COVID-19 Impact on Global Wafer Level Package Market Size, Status and Forecast 2020-2026

August 2020 | 90 pages | ID: C80633676D9BEN
QYResearch

Abstracts

This report focuses on the global Wafer Level Package status, future forecast, growth opportunity, key market and key players. The study objectives are to present the Wafer Level Package development in North America, Europe, China, Japan, Southeast Asia, India and Central & South America.
The key players covered in this study

• lASE
• Amkor
• Intel
• Samsung
• AT&S
• Toshiba
• JCET
• Qualcomm
• IBM
• SK Hynix
• UTAC
• TSMC
• China Wafer Level CSP
• Interconnect Systems

Market segment by Type, the product can be split into

• 3D Wire Bonding
• 3D TSV
• Others

Market segment by Application, split into

• Consumer Electronics
• Industrial
• Automotive & Transport
• IT & Telecommunication
• Others

Market segment by Regions/Countries, this report covers

• North America
• Europe
• China
• Japan
• Southeast Asia
• India
• Central & South America

The study objectives of this report are:

• To analyze global Wafer Level Package status, future forecast, growth opportunity, key market and key players.
• To present the Wafer Level Package development in North America, Europe, China, Japan, Southeast Asia, India and Central & South America.
• To strategically profile the key players and comprehensively analyze their development plan and strategies.
• To define, describe and forecast the market by type, market and key regions.

In this study, the years considered to estimate the market size of Wafer Level Package are as follows:

• History Year: 2015-2019
• Base Year: 2019
• Estimated Year: 2020
• Forecast Year 2020 to 2026

For the data information by region, company, type and application, 2019 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.

Contents

1 REPORT OVERVIEW

1.1 Study Scope
1.2 Key Market Segments
1.3 Players Covered: Ranking by Wafer Level Package Revenue
1.4 Market Analysis by Type
  1.4.1 Global Wafer Level Package Market Size Growth Rate by Type: 2020 VS 2026
  1.4.2 3D Wire Bonding
  1.4.3 3D TSV
  1.4.4 Others
1.5 Market by Application
  1.5.1 Global Wafer Level Package Market Share by Application: 2020 VS 2026
  1.5.2 Consumer Electronics
  1.5.3 Industrial
  1.5.4 Automotive & Transport
  1.5.5 IT & Telecommunication
  1.5.6 Others
1.6 Coronavirus Disease 2019 (Covid-19): Wafer Level Package Industry Impact
  1.6.1 How the Covid-19 is Affecting the Wafer Level Package Industry
    1.6.1.1 Wafer Level Package Business Impact Assessment - Covid-19
    1.6.1.2 Supply Chain Challenges
    1.6.1.3 COVID-19’s Impact On Crude Oil and Refined Products
  1.6.2 Market Trends and Wafer Level Package Potential Opportunities in the COVID-19 Landscape
  1.6.3 Measures / Proposal against Covid-19
    1.6.3.1 Government Measures to Combat Covid-19 Impact
    1.6.3.2 Proposal for Wafer Level Package Players to Combat Covid-19 Impact
1.7 Study Objectives
1.8 Years Considered

2 EXECUTIVE SUMMARY

2.1 Wafer Level Package Market Perspective (2015-2026)
2.2 Wafer Level Package Growth Trends by Regions
  2.2.1 Wafer Level Package Market Size by Regions: 2015 VS 2020 VS 2026
  2.2.2 Wafer Level Package Historic Market Share by Regions (2018-2019)
2.3 Industry Trends and Growth Strategy
  2.3.1 Market Top Trends
  2.3.2 Market Drivers

3 COMPETITION LANDSCAPE BY KEY PLAYERS

3.1 Wafer Level Package Revenue by Players (2019-2020)
3.2 Wafer Level Package Key Players Head office and Area Served
3.3 Key Players Wafer Level Package Product/Solution/Service
3.4 Date of Enter into Wafer Level Package Market
3.5 Key Players Wafer Level Package Funding/Investment Analysis
3.6 Global Key Players Wafer Level Package Valuation & Market Capitalization
3.7 Mergers & Acquisitions, Expansion Plans

4 GLOBAL WAFER LEVEL PACKAGE MARKET SIZE BY TYPE (2019-2026)

5 GLOBAL WAFER LEVEL PACKAGE MARKET SIZE BY APPLICATION (2019-2026)

6 NORTH AMERICA

6.1 North America Wafer Level Package Market Forecast (2019-2026)
6.2 Wafer Level Package Key Players in North America (2019-2020)
6.3 North America Wafer Level Package Market Size by Type (2015-2020)
6.4 North America Wafer Level Package Market Size by Application (2015-2020)

7 EUROPE

7.1 Europe Wafer Level Package Market Forecast (2019-2026)
7.2 Wafer Level Package Key Players in Europe (2019-2020)
7.3 Europe Wafer Level Package Market Size by Type (2015-2020)
7.4 Europe Wafer Level Package Market Size by Application (2015-2020)

8 CHINA

8.1 China Wafer Level Package Market Forecast (2019-2026)
8.2 Wafer Level Package Key Players in China (2019-2020)
8.3 China Wafer Level Package Market Size by Type (2015-2020)
8.4 China Wafer Level Package Market Size by Application (2015-2020)

9 JAPAN

9.1 Japan Wafer Level Package Market Forecast (2019-2026)
9.2 Wafer Level Package Key Players in Japan (2019-2020)
9.3 Japan Wafer Level Package Market Size by Type (2015-2020)
9.4 Japan Wafer Level Package Market Size by Application (2015-2020)

10 SOUTHEAST ASIA

10.1 Southeast Asia Wafer Level Package Market Forecast (2019-2026)
10.2 Wafer Level Package Key Players in Southeast Asia (2019-2020)
10.3 Southeast Asia Wafer Level Package Market Size by Type (2015-2020)
10.4 Southeast Asia Wafer Level Package Market Size by Application (2015-2020)

11 INDIA

11.1 India Wafer Level Package Market Forecast (2019-2026)
11.2 Wafer Level Package Key Players in India (2019-2020)
11.3 India Wafer Level Package Market Size by Type (2015-2020)
11.4 India Wafer Level Package Market Size by Application (2015-2020)

12 CENTRAL & SOUTH AMERICA

12.1 Central & South America Wafer Level Package Market Forecast (2019-2026)
12.2 Wafer Level Package Key Players in Central & South America (2019-2020)
12.3 Central & South America Wafer Level Package Market Size by Type (2015-2020)
12.4 Central & South America Wafer Level Package Market Size by Application (2015-2020)

13 KEY PLAYERS PROFILES

13.1 lASE
  13.1.1 lASE Company Details
  13.1.2 lASE Business Overview and Its Total Revenue
  13.1.3 lASE Wafer Level Package Introduction
  13.1.4 lASE Revenue in Wafer Level Package Business (2019-2020))
  13.1.5 lASE Recent Development
13.2 Amkor
  13.2.1 Amkor Company Details
  13.2.2 Amkor Business Overview and Its Total Revenue
  13.2.3 Amkor Wafer Level Package Introduction
  13.2.4 Amkor Revenue in Wafer Level Package Business (2019-2020))
  13.2.5 Amkor Recent Development
13.3 Intel
  13.3.1 Intel Company Details
  13.3.2 Intel Business Overview and Its Total Revenue
  13.3.3 Intel Wafer Level Package Introduction
  13.3.4 Intel Revenue in Wafer Level Package Business (2019-2020))
  13.3.5 Intel Recent Development
13.4 Samsung
  13.4.1 Samsung Company Details
  13.4.2 Samsung Business Overview and Its Total Revenue
  13.4.3 Samsung Wafer Level Package Introduction
  13.4.4 Samsung Revenue in Wafer Level Package Business (2019-2020))
  13.4.5 Samsung Recent Development
13.5 AT&S
  13.5.1 AT&S Company Details
  13.5.2 AT&S Business Overview and Its Total Revenue
  13.5.3 AT&S Wafer Level Package Introduction
  13.5.4 AT&S Revenue in Wafer Level Package Business (2019-2020))
  13.5.5 AT&S Recent Development
13.6 Toshiba
  13.6.1 Toshiba Company Details
  13.6.2 Toshiba Business Overview and Its Total Revenue
  13.6.3 Toshiba Wafer Level Package Introduction
  13.6.4 Toshiba Revenue in Wafer Level Package Business (2019-2020))
  13.6.5 Toshiba Recent Development
13.7 JCET
  13.7.1 JCET Company Details
  13.7.2 JCET Business Overview and Its Total Revenue
  13.7.3 JCET Wafer Level Package Introduction
  13.7.4 JCET Revenue in Wafer Level Package Business (2019-2020))
  13.7.5 JCET Recent Development
13.8 Qualcomm
  13.8.1 Qualcomm Company Details
  13.8.2 Qualcomm Business Overview and Its Total Revenue
  13.8.3 Qualcomm Wafer Level Package Introduction
  13.8.4 Qualcomm Revenue in Wafer Level Package Business (2019-2020))
  13.8.5 Qualcomm Recent Development
13.9 IBM
  13.9.1 IBM Company Details
  13.9.2 IBM Business Overview and Its Total Revenue
  13.9.3 IBM Wafer Level Package Introduction
  13.9.4 IBM Revenue in Wafer Level Package Business (2019-2020))
  13.9.5 IBM Recent Development
13.10 SK Hynix
  13.10.1 SK Hynix Company Details
  13.10.2 SK Hynix Business Overview and Its Total Revenue
  13.10.3 SK Hynix Wafer Level Package Introduction
  13.10.4 SK Hynix Revenue in Wafer Level Package Business (2019-2020))
  13.10.5 SK Hynix Recent Development
13.11 UTAC
  10.11.1 UTAC Company Details
  10.11.2 UTAC Business Overview and Its Total Revenue
  10.11.3 UTAC Wafer Level Package Introduction
  10.11.4 UTAC Revenue in Wafer Level Package Business (2019-2020))
  10.11.5 UTAC Recent Development
13.12 TSMC
  10.12.1 TSMC Company Details
  10.12.2 TSMC Business Overview and Its Total Revenue
  10.12.3 TSMC Wafer Level Package Introduction
  10.12.4 TSMC Revenue in Wafer Level Package Business (2019-2020))
  10.12.5 TSMC Recent Development
13.13 China Wafer Level CSP
  10.13.1 China Wafer Level CSP Company Details
  10.13.2 China Wafer Level CSP Business Overview and Its Total Revenue
  10.13.3 China Wafer Level CSP Wafer Level Package Introduction
  10.13.4 China Wafer Level CSP Revenue in Wafer Level Package Business (2019-2020))
  10.13.5 China Wafer Level CSP Recent Development
13.14 Interconnect Systems
  10.14.1 Interconnect Systems Company Details
  10.14.2 Interconnect Systems Business Overview and Its Total Revenue
  10.14.3 Interconnect Systems Wafer Level Package Introduction
  10.14.4 Interconnect Systems Revenue in Wafer Level Package Business (2019-2020))
  10.14.5 Interconnect Systems Recent Development

14 MARKET DYNAMICS

14.1 Drivers
14.2 Challenges
14.3 Porter’s Five Forces Analysis
14.4 Market Ecosystem and Value Chain Analysis

15 KEY FINDINGS IN THIS REPORT

15.1 Research Methodology
  15.1.1 Methodology/Research Approach
  15.1.2 Data Source
15.2 Disclaimer
15.3 Author Details

List Of Tables

LIST OF TABLES

Table 1. Wafer Level Package Key Market Segments
Table 2. Key Players Covered: Ranking by Wafer Level Package Revenue
Table 3. Ranking of Global Top Wafer Level Package Manufacturers by Revenue (US$ Million) in 2019
Table 4. Global Wafer Level Package Market Size Growth Rate by Type (US$ Million): 2020 VS 2026
Table 5. Key Players of 3D Wire Bonding
Table 6. Key Players of 3D TSV
Table 7. Key Players of Others
Table 8. COVID-19 Impact Global Market: (Four Wafer Level Package Market Size Forecast Scenarios)
Table 9. Opportunities and Trends for Wafer Level Package Players in the COVID-19 Landscape
Table 10. Present Opportunities in China & Elsewhere Due to the Coronavirus Crisis
Table 11. Key Regions/Countries Measures against Covid-19 Impact
Table 12. Proposal for Wafer Level Package Players to Combat Covid-19 Impact
Table 13. Global Wafer Level Package Market Size Growth by Application (US$ Million): 2020 VS 2026
Table 14. Global Wafer Level Package Market Size by Regions (US$ Million): 2020 VS 2026
Table 15. Global Wafer Level Package Market Size by Regions (US$ Million): 2020 VS 2026
Table 16. Global Wafer Level Package Market Share by Regions 2019-2026
Table 17. Market Top Trends
Table 18. Market Use Cases
Table 19. Global Wafer Level Package Revenue by Players (2019-2020) (Million US$)
Table 20. Global Wafer Level Package Market Share by Players (2019-2020)
Table 21. Key Players Headquarters and Area Served
Table 22. Key Players Wafer Level Package Product Solution and Service
Table 23. Date of Enter into Wafer Level Package Market
Table 24. Global Key Players Wafer Level Package Funding/Investment Analysis (Million USD)
Table 25. Global Key Players Wafer Level Package Valuation & Market Capitalization (Million USD)
Table 26. Mergers & Acquisitions, Expansion Plans
Table 27. Global Wafer Level Package Market Size by Type (2019-2026) (Million US$)
Table 28. Global Wafer Level Package Market Size Share by Type (2019-2026)
Table 29. Global Wafer Level Package Market Size by Application (2019-2026) (Million US$)
Table 30. Global Wafer Level Package Market Size Share by Application (2019-2026)
Table 31. North America Key Players Wafer Level Package Revenue (2019-2020) (Million US$)
Table 32. North America Key Players Wafer Level Package Market Share (2019-2020)
Table 33. North America Wafer Level Package Market Size by Type (2019-2026) (Million US$)
Table 34. North America Wafer Level Package Market Share by Type (2019-2026)
Table 35. North America Wafer Level Package Market Size by Application (2019-2026) (Million US$)
Table 36. North America Wafer Level Package Market Share by Application (2019-2026)
Table 37. Europe Key Players Wafer Level Package Revenue (2019-2020) (Million US$)
Table 38. Europe Key Players Wafer Level Package Market Share (2019-2020)
Table 39. Europe Wafer Level Package Market Size by Type (2019-2026) (Million US$)
Table 40. Europe Wafer Level Package Market Share by Type (2019-2026)
Table 41. Europe Wafer Level Package Market Size by Application (2019-2026) (Million US$)
Table 42. Europe Wafer Level Package Market Share by Application (2019-2026)
Table 43. China Key Players Wafer Level Package Revenue (2019-2020) (Million US$)
Table 44. China Key Players Wafer Level Package Market Share (2019-2020)
Table 45. China Wafer Level Package Market Size by Type (2019-2026) (Million US$)
Table 46. China Wafer Level Package Market Share by Type (2019-2026)
Table 47. China Wafer Level Package Market Size by Application (2019-2026) (Million US$)
Table 48. China Wafer Level Package Market Share by Application (2019-2026)
Table 49. Japan Key Players Wafer Level Package Revenue (2019-2020) (Million US$)
Table 50. Japan Key Players Wafer Level Package Market Share (2019-2020)
Table 51. Japan Wafer Level Package Market Size by Type (2019-2026) (Million US$)
Table 52. Japan Wafer Level Package Market Share by Type (2019-2026)
Table 53. Japan Wafer Level Package Market Size by Application (2019-2026) (Million US$)
Table 54. Japan Wafer Level Package Market Share by Application (2019-2026)
Table 55. Southeast Asia Key Players Wafer Level Package Revenue (2019-2020) (Million US$)
Table 56. Southeast Asia Key Players Wafer Level Package Market Share (2019-2020)
Table 57. Southeast Asia Wafer Level Package Market Size by Type (2019-2026) (Million US$)
Table 58. Southeast Asia Wafer Level Package Market Share by Type (2019-2026)
Table 59. Southeast Asia Wafer Level Package Market Size by Application (2019-2026) (Million US$)
Table 60. Southeast Asia Wafer Level Package Market Share by Application (2019-2026)
Table 61. India Key Players Wafer Level Package Revenue (2019-2020) (Million US$)
Table 62. India Key Players Wafer Level Package Market Share (2019-2020)
Table 63. India Wafer Level Package Market Size by Type (2019-2026) (Million US$)
Table 64. India Wafer Level Package Market Share by Type (2019-2026)
Table 65. India Wafer Level Package Market Size by Application (2019-2026) (Million US$)
Table 66. India Wafer Level Package Market Share by Application (2019-2026)
Table 67. Central & South America Key Players Wafer Level Package Revenue (2019-2020) (Million US$)
Table 68. Central & South America Key Players Wafer Level Package Market Share (2019-2020)
Table 69. Central & South America Wafer Level Package Market Size by Type (2019-2026) (Million US$)
Table 70. Central & South America Wafer Level Package Market Share by Type (2019-2026)
Table 71. Central & South America Wafer Level Package Market Size by Application (2019-2026) (Million US$)
Table 72. Central & South America Wafer Level Package Market Share by Application (2019-2026)
Table 73. lASE Company Details
Table 74. lASE Business Overview
Table 75. lASE Product
Table 76. Company Description and Business Overview
Table 77. lASE Wafer Level Package Product
Table 78. lASE Revenue in Wafer Level Package Business 2019 and 2020 (Million US$)
Table 79. lASE Recent Development
Table 80. Amkor Company Details
Table 81. Amkor Business Overview
Table 82. Amkor Product
Table 83. Company Description and Business Overview
Table 84. Amkor Wafer Level Package Product
Table 85. Amkor Revenue in Wafer Level Package Business 2019 and 2020 (Million US$)
Table 86. Amkor Recent Development
Table 87. Intel Company Details
Table 88. Intel Business Overview
Table 89. Intel Product
Table 90. Company Description and Business Overview
Table 91. Intel Wafer Level Package Product
Table 92. Intel Revenue in Wafer Level Package Business 2019 and 2020 (Million US$)
Table 93. Intel Recent Development
Table 94. Samsung Company Details
Table 95. Samsung Business Overview
Table 96. Samsung Product
Table 97. Company Description and Business Overview
Table 98. Samsung Wafer Level Package Product
Table 99. Samsung Revenue in Wafer Level Package Business 2019 and 2020 (Million US$)
Table 100. Samsung Recent Development
Table 101. AT&S Company Details
Table 102. AT&S Business Overview
Table 103. AT&S Product
Table 104. Company Description and Business Overview
Table 105. AT&S Wafer Level Package Product
Table 106. AT&S Revenue in Wafer Level Package Business 2019 and 2020 (Million US$)
Table 107. AT&S Recent Development
Table 108. Toshiba Company Details
Table 109. Toshiba Business Overview
Table 110. Toshiba Product
Table 111. Company Description and Business Overview
Table 112. Toshiba Wafer Level Package Product
Table 113. Toshiba Revenue in Wafer Level Package Business 2019 and 2020 (Million US$)
Table 114. Toshiba Recent Development
Table 115. JCET Company Details
Table 116. JCET Business Overview
Table 117. JCET Product
Table 118. Company Description and Business Overview
Table 119. JCET Wafer Level Package Product
Table 120. JCET Revenue in Wafer Level Package Business 2019 and 2020 (Million US$)
Table 121. JCET Recent Development
Table 122. Qualcomm Business Overview
Table 123. Qualcomm Product
Table 124. Qualcomm Company Details
Table 125. Company Description and Business Overview
Table 126. Qualcomm Wafer Level Package Product
Table 127. Qualcomm Revenue in Wafer Level Package Business 2019 and 2020 (Million US$)
Table 128. Qualcomm Recent Development
Table 129. IBM Company Details
Table 130. IBM Business Overview
Table 131. IBM Product
Table 132. Company Description and Business Overview
Table 133. IBM Wafer Level Package Product
Table 134. IBM Revenue in Wafer Level Package Business 2019 and 2020 (Million US$)
Table 135. IBM Recent Development
Table 136. SK Hynix Company Details
Table 137. SK Hynix Business Overview
Table 138. SK Hynix Product
Table 139. Company Description and Business Overview
Table 140. SK Hynix Wafer Level Package Product
Table 141. SK Hynix Revenue in Wafer Level Package Business 2019 and 2020 (Million US$)
Table 142. SK Hynix Recent Development
Table 143. UTAC Company Details
Table 144. UTAC Business Overview
Table 145. UTAC Product
Table 146. Company Description and Business Overview
Table 147. UTAC Wafer Level Package Product
Table 148. UTAC Revenue in Wafer Level Package Business 2019 and 2020 (Million US$)
Table 149. UTAC Recent Development
Table 150. TSMC Company Details
Table 151. TSMC Business Overview
Table 152. TSMC Product
Table 153. Company Description and Business Overview
Table 154. TSMC Wafer Level Package Product
Table 155. TSMC Revenue in Wafer Level Package Business 2019 and 2020 (Million US$)
Table 156. TSMC Recent Development
Table 157. China Wafer Level CSP Company Details
Table 158. China Wafer Level CSP Business Overview
Table 159. China Wafer Level CSP Product
Table 160. Company Description and Business Overview
Table 161. China Wafer Level CSP Wafer Level Package Product
Table 162. China Wafer Level CSP Revenue in Wafer Level Package Business 2019 and 2020 (Million US$)
Table 163. China Wafer Level CSP Recent Development
Table 164. Interconnect Systems Company Details
Table 165. Interconnect Systems Business Overview
Table 166. Interconnect Systems Product
Table 167. Company Description and Business Overview
Table 168. Interconnect Systems Wafer Level Package Product
Table 169. Interconnect Systems Revenue in Wafer Level Package Business 2019 and 2020 (Million US$)
Table 170. Interconnect Systems Recent Development
Table 171. Company Description and Business Overview
Table 172. Company Description and Business Overview
Table 173. Company Description and Business Overview
Table 174. Company Description and Business Overview
Table 175. Company Description and Business Overview
Table 176. Company Description and Business Overview
Table 177. Company Description and Business Overview
Table 178. Company Description and Business Overview
Table 179. Company Description and Business Overview
Table 180. Company Description and Business Overview
Table 181. Company Description and Business Overview
Table 182. Company Description and Business Overview
Table 183. Company Description and Business Overview
Table 184. Company Description and Business Overview
Table 185. Company Description and Business Overview
Table 186. Company Description and Business Overview
Table 187. Company Description and Business Overview
Table 188. Company Description and Business Overview
Table 189. Company Description and Business Overview
Table 190. Company Description and Business Overview
Table 191. Company Description and Business Overview
Table 192. Company Description and Business Overview
Table 193. Company Description and Business Overview
Table 194. Company Description and Business Overview
Table 195. Company Description and Business Overview
Table 196. Company Description and Business Overview
Table 197. Key Drivers: Impact Analysis (2021-2026)
Table 198. Key Opportunities
Table 199. Key Challenges
Table 200. Research Programs/Design for This Report
Table 201. Key Data Information from Secondary Sources
Table 202. Key Data Information from Primary Sources

List Of Figures

LIST OF FIGURES

Figure 1. Global Wafer Level Package Market Share by Type: 2020 VS 2026
Figure 2. 3D Wire Bonding Features
Figure 3. 3D TSV Features
Figure 4. Others Features
Figure 5. Global Wafer Level Package Market Share by Application: 2020 VS 2026
Figure 6. Consumer Electronics Case Studies
Figure 7. Industrial Case Studies
Figure 8. Automotive & Transport Case Studies
Figure 9. IT & Telecommunication Case Studies
Figure 10. Others Case Studies
Figure 11. Wafer Level Package Report Years Considered
Figure 12. Global Wafer Level Package and Growth Rate (2019-2026) (Million US$)
Figure 13. Global Wafer Level Package Market Share by Regions (2019-2026)
Figure 14. Global Wafer Level Package Market Share by Players in 2019
Figure 15. Global Wafer Level Package Market Size Market Share by Type (2019-2026)
Figure 16. Global Wafer Level Package Market Size Market Share by Application (2019-2026)
Figure 17. North America Wafer Level Package Market Size YoY Growth (2019-2026) (Million US$)
Figure 18. Europe Wafer Level Package Market Size YoY Growth (2019-2026) (Million US$)
Figure 19. China Wafer Level Package Market Size YoY Growth (2019-2026) (Million US$)
Figure 20. Japan Wafer Level Package Market Size YoY Growth (2019-2026) (Million US$)
Figure 21. Southeast Asia Wafer Level Package Market Size YoY Growth (2019-2026) (Million US$)
Figure 22. India Wafer Level Package Market Size YoY Growth (2019-2026) (Million US$)
Figure 23. Central & South America Wafer Level Package Market Size YoY Growth (2019-2026) (Million US$)
Figure 24. Bottom-up and Top-down Approaches for This Report
Figure 25. Data Triangulation
Figure 26. Key Executives Interviewed