- Victory Giant Technology
Global markets are presented by IC Package Substrates type, along with growth forecasts through 2029. Estimates on production and value are based on the price in the supply chain at which the IC Package Substrates are procured by the manufacturers.
This report has studied every segment and provided the market size using historical data. They have also talked about the growth opportunities that the segment may pose in the future. This study bestows production and revenue data by type, and during the historical period (2018-2023) and forecast period (2024-2029).
IC Package Substrates segment by Type
- FC-BGA
- FC-CSP
- WB BGA
- WB CSP
- RF Module
- Others
This report has provided the market size (production and revenue data) by application, during the historical period (2018-2023) and forecast period (2024-2029).
This report also outlines the market trends of each segment and consumer behaviors impacting the IC Package Substrates market and what implications these may have on the industry's future. This report can help to understand the relevant market and consumer trends that are driving the IC Package Substrates market.
IC Package Substrates segment by Application
- Smart Phone
- PC (tablet and Laptop)
- Wearable Device
- Others
This section of the report provides key insights regarding various regions and the key players operating in each region. Economic, social, environmental, technological, and political factors have been taken into consideration while assessing the growth of the particular region/country. The readers will also get their hands on the revenue and sales data of each region and country for the period 2018-2029.
The market has been segmented into various major geographies, including North America, Europe, Asia-Pacific, South America. Detailed analysis of major countries such as the USA, Germany, the U.K., Italy, France, China, Japan, South Korea, Southeast Asia, and India will be covered within the regional segment. For market estimates, data are going to be provided for 2022 because of the base year, with estimates for 2023 and forecast value for 2029.
- North America
- United States
- Canada
- Europe
- Germany
- France
- U.K.
- Italy
- Russia
- Asia-Pacific
- China
- Japan
- South Korea
- India
- Australia
- China Taiwan
- Indonesia
- Thailand
- Malaysia
- Latin America
- Mexico
- Brazil
- Argentina
High-impact rendering factors and drivers have been studied in this report to aid the readers to understand the general development. Moreover, the report includes restraints and challenges that may act as stumbling blocks on the way of the players. This will assist the users to be attentive and make informed decisions related to business. Specialists have also laid their focus on the upcoming business prospects.
COVID-19 and Russia-Ukraine War Influence Analysis
The readers in the section will understand how the IC Package Substrates market scenario changed across the globe during the pandemic, post-pandemic and Russia-Ukraine War. The study is done keeping in view the changes in aspects such as demand, consumption, transportation, consumer behavior, supply chain management, export and import, and production. The industry experts have also highlighted the key factors that will help create opportunities for players and stabilize the overall industry in the years to come.
Reasons to Buy This Report
This report will help the readers to understand the competition within the industries and strategies for the competitive environment to enhance the potential profit. The report also focuses on the competitive landscape of the global IC Package Substrates market, and introduces in detail the market share, industry ranking, competitor ecosystem, market performance, new product development, operation situation, expansion, and acquisition. etc. of the main players, which helps the readers to identify the main competitors and deeply understand the competition pattern of the market.
This report will help stakeholders to understand the global industry status and trends of IC Package Substrates and provides them with information on key market drivers, restraints, challenges, and opportunities.
This report will help stakeholders to understand competitors better and gain more insights to strengthen their position in their businesses. The competitive landscape section includes the market share and rank (in volume and value), competitor ecosystem, new product development, expansion, and acquisition.
This report stays updated with novel technology integration, features, and the latest developments in the market
This report helps stakeholders to understand the COVID-19 and Russia-Ukraine War Influence on the IC Package Substrates industry.
This report helps stakeholders to gain insights into which regions to target globally
This report helps stakeholders to gain insights into the end-user perception concerning the adoption of IC Package Substrates.
This report helps stakeholders to identify some of the key players in the market and understand their valuable contribution.
Core Chapters
Chapter 1: Research objectives, research methods, data sources, data cross-validation;
Chapter 2: Introduces the report scope of the report, executive summary of different market segments (by region, product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 3: Detailed analysis of IC Package Substrates manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 5: Production/output, value of IC Package Substrates by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 6: Consumption of IC Package Substrates in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 7: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 8: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 9: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 10: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 11: The main points and conclusions of the report.
1 PREFACE
1.1 Scope of Report
1.2 Reasons for Doing This Study
1.3 Research Methodology
1.4 Research Process
1.5 Data Source
1.5.1 Secondary Sources
1.5.2 Primary Sources
2 MARKET OVERVIEW
2.1 Product Definition
2.2 IC Package Substrates by Type
2.2.1 Market Value Comparison by Type (2018 VS 2022 VS 2029) & (US$ Million)
1.2.2 FC-BGA
1.2.3 FC-CSP
1.2.4 WB BGA
1.2.5 WB CSP
1.2.6 RF Module
1.2.7 Others
2.3 IC Package Substrates by Application
2.3.1 Market Value Comparison by Application (2018 VS 2022 VS 2029) & (US$ Million)
2.3.2 Smart Phone
2.3.3 PC (tablet and Laptop)
2.3.4 Wearable Device
2.3.5 Others
2.4 Global Market Growth Prospects
2.4.1 Global IC Package Substrates Production Value Estimates and Forecasts (2018-2029)
2.4.2 Global IC Package Substrates Production Capacity Estimates and Forecasts (2018-2029)
2.4.3 Global IC Package Substrates Production Estimates and Forecasts (2018-2029)
2.4.4 Global IC Package Substrates Market Average Price (2018-2029)
3 MARKET COMPETITIVE LANDSCAPE BY MANUFACTURERS
3.1 Global IC Package Substrates Production by Manufacturers (2018-2023)
3.2 Global IC Package Substrates Production Value by Manufacturers (2018-2023)
3.3 Global IC Package Substrates Average Price by Manufacturers (2018-2023)
3.4 Global IC Package Substrates Industry Manufacturers Ranking, 2021 VS 2022 VS 2023
3.5 Global IC Package Substrates Key Manufacturers, Manufacturing Sites & Headquarters
3.6 Global IC Package Substrates Manufacturers, Product Type & Application
3.7 Global IC Package Substrates Manufacturers, Date of Enter into This Industry
3.8 Global IC Package Substrates Market CR5 and HHI
3.9 Global Manufacturers Mergers & Acquisition
4 MANUFACTURERS PROFILED
4.1 Unimicron
4.1.1 Unimicron IC Package Substrates Company Information
4.1.2 Unimicron IC Package Substrates Business Overview
4.1.3 Unimicron IC Package Substrates Production, Value and Gross Margin (2018-2023)
4.1.4 Unimicron Product Portfolio
4.1.5 Unimicron Recent Developments
4.2 Ibiden
4.2.1 Ibiden IC Package Substrates Company Information
4.2.2 Ibiden IC Package Substrates Business Overview
4.2.3 Ibiden IC Package Substrates Production, Value and Gross Margin (2018-2023)
4.2.4 Ibiden Product Portfolio
4.2.5 Ibiden Recent Developments
4.3 Nan Ya PCB
4.3.1 Nan Ya PCB IC Package Substrates Company Information
4.3.2 Nan Ya PCB IC Package Substrates Business Overview
4.3.3 Nan Ya PCB IC Package Substrates Production, Value and Gross Margin (2018-2023)
4.3.4 Nan Ya PCB Product Portfolio
4.3.5 Nan Ya PCB Recent Developments
4.4 Shinko Electric Industries
4.4.1 Shinko Electric Industries IC Package Substrates Company Information
4.4.2 Shinko Electric Industries IC Package Substrates Business Overview
4.4.3 Shinko Electric Industries IC Package Substrates Production, Value and Gross Margin (2018-2023)
4.4.4 Shinko Electric Industries Product Portfolio
4.4.5 Shinko Electric Industries Recent Developments
4.5 Kinsus Interconnect Technology
4.5.1 Kinsus Interconnect Technology IC Package Substrates Company Information
4.5.2 Kinsus Interconnect Technology IC Package Substrates Business Overview
4.5.3 Kinsus Interconnect Technology IC Package Substrates Production, Value and Gross Margin (2018-2023)
4.5.4 Kinsus Interconnect Technology Product Portfolio
4.5.5 Kinsus Interconnect Technology Recent Developments
4.6 AT&S
4.6.1 AT&S IC Package Substrates Company Information
4.6.2 AT&S IC Package Substrates Business Overview
4.6.3 AT&S IC Package Substrates Production, Value and Gross Margin (2018-2023)
4.6.4 AT&S Product Portfolio
4.6.5 AT&S Recent Developments
4.7 Semco
4.7.1 Semco IC Package Substrates Company Information
4.7.2 Semco IC Package Substrates Business Overview
4.7.3 Semco IC Package Substrates Production, Value and Gross Margin (2018-2023)
4.7.4 Semco Product Portfolio
4.7.5 Semco Recent Developments
4.8 Kyocera
4.8.1 Kyocera IC Package Substrates Company Information
4.8.2 Kyocera IC Package Substrates Business Overview
4.8.3 Kyocera IC Package Substrates Production, Value and Gross Margin (2018-2023)
4.8.4 Kyocera Product Portfolio
4.8.5 Kyocera Recent Developments
4.9 TOPPAN
4.9.1 TOPPAN IC Package Substrates Company Information
4.9.2 TOPPAN IC Package Substrates Business Overview
4.9.3 TOPPAN IC Package Substrates Production, Value and Gross Margin (2018-2023)
4.9.4 TOPPAN Product Portfolio
4.9.5 TOPPAN Recent Developments
4.10 Zhen Ding Technology
4.10.1 Zhen Ding Technology IC Package Substrates Company Information
4.10.2 Zhen Ding Technology IC Package Substrates Business Overview
4.10.3 Zhen Ding Technology IC Package Substrates Production, Value and Gross Margin (2018-2023)
4.10.4 Zhen Ding Technology Product Portfolio
4.10.5 Zhen Ding Technology Recent Developments
7.11 Daeduck Electronics
7.11.1 Daeduck Electronics IC Package Substrates Company Information
7.11.2 Daeduck Electronics IC Package Substrates Business Overview
4.11.3 Daeduck Electronics IC Package Substrates Production, Value and Gross Margin (2018-2023)
7.11.4 Daeduck Electronics Product Portfolio
7.11.5 Daeduck Electronics Recent Developments
7.12 ASE Material
7.12.1 ASE Material IC Package Substrates Company Information
7.12.2 ASE Material IC Package Substrates Business Overview
7.12.3 ASE Material IC Package Substrates Production, Value and Gross Margin (2018-2023)
7.12.4 ASE Material Product Portfolio
7.12.5 ASE Material Recent Developments
7.13 LG InnoTek
7.13.1 LG InnoTek IC Package Substrates Company Information
7.13.2 LG InnoTek IC Package Substrates Business Overview
7.13.3 LG InnoTek IC Package Substrates Production, Value and Gross Margin (2018-2023)
7.13.4 LG InnoTek Product Portfolio
7.13.5 LG InnoTek Recent Developments
7.14 Simmtech
7.14.1 Simmtech IC Package Substrates Company Information
7.14.2 Simmtech IC Package Substrates Business Overview
7.14.3 Simmtech IC Package Substrates Production, Value and Gross Margin (2018-2023)
7.14.4 Simmtech Product Portfolio
7.14.5 Simmtech Recent Developments
7.15 Shennan Circuit
7.15.1 Shennan Circuit IC Package Substrates Company Information
7.15.2 Shennan Circuit IC Package Substrates Business Overview
7.15.3 Shennan Circuit IC Package Substrates Production, Value and Gross Margin (2018-2023)
7.15.4 Shennan Circuit Product Portfolio
7.15.5 Shennan Circuit Recent Developments
7.16 Shenzhen Fastprint Circuit Tech
7.16.1 Shenzhen Fastprint Circuit Tech IC Package Substrates Company Information
7.16.2 Shenzhen Fastprint Circuit Tech IC Package Substrates Business Overview
7.16.3 Shenzhen Fastprint Circuit Tech IC Package Substrates Production, Value and Gross Margin (2018-2023)
7.16.4 Shenzhen Fastprint Circuit Tech Product Portfolio
7.16.5 Shenzhen Fastprint Circuit Tech Recent Developments
7.17 ACCESS
7.17.1 ACCESS IC Package Substrates Company Information
7.17.2 ACCESS IC Package Substrates Business Overview
7.17.3 ACCESS IC Package Substrates Production, Value and Gross Margin (2018-2023)
7.17.4 ACCESS Product Portfolio
7.17.5 ACCESS Recent Developments
7.18 Suntak Technology
7.18.1 Suntak Technology IC Package Substrates Company Information
7.18.2 Suntak Technology IC Package Substrates Business Overview
7.18.3 Suntak Technology IC Package Substrates Production, Value and Gross Margin (2018-2023)
7.18.4 Suntak Technology Product Portfolio
7.18.5 Suntak Technology Recent Developments
7.19 National Center for Advanced Packaging (NCAP China)
7.19.1 National Center for Advanced Packaging (NCAP China) IC Package Substrates Company Information
7.19.2 National Center for Advanced Packaging (NCAP China) IC Package Substrates Business Overview
7.19.3 National Center for Advanced Packaging (NCAP China) IC Package Substrates Production, Value and Gross Margin (2018-2023)
7.19.4 National Center for Advanced Packaging (NCAP China) Product Portfolio
7.19.5 National Center for Advanced Packaging (NCAP China) Recent Developments
7.20 Huizhou China Eagle Electronic Technology
7.20.1 Huizhou China Eagle Electronic Technology IC Package Substrates Company Information
7.20.2 Huizhou China Eagle Electronic Technology IC Package Substrates Business Overview
7.20.3 Huizhou China Eagle Electronic Technology IC Package Substrates Production, Value and Gross Margin (2018-2023)
7.20.4 Huizhou China Eagle Electronic Technology Product Portfolio
7.20.5 Huizhou China Eagle Electronic Technology Recent Developments
7.21 DSBJ
7.21.1 DSBJ IC Package Substrates Company Information
7.21.2 DSBJ IC Package Substrates Business Overview
7.21.3 DSBJ IC Package Substrates Production, Value and Gross Margin (2018-2023)
7.21.4 DSBJ Product Portfolio
7.21.5 DSBJ Recent Developments
7.22 Shenzhen Kinwong Electronic
7.22.1 Shenzhen Kinwong Electronic IC Package Substrates Company Information
7.22.2 Shenzhen Kinwong Electronic IC Package Substrates Business Overview
7.22.3 Shenzhen Kinwong Electronic IC Package Substrates Production, Value and Gross Margin (2018-2023)
7.22.4 Shenzhen Kinwong Electronic Product Portfolio
7.22.5 Shenzhen Kinwong Electronic Recent Developments
7.23 AKM Meadville
7.23.1 AKM Meadville IC Package Substrates Company Information
7.23.2 AKM Meadville IC Package Substrates Business Overview
7.23.3 AKM Meadville IC Package Substrates Production, Value and Gross Margin (2018-2023)
7.23.4 AKM Meadville Product Portfolio
7.23.5 AKM Meadville Recent Developments
7.24 Victory Giant Technology
7.24.1 Victory Giant Technology IC Package Substrates Company Information
7.24.2 Victory Giant Technology IC Package Substrates Business Overview
7.24.3 Victory Giant Technology IC Package Substrates Production, Value and Gross Margin (2018-2023)
7.24.4 Victory Giant Technology Product Portfolio
7.24.5 Victory Giant Technology Recent Developments
5 GLOBAL IC PACKAGE SUBSTRATES PRODUCTION BY REGION
5.1 Global IC Package Substrates Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
5.2 Global IC Package Substrates Production by Region: 2018-2029
5.2.1 Global IC Package Substrates Production by Region: 2018-2023
5.2.2 Global IC Package Substrates Production Forecast by Region (2024-2029)
5.3 Global IC Package Substrates Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
5.4 Global IC Package Substrates Production Value by Region: 2018-2029
5.4.1 Global IC Package Substrates Production Value by Region: 2018-2023
5.4.2 Global IC Package Substrates Production Value Forecast by Region (2024-2029)
5.5 Global IC Package Substrates Market Price Analysis by Region (2018-2023)
5.6 Global IC Package Substrates Production and Value, YOY Growth
5.6.1 North America IC Package Substrates Production Value Estimates and Forecasts (2018-2029)
5.6.2 Europe IC Package Substrates Production Value Estimates and Forecasts (2018-2029)
5.6.3 China IC Package Substrates Production Value Estimates and Forecasts (2018-2029)
5.6.4 Japan IC Package Substrates Production Value Estimates and Forecasts (2018-2029)
5.6.5 South Korea IC Package Substrates Production Value Estimates and Forecasts (2018-2029)
6 GLOBAL IC PACKAGE SUBSTRATES CONSUMPTION BY REGION
6.1 Global IC Package Substrates Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
6.2 Global IC Package Substrates Consumption by Region (2018-2029)
6.2.1 Global IC Package Substrates Consumption by Region: 2018-2029
6.2.2 Global IC Package Substrates Forecasted Consumption by Region (2024-2029)
6.3 North America
6.3.1 North America IC Package Substrates Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
6.3.2 North America IC Package Substrates Consumption by Country (2018-2029)
6.3.3 United States
6.3.4 Canada
6.4 Europe
6.4.1 Europe IC Package Substrates Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
6.4.2 Europe IC Package Substrates Consumption by Country (2018-2029)
6.4.3 Germany
6.4.4 France
6.4.5 U.K.
6.4.6 Italy
6.4.7 Russia
6.5 Asia Pacific
6.5.1 Asia Pacific IC Package Substrates Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
6.5.2 Asia Pacific IC Package Substrates Consumption by Country (2018-2029)
6.5.3 China
6.5.4 Japan
6.5.5 South Korea
6.5.6 China Taiwan
6.5.7 Southeast Asia
6.5.8 India
6.5.9 Australia
6.6 Latin America, Middle East & Africa
6.6.1 Latin America, Middle East & Africa IC Package Substrates Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
6.6.2 Latin America, Middle East & Africa IC Package Substrates Consumption by Country (2018-2029)
6.6.3 Mexico
6.6.4 Brazil
6.6.5 Turkey
6.6.5 GCC Countries
7 SEGMENT BY TYPE
7.1 Global IC Package Substrates Production by Type (2018-2029)
7.1.1 Global IC Package Substrates Production by Type (2018-2029) & (K Sqm)
7.1.2 Global IC Package Substrates Production Market Share by Type (2018-2029)
7.2 Global IC Package Substrates Production Value by Type (2018-2029)
7.2.1 Global IC Package Substrates Production Value by Type (2018-2029) & (US$ Million)
7.2.2 Global IC Package Substrates Production Value Market Share by Type (2018-2029)
7.3 Global IC Package Substrates Price by Type (2018-2029)
8 SEGMENT BY APPLICATION
8.1 Global IC Package Substrates Production by Application (2018-2029)
8.1.1 Global IC Package Substrates Production by Application (2018-2029) & (K Sqm)
8.1.2 Global IC Package Substrates Production by Application (2018-2029) & (K Sqm)
8.2 Global IC Package Substrates Production Value by Application (2018-2029)
8.2.1 Global IC Package Substrates Production Value by Application (2018-2029) & (US$ Million)
8.2.2 Global IC Package Substrates Production Value Market Share by Application (2018-2029)
8.3 Global IC Package Substrates Price by Application (2018-2029)
9 VALUE CHAIN AND SALES CHANNELS ANALYSIS OF THE MARKET
9.1 IC Package Substrates Value Chain Analysis
9.1.1 IC Package Substrates Key Raw Materials
9.1.2 Raw Materials Key Suppliers
9.1.3 IC Package Substrates Production Mode & Process
9.2 IC Package Substrates Sales Channels Analysis
9.2.1 Direct Comparison with Distribution Share
9.2.2 IC Package Substrates Distributors
9.2.3 IC Package Substrates Customers
10 GLOBAL IC PACKAGE SUBSTRATES ANALYZING MARKET DYNAMICS
10.1 IC Package Substrates Industry Trends
10.2 IC Package Substrates Industry Drivers
10.3 IC Package Substrates Industry Opportunities and Challenges
10.4 IC Package Substrates Industry Restraints
11 REPORT CONCLUSION
12 DISCLAIMER
1.1 Scope of Report
1.2 Reasons for Doing This Study
1.3 Research Methodology
1.4 Research Process
1.5 Data Source
1.5.1 Secondary Sources
1.5.2 Primary Sources
2 MARKET OVERVIEW
2.1 Product Definition
2.2 IC Package Substrates by Type
2.2.1 Market Value Comparison by Type (2018 VS 2022 VS 2029) & (US$ Million)
1.2.2 FC-BGA
1.2.3 FC-CSP
1.2.4 WB BGA
1.2.5 WB CSP
1.2.6 RF Module
1.2.7 Others
2.3 IC Package Substrates by Application
2.3.1 Market Value Comparison by Application (2018 VS 2022 VS 2029) & (US$ Million)
2.3.2 Smart Phone
2.3.3 PC (tablet and Laptop)
2.3.4 Wearable Device
2.3.5 Others
2.4 Global Market Growth Prospects
2.4.1 Global IC Package Substrates Production Value Estimates and Forecasts (2018-2029)
2.4.2 Global IC Package Substrates Production Capacity Estimates and Forecasts (2018-2029)
2.4.3 Global IC Package Substrates Production Estimates and Forecasts (2018-2029)
2.4.4 Global IC Package Substrates Market Average Price (2018-2029)
3 MARKET COMPETITIVE LANDSCAPE BY MANUFACTURERS
3.1 Global IC Package Substrates Production by Manufacturers (2018-2023)
3.2 Global IC Package Substrates Production Value by Manufacturers (2018-2023)
3.3 Global IC Package Substrates Average Price by Manufacturers (2018-2023)
3.4 Global IC Package Substrates Industry Manufacturers Ranking, 2021 VS 2022 VS 2023
3.5 Global IC Package Substrates Key Manufacturers, Manufacturing Sites & Headquarters
3.6 Global IC Package Substrates Manufacturers, Product Type & Application
3.7 Global IC Package Substrates Manufacturers, Date of Enter into This Industry
3.8 Global IC Package Substrates Market CR5 and HHI
3.9 Global Manufacturers Mergers & Acquisition
4 MANUFACTURERS PROFILED
4.1 Unimicron
4.1.1 Unimicron IC Package Substrates Company Information
4.1.2 Unimicron IC Package Substrates Business Overview
4.1.3 Unimicron IC Package Substrates Production, Value and Gross Margin (2018-2023)
4.1.4 Unimicron Product Portfolio
4.1.5 Unimicron Recent Developments
4.2 Ibiden
4.2.1 Ibiden IC Package Substrates Company Information
4.2.2 Ibiden IC Package Substrates Business Overview
4.2.3 Ibiden IC Package Substrates Production, Value and Gross Margin (2018-2023)
4.2.4 Ibiden Product Portfolio
4.2.5 Ibiden Recent Developments
4.3 Nan Ya PCB
4.3.1 Nan Ya PCB IC Package Substrates Company Information
4.3.2 Nan Ya PCB IC Package Substrates Business Overview
4.3.3 Nan Ya PCB IC Package Substrates Production, Value and Gross Margin (2018-2023)
4.3.4 Nan Ya PCB Product Portfolio
4.3.5 Nan Ya PCB Recent Developments
4.4 Shinko Electric Industries
4.4.1 Shinko Electric Industries IC Package Substrates Company Information
4.4.2 Shinko Electric Industries IC Package Substrates Business Overview
4.4.3 Shinko Electric Industries IC Package Substrates Production, Value and Gross Margin (2018-2023)
4.4.4 Shinko Electric Industries Product Portfolio
4.4.5 Shinko Electric Industries Recent Developments
4.5 Kinsus Interconnect Technology
4.5.1 Kinsus Interconnect Technology IC Package Substrates Company Information
4.5.2 Kinsus Interconnect Technology IC Package Substrates Business Overview
4.5.3 Kinsus Interconnect Technology IC Package Substrates Production, Value and Gross Margin (2018-2023)
4.5.4 Kinsus Interconnect Technology Product Portfolio
4.5.5 Kinsus Interconnect Technology Recent Developments
4.6 AT&S
4.6.1 AT&S IC Package Substrates Company Information
4.6.2 AT&S IC Package Substrates Business Overview
4.6.3 AT&S IC Package Substrates Production, Value and Gross Margin (2018-2023)
4.6.4 AT&S Product Portfolio
4.6.5 AT&S Recent Developments
4.7 Semco
4.7.1 Semco IC Package Substrates Company Information
4.7.2 Semco IC Package Substrates Business Overview
4.7.3 Semco IC Package Substrates Production, Value and Gross Margin (2018-2023)
4.7.4 Semco Product Portfolio
4.7.5 Semco Recent Developments
4.8 Kyocera
4.8.1 Kyocera IC Package Substrates Company Information
4.8.2 Kyocera IC Package Substrates Business Overview
4.8.3 Kyocera IC Package Substrates Production, Value and Gross Margin (2018-2023)
4.8.4 Kyocera Product Portfolio
4.8.5 Kyocera Recent Developments
4.9 TOPPAN
4.9.1 TOPPAN IC Package Substrates Company Information
4.9.2 TOPPAN IC Package Substrates Business Overview
4.9.3 TOPPAN IC Package Substrates Production, Value and Gross Margin (2018-2023)
4.9.4 TOPPAN Product Portfolio
4.9.5 TOPPAN Recent Developments
4.10 Zhen Ding Technology
4.10.1 Zhen Ding Technology IC Package Substrates Company Information
4.10.2 Zhen Ding Technology IC Package Substrates Business Overview
4.10.3 Zhen Ding Technology IC Package Substrates Production, Value and Gross Margin (2018-2023)
4.10.4 Zhen Ding Technology Product Portfolio
4.10.5 Zhen Ding Technology Recent Developments
7.11 Daeduck Electronics
7.11.1 Daeduck Electronics IC Package Substrates Company Information
7.11.2 Daeduck Electronics IC Package Substrates Business Overview
4.11.3 Daeduck Electronics IC Package Substrates Production, Value and Gross Margin (2018-2023)
7.11.4 Daeduck Electronics Product Portfolio
7.11.5 Daeduck Electronics Recent Developments
7.12 ASE Material
7.12.1 ASE Material IC Package Substrates Company Information
7.12.2 ASE Material IC Package Substrates Business Overview
7.12.3 ASE Material IC Package Substrates Production, Value and Gross Margin (2018-2023)
7.12.4 ASE Material Product Portfolio
7.12.5 ASE Material Recent Developments
7.13 LG InnoTek
7.13.1 LG InnoTek IC Package Substrates Company Information
7.13.2 LG InnoTek IC Package Substrates Business Overview
7.13.3 LG InnoTek IC Package Substrates Production, Value and Gross Margin (2018-2023)
7.13.4 LG InnoTek Product Portfolio
7.13.5 LG InnoTek Recent Developments
7.14 Simmtech
7.14.1 Simmtech IC Package Substrates Company Information
7.14.2 Simmtech IC Package Substrates Business Overview
7.14.3 Simmtech IC Package Substrates Production, Value and Gross Margin (2018-2023)
7.14.4 Simmtech Product Portfolio
7.14.5 Simmtech Recent Developments
7.15 Shennan Circuit
7.15.1 Shennan Circuit IC Package Substrates Company Information
7.15.2 Shennan Circuit IC Package Substrates Business Overview
7.15.3 Shennan Circuit IC Package Substrates Production, Value and Gross Margin (2018-2023)
7.15.4 Shennan Circuit Product Portfolio
7.15.5 Shennan Circuit Recent Developments
7.16 Shenzhen Fastprint Circuit Tech
7.16.1 Shenzhen Fastprint Circuit Tech IC Package Substrates Company Information
7.16.2 Shenzhen Fastprint Circuit Tech IC Package Substrates Business Overview
7.16.3 Shenzhen Fastprint Circuit Tech IC Package Substrates Production, Value and Gross Margin (2018-2023)
7.16.4 Shenzhen Fastprint Circuit Tech Product Portfolio
7.16.5 Shenzhen Fastprint Circuit Tech Recent Developments
7.17 ACCESS
7.17.1 ACCESS IC Package Substrates Company Information
7.17.2 ACCESS IC Package Substrates Business Overview
7.17.3 ACCESS IC Package Substrates Production, Value and Gross Margin (2018-2023)
7.17.4 ACCESS Product Portfolio
7.17.5 ACCESS Recent Developments
7.18 Suntak Technology
7.18.1 Suntak Technology IC Package Substrates Company Information
7.18.2 Suntak Technology IC Package Substrates Business Overview
7.18.3 Suntak Technology IC Package Substrates Production, Value and Gross Margin (2018-2023)
7.18.4 Suntak Technology Product Portfolio
7.18.5 Suntak Technology Recent Developments
7.19 National Center for Advanced Packaging (NCAP China)
7.19.1 National Center for Advanced Packaging (NCAP China) IC Package Substrates Company Information
7.19.2 National Center for Advanced Packaging (NCAP China) IC Package Substrates Business Overview
7.19.3 National Center for Advanced Packaging (NCAP China) IC Package Substrates Production, Value and Gross Margin (2018-2023)
7.19.4 National Center for Advanced Packaging (NCAP China) Product Portfolio
7.19.5 National Center for Advanced Packaging (NCAP China) Recent Developments
7.20 Huizhou China Eagle Electronic Technology
7.20.1 Huizhou China Eagle Electronic Technology IC Package Substrates Company Information
7.20.2 Huizhou China Eagle Electronic Technology IC Package Substrates Business Overview
7.20.3 Huizhou China Eagle Electronic Technology IC Package Substrates Production, Value and Gross Margin (2018-2023)
7.20.4 Huizhou China Eagle Electronic Technology Product Portfolio
7.20.5 Huizhou China Eagle Electronic Technology Recent Developments
7.21 DSBJ
7.21.1 DSBJ IC Package Substrates Company Information
7.21.2 DSBJ IC Package Substrates Business Overview
7.21.3 DSBJ IC Package Substrates Production, Value and Gross Margin (2018-2023)
7.21.4 DSBJ Product Portfolio
7.21.5 DSBJ Recent Developments
7.22 Shenzhen Kinwong Electronic
7.22.1 Shenzhen Kinwong Electronic IC Package Substrates Company Information
7.22.2 Shenzhen Kinwong Electronic IC Package Substrates Business Overview
7.22.3 Shenzhen Kinwong Electronic IC Package Substrates Production, Value and Gross Margin (2018-2023)
7.22.4 Shenzhen Kinwong Electronic Product Portfolio
7.22.5 Shenzhen Kinwong Electronic Recent Developments
7.23 AKM Meadville
7.23.1 AKM Meadville IC Package Substrates Company Information
7.23.2 AKM Meadville IC Package Substrates Business Overview
7.23.3 AKM Meadville IC Package Substrates Production, Value and Gross Margin (2018-2023)
7.23.4 AKM Meadville Product Portfolio
7.23.5 AKM Meadville Recent Developments
7.24 Victory Giant Technology
7.24.1 Victory Giant Technology IC Package Substrates Company Information
7.24.2 Victory Giant Technology IC Package Substrates Business Overview
7.24.3 Victory Giant Technology IC Package Substrates Production, Value and Gross Margin (2018-2023)
7.24.4 Victory Giant Technology Product Portfolio
7.24.5 Victory Giant Technology Recent Developments
5 GLOBAL IC PACKAGE SUBSTRATES PRODUCTION BY REGION
5.1 Global IC Package Substrates Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
5.2 Global IC Package Substrates Production by Region: 2018-2029
5.2.1 Global IC Package Substrates Production by Region: 2018-2023
5.2.2 Global IC Package Substrates Production Forecast by Region (2024-2029)
5.3 Global IC Package Substrates Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
5.4 Global IC Package Substrates Production Value by Region: 2018-2029
5.4.1 Global IC Package Substrates Production Value by Region: 2018-2023
5.4.2 Global IC Package Substrates Production Value Forecast by Region (2024-2029)
5.5 Global IC Package Substrates Market Price Analysis by Region (2018-2023)
5.6 Global IC Package Substrates Production and Value, YOY Growth
5.6.1 North America IC Package Substrates Production Value Estimates and Forecasts (2018-2029)
5.6.2 Europe IC Package Substrates Production Value Estimates and Forecasts (2018-2029)
5.6.3 China IC Package Substrates Production Value Estimates and Forecasts (2018-2029)
5.6.4 Japan IC Package Substrates Production Value Estimates and Forecasts (2018-2029)
5.6.5 South Korea IC Package Substrates Production Value Estimates and Forecasts (2018-2029)
6 GLOBAL IC PACKAGE SUBSTRATES CONSUMPTION BY REGION
6.1 Global IC Package Substrates Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
6.2 Global IC Package Substrates Consumption by Region (2018-2029)
6.2.1 Global IC Package Substrates Consumption by Region: 2018-2029
6.2.2 Global IC Package Substrates Forecasted Consumption by Region (2024-2029)
6.3 North America
6.3.1 North America IC Package Substrates Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
6.3.2 North America IC Package Substrates Consumption by Country (2018-2029)
6.3.3 United States
6.3.4 Canada
6.4 Europe
6.4.1 Europe IC Package Substrates Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
6.4.2 Europe IC Package Substrates Consumption by Country (2018-2029)
6.4.3 Germany
6.4.4 France
6.4.5 U.K.
6.4.6 Italy
6.4.7 Russia
6.5 Asia Pacific
6.5.1 Asia Pacific IC Package Substrates Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
6.5.2 Asia Pacific IC Package Substrates Consumption by Country (2018-2029)
6.5.3 China
6.5.4 Japan
6.5.5 South Korea
6.5.6 China Taiwan
6.5.7 Southeast Asia
6.5.8 India
6.5.9 Australia
6.6 Latin America, Middle East & Africa
6.6.1 Latin America, Middle East & Africa IC Package Substrates Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
6.6.2 Latin America, Middle East & Africa IC Package Substrates Consumption by Country (2018-2029)
6.6.3 Mexico
6.6.4 Brazil
6.6.5 Turkey
6.6.5 GCC Countries
7 SEGMENT BY TYPE
7.1 Global IC Package Substrates Production by Type (2018-2029)
7.1.1 Global IC Package Substrates Production by Type (2018-2029) & (K Sqm)
7.1.2 Global IC Package Substrates Production Market Share by Type (2018-2029)
7.2 Global IC Package Substrates Production Value by Type (2018-2029)
7.2.1 Global IC Package Substrates Production Value by Type (2018-2029) & (US$ Million)
7.2.2 Global IC Package Substrates Production Value Market Share by Type (2018-2029)
7.3 Global IC Package Substrates Price by Type (2018-2029)
8 SEGMENT BY APPLICATION
8.1 Global IC Package Substrates Production by Application (2018-2029)
8.1.1 Global IC Package Substrates Production by Application (2018-2029) & (K Sqm)
8.1.2 Global IC Package Substrates Production by Application (2018-2029) & (K Sqm)
8.2 Global IC Package Substrates Production Value by Application (2018-2029)
8.2.1 Global IC Package Substrates Production Value by Application (2018-2029) & (US$ Million)
8.2.2 Global IC Package Substrates Production Value Market Share by Application (2018-2029)
8.3 Global IC Package Substrates Price by Application (2018-2029)
9 VALUE CHAIN AND SALES CHANNELS ANALYSIS OF THE MARKET
9.1 IC Package Substrates Value Chain Analysis
9.1.1 IC Package Substrates Key Raw Materials
9.1.2 Raw Materials Key Suppliers
9.1.3 IC Package Substrates Production Mode & Process
9.2 IC Package Substrates Sales Channels Analysis
9.2.1 Direct Comparison with Distribution Share
9.2.2 IC Package Substrates Distributors
9.2.3 IC Package Substrates Customers
10 GLOBAL IC PACKAGE SUBSTRATES ANALYZING MARKET DYNAMICS
10.1 IC Package Substrates Industry Trends
10.2 IC Package Substrates Industry Drivers
10.3 IC Package Substrates Industry Opportunities and Challenges
10.4 IC Package Substrates Industry Restraints
11 REPORT CONCLUSION
12 DISCLAIMER
LIST OF TABLES
Table 1. Secondary Sources
Table 2. Primary Sources
Table 3. Market Value Comparison by Type (2018 VS 2022 VS 2029) & (US$ Million)
Table 4. Market Value Comparison by Application (2018 VS 2022 VS 2029) & (US$ Million)
Table 5. Global IC Package Substrates Production by Manufacturers (K Sqm) & (2018-2023)
Table 6. Global IC Package Substrates Production Market Share by Manufacturers
Table 7. Global IC Package Substrates Production Value by Manufacturers (US$ Million) & (2018-2023)
Table 8. Global IC Package Substrates Production Value Market Share by Manufacturers (2018-2023)
Table 9. Global IC Package Substrates Average Price (US$/Sqm) of Key Manufacturers (2018-2023)
Table 10. Global IC Package Substrates Industry Manufacturers Ranking, 2021 VS 2022 VS 2023
Table 11. Global IC Package Substrates Manufacturers, Product Type & Application
Table 12. Global Manufacturers Market Concentration Ratio (CR5 and HHI)
Table 13. Global IC Package Substrates by Manufacturers Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value of 2022)
Table 14. Manufacturers Mergers & Acquisitions, Expansion Plans)
Table 15. Unimicron IC Package Substrates Company Information
Table 16. Unimicron Business Overview
Table 17. Unimicron IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 18. Unimicron Product Portfolio
Table 19. Unimicron Recent Developments
Table 20. Ibiden IC Package Substrates Company Information
Table 21. Ibiden Business Overview
Table 22. Ibiden IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 23. Ibiden Product Portfolio
Table 24. Ibiden Recent Developments
Table 25. Nan Ya PCB IC Package Substrates Company Information
Table 26. Nan Ya PCB Business Overview
Table 27. Nan Ya PCB IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 28. Nan Ya PCB Product Portfolio
Table 29. Nan Ya PCB Recent Developments
Table 30. Shinko Electric Industries IC Package Substrates Company Information
Table 31. Shinko Electric Industries Business Overview
Table 32. Shinko Electric Industries IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 33. Shinko Electric Industries Product Portfolio
Table 34. Shinko Electric Industries Recent Developments
Table 35. Kinsus Interconnect Technology IC Package Substrates Company Information
Table 36. Kinsus Interconnect Technology Business Overview
Table 37. Kinsus Interconnect Technology IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 38. Kinsus Interconnect Technology Product Portfolio
Table 39. Kinsus Interconnect Technology Recent Developments
Table 40. AT&S IC Package Substrates Company Information
Table 41. AT&S Business Overview
Table 42. AT&S IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 43. AT&S Product Portfolio
Table 44. AT&S Recent Developments
Table 45. Semco IC Package Substrates Company Information
Table 46. Semco Business Overview
Table 47. Semco IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 48. Semco Product Portfolio
Table 49. Semco Recent Developments
Table 50. Kyocera IC Package Substrates Company Information
Table 51. Kyocera Business Overview
Table 52. Kyocera IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 53. Kyocera Product Portfolio
Table 54. Kyocera Recent Developments
Table 55. TOPPAN IC Package Substrates Company Information
Table 56. TOPPAN Business Overview
Table 57. TOPPAN IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 58. TOPPAN Product Portfolio
Table 59. TOPPAN Recent Developments
Table 60. Zhen Ding Technology IC Package Substrates Company Information
Table 61. Zhen Ding Technology Business Overview
Table 62. Zhen Ding Technology IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 63. Zhen Ding Technology Product Portfolio
Table 64. Zhen Ding Technology Recent Developments
Table 65. Daeduck Electronics IC Package Substrates Company Information
Table 66. Daeduck Electronics Business Overview
Table 67. Daeduck Electronics IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 68. Daeduck Electronics Product Portfolio
Table 69. Daeduck Electronics Recent Developments
Table 70. ASE Material IC Package Substrates Company Information
Table 71. ASE Material Business Overview
Table 72. ASE Material IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 73. ASE Material Product Portfolio
Table 74. ASE Material Recent Developments
Table 75. LG InnoTek IC Package Substrates Company Information
Table 76. LG InnoTek Business Overview
Table 77. LG InnoTek IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 78. LG InnoTek Product Portfolio
Table 79. LG InnoTek Recent Developments
Table 80. Simmtech IC Package Substrates Company Information
Table 81. Simmtech Business Overview
Table 82. Simmtech IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 83. Simmtech Product Portfolio
Table 84. Simmtech Recent Developments
Table 85. Simmtech IC Package Substrates Company Information
Table 86. Shennan Circuit Business Overview
Table 87. Shennan Circuit IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 88. Shennan Circuit Product Portfolio
Table 89. Shennan Circuit Recent Developments
Table 90. Shenzhen Fastprint Circuit Tech IC Package Substrates Company Information
Table 91. Shenzhen Fastprint Circuit Tech IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 92. Shenzhen Fastprint Circuit Tech Product Portfolio
Table 93. Shenzhen Fastprint Circuit Tech Recent Developments
Table 94. ACCESS IC Package Substrates Company Information
Table 95. ACCESS Business Overview
Table 96. ACCESS IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 97. ACCESS Product Portfolio
Table 98. ACCESS Recent Developments
Table 99. Suntak Technology IC Package Substrates Company Information
Table 100. Suntak Technology Business Overview
Table 101. Suntak Technology IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 102. Suntak Technology Product Portfolio
Table 103. Suntak Technology Recent Developments
Table 104. National Center for Advanced Packaging (NCAP China) IC Package Substrates Company Information
Table 105. National Center for Advanced Packaging (NCAP China) Business Overview
Table 106. National Center for Advanced Packaging (NCAP China) IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 107. National Center for Advanced Packaging (NCAP China) Product Portfolio
Table 108. National Center for Advanced Packaging (NCAP China) Recent Developments
Table 109. Huizhou China Eagle Electronic Technology IC Package Substrates Company Information
Table 110. Huizhou China Eagle Electronic Technology Business Overview
Table 111. Huizhou China Eagle Electronic Technology IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 112. Huizhou China Eagle Electronic Technology Product Portfolio
Table 113. Huizhou China Eagle Electronic Technology Recent Developments
Table 114. DSBJ IC Package Substrates Company Information
Table 115. DSBJ Business Overview
Table 116. DSBJ IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 117. DSBJ Product Portfolio
Table 118. DSBJ Recent Developments
Table 119. Shenzhen Kinwong Electronic IC Package Substrates Company Information
Table 120. Shenzhen Kinwong Electronic Business Overview
Table 121. Shenzhen Kinwong Electronic IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 122. Shenzhen Kinwong Electronic Product Portfolio
Table 123. Shenzhen Kinwong Electronic Recent Developments
Table 124. AKM Meadville IC Package Substrates Company Information
Table 125. AKM Meadville Business Overview
Table 126. AKM Meadville IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 127. AKM Meadville Product Portfolio
Table 128. AKM Meadville Recent Developments
Table 129. Victory Giant Technology IC Package Substrates Company Information
Table 130. Victory Giant Technology Business Overview
Table 131. Victory Giant Technology IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 132. Victory Giant Technology Product Portfolio
Table 133. Victory Giant Technology Recent Developments
Table 134. Global IC Package Substrates Production Comparison by Region: 2018 VS 2022 VS 2029 (K Sqm)
Table 135. Global IC Package Substrates Production by Region (2018-2023) & (K Sqm)
Table 136. Global IC Package Substrates Production Market Share by Region (2018-2023)
Table 137. Global IC Package Substrates Production Forecast by Region (2024-2029) & (K Sqm)
Table 138. Global IC Package Substrates Production Market Share Forecast by Region (2024-2029)
Table 139. Global IC Package Substrates Production Value Comparison by Region: 2018 VS 2022 VS 2029 (US$ Million)
Table 140. Global IC Package Substrates Production Value by Region (2018-2023) & (US$ Million)
Table 141. Global IC Package Substrates Production Value Market Share by Region (2018-2023)
Table 142. Global IC Package Substrates Production Value Forecast by Region (2024-2029) & (US$ Million)
Table 143. Global IC Package Substrates Production Value Market Share Forecast by Region (2024-2029)
Table 144. Global IC Package Substrates Market Average Price (US$/Sqm) by Region (2018-2023)
Table 145. Global IC Package Substrates Consumption Comparison by Region: 2018 VS 2022 VS 2029 (K Sqm)
Table 146. Global IC Package Substrates Consumption by Region (2018-2023) & (K Sqm)
Table 147. Global IC Package Substrates Consumption Market Share by Region (2018-2023)
Table 148. Global IC Package Substrates Forecasted Consumption by Region (2024-2029) & (K Sqm)
Table 149. Global IC Package Substrates Forecasted Consumption Market Share by Region (2024-2029)
Table 150. North America IC Package Substrates Consumption Growth Rate by Country: 2018 VS 2022 VS 2029 (K Sqm)
Table 151. North America IC Package Substrates Consumption by Country (2018-2023) & (K Sqm)
Table 152. North America IC Package Substrates Consumption by Country (2024-2029) & (K Sqm)
Table 153. Europe IC Package Substrates Consumption Growth Rate by Country: 2018 VS 2022 VS 2029 (K Sqm)
Table 154. Europe IC Package Substrates Consumption by Country (2018-2023) & (K Sqm)
Table 155. Europe IC Package Substrates Consumption by Country (2024-2029) & (K Sqm)
Table 156. Asia Pacific IC Package Substrates Consumption Growth Rate by Country: 2018 VS 2022 VS 2029 (K Sqm)
Table 157. Asia Pacific IC Package Substrates Consumption by Country (2018-2023) & (K Sqm)
Table 158. Asia Pacific IC Package Substrates Consumption by Country (2024-2029) & (K Sqm)
Table 159. Latin America, Middle East & Africa IC Package Substrates Consumption Growth Rate by Country: 2018 VS 2022 VS 2029 (K Sqm)
Table 160. Latin America, Middle East & Africa IC Package Substrates Consumption by Country (2018-2023) & (K Sqm)
Table 161. Latin America, Middle East & Africa IC Package Substrates Consumption by Country (2024-2029) & (K Sqm)
Table 162. Global IC Package Substrates Production by Type (2018-2023) & (K Sqm)
Table 163. Global IC Package Substrates Production by Type (2024-2029) & (K Sqm)
Table 164. Global IC Package Substrates Production Market Share by Type (2018-2023)
Table 165. Global IC Package Substrates Production Market Share by Type (2024-2029)
Table 166. Global IC Package Substrates Production Value by Type (2018-2023) & (US$ Million)
Table 167. Global IC Package Substrates Production Value by Type (2024-2029) & (US$ Million)
Table 168. Global IC Package Substrates Production Value Market Share by Type (2018-2023)
Table 169. Global IC Package Substrates Production Value Market Share by Type (2024-2029)
Table 170. Global IC Package Substrates Price by Type (2018-2023) & (US$/Sqm)
Table 171. Global IC Package Substrates Price by Type (2024-2029) & (US$/Sqm)
Table 172. Global IC Package Substrates Production by Application (2018-2023) & (K Sqm)
Table 173. Global IC Package Substrates Production by Application (2024-2029) & (K Sqm)
Table 174. Global IC Package Substrates Production Market Share by Application (2018-2023)
Table 175. Global IC Package Substrates Production Market Share by Application (2024-2029)
Table 176. Global IC Package Substrates Production Value by Application (2018-2023) & (US$ Million)
Table 177. Global IC Package Substrates Production Value by Application (2024-2029) & (US$ Million)
Table 178. Global IC Package Substrates Production Value Market Share by Application (2018-2023)
Table 179. Global IC Package Substrates Production Value Market Share by Application (2024-2029)
Table 180. Global IC Package Substrates Price by Application (2018-2023) & (US$/Sqm)
Table 181. Global IC Package Substrates Price by Application (2024-2029) & (US$/Sqm)
Table 182. Key Raw Materials
Table 183. Raw Materials Key Suppliers
Table 184. IC Package Substrates Distributors List
Table 185. IC Package Substrates Customers List
Table 186. IC Package Substrates Industry Trends
Table 187. IC Package Substrates Industry Drivers
Table 188. IC Package Substrates Industry Restraints
Table 189. Authors List of This Report
Table 1. Secondary Sources
Table 2. Primary Sources
Table 3. Market Value Comparison by Type (2018 VS 2022 VS 2029) & (US$ Million)
Table 4. Market Value Comparison by Application (2018 VS 2022 VS 2029) & (US$ Million)
Table 5. Global IC Package Substrates Production by Manufacturers (K Sqm) & (2018-2023)
Table 6. Global IC Package Substrates Production Market Share by Manufacturers
Table 7. Global IC Package Substrates Production Value by Manufacturers (US$ Million) & (2018-2023)
Table 8. Global IC Package Substrates Production Value Market Share by Manufacturers (2018-2023)
Table 9. Global IC Package Substrates Average Price (US$/Sqm) of Key Manufacturers (2018-2023)
Table 10. Global IC Package Substrates Industry Manufacturers Ranking, 2021 VS 2022 VS 2023
Table 11. Global IC Package Substrates Manufacturers, Product Type & Application
Table 12. Global Manufacturers Market Concentration Ratio (CR5 and HHI)
Table 13. Global IC Package Substrates by Manufacturers Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value of 2022)
Table 14. Manufacturers Mergers & Acquisitions, Expansion Plans)
Table 15. Unimicron IC Package Substrates Company Information
Table 16. Unimicron Business Overview
Table 17. Unimicron IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 18. Unimicron Product Portfolio
Table 19. Unimicron Recent Developments
Table 20. Ibiden IC Package Substrates Company Information
Table 21. Ibiden Business Overview
Table 22. Ibiden IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 23. Ibiden Product Portfolio
Table 24. Ibiden Recent Developments
Table 25. Nan Ya PCB IC Package Substrates Company Information
Table 26. Nan Ya PCB Business Overview
Table 27. Nan Ya PCB IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 28. Nan Ya PCB Product Portfolio
Table 29. Nan Ya PCB Recent Developments
Table 30. Shinko Electric Industries IC Package Substrates Company Information
Table 31. Shinko Electric Industries Business Overview
Table 32. Shinko Electric Industries IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 33. Shinko Electric Industries Product Portfolio
Table 34. Shinko Electric Industries Recent Developments
Table 35. Kinsus Interconnect Technology IC Package Substrates Company Information
Table 36. Kinsus Interconnect Technology Business Overview
Table 37. Kinsus Interconnect Technology IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 38. Kinsus Interconnect Technology Product Portfolio
Table 39. Kinsus Interconnect Technology Recent Developments
Table 40. AT&S IC Package Substrates Company Information
Table 41. AT&S Business Overview
Table 42. AT&S IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 43. AT&S Product Portfolio
Table 44. AT&S Recent Developments
Table 45. Semco IC Package Substrates Company Information
Table 46. Semco Business Overview
Table 47. Semco IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 48. Semco Product Portfolio
Table 49. Semco Recent Developments
Table 50. Kyocera IC Package Substrates Company Information
Table 51. Kyocera Business Overview
Table 52. Kyocera IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 53. Kyocera Product Portfolio
Table 54. Kyocera Recent Developments
Table 55. TOPPAN IC Package Substrates Company Information
Table 56. TOPPAN Business Overview
Table 57. TOPPAN IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 58. TOPPAN Product Portfolio
Table 59. TOPPAN Recent Developments
Table 60. Zhen Ding Technology IC Package Substrates Company Information
Table 61. Zhen Ding Technology Business Overview
Table 62. Zhen Ding Technology IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 63. Zhen Ding Technology Product Portfolio
Table 64. Zhen Ding Technology Recent Developments
Table 65. Daeduck Electronics IC Package Substrates Company Information
Table 66. Daeduck Electronics Business Overview
Table 67. Daeduck Electronics IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 68. Daeduck Electronics Product Portfolio
Table 69. Daeduck Electronics Recent Developments
Table 70. ASE Material IC Package Substrates Company Information
Table 71. ASE Material Business Overview
Table 72. ASE Material IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 73. ASE Material Product Portfolio
Table 74. ASE Material Recent Developments
Table 75. LG InnoTek IC Package Substrates Company Information
Table 76. LG InnoTek Business Overview
Table 77. LG InnoTek IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 78. LG InnoTek Product Portfolio
Table 79. LG InnoTek Recent Developments
Table 80. Simmtech IC Package Substrates Company Information
Table 81. Simmtech Business Overview
Table 82. Simmtech IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 83. Simmtech Product Portfolio
Table 84. Simmtech Recent Developments
Table 85. Simmtech IC Package Substrates Company Information
Table 86. Shennan Circuit Business Overview
Table 87. Shennan Circuit IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 88. Shennan Circuit Product Portfolio
Table 89. Shennan Circuit Recent Developments
Table 90. Shenzhen Fastprint Circuit Tech IC Package Substrates Company Information
Table 91. Shenzhen Fastprint Circuit Tech IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 92. Shenzhen Fastprint Circuit Tech Product Portfolio
Table 93. Shenzhen Fastprint Circuit Tech Recent Developments
Table 94. ACCESS IC Package Substrates Company Information
Table 95. ACCESS Business Overview
Table 96. ACCESS IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 97. ACCESS Product Portfolio
Table 98. ACCESS Recent Developments
Table 99. Suntak Technology IC Package Substrates Company Information
Table 100. Suntak Technology Business Overview
Table 101. Suntak Technology IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 102. Suntak Technology Product Portfolio
Table 103. Suntak Technology Recent Developments
Table 104. National Center for Advanced Packaging (NCAP China) IC Package Substrates Company Information
Table 105. National Center for Advanced Packaging (NCAP China) Business Overview
Table 106. National Center for Advanced Packaging (NCAP China) IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 107. National Center for Advanced Packaging (NCAP China) Product Portfolio
Table 108. National Center for Advanced Packaging (NCAP China) Recent Developments
Table 109. Huizhou China Eagle Electronic Technology IC Package Substrates Company Information
Table 110. Huizhou China Eagle Electronic Technology Business Overview
Table 111. Huizhou China Eagle Electronic Technology IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 112. Huizhou China Eagle Electronic Technology Product Portfolio
Table 113. Huizhou China Eagle Electronic Technology Recent Developments
Table 114. DSBJ IC Package Substrates Company Information
Table 115. DSBJ Business Overview
Table 116. DSBJ IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 117. DSBJ Product Portfolio
Table 118. DSBJ Recent Developments
Table 119. Shenzhen Kinwong Electronic IC Package Substrates Company Information
Table 120. Shenzhen Kinwong Electronic Business Overview
Table 121. Shenzhen Kinwong Electronic IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 122. Shenzhen Kinwong Electronic Product Portfolio
Table 123. Shenzhen Kinwong Electronic Recent Developments
Table 124. AKM Meadville IC Package Substrates Company Information
Table 125. AKM Meadville Business Overview
Table 126. AKM Meadville IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 127. AKM Meadville Product Portfolio
Table 128. AKM Meadville Recent Developments
Table 129. Victory Giant Technology IC Package Substrates Company Information
Table 130. Victory Giant Technology Business Overview
Table 131. Victory Giant Technology IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2018-2023)
Table 132. Victory Giant Technology Product Portfolio
Table 133. Victory Giant Technology Recent Developments
Table 134. Global IC Package Substrates Production Comparison by Region: 2018 VS 2022 VS 2029 (K Sqm)
Table 135. Global IC Package Substrates Production by Region (2018-2023) & (K Sqm)
Table 136. Global IC Package Substrates Production Market Share by Region (2018-2023)
Table 137. Global IC Package Substrates Production Forecast by Region (2024-2029) & (K Sqm)
Table 138. Global IC Package Substrates Production Market Share Forecast by Region (2024-2029)
Table 139. Global IC Package Substrates Production Value Comparison by Region: 2018 VS 2022 VS 2029 (US$ Million)
Table 140. Global IC Package Substrates Production Value by Region (2018-2023) & (US$ Million)
Table 141. Global IC Package Substrates Production Value Market Share by Region (2018-2023)
Table 142. Global IC Package Substrates Production Value Forecast by Region (2024-2029) & (US$ Million)
Table 143. Global IC Package Substrates Production Value Market Share Forecast by Region (2024-2029)
Table 144. Global IC Package Substrates Market Average Price (US$/Sqm) by Region (2018-2023)
Table 145. Global IC Package Substrates Consumption Comparison by Region: 2018 VS 2022 VS 2029 (K Sqm)
Table 146. Global IC Package Substrates Consumption by Region (2018-2023) & (K Sqm)
Table 147. Global IC Package Substrates Consumption Market Share by Region (2018-2023)
Table 148. Global IC Package Substrates Forecasted Consumption by Region (2024-2029) & (K Sqm)
Table 149. Global IC Package Substrates Forecasted Consumption Market Share by Region (2024-2029)
Table 150. North America IC Package Substrates Consumption Growth Rate by Country: 2018 VS 2022 VS 2029 (K Sqm)
Table 151. North America IC Package Substrates Consumption by Country (2018-2023) & (K Sqm)
Table 152. North America IC Package Substrates Consumption by Country (2024-2029) & (K Sqm)
Table 153. Europe IC Package Substrates Consumption Growth Rate by Country: 2018 VS 2022 VS 2029 (K Sqm)
Table 154. Europe IC Package Substrates Consumption by Country (2018-2023) & (K Sqm)
Table 155. Europe IC Package Substrates Consumption by Country (2024-2029) & (K Sqm)
Table 156. Asia Pacific IC Package Substrates Consumption Growth Rate by Country: 2018 VS 2022 VS 2029 (K Sqm)
Table 157. Asia Pacific IC Package Substrates Consumption by Country (2018-2023) & (K Sqm)
Table 158. Asia Pacific IC Package Substrates Consumption by Country (2024-2029) & (K Sqm)
Table 159. Latin America, Middle East & Africa IC Package Substrates Consumption Growth Rate by Country: 2018 VS 2022 VS 2029 (K Sqm)
Table 160. Latin America, Middle East & Africa IC Package Substrates Consumption by Country (2018-2023) & (K Sqm)
Table 161. Latin America, Middle East & Africa IC Package Substrates Consumption by Country (2024-2029) & (K Sqm)
Table 162. Global IC Package Substrates Production by Type (2018-2023) & (K Sqm)
Table 163. Global IC Package Substrates Production by Type (2024-2029) & (K Sqm)
Table 164. Global IC Package Substrates Production Market Share by Type (2018-2023)
Table 165. Global IC Package Substrates Production Market Share by Type (2024-2029)
Table 166. Global IC Package Substrates Production Value by Type (2018-2023) & (US$ Million)
Table 167. Global IC Package Substrates Production Value by Type (2024-2029) & (US$ Million)
Table 168. Global IC Package Substrates Production Value Market Share by Type (2018-2023)
Table 169. Global IC Package Substrates Production Value Market Share by Type (2024-2029)
Table 170. Global IC Package Substrates Price by Type (2018-2023) & (US$/Sqm)
Table 171. Global IC Package Substrates Price by Type (2024-2029) & (US$/Sqm)
Table 172. Global IC Package Substrates Production by Application (2018-2023) & (K Sqm)
Table 173. Global IC Package Substrates Production by Application (2024-2029) & (K Sqm)
Table 174. Global IC Package Substrates Production Market Share by Application (2018-2023)
Table 175. Global IC Package Substrates Production Market Share by Application (2024-2029)
Table 176. Global IC Package Substrates Production Value by Application (2018-2023) & (US$ Million)
Table 177. Global IC Package Substrates Production Value by Application (2024-2029) & (US$ Million)
Table 178. Global IC Package Substrates Production Value Market Share by Application (2018-2023)
Table 179. Global IC Package Substrates Production Value Market Share by Application (2024-2029)
Table 180. Global IC Package Substrates Price by Application (2018-2023) & (US$/Sqm)
Table 181. Global IC Package Substrates Price by Application (2024-2029) & (US$/Sqm)
Table 182. Key Raw Materials
Table 183. Raw Materials Key Suppliers
Table 184. IC Package Substrates Distributors List
Table 185. IC Package Substrates Customers List
Table 186. IC Package Substrates Industry Trends
Table 187. IC Package Substrates Industry Drivers
Table 188. IC Package Substrates Industry Restraints
Table 189. Authors List of This Report
LIST OF FIGURES
Figure 1. Research Methodology
Figure 2. Research Process
Figure 3. Key Executives Interviewed
Figure 4. IC Package SubstratesProduct Picture
Figure 5. Market Value Comparison by Type (2018 VS 2022 VS 2029) & (US$ Million)
Figure 6. FC-BGA Product Picture
Figure 7. FC-CSP Product Picture
Figure 8. WB BGA Product Picture
Figure 9. WB CSP Product Picture
Figure 10. RF Module Product Picture
Figure 11. Others Product Picture
Figure 12. Smart Phone Product Picture
Figure 13. PC (tablet and Laptop) Product Picture
Figure 14. Wearable Device Product Picture
Figure 15. Others Product Picture
Figure . Global IC Package Substrates Production Value (US$ Million), 2018 VS 2022 VS 2029
Figure 1. Global IC Package Substrates Production Value (2018-2029) & (US$ Million)
Figure 2. Global IC Package Substrates Production Capacity (2018-2029) & (K Sqm)
Figure 3. Global IC Package Substrates Production (2018-2029) & (K Sqm)
Figure 4. Global IC Package Substrates Average Price (US$/Sqm) & (2018-2029)
Figure 5. Global IC Package Substrates Key Manufacturers, Manufacturing Sites & Headquarters
Figure 6. Global IC Package Substrates Manufacturers, Date of Enter into This Industry
Figure 7. Global Top 5 and 10 IC Package Substrates Players Market Share by Production Valu in 2022
Figure 8. Manufacturers Type (Tier 1, Tier 2, and Tier 3): 2018 VS 2022
Figure 9. Global IC Package Substrates Production Comparison by Region: 2018 VS 2022 VS 2029 (K Sqm)
Figure 10. Global IC Package Substrates Production Market Share by Region: 2018 VS 2022 VS 2029
Figure 11. Global IC Package Substrates Production Value Comparison by Region: 2018 VS 2022 VS 2029 (US$ Million)
Figure 12. Global IC Package Substrates Production Value Market Share by Region: 2018 VS 2022 VS 2029
Figure 13. North America IC Package Substrates Production Value (US$ Million) Growth Rate (2018-2029)
Figure 14. Europe IC Package Substrates Production Value (US$ Million) Growth Rate (2018-2029)
Figure 15. China IC Package Substrates Production Value (US$ Million) Growth Rate (2018-2029)
Figure 16. Japan IC Package Substrates Production Value (US$ Million) Growth Rate (2018-2029)
Figure 17. South Korea IC Package Substrates Production Value (US$ Million) Growth Rate (2018-2029)
Figure 18. Global IC Package Substrates Consumption Comparison by Region: 2018 VS 2022 VS 2029 (K Sqm)
Figure 19. Global IC Package Substrates Consumption Market Share by Region: 2018 VS 2022 VS 2029
Figure 20. North America IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 21. North America IC Package Substrates Consumption Market Share by Country (2018-2029)
Figure 22. United States IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 23. Canada IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 24. Europe IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 25. Europe IC Package Substrates Consumption Market Share by Country (2018-2029)
Figure 26. Germany IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 27. France IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 28. U.K. IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 29. Italy IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 30. Netherlands IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 31. Asia Pacific IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 32. Asia Pacific IC Package Substrates Consumption Market Share by Country (2018-2029)
Figure 33. China IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 34. Japan IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 35. South Korea IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 36. China Taiwan IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 37. Southeast Asia IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 38. India IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 39. Australia IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 40. Latin America, Middle East & Africa IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 41. Latin America, Middle East & Africa IC Package Substrates Consumption Market Share by Country (2018-2029)
Figure 42. Mexico IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 43. Brazil IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 44. Turkey IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 45. GCC Countries IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 46. Global IC Package Substrates Production Market Share by Type (2018-2029)
Figure 47. Global IC Package Substrates Production Value Market Share by Type (2018-2029)
Figure 48. Global IC Package Substrates Price (US$/Sqm) by Type (2018-2029)
Figure 49. Global IC Package Substrates Production Market Share by Application (2018-2029)
Figure 50. Global IC Package Substrates Production Value Market Share by Application (2018-2029)
Figure 51. Global IC Package Substrates Price (US$/Sqm) by Application (2018-2029)
Figure 52. IC Package Substrates Value Chain
Figure 53. IC Package Substrates Production Mode & Process
Figure 54. Direct Comparison with Distribution Share
Figure 55. Distributors Profiles
Figure 56. IC Package Substrates Industry Opportunities and Challenges
Highlights
The global IC Package Substrates market is projected to reach US$ million by 2028 from an estimated US$ million in 2022, at a CAGR of % during 2024 and 2029.
North American market for IC Package Substrates is estimated to increase from $ million in 2022 to reach $ million by 2028, at a CAGR of % during the forecast period of 2023 through 2028.
Asia-Pacific market for IC Package Substrates is estimated to increase from $ million in 2022 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The major global companies of IC Package Substrates include Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect Technology, AT&S, Semco, Kyocera and TOPPAN, etc. In 2022, the world's top three vendors accounted for approximately % of the revenue.
The global market for IC Package Substrates in Smart Phone is estimated to increase from $ million in 2023 to $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Considering the economic change due to COVID-19 and Russia-Ukraine War Influence, FC-BGA, which accounted for % of the global market of IC Package Substrates in 2022, is expected to reach million US$ by 2029, growing at a revised CAGR of % from 2023 to 2029.
Report Scope
This report aims to provide a comprehensive presentation of the global market for IC Package Substrates, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding IC Package Substrates.
The IC Package Substrates market size, estimations, and forecasts are provided in terms of output/shipments (K Sqm) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global IC Package Substrates market comprehensively. Regional market sizes, concerning products by types, by application, and by players, are also provided. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the IC Package Substrates manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, product type, application, and regions.
Key Companies & Market Share Insights
In this section, the readers will gain an understanding of the key players competing. This report has studied the key growth strategies, such as innovative trends and developments, intensification of product portfolio, mergers and acquisitions, collaborations, new product innovation, and geographical expansion, undertaken by these participants to maintain their presence. Apart from business strategies, the study includes current developments and key financials. The readers will also get access to the data related to global revenue, price, and sales by manufacturers for the period 2017-2022. This all-inclusive report will certainly serve the clients to stay updated and make effective decisions in their businesses. Some of the prominent players reviewed in the research report include:
Unimicron
Ibiden
Nan Ya PCB
Shinko Electric Industries
Kinsus Interconnect Technology
AT&S
Semco
Kyocera
TOPPAN
Zhen Ding Technology
Daeduck Electronics
ASE Material
LG InnoTek
Simmtech
Shennan Circuit
Shenzhen Fastprint Circuit Tech
ACCESS
Suntak Technology
National Center for Advanced Packaging (NCAP China)
Huizhou China Eagle Electronic Technology
DSBJ
Shenzhen Kinwong Electronic
AKM Meadville
Figure 1. Research Methodology
Figure 2. Research Process
Figure 3. Key Executives Interviewed
Figure 4. IC Package SubstratesProduct Picture
Figure 5. Market Value Comparison by Type (2018 VS 2022 VS 2029) & (US$ Million)
Figure 6. FC-BGA Product Picture
Figure 7. FC-CSP Product Picture
Figure 8. WB BGA Product Picture
Figure 9. WB CSP Product Picture
Figure 10. RF Module Product Picture
Figure 11. Others Product Picture
Figure 12. Smart Phone Product Picture
Figure 13. PC (tablet and Laptop) Product Picture
Figure 14. Wearable Device Product Picture
Figure 15. Others Product Picture
Figure . Global IC Package Substrates Production Value (US$ Million), 2018 VS 2022 VS 2029
Figure 1. Global IC Package Substrates Production Value (2018-2029) & (US$ Million)
Figure 2. Global IC Package Substrates Production Capacity (2018-2029) & (K Sqm)
Figure 3. Global IC Package Substrates Production (2018-2029) & (K Sqm)
Figure 4. Global IC Package Substrates Average Price (US$/Sqm) & (2018-2029)
Figure 5. Global IC Package Substrates Key Manufacturers, Manufacturing Sites & Headquarters
Figure 6. Global IC Package Substrates Manufacturers, Date of Enter into This Industry
Figure 7. Global Top 5 and 10 IC Package Substrates Players Market Share by Production Valu in 2022
Figure 8. Manufacturers Type (Tier 1, Tier 2, and Tier 3): 2018 VS 2022
Figure 9. Global IC Package Substrates Production Comparison by Region: 2018 VS 2022 VS 2029 (K Sqm)
Figure 10. Global IC Package Substrates Production Market Share by Region: 2018 VS 2022 VS 2029
Figure 11. Global IC Package Substrates Production Value Comparison by Region: 2018 VS 2022 VS 2029 (US$ Million)
Figure 12. Global IC Package Substrates Production Value Market Share by Region: 2018 VS 2022 VS 2029
Figure 13. North America IC Package Substrates Production Value (US$ Million) Growth Rate (2018-2029)
Figure 14. Europe IC Package Substrates Production Value (US$ Million) Growth Rate (2018-2029)
Figure 15. China IC Package Substrates Production Value (US$ Million) Growth Rate (2018-2029)
Figure 16. Japan IC Package Substrates Production Value (US$ Million) Growth Rate (2018-2029)
Figure 17. South Korea IC Package Substrates Production Value (US$ Million) Growth Rate (2018-2029)
Figure 18. Global IC Package Substrates Consumption Comparison by Region: 2018 VS 2022 VS 2029 (K Sqm)
Figure 19. Global IC Package Substrates Consumption Market Share by Region: 2018 VS 2022 VS 2029
Figure 20. North America IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 21. North America IC Package Substrates Consumption Market Share by Country (2018-2029)
Figure 22. United States IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 23. Canada IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 24. Europe IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 25. Europe IC Package Substrates Consumption Market Share by Country (2018-2029)
Figure 26. Germany IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 27. France IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 28. U.K. IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 29. Italy IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 30. Netherlands IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 31. Asia Pacific IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 32. Asia Pacific IC Package Substrates Consumption Market Share by Country (2018-2029)
Figure 33. China IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 34. Japan IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 35. South Korea IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 36. China Taiwan IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 37. Southeast Asia IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 38. India IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 39. Australia IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 40. Latin America, Middle East & Africa IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 41. Latin America, Middle East & Africa IC Package Substrates Consumption Market Share by Country (2018-2029)
Figure 42. Mexico IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 43. Brazil IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 44. Turkey IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 45. GCC Countries IC Package Substrates Consumption and Growth Rate (2018-2029) & (K Sqm)
Figure 46. Global IC Package Substrates Production Market Share by Type (2018-2029)
Figure 47. Global IC Package Substrates Production Value Market Share by Type (2018-2029)
Figure 48. Global IC Package Substrates Price (US$/Sqm) by Type (2018-2029)
Figure 49. Global IC Package Substrates Production Market Share by Application (2018-2029)
Figure 50. Global IC Package Substrates Production Value Market Share by Application (2018-2029)
Figure 51. Global IC Package Substrates Price (US$/Sqm) by Application (2018-2029)
Figure 52. IC Package Substrates Value Chain
Figure 53. IC Package Substrates Production Mode & Process
Figure 54. Direct Comparison with Distribution Share
Figure 55. Distributors Profiles
Figure 56. IC Package Substrates Industry Opportunities and Challenges
Highlights
The global IC Package Substrates market is projected to reach US$ million by 2028 from an estimated US$ million in 2022, at a CAGR of % during 2024 and 2029.
North American market for IC Package Substrates is estimated to increase from $ million in 2022 to reach $ million by 2028, at a CAGR of % during the forecast period of 2023 through 2028.
Asia-Pacific market for IC Package Substrates is estimated to increase from $ million in 2022 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The major global companies of IC Package Substrates include Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect Technology, AT&S, Semco, Kyocera and TOPPAN, etc. In 2022, the world's top three vendors accounted for approximately % of the revenue.
The global market for IC Package Substrates in Smart Phone is estimated to increase from $ million in 2023 to $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Considering the economic change due to COVID-19 and Russia-Ukraine War Influence, FC-BGA, which accounted for % of the global market of IC Package Substrates in 2022, is expected to reach million US$ by 2029, growing at a revised CAGR of % from 2023 to 2029.
Report Scope
This report aims to provide a comprehensive presentation of the global market for IC Package Substrates, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding IC Package Substrates.
The IC Package Substrates market size, estimations, and forecasts are provided in terms of output/shipments (K Sqm) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global IC Package Substrates market comprehensively. Regional market sizes, concerning products by types, by application, and by players, are also provided. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the IC Package Substrates manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, product type, application, and regions.
Key Companies & Market Share Insights
In this section, the readers will gain an understanding of the key players competing. This report has studied the key growth strategies, such as innovative trends and developments, intensification of product portfolio, mergers and acquisitions, collaborations, new product innovation, and geographical expansion, undertaken by these participants to maintain their presence. Apart from business strategies, the study includes current developments and key financials. The readers will also get access to the data related to global revenue, price, and sales by manufacturers for the period 2017-2022. This all-inclusive report will certainly serve the clients to stay updated and make effective decisions in their businesses. Some of the prominent players reviewed in the research report include:
Unimicron
Ibiden
Nan Ya PCB
Shinko Electric Industries
Kinsus Interconnect Technology
AT&S
Semco
Kyocera
TOPPAN
Zhen Ding Technology
Daeduck Electronics
ASE Material
LG InnoTek
Simmtech
Shennan Circuit
Shenzhen Fastprint Circuit Tech
ACCESS
Suntak Technology
National Center for Advanced Packaging (NCAP China)
Huizhou China Eagle Electronic Technology
DSBJ
Shenzhen Kinwong Electronic
AKM Meadville
