Global Chip On Board (COB) Packaging Technology Supply, Demand and Key Producers, 2023-2029
The global Chip On Board (COB) Packaging Technology market size is expected to reach $ million by 2029, rising at a market growth of % CAGR during the forecast period (2023-2029).
Chip On Board (COB) packaging technology is a packaging technique used in electronic devices, primarily for integrated circuits (ICs). In COB packaging, the bare semiconductor chip is directly mounted and electrically connected onto a printed circuit board (PCB) or a substrate.
COB technology eliminates the need for a traditional IC package, such as a plastic or ceramic package, by directly bonding the chip to the PCB. The chip is typically wire bonded to the PCB, and then covered with a protective resin or epoxy coating.
This report studies the global Chip On Board (COB) Packaging Technology demand, key companies, and key regions.
This report is a detailed and comprehensive analysis of the world market for Chip On Board (COB) Packaging Technology, and provides market size (US$ million) and Year-over-Year (YoY) growth, considering 2022 as the base year. This report explores demand trends and competition, as well as details the characteristics of Chip On Board (COB) Packaging Technology that contribute to its increasing demand across many markets.
Highlights and key features of the study
Global Chip On Board (COB) Packaging Technology total market, 2018-2029, (USD Million)
Global Chip On Board (COB) Packaging Technology total market by region & country, CAGR, 2018-2029, (USD Million)
U.S. VS China: Chip On Board (COB) Packaging Technology total market, key domestic companies and share, (USD Million)
Global Chip On Board (COB) Packaging Technology revenue by player and market share 2018-2023, (USD Million)
Global Chip On Board (COB) Packaging Technology total market by Type, CAGR, 2018-2029, (USD Million)
Global Chip On Board (COB) Packaging Technology total market by Application, CAGR, 2018-2029, (USD Million).
This reports profiles major players in the global Chip On Board (COB) Packaging Technology market based on the following parameters – company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Cree, Inc., Lumileds, Samsung Electronics Co., Ltd., LG Innotek, OSRAM Opto Semiconductors, Bridgelux, Inc., Everlight Electronics Co., Ltd., Nichia Corporation and Epistar Corporation, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Chip On Board (COB) Packaging Technology market.
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), by player, by regions, by Type, and by Application. Data is given for the years 2018-2029 by year with 2022 as the base year, 2023 as the estimate year, and 2024-2029 as the forecast year.
Global Chip On Board (COB) Packaging Technology Market, By Region:
1. How big is the global Chip On Board (COB) Packaging Technology market?
2. What is the demand of the global Chip On Board (COB) Packaging Technology market?
3. What is the year over year growth of the global Chip On Board (COB) Packaging Technology market?
4. What is the total value of the global Chip On Board (COB) Packaging Technology market?
5. Who are the major players in the global Chip On Board (COB) Packaging Technology market?
Chip On Board (COB) packaging technology is a packaging technique used in electronic devices, primarily for integrated circuits (ICs). In COB packaging, the bare semiconductor chip is directly mounted and electrically connected onto a printed circuit board (PCB) or a substrate.
COB technology eliminates the need for a traditional IC package, such as a plastic or ceramic package, by directly bonding the chip to the PCB. The chip is typically wire bonded to the PCB, and then covered with a protective resin or epoxy coating.
This report studies the global Chip On Board (COB) Packaging Technology demand, key companies, and key regions.
This report is a detailed and comprehensive analysis of the world market for Chip On Board (COB) Packaging Technology, and provides market size (US$ million) and Year-over-Year (YoY) growth, considering 2022 as the base year. This report explores demand trends and competition, as well as details the characteristics of Chip On Board (COB) Packaging Technology that contribute to its increasing demand across many markets.
Highlights and key features of the study
Global Chip On Board (COB) Packaging Technology total market, 2018-2029, (USD Million)
Global Chip On Board (COB) Packaging Technology total market by region & country, CAGR, 2018-2029, (USD Million)
U.S. VS China: Chip On Board (COB) Packaging Technology total market, key domestic companies and share, (USD Million)
Global Chip On Board (COB) Packaging Technology revenue by player and market share 2018-2023, (USD Million)
Global Chip On Board (COB) Packaging Technology total market by Type, CAGR, 2018-2029, (USD Million)
Global Chip On Board (COB) Packaging Technology total market by Application, CAGR, 2018-2029, (USD Million).
This reports profiles major players in the global Chip On Board (COB) Packaging Technology market based on the following parameters – company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Cree, Inc., Lumileds, Samsung Electronics Co., Ltd., LG Innotek, OSRAM Opto Semiconductors, Bridgelux, Inc., Everlight Electronics Co., Ltd., Nichia Corporation and Epistar Corporation, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Chip On Board (COB) Packaging Technology market.
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), by player, by regions, by Type, and by Application. Data is given for the years 2018-2029 by year with 2022 as the base year, 2023 as the estimate year, and 2024-2029 as the forecast year.
Global Chip On Board (COB) Packaging Technology Market, By Region:
- United States
- China
- Europe
- Japan
- South Korea
- ASEAN
- India
- Rest of World
- Traditional COB Packaging Technology
- Modular COB Packaging Technology
- Others
- Lighting
- Electronics
- Industrial
- Displays
- Automotive
- Medical and Healthcare
- Others
- Cree, Inc.
- Lumileds
- Samsung Electronics Co., Ltd.
- LG Innotek
- OSRAM Opto Semiconductors
- Bridgelux, Inc.
- Everlight Electronics Co., Ltd.
- Nichia Corporation
- Epistar Corporation
- Seoul Semiconductor Co., Ltd.
- Sharp Corporation
- Kingbright Electronic Co., Ltd.
1. How big is the global Chip On Board (COB) Packaging Technology market?
2. What is the demand of the global Chip On Board (COB) Packaging Technology market?
3. What is the year over year growth of the global Chip On Board (COB) Packaging Technology market?
4. What is the total value of the global Chip On Board (COB) Packaging Technology market?
5. Who are the major players in the global Chip On Board (COB) Packaging Technology market?
1 SUPPLY SUMMARY
1.1 Chip On Board (COB) Packaging Technology Introduction
1.2 World Chip On Board (COB) Packaging Technology Market Size & Forecast (2018 & 2022 & 2029)
1.3 World Chip On Board (COB) Packaging Technology Total Market by Region (by Headquarter Location)
1.3.1 World Chip On Board (COB) Packaging Technology Market Size by Region (2018-2029), (by Headquarter Location)
1.3.2 United States Chip On Board (COB) Packaging Technology Market Size (2018-2029)
1.3.3 China Chip On Board (COB) Packaging Technology Market Size (2018-2029)
1.3.4 Europe Chip On Board (COB) Packaging Technology Market Size (2018-2029)
1.3.5 Japan Chip On Board (COB) Packaging Technology Market Size (2018-2029)
1.3.6 South Korea Chip On Board (COB) Packaging Technology Market Size (2018-2029)
1.3.7 ASEAN Chip On Board (COB) Packaging Technology Market Size (2018-2029)
1.3.8 India Chip On Board (COB) Packaging Technology Market Size (2018-2029)
1.4 Market Drivers, Restraints and Trends
1.4.1 Chip On Board (COB) Packaging Technology Market Drivers
1.4.2 Factors Affecting Demand
1.4.3 Chip On Board (COB) Packaging Technology Major Market Trends
2 DEMAND SUMMARY
2.1 World Chip On Board (COB) Packaging Technology Consumption Value (2018-2029)
2.2 World Chip On Board (COB) Packaging Technology Consumption Value by Region
2.2.1 World Chip On Board (COB) Packaging Technology Consumption Value by Region (2018-2023)
2.2.2 World Chip On Board (COB) Packaging Technology Consumption Value Forecast by Region (2024-2029)
2.3 United States Chip On Board (COB) Packaging Technology Consumption Value (2018-2029)
2.4 China Chip On Board (COB) Packaging Technology Consumption Value (2018-2029)
2.5 Europe Chip On Board (COB) Packaging Technology Consumption Value (2018-2029)
2.6 Japan Chip On Board (COB) Packaging Technology Consumption Value (2018-2029)
2.7 South Korea Chip On Board (COB) Packaging Technology Consumption Value (2018-2029)
2.8 ASEAN Chip On Board (COB) Packaging Technology Consumption Value (2018-2029)
2.9 India Chip On Board (COB) Packaging Technology Consumption Value (2018-2029)
3 WORLD CHIP ON BOARD (COB) PACKAGING TECHNOLOGY COMPANIES COMPETITIVE ANALYSIS
3.1 World Chip On Board (COB) Packaging Technology Revenue by Player (2018-2023)
3.2 Industry Rank and Concentration Rate (CR)
3.2.1 Global Chip On Board (COB) Packaging Technology Industry Rank of Major Players
3.2.2 Global Concentration Ratios (CR4) for Chip On Board (COB) Packaging Technology in 2022
3.2.3 Global Concentration Ratios (CR8) for Chip On Board (COB) Packaging Technology in 2022
3.3 Chip On Board (COB) Packaging Technology Company Evaluation Quadrant
3.4 Chip On Board (COB) Packaging Technology Market: Overall Company Footprint Analysis
3.4.1 Chip On Board (COB) Packaging Technology Market: Region Footprint
3.4.2 Chip On Board (COB) Packaging Technology Market: Company Product Type Footprint
3.4.3 Chip On Board (COB) Packaging Technology Market: Company Product Application Footprint
3.5 Competitive Environment
3.5.1 Historical Structure of the Industry
3.5.2 Barriers of Market Entry
3.5.3 Factors of Competition
3.6 Mergers, Acquisitions Activity
4 UNITED STATES VS CHINA VS REST OF THE WORLD (BY HEADQUARTER LOCATION)
4.1 United States VS China: Chip On Board (COB) Packaging Technology Revenue Comparison (by Headquarter Location)
4.1.1 United States VS China: Chip On Board (COB) Packaging Technology Market Size Comparison (2018 & 2022 & 2029) (by Headquarter Location)
4.1.2 United States VS China: Chip On Board (COB) Packaging Technology Revenue Market Share Comparison (2018 & 2022 & 2029)
4.2 United States Based Companies VS China Based Companies: Chip On Board (COB) Packaging Technology Consumption Value Comparison
4.2.1 United States VS China: Chip On Board (COB) Packaging Technology Consumption Value Comparison (2018 & 2022 & 2029)
4.2.2 United States VS China: Chip On Board (COB) Packaging Technology Consumption Value Market Share Comparison (2018 & 2022 & 2029)
4.3 United States Based Chip On Board (COB) Packaging Technology Companies and Market Share, 2018-2023
4.3.1 United States Based Chip On Board (COB) Packaging Technology Companies, Headquarters (States, Country)
4.3.2 United States Based Companies Chip On Board (COB) Packaging Technology Revenue, (2018-2023)
4.4 China Based Companies Chip On Board (COB) Packaging Technology Revenue and Market Share, 2018-2023
4.4.1 China Based Chip On Board (COB) Packaging Technology Companies, Company Headquarters (Province, Country)
4.4.2 China Based Companies Chip On Board (COB) Packaging Technology Revenue, (2018-2023)
4.5 Rest of World Based Chip On Board (COB) Packaging Technology Companies and Market Share, 2018-2023
4.5.1 Rest of World Based Chip On Board (COB) Packaging Technology Companies, Headquarters (States, Country)
4.5.2 Rest of World Based Companies Chip On Board (COB) Packaging Technology Revenue, (2018-2023)
5 MARKET ANALYSIS BY TYPE
5.1 World Chip On Board (COB) Packaging Technology Market Size Overview by Type: 2018 VS 2022 VS 2029
5.2 Segment Introduction by Type
5.2.1 Traditional COB Packaging Technology
5.2.2 Modular COB Packaging Technology
5.2.3 Others
5.3 Market Segment by Type
5.3.1 World Chip On Board (COB) Packaging Technology Market Size by Type (2018-2023)
5.3.2 World Chip On Board (COB) Packaging Technology Market Size by Type (2024-2029)
5.3.3 World Chip On Board (COB) Packaging Technology Market Size Market Share by Type (2018-2029)
6 MARKET ANALYSIS BY APPLICATION
6.1 World Chip On Board (COB) Packaging Technology Market Size Overview by Application: 2018 VS 2022 VS 2029
6.2 Segment Introduction by Application
6.2.1 Lighting
6.2.2 Electronics
6.2.3 Industrial
6.2.4 Displays
6.2.5 Displays
6.2.6 Medical and Healthcare
6.2.7 Others
6.3 Market Segment by Application
6.3.1 World Chip On Board (COB) Packaging Technology Market Size by Application (2018-2023)
6.3.2 World Chip On Board (COB) Packaging Technology Market Size by Application (2024-2029)
6.3.3 World Chip On Board (COB) Packaging Technology Market Size by Application (2018-2029)
7 COMPANY PROFILES
7.1 Cree, Inc.
7.1.1 Cree, Inc. Details
7.1.2 Cree, Inc. Major Business
7.1.3 Cree, Inc. Chip On Board (COB) Packaging Technology Product and Services
7.1.4 Cree, Inc. Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023)
7.1.5 Cree, Inc. Recent Developments/Updates
7.1.6 Cree, Inc. Competitive Strengths & Weaknesses
7.2 Lumileds
7.2.1 Lumileds Details
7.2.2 Lumileds Major Business
7.2.3 Lumileds Chip On Board (COB) Packaging Technology Product and Services
7.2.4 Lumileds Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023)
7.2.5 Lumileds Recent Developments/Updates
7.2.6 Lumileds Competitive Strengths & Weaknesses
7.3 Samsung Electronics Co., Ltd.
7.3.1 Samsung Electronics Co., Ltd. Details
7.3.2 Samsung Electronics Co., Ltd. Major Business
7.3.3 Samsung Electronics Co., Ltd. Chip On Board (COB) Packaging Technology Product and Services
7.3.4 Samsung Electronics Co., Ltd. Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023)
7.3.5 Samsung Electronics Co., Ltd. Recent Developments/Updates
7.3.6 Samsung Electronics Co., Ltd. Competitive Strengths & Weaknesses
7.4 LG Innotek
7.4.1 LG Innotek Details
7.4.2 LG Innotek Major Business
7.4.3 LG Innotek Chip On Board (COB) Packaging Technology Product and Services
7.4.4 LG Innotek Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023)
7.4.5 LG Innotek Recent Developments/Updates
7.4.6 LG Innotek Competitive Strengths & Weaknesses
7.5 OSRAM Opto Semiconductors
7.5.1 OSRAM Opto Semiconductors Details
7.5.2 OSRAM Opto Semiconductors Major Business
7.5.3 OSRAM Opto Semiconductors Chip On Board (COB) Packaging Technology Product and Services
7.5.4 OSRAM Opto Semiconductors Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023)
7.5.5 OSRAM Opto Semiconductors Recent Developments/Updates
7.5.6 OSRAM Opto Semiconductors Competitive Strengths & Weaknesses
7.6 Bridgelux, Inc.
7.6.1 Bridgelux, Inc. Details
7.6.2 Bridgelux, Inc. Major Business
7.6.3 Bridgelux, Inc. Chip On Board (COB) Packaging Technology Product and Services
7.6.4 Bridgelux, Inc. Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023)
7.6.5 Bridgelux, Inc. Recent Developments/Updates
7.6.6 Bridgelux, Inc. Competitive Strengths & Weaknesses
7.7 Everlight Electronics Co., Ltd.
7.7.1 Everlight Electronics Co., Ltd. Details
7.7.2 Everlight Electronics Co., Ltd. Major Business
7.7.3 Everlight Electronics Co., Ltd. Chip On Board (COB) Packaging Technology Product and Services
7.7.4 Everlight Electronics Co., Ltd. Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023)
7.7.5 Everlight Electronics Co., Ltd. Recent Developments/Updates
7.7.6 Everlight Electronics Co., Ltd. Competitive Strengths & Weaknesses
7.8 Nichia Corporation
7.8.1 Nichia Corporation Details
7.8.2 Nichia Corporation Major Business
7.8.3 Nichia Corporation Chip On Board (COB) Packaging Technology Product and Services
7.8.4 Nichia Corporation Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023)
7.8.5 Nichia Corporation Recent Developments/Updates
7.8.6 Nichia Corporation Competitive Strengths & Weaknesses
7.9 Epistar Corporation
7.9.1 Epistar Corporation Details
7.9.2 Epistar Corporation Major Business
7.9.3 Epistar Corporation Chip On Board (COB) Packaging Technology Product and Services
7.9.4 Epistar Corporation Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023)
7.9.5 Epistar Corporation Recent Developments/Updates
7.9.6 Epistar Corporation Competitive Strengths & Weaknesses
7.10 Seoul Semiconductor Co., Ltd.
7.10.1 Seoul Semiconductor Co., Ltd. Details
7.10.2 Seoul Semiconductor Co., Ltd. Major Business
7.10.3 Seoul Semiconductor Co., Ltd. Chip On Board (COB) Packaging Technology Product and Services
7.10.4 Seoul Semiconductor Co., Ltd. Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023)
7.10.5 Seoul Semiconductor Co., Ltd. Recent Developments/Updates
7.10.6 Seoul Semiconductor Co., Ltd. Competitive Strengths & Weaknesses
7.11 Sharp Corporation
7.11.1 Sharp Corporation Details
7.11.2 Sharp Corporation Major Business
7.11.3 Sharp Corporation Chip On Board (COB) Packaging Technology Product and Services
7.11.4 Sharp Corporation Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023)
7.11.5 Sharp Corporation Recent Developments/Updates
7.11.6 Sharp Corporation Competitive Strengths & Weaknesses
7.12 Kingbright Electronic Co., Ltd.
7.12.1 Kingbright Electronic Co., Ltd. Details
7.12.2 Kingbright Electronic Co., Ltd. Major Business
7.12.3 Kingbright Electronic Co., Ltd. Chip On Board (COB) Packaging Technology Product and Services
7.12.4 Kingbright Electronic Co., Ltd. Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023)
7.12.5 Kingbright Electronic Co., Ltd. Recent Developments/Updates
7.12.6 Kingbright Electronic Co., Ltd. Competitive Strengths & Weaknesses
8 INDUSTRY CHAIN ANALYSIS
8.1 Chip On Board (COB) Packaging Technology Industry Chain
8.2 Chip On Board (COB) Packaging Technology Upstream Analysis
8.3 Chip On Board (COB) Packaging Technology Midstream Analysis
8.4 Chip On Board (COB) Packaging Technology Downstream Analysis
9 RESEARCH FINDINGS AND CONCLUSION
10 APPENDIX
10.1 Methodology
10.2 Research Process and Data Source
10.3 Disclaimer
1.1 Chip On Board (COB) Packaging Technology Introduction
1.2 World Chip On Board (COB) Packaging Technology Market Size & Forecast (2018 & 2022 & 2029)
1.3 World Chip On Board (COB) Packaging Technology Total Market by Region (by Headquarter Location)
1.3.1 World Chip On Board (COB) Packaging Technology Market Size by Region (2018-2029), (by Headquarter Location)
1.3.2 United States Chip On Board (COB) Packaging Technology Market Size (2018-2029)
1.3.3 China Chip On Board (COB) Packaging Technology Market Size (2018-2029)
1.3.4 Europe Chip On Board (COB) Packaging Technology Market Size (2018-2029)
1.3.5 Japan Chip On Board (COB) Packaging Technology Market Size (2018-2029)
1.3.6 South Korea Chip On Board (COB) Packaging Technology Market Size (2018-2029)
1.3.7 ASEAN Chip On Board (COB) Packaging Technology Market Size (2018-2029)
1.3.8 India Chip On Board (COB) Packaging Technology Market Size (2018-2029)
1.4 Market Drivers, Restraints and Trends
1.4.1 Chip On Board (COB) Packaging Technology Market Drivers
1.4.2 Factors Affecting Demand
1.4.3 Chip On Board (COB) Packaging Technology Major Market Trends
2 DEMAND SUMMARY
2.1 World Chip On Board (COB) Packaging Technology Consumption Value (2018-2029)
2.2 World Chip On Board (COB) Packaging Technology Consumption Value by Region
2.2.1 World Chip On Board (COB) Packaging Technology Consumption Value by Region (2018-2023)
2.2.2 World Chip On Board (COB) Packaging Technology Consumption Value Forecast by Region (2024-2029)
2.3 United States Chip On Board (COB) Packaging Technology Consumption Value (2018-2029)
2.4 China Chip On Board (COB) Packaging Technology Consumption Value (2018-2029)
2.5 Europe Chip On Board (COB) Packaging Technology Consumption Value (2018-2029)
2.6 Japan Chip On Board (COB) Packaging Technology Consumption Value (2018-2029)
2.7 South Korea Chip On Board (COB) Packaging Technology Consumption Value (2018-2029)
2.8 ASEAN Chip On Board (COB) Packaging Technology Consumption Value (2018-2029)
2.9 India Chip On Board (COB) Packaging Technology Consumption Value (2018-2029)
3 WORLD CHIP ON BOARD (COB) PACKAGING TECHNOLOGY COMPANIES COMPETITIVE ANALYSIS
3.1 World Chip On Board (COB) Packaging Technology Revenue by Player (2018-2023)
3.2 Industry Rank and Concentration Rate (CR)
3.2.1 Global Chip On Board (COB) Packaging Technology Industry Rank of Major Players
3.2.2 Global Concentration Ratios (CR4) for Chip On Board (COB) Packaging Technology in 2022
3.2.3 Global Concentration Ratios (CR8) for Chip On Board (COB) Packaging Technology in 2022
3.3 Chip On Board (COB) Packaging Technology Company Evaluation Quadrant
3.4 Chip On Board (COB) Packaging Technology Market: Overall Company Footprint Analysis
3.4.1 Chip On Board (COB) Packaging Technology Market: Region Footprint
3.4.2 Chip On Board (COB) Packaging Technology Market: Company Product Type Footprint
3.4.3 Chip On Board (COB) Packaging Technology Market: Company Product Application Footprint
3.5 Competitive Environment
3.5.1 Historical Structure of the Industry
3.5.2 Barriers of Market Entry
3.5.3 Factors of Competition
3.6 Mergers, Acquisitions Activity
4 UNITED STATES VS CHINA VS REST OF THE WORLD (BY HEADQUARTER LOCATION)
4.1 United States VS China: Chip On Board (COB) Packaging Technology Revenue Comparison (by Headquarter Location)
4.1.1 United States VS China: Chip On Board (COB) Packaging Technology Market Size Comparison (2018 & 2022 & 2029) (by Headquarter Location)
4.1.2 United States VS China: Chip On Board (COB) Packaging Technology Revenue Market Share Comparison (2018 & 2022 & 2029)
4.2 United States Based Companies VS China Based Companies: Chip On Board (COB) Packaging Technology Consumption Value Comparison
4.2.1 United States VS China: Chip On Board (COB) Packaging Technology Consumption Value Comparison (2018 & 2022 & 2029)
4.2.2 United States VS China: Chip On Board (COB) Packaging Technology Consumption Value Market Share Comparison (2018 & 2022 & 2029)
4.3 United States Based Chip On Board (COB) Packaging Technology Companies and Market Share, 2018-2023
4.3.1 United States Based Chip On Board (COB) Packaging Technology Companies, Headquarters (States, Country)
4.3.2 United States Based Companies Chip On Board (COB) Packaging Technology Revenue, (2018-2023)
4.4 China Based Companies Chip On Board (COB) Packaging Technology Revenue and Market Share, 2018-2023
4.4.1 China Based Chip On Board (COB) Packaging Technology Companies, Company Headquarters (Province, Country)
4.4.2 China Based Companies Chip On Board (COB) Packaging Technology Revenue, (2018-2023)
4.5 Rest of World Based Chip On Board (COB) Packaging Technology Companies and Market Share, 2018-2023
4.5.1 Rest of World Based Chip On Board (COB) Packaging Technology Companies, Headquarters (States, Country)
4.5.2 Rest of World Based Companies Chip On Board (COB) Packaging Technology Revenue, (2018-2023)
5 MARKET ANALYSIS BY TYPE
5.1 World Chip On Board (COB) Packaging Technology Market Size Overview by Type: 2018 VS 2022 VS 2029
5.2 Segment Introduction by Type
5.2.1 Traditional COB Packaging Technology
5.2.2 Modular COB Packaging Technology
5.2.3 Others
5.3 Market Segment by Type
5.3.1 World Chip On Board (COB) Packaging Technology Market Size by Type (2018-2023)
5.3.2 World Chip On Board (COB) Packaging Technology Market Size by Type (2024-2029)
5.3.3 World Chip On Board (COB) Packaging Technology Market Size Market Share by Type (2018-2029)
6 MARKET ANALYSIS BY APPLICATION
6.1 World Chip On Board (COB) Packaging Technology Market Size Overview by Application: 2018 VS 2022 VS 2029
6.2 Segment Introduction by Application
6.2.1 Lighting
6.2.2 Electronics
6.2.3 Industrial
6.2.4 Displays
6.2.5 Displays
6.2.6 Medical and Healthcare
6.2.7 Others
6.3 Market Segment by Application
6.3.1 World Chip On Board (COB) Packaging Technology Market Size by Application (2018-2023)
6.3.2 World Chip On Board (COB) Packaging Technology Market Size by Application (2024-2029)
6.3.3 World Chip On Board (COB) Packaging Technology Market Size by Application (2018-2029)
7 COMPANY PROFILES
7.1 Cree, Inc.
7.1.1 Cree, Inc. Details
7.1.2 Cree, Inc. Major Business
7.1.3 Cree, Inc. Chip On Board (COB) Packaging Technology Product and Services
7.1.4 Cree, Inc. Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023)
7.1.5 Cree, Inc. Recent Developments/Updates
7.1.6 Cree, Inc. Competitive Strengths & Weaknesses
7.2 Lumileds
7.2.1 Lumileds Details
7.2.2 Lumileds Major Business
7.2.3 Lumileds Chip On Board (COB) Packaging Technology Product and Services
7.2.4 Lumileds Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023)
7.2.5 Lumileds Recent Developments/Updates
7.2.6 Lumileds Competitive Strengths & Weaknesses
7.3 Samsung Electronics Co., Ltd.
7.3.1 Samsung Electronics Co., Ltd. Details
7.3.2 Samsung Electronics Co., Ltd. Major Business
7.3.3 Samsung Electronics Co., Ltd. Chip On Board (COB) Packaging Technology Product and Services
7.3.4 Samsung Electronics Co., Ltd. Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023)
7.3.5 Samsung Electronics Co., Ltd. Recent Developments/Updates
7.3.6 Samsung Electronics Co., Ltd. Competitive Strengths & Weaknesses
7.4 LG Innotek
7.4.1 LG Innotek Details
7.4.2 LG Innotek Major Business
7.4.3 LG Innotek Chip On Board (COB) Packaging Technology Product and Services
7.4.4 LG Innotek Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023)
7.4.5 LG Innotek Recent Developments/Updates
7.4.6 LG Innotek Competitive Strengths & Weaknesses
7.5 OSRAM Opto Semiconductors
7.5.1 OSRAM Opto Semiconductors Details
7.5.2 OSRAM Opto Semiconductors Major Business
7.5.3 OSRAM Opto Semiconductors Chip On Board (COB) Packaging Technology Product and Services
7.5.4 OSRAM Opto Semiconductors Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023)
7.5.5 OSRAM Opto Semiconductors Recent Developments/Updates
7.5.6 OSRAM Opto Semiconductors Competitive Strengths & Weaknesses
7.6 Bridgelux, Inc.
7.6.1 Bridgelux, Inc. Details
7.6.2 Bridgelux, Inc. Major Business
7.6.3 Bridgelux, Inc. Chip On Board (COB) Packaging Technology Product and Services
7.6.4 Bridgelux, Inc. Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023)
7.6.5 Bridgelux, Inc. Recent Developments/Updates
7.6.6 Bridgelux, Inc. Competitive Strengths & Weaknesses
7.7 Everlight Electronics Co., Ltd.
7.7.1 Everlight Electronics Co., Ltd. Details
7.7.2 Everlight Electronics Co., Ltd. Major Business
7.7.3 Everlight Electronics Co., Ltd. Chip On Board (COB) Packaging Technology Product and Services
7.7.4 Everlight Electronics Co., Ltd. Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023)
7.7.5 Everlight Electronics Co., Ltd. Recent Developments/Updates
7.7.6 Everlight Electronics Co., Ltd. Competitive Strengths & Weaknesses
7.8 Nichia Corporation
7.8.1 Nichia Corporation Details
7.8.2 Nichia Corporation Major Business
7.8.3 Nichia Corporation Chip On Board (COB) Packaging Technology Product and Services
7.8.4 Nichia Corporation Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023)
7.8.5 Nichia Corporation Recent Developments/Updates
7.8.6 Nichia Corporation Competitive Strengths & Weaknesses
7.9 Epistar Corporation
7.9.1 Epistar Corporation Details
7.9.2 Epistar Corporation Major Business
7.9.3 Epistar Corporation Chip On Board (COB) Packaging Technology Product and Services
7.9.4 Epistar Corporation Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023)
7.9.5 Epistar Corporation Recent Developments/Updates
7.9.6 Epistar Corporation Competitive Strengths & Weaknesses
7.10 Seoul Semiconductor Co., Ltd.
7.10.1 Seoul Semiconductor Co., Ltd. Details
7.10.2 Seoul Semiconductor Co., Ltd. Major Business
7.10.3 Seoul Semiconductor Co., Ltd. Chip On Board (COB) Packaging Technology Product and Services
7.10.4 Seoul Semiconductor Co., Ltd. Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023)
7.10.5 Seoul Semiconductor Co., Ltd. Recent Developments/Updates
7.10.6 Seoul Semiconductor Co., Ltd. Competitive Strengths & Weaknesses
7.11 Sharp Corporation
7.11.1 Sharp Corporation Details
7.11.2 Sharp Corporation Major Business
7.11.3 Sharp Corporation Chip On Board (COB) Packaging Technology Product and Services
7.11.4 Sharp Corporation Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023)
7.11.5 Sharp Corporation Recent Developments/Updates
7.11.6 Sharp Corporation Competitive Strengths & Weaknesses
7.12 Kingbright Electronic Co., Ltd.
7.12.1 Kingbright Electronic Co., Ltd. Details
7.12.2 Kingbright Electronic Co., Ltd. Major Business
7.12.3 Kingbright Electronic Co., Ltd. Chip On Board (COB) Packaging Technology Product and Services
7.12.4 Kingbright Electronic Co., Ltd. Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023)
7.12.5 Kingbright Electronic Co., Ltd. Recent Developments/Updates
7.12.6 Kingbright Electronic Co., Ltd. Competitive Strengths & Weaknesses
8 INDUSTRY CHAIN ANALYSIS
8.1 Chip On Board (COB) Packaging Technology Industry Chain
8.2 Chip On Board (COB) Packaging Technology Upstream Analysis
8.3 Chip On Board (COB) Packaging Technology Midstream Analysis
8.4 Chip On Board (COB) Packaging Technology Downstream Analysis
9 RESEARCH FINDINGS AND CONCLUSION
10 APPENDIX
10.1 Methodology
10.2 Research Process and Data Source
10.3 Disclaimer
LIST OF TABLES
Table 1. World Chip On Board (COB) Packaging Technology Revenue by Region (2018, 2022 and 2029) & (USD Million), (by Headquarter Location)
Table 2. World Chip On Board (COB) Packaging Technology Revenue by Region (2018-2023) & (USD Million), (by Headquarter Location)
Table 3. World Chip On Board (COB) Packaging Technology Revenue by Region (2024-2029) & (USD Million), (by Headquarter Location)
Table 4. World Chip On Board (COB) Packaging Technology Revenue Market Share by Region (2018-2023), (by Headquarter Location)
Table 5. World Chip On Board (COB) Packaging Technology Revenue Market Share by Region (2024-2029), (by Headquarter Location)
Table 6. Major Market Trends
Table 7. World Chip On Board (COB) Packaging Technology Consumption Value Growth Rate Forecast by Region (2018 & 2022 & 2029) & (USD Million)
Table 8. World Chip On Board (COB) Packaging Technology Consumption Value by Region (2018-2023) & (USD Million)
Table 9. World Chip On Board (COB) Packaging Technology Consumption Value Forecast by Region (2024-2029) & (USD Million)
Table 10. World Chip On Board (COB) Packaging Technology Revenue by Player (2018-2023) & (USD Million)
Table 11. Revenue Market Share of Key Chip On Board (COB) Packaging Technology Players in 2022
Table 12. World Chip On Board (COB) Packaging Technology Industry Rank of Major Player, Based on Revenue in 2022
Table 13. Global Chip On Board (COB) Packaging Technology Company Evaluation Quadrant
Table 14. Head Office of Key Chip On Board (COB) Packaging Technology Player
Table 15. Chip On Board (COB) Packaging Technology Market: Company Product Type Footprint
Table 16. Chip On Board (COB) Packaging Technology Market: Company Product Application Footprint
Table 17. Chip On Board (COB) Packaging Technology Mergers & Acquisitions Activity
Table 18. United States VS China Chip On Board (COB) Packaging Technology Market Size Comparison, (2018 & 2022 & 2029) & (USD Million)
Table 19. United States VS China Chip On Board (COB) Packaging Technology Consumption Value Comparison, (2018 & 2022 & 2029) & (USD Million)
Table 20. United States Based Chip On Board (COB) Packaging Technology Companies, Headquarters (States, Country)
Table 21. United States Based Companies Chip On Board (COB) Packaging Technology Revenue, (2018-2023) & (USD Million)
Table 22. United States Based Companies Chip On Board (COB) Packaging Technology Revenue Market Share (2018-2023)
Table 23. China Based Chip On Board (COB) Packaging Technology Companies, Headquarters (Province, Country)
Table 24. China Based Companies Chip On Board (COB) Packaging Technology Revenue, (2018-2023) & (USD Million)
Table 25. China Based Companies Chip On Board (COB) Packaging Technology Revenue Market Share (2018-2023)
Table 26. Rest of World Based Chip On Board (COB) Packaging Technology Companies, Headquarters (States, Country)
Table 27. Rest of World Based Companies Chip On Board (COB) Packaging Technology Revenue, (2018-2023) & (USD Million)
Table 28. Rest of World Based Companies Chip On Board (COB) Packaging Technology Revenue Market Share (2018-2023)
Table 29. World Chip On Board (COB) Packaging Technology Market Size by Type, (USD Million), 2018 & 2022 & 2029
Table 30. World Chip On Board (COB) Packaging Technology Market Size by Type (2018-2023) & (USD Million)
Table 31. World Chip On Board (COB) Packaging Technology Market Size by Type (2024-2029) & (USD Million)
Table 32. World Chip On Board (COB) Packaging Technology Market Size by Application, (USD Million), 2018 & 2022 & 2029
Table 33. World Chip On Board (COB) Packaging Technology Market Size by Application (2018-2023) & (USD Million)
Table 34. World Chip On Board (COB) Packaging Technology Market Size by Application (2024-2029) & (USD Million)
Table 35. Cree, Inc. Basic Information, Area Served and Competitors
Table 36. Cree, Inc. Major Business
Table 37. Cree, Inc. Chip On Board (COB) Packaging Technology Product and Services
Table 38. Cree, Inc. Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 39. Cree, Inc. Recent Developments/Updates
Table 40. Cree, Inc. Competitive Strengths & Weaknesses
Table 41. Lumileds Basic Information, Area Served and Competitors
Table 42. Lumileds Major Business
Table 43. Lumileds Chip On Board (COB) Packaging Technology Product and Services
Table 44. Lumileds Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 45. Lumileds Recent Developments/Updates
Table 46. Lumileds Competitive Strengths & Weaknesses
Table 47. Samsung Electronics Co., Ltd. Basic Information, Area Served and Competitors
Table 48. Samsung Electronics Co., Ltd. Major Business
Table 49. Samsung Electronics Co., Ltd. Chip On Board (COB) Packaging Technology Product and Services
Table 50. Samsung Electronics Co., Ltd. Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 51. Samsung Electronics Co., Ltd. Recent Developments/Updates
Table 52. Samsung Electronics Co., Ltd. Competitive Strengths & Weaknesses
Table 53. LG Innotek Basic Information, Area Served and Competitors
Table 54. LG Innotek Major Business
Table 55. LG Innotek Chip On Board (COB) Packaging Technology Product and Services
Table 56. LG Innotek Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 57. LG Innotek Recent Developments/Updates
Table 58. LG Innotek Competitive Strengths & Weaknesses
Table 59. OSRAM Opto Semiconductors Basic Information, Area Served and Competitors
Table 60. OSRAM Opto Semiconductors Major Business
Table 61. OSRAM Opto Semiconductors Chip On Board (COB) Packaging Technology Product and Services
Table 62. OSRAM Opto Semiconductors Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 63. OSRAM Opto Semiconductors Recent Developments/Updates
Table 64. OSRAM Opto Semiconductors Competitive Strengths & Weaknesses
Table 65. Bridgelux, Inc. Basic Information, Area Served and Competitors
Table 66. Bridgelux, Inc. Major Business
Table 67. Bridgelux, Inc. Chip On Board (COB) Packaging Technology Product and Services
Table 68. Bridgelux, Inc. Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 69. Bridgelux, Inc. Recent Developments/Updates
Table 70. Bridgelux, Inc. Competitive Strengths & Weaknesses
Table 71. Everlight Electronics Co., Ltd. Basic Information, Area Served and Competitors
Table 72. Everlight Electronics Co., Ltd. Major Business
Table 73. Everlight Electronics Co., Ltd. Chip On Board (COB) Packaging Technology Product and Services
Table 74. Everlight Electronics Co., Ltd. Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 75. Everlight Electronics Co., Ltd. Recent Developments/Updates
Table 76. Everlight Electronics Co., Ltd. Competitive Strengths & Weaknesses
Table 77. Nichia Corporation Basic Information, Area Served and Competitors
Table 78. Nichia Corporation Major Business
Table 79. Nichia Corporation Chip On Board (COB) Packaging Technology Product and Services
Table 80. Nichia Corporation Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 81. Nichia Corporation Recent Developments/Updates
Table 82. Nichia Corporation Competitive Strengths & Weaknesses
Table 83. Epistar Corporation Basic Information, Area Served and Competitors
Table 84. Epistar Corporation Major Business
Table 85. Epistar Corporation Chip On Board (COB) Packaging Technology Product and Services
Table 86. Epistar Corporation Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 87. Epistar Corporation Recent Developments/Updates
Table 88. Epistar Corporation Competitive Strengths & Weaknesses
Table 89. Seoul Semiconductor Co., Ltd. Basic Information, Area Served and Competitors
Table 90. Seoul Semiconductor Co., Ltd. Major Business
Table 91. Seoul Semiconductor Co., Ltd. Chip On Board (COB) Packaging Technology Product and Services
Table 92. Seoul Semiconductor Co., Ltd. Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 93. Seoul Semiconductor Co., Ltd. Recent Developments/Updates
Table 94. Seoul Semiconductor Co., Ltd. Competitive Strengths & Weaknesses
Table 95. Sharp Corporation Basic Information, Area Served and Competitors
Table 96. Sharp Corporation Major Business
Table 97. Sharp Corporation Chip On Board (COB) Packaging Technology Product and Services
Table 98. Sharp Corporation Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 99. Sharp Corporation Recent Developments/Updates
Table 100. Kingbright Electronic Co., Ltd. Basic Information, Area Served and Competitors
Table 101. Kingbright Electronic Co., Ltd. Major Business
Table 102. Kingbright Electronic Co., Ltd. Chip On Board (COB) Packaging Technology Product and Services
Table 103. Kingbright Electronic Co., Ltd. Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 104. Global Key Players of Chip On Board (COB) Packaging Technology Upstream (Raw Materials)
Table 105. Chip On Board (COB) Packaging Technology Typical Customers
LIST OF FIGURE
Figure 1. Chip On Board (COB) Packaging Technology Picture
Figure 2. World Chip On Board (COB) Packaging Technology Total Market Size: 2018 & 2022 & 2029, (USD Million)
Figure 3. World Chip On Board (COB) Packaging Technology Total Market Size (2018-2029) & (USD Million)
Figure 4. World Chip On Board (COB) Packaging Technology Revenue Market Share by Region (2018, 2022 and 2029) & (USD Million) , (by Headquarter Location)
Figure 5. World Chip On Board (COB) Packaging Technology Revenue Market Share by Region (2018-2029), (by Headquarter Location)
Figure 6. United States Based Company Chip On Board (COB) Packaging Technology Revenue (2018-2029) & (USD Million)
Figure 7. China Based Company Chip On Board (COB) Packaging Technology Revenue (2018-2029) & (USD Million)
Figure 8. Europe Based Company Chip On Board (COB) Packaging Technology Revenue (2018-2029) & (USD Million)
Figure 9. Japan Based Company Chip On Board (COB) Packaging Technology Revenue (2018-2029) & (USD Million)
Figure 10. South Korea Based Company Chip On Board (COB) Packaging Technology Revenue (2018-2029) & (USD Million)
Figure 11. ASEAN Based Company Chip On Board (COB) Packaging Technology Revenue (2018-2029) & (USD Million)
Figure 12. India Based Company Chip On Board (COB) Packaging Technology Revenue (2018-2029) & (USD Million)
Figure 13. Chip On Board (COB) Packaging Technology Market Drivers
Figure 14. Factors Affecting Demand
Figure 15. World Chip On Board (COB) Packaging Technology Consumption Value (2018-2029) & (USD Million)
Figure 16. World Chip On Board (COB) Packaging Technology Consumption Value Market Share by Region (2018-2029)
Figure 17. United States Chip On Board (COB) Packaging Technology Consumption Value (2018-2029) & (USD Million)
Figure 18. China Chip On Board (COB) Packaging Technology Consumption Value (2018-2029) & (USD Million)
Figure 19. Europe Chip On Board (COB) Packaging Technology Consumption Value (2018-2029) & (USD Million)
Figure 20. Japan Chip On Board (COB) Packaging Technology Consumption Value (2018-2029) & (USD Million)
Figure 21. South Korea Chip On Board (COB) Packaging Technology Consumption Value (2018-2029) & (USD Million)
Figure 22. ASEAN Chip On Board (COB) Packaging Technology Consumption Value (2018-2029) & (USD Million)
Figure 23. India Chip On Board (COB) Packaging Technology Consumption Value (2018-2029) & (USD Million)
Figure 24. Producer Shipments of Chip On Board (COB) Packaging Technology by Player Revenue ($MM) and Market Share (%): 2022
Figure 25. Global Four-firm Concentration Ratios (CR4) for Chip On Board (COB) Packaging Technology Markets in 2022
Figure 26. Global Four-firm Concentration Ratios (CR8) for Chip On Board (COB) Packaging Technology Markets in 2022
Figure 27. United States VS China: Chip On Board (COB) Packaging Technology Revenue Market Share Comparison (2018 & 2022 & 2029)
Figure 28. United States VS China: Chip On Board (COB) Packaging Technology Consumption Value Market Share Comparison (2018 & 2022 & 2029)
Figure 29. World Chip On Board (COB) Packaging Technology Market Size by Type, (USD Million), 2018 & 2022 & 2029
Figure 30. World Chip On Board (COB) Packaging Technology Market Size Market Share by Type in 2022
Figure 31. Traditional COB Packaging Technology
Figure 32. Modular COB Packaging Technology
Figure 33. Others
Figure 34. World Chip On Board (COB) Packaging Technology Market Size Market Share by Type (2018-2029)
Figure 35. World Chip On Board (COB) Packaging Technology Market Size by Application, (USD Million), 2018 & 2022 & 2029
Figure 36. World Chip On Board (COB) Packaging Technology Market Size Market Share by Application in 2022
Figure 37. Lighting
Figure 38. Electronics
Figure 39. Industrial
Figure 40. Displays
Figure 41. Automotive
Figure 42. Medical and Healthcare
Figure 43. Others
Figure 44. Chip On Board (COB) Packaging Technology Industrial Chain
Figure 45. Methodology
Figure 46. Research Process and Data Source
Table 1. World Chip On Board (COB) Packaging Technology Revenue by Region (2018, 2022 and 2029) & (USD Million), (by Headquarter Location)
Table 2. World Chip On Board (COB) Packaging Technology Revenue by Region (2018-2023) & (USD Million), (by Headquarter Location)
Table 3. World Chip On Board (COB) Packaging Technology Revenue by Region (2024-2029) & (USD Million), (by Headquarter Location)
Table 4. World Chip On Board (COB) Packaging Technology Revenue Market Share by Region (2018-2023), (by Headquarter Location)
Table 5. World Chip On Board (COB) Packaging Technology Revenue Market Share by Region (2024-2029), (by Headquarter Location)
Table 6. Major Market Trends
Table 7. World Chip On Board (COB) Packaging Technology Consumption Value Growth Rate Forecast by Region (2018 & 2022 & 2029) & (USD Million)
Table 8. World Chip On Board (COB) Packaging Technology Consumption Value by Region (2018-2023) & (USD Million)
Table 9. World Chip On Board (COB) Packaging Technology Consumption Value Forecast by Region (2024-2029) & (USD Million)
Table 10. World Chip On Board (COB) Packaging Technology Revenue by Player (2018-2023) & (USD Million)
Table 11. Revenue Market Share of Key Chip On Board (COB) Packaging Technology Players in 2022
Table 12. World Chip On Board (COB) Packaging Technology Industry Rank of Major Player, Based on Revenue in 2022
Table 13. Global Chip On Board (COB) Packaging Technology Company Evaluation Quadrant
Table 14. Head Office of Key Chip On Board (COB) Packaging Technology Player
Table 15. Chip On Board (COB) Packaging Technology Market: Company Product Type Footprint
Table 16. Chip On Board (COB) Packaging Technology Market: Company Product Application Footprint
Table 17. Chip On Board (COB) Packaging Technology Mergers & Acquisitions Activity
Table 18. United States VS China Chip On Board (COB) Packaging Technology Market Size Comparison, (2018 & 2022 & 2029) & (USD Million)
Table 19. United States VS China Chip On Board (COB) Packaging Technology Consumption Value Comparison, (2018 & 2022 & 2029) & (USD Million)
Table 20. United States Based Chip On Board (COB) Packaging Technology Companies, Headquarters (States, Country)
Table 21. United States Based Companies Chip On Board (COB) Packaging Technology Revenue, (2018-2023) & (USD Million)
Table 22. United States Based Companies Chip On Board (COB) Packaging Technology Revenue Market Share (2018-2023)
Table 23. China Based Chip On Board (COB) Packaging Technology Companies, Headquarters (Province, Country)
Table 24. China Based Companies Chip On Board (COB) Packaging Technology Revenue, (2018-2023) & (USD Million)
Table 25. China Based Companies Chip On Board (COB) Packaging Technology Revenue Market Share (2018-2023)
Table 26. Rest of World Based Chip On Board (COB) Packaging Technology Companies, Headquarters (States, Country)
Table 27. Rest of World Based Companies Chip On Board (COB) Packaging Technology Revenue, (2018-2023) & (USD Million)
Table 28. Rest of World Based Companies Chip On Board (COB) Packaging Technology Revenue Market Share (2018-2023)
Table 29. World Chip On Board (COB) Packaging Technology Market Size by Type, (USD Million), 2018 & 2022 & 2029
Table 30. World Chip On Board (COB) Packaging Technology Market Size by Type (2018-2023) & (USD Million)
Table 31. World Chip On Board (COB) Packaging Technology Market Size by Type (2024-2029) & (USD Million)
Table 32. World Chip On Board (COB) Packaging Technology Market Size by Application, (USD Million), 2018 & 2022 & 2029
Table 33. World Chip On Board (COB) Packaging Technology Market Size by Application (2018-2023) & (USD Million)
Table 34. World Chip On Board (COB) Packaging Technology Market Size by Application (2024-2029) & (USD Million)
Table 35. Cree, Inc. Basic Information, Area Served and Competitors
Table 36. Cree, Inc. Major Business
Table 37. Cree, Inc. Chip On Board (COB) Packaging Technology Product and Services
Table 38. Cree, Inc. Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 39. Cree, Inc. Recent Developments/Updates
Table 40. Cree, Inc. Competitive Strengths & Weaknesses
Table 41. Lumileds Basic Information, Area Served and Competitors
Table 42. Lumileds Major Business
Table 43. Lumileds Chip On Board (COB) Packaging Technology Product and Services
Table 44. Lumileds Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 45. Lumileds Recent Developments/Updates
Table 46. Lumileds Competitive Strengths & Weaknesses
Table 47. Samsung Electronics Co., Ltd. Basic Information, Area Served and Competitors
Table 48. Samsung Electronics Co., Ltd. Major Business
Table 49. Samsung Electronics Co., Ltd. Chip On Board (COB) Packaging Technology Product and Services
Table 50. Samsung Electronics Co., Ltd. Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 51. Samsung Electronics Co., Ltd. Recent Developments/Updates
Table 52. Samsung Electronics Co., Ltd. Competitive Strengths & Weaknesses
Table 53. LG Innotek Basic Information, Area Served and Competitors
Table 54. LG Innotek Major Business
Table 55. LG Innotek Chip On Board (COB) Packaging Technology Product and Services
Table 56. LG Innotek Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 57. LG Innotek Recent Developments/Updates
Table 58. LG Innotek Competitive Strengths & Weaknesses
Table 59. OSRAM Opto Semiconductors Basic Information, Area Served and Competitors
Table 60. OSRAM Opto Semiconductors Major Business
Table 61. OSRAM Opto Semiconductors Chip On Board (COB) Packaging Technology Product and Services
Table 62. OSRAM Opto Semiconductors Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 63. OSRAM Opto Semiconductors Recent Developments/Updates
Table 64. OSRAM Opto Semiconductors Competitive Strengths & Weaknesses
Table 65. Bridgelux, Inc. Basic Information, Area Served and Competitors
Table 66. Bridgelux, Inc. Major Business
Table 67. Bridgelux, Inc. Chip On Board (COB) Packaging Technology Product and Services
Table 68. Bridgelux, Inc. Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 69. Bridgelux, Inc. Recent Developments/Updates
Table 70. Bridgelux, Inc. Competitive Strengths & Weaknesses
Table 71. Everlight Electronics Co., Ltd. Basic Information, Area Served and Competitors
Table 72. Everlight Electronics Co., Ltd. Major Business
Table 73. Everlight Electronics Co., Ltd. Chip On Board (COB) Packaging Technology Product and Services
Table 74. Everlight Electronics Co., Ltd. Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 75. Everlight Electronics Co., Ltd. Recent Developments/Updates
Table 76. Everlight Electronics Co., Ltd. Competitive Strengths & Weaknesses
Table 77. Nichia Corporation Basic Information, Area Served and Competitors
Table 78. Nichia Corporation Major Business
Table 79. Nichia Corporation Chip On Board (COB) Packaging Technology Product and Services
Table 80. Nichia Corporation Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 81. Nichia Corporation Recent Developments/Updates
Table 82. Nichia Corporation Competitive Strengths & Weaknesses
Table 83. Epistar Corporation Basic Information, Area Served and Competitors
Table 84. Epistar Corporation Major Business
Table 85. Epistar Corporation Chip On Board (COB) Packaging Technology Product and Services
Table 86. Epistar Corporation Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 87. Epistar Corporation Recent Developments/Updates
Table 88. Epistar Corporation Competitive Strengths & Weaknesses
Table 89. Seoul Semiconductor Co., Ltd. Basic Information, Area Served and Competitors
Table 90. Seoul Semiconductor Co., Ltd. Major Business
Table 91. Seoul Semiconductor Co., Ltd. Chip On Board (COB) Packaging Technology Product and Services
Table 92. Seoul Semiconductor Co., Ltd. Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 93. Seoul Semiconductor Co., Ltd. Recent Developments/Updates
Table 94. Seoul Semiconductor Co., Ltd. Competitive Strengths & Weaknesses
Table 95. Sharp Corporation Basic Information, Area Served and Competitors
Table 96. Sharp Corporation Major Business
Table 97. Sharp Corporation Chip On Board (COB) Packaging Technology Product and Services
Table 98. Sharp Corporation Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 99. Sharp Corporation Recent Developments/Updates
Table 100. Kingbright Electronic Co., Ltd. Basic Information, Area Served and Competitors
Table 101. Kingbright Electronic Co., Ltd. Major Business
Table 102. Kingbright Electronic Co., Ltd. Chip On Board (COB) Packaging Technology Product and Services
Table 103. Kingbright Electronic Co., Ltd. Chip On Board (COB) Packaging Technology Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 104. Global Key Players of Chip On Board (COB) Packaging Technology Upstream (Raw Materials)
Table 105. Chip On Board (COB) Packaging Technology Typical Customers
LIST OF FIGURE
Figure 1. Chip On Board (COB) Packaging Technology Picture
Figure 2. World Chip On Board (COB) Packaging Technology Total Market Size: 2018 & 2022 & 2029, (USD Million)
Figure 3. World Chip On Board (COB) Packaging Technology Total Market Size (2018-2029) & (USD Million)
Figure 4. World Chip On Board (COB) Packaging Technology Revenue Market Share by Region (2018, 2022 and 2029) & (USD Million) , (by Headquarter Location)
Figure 5. World Chip On Board (COB) Packaging Technology Revenue Market Share by Region (2018-2029), (by Headquarter Location)
Figure 6. United States Based Company Chip On Board (COB) Packaging Technology Revenue (2018-2029) & (USD Million)
Figure 7. China Based Company Chip On Board (COB) Packaging Technology Revenue (2018-2029) & (USD Million)
Figure 8. Europe Based Company Chip On Board (COB) Packaging Technology Revenue (2018-2029) & (USD Million)
Figure 9. Japan Based Company Chip On Board (COB) Packaging Technology Revenue (2018-2029) & (USD Million)
Figure 10. South Korea Based Company Chip On Board (COB) Packaging Technology Revenue (2018-2029) & (USD Million)
Figure 11. ASEAN Based Company Chip On Board (COB) Packaging Technology Revenue (2018-2029) & (USD Million)
Figure 12. India Based Company Chip On Board (COB) Packaging Technology Revenue (2018-2029) & (USD Million)
Figure 13. Chip On Board (COB) Packaging Technology Market Drivers
Figure 14. Factors Affecting Demand
Figure 15. World Chip On Board (COB) Packaging Technology Consumption Value (2018-2029) & (USD Million)
Figure 16. World Chip On Board (COB) Packaging Technology Consumption Value Market Share by Region (2018-2029)
Figure 17. United States Chip On Board (COB) Packaging Technology Consumption Value (2018-2029) & (USD Million)
Figure 18. China Chip On Board (COB) Packaging Technology Consumption Value (2018-2029) & (USD Million)
Figure 19. Europe Chip On Board (COB) Packaging Technology Consumption Value (2018-2029) & (USD Million)
Figure 20. Japan Chip On Board (COB) Packaging Technology Consumption Value (2018-2029) & (USD Million)
Figure 21. South Korea Chip On Board (COB) Packaging Technology Consumption Value (2018-2029) & (USD Million)
Figure 22. ASEAN Chip On Board (COB) Packaging Technology Consumption Value (2018-2029) & (USD Million)
Figure 23. India Chip On Board (COB) Packaging Technology Consumption Value (2018-2029) & (USD Million)
Figure 24. Producer Shipments of Chip On Board (COB) Packaging Technology by Player Revenue ($MM) and Market Share (%): 2022
Figure 25. Global Four-firm Concentration Ratios (CR4) for Chip On Board (COB) Packaging Technology Markets in 2022
Figure 26. Global Four-firm Concentration Ratios (CR8) for Chip On Board (COB) Packaging Technology Markets in 2022
Figure 27. United States VS China: Chip On Board (COB) Packaging Technology Revenue Market Share Comparison (2018 & 2022 & 2029)
Figure 28. United States VS China: Chip On Board (COB) Packaging Technology Consumption Value Market Share Comparison (2018 & 2022 & 2029)
Figure 29. World Chip On Board (COB) Packaging Technology Market Size by Type, (USD Million), 2018 & 2022 & 2029
Figure 30. World Chip On Board (COB) Packaging Technology Market Size Market Share by Type in 2022
Figure 31. Traditional COB Packaging Technology
Figure 32. Modular COB Packaging Technology
Figure 33. Others
Figure 34. World Chip On Board (COB) Packaging Technology Market Size Market Share by Type (2018-2029)
Figure 35. World Chip On Board (COB) Packaging Technology Market Size by Application, (USD Million), 2018 & 2022 & 2029
Figure 36. World Chip On Board (COB) Packaging Technology Market Size Market Share by Application in 2022
Figure 37. Lighting
Figure 38. Electronics
Figure 39. Industrial
Figure 40. Displays
Figure 41. Automotive
Figure 42. Medical and Healthcare
Figure 43. Others
Figure 44. Chip On Board (COB) Packaging Technology Industrial Chain
Figure 45. Methodology
Figure 46. Research Process and Data Source
