Chip Packaging Industry Research Report 2023

August 2023 | 96 pages | ID: C72B09D863CDEN
APO Research

Abstracts

This report aims to provide a comprehensive presentation of the global market for Chip Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Chip Packaging.

The Chip Packaging market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Chip Packaging market comprehensively. Regional market sizes, concerning products by types, by application, and by players, are also provided. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Chip Packaging companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, product type, application, and regions.

Key Companies & Market Share Insights

In this section, the readers will gain an understanding of the key players competing. This report has studied the key growth strategies, such as innovative trends and developments, intensification of product portfolio, mergers and acquisitions, collaborations, new product innovation, and geographical expansion, undertaken by these participants to maintain their presence. Apart from business strategies, the study includes current developments and key financials. The readers will also get access to the data related to global revenue by companies for the period 2017-2022. This all-inclusive report will certainly serve the clients to stay updated and make effective decisions in their businesses. Some of the prominent players reviewed in the research report include:

• ASE Group
• Amkor Technology
• JCET
• Siliconware Precision Industries
• Powertech Technology
• TongFu Microelectronics
• Tianshui Huatian Technology
• UTAC
• Chipbond Technology
• Hana Micron
• OSE
• Walton Advanced Engineering
• NEPES
• Unisem
• ChipMOS
• Signetics
• Carsem
• King Yuan ELECTRONICS

Product Type Insights

Global markets are presented by Chip Packaging type, along with growth forecasts through 2029. Estimates on revenue are based on the price in the supply chain at which the Chip Packaging are procured by the companies.

This report has studied every segment and provided the market size using historical data. They have also talked about the growth opportunities that the segment may pose in the future. This study bestows revenue data by type, and during the historical period (2018-2023) and forecast period (2024-2029).

Chip Packaging segment by Type

• Traditional Packaging
• Advanced Packaging

Application Insights

This report has provided the market size (revenue data) by application, during the historical period (2018-2023) and forecast period (2024-2029).

This report also outlines the market trends of each segment and consumer behaviors impacting the Chip Packaging market and what implications these may have on the industry's future. This report can help to understand the relevant market and consumer trends that are driving the Chip Packaging market.

Chip Packaging Segment by Application

• Automotive and Traffic
• Consumer Electronics
• Communication
• Other

Regional Outlook

This section of the report provides key insights regarding various regions and the key players operating in each region. Economic, social, environmental, technological, and political factors have been taken into consideration while assessing the growth of the particular region/country. The readers will also get their hands on the revenue data of each region and country for the period 2018-2029.

The market has been segmented into various major geographies, including North America, Europe, Asia-Pacific, South America, Middle East & Africa. Detailed analysis of major countries such as the USA, Germany, the U.K., Italy, France, China, Japan, South Korea, Southeast Asia, and India will be covered within the regional segment. For market estimates, data are going to be provided for 2022 because of the base year, with estimates for 2023 and forecast revenue for 2029.

• North America
• United States
• Canada
• Europe
• Germany
• France
• UK
• Italy
• Russia
• Nordic Countries
• Rest of Europe
• Asia-Pacific
• China
• Japan
• South Korea
• Southeast Asia
• India
• Australia
• Rest of Asia
• Latin America
• Mexico
• Brazil
• Rest of Latin America
• Middle East & Africa
• Turkey
• Saudi Arabia
• UAE
• Rest of MEA

Key Drivers & Barriers

High-impact rendering factors and drivers have been studied in this report to aid the readers to understand the general development. Moreover, the report includes restraints and challenges that may act as stumbling blocks on the way of the players. This will assist the users to be attentive and make informed decisions related to business. Specialists have also laid their focus on the upcoming business prospects.

COVID-19 and Russia-Ukraine War Influence Analysis

The readers in the section will understand how the Chip Packaging market scenario changed across the globe during the pandemic, post-pandemic and Russia-Ukraine War. The study is done keeping in view the changes in aspects such as demand, consumption, transportation, consumer behavior, supply chain management. The industry experts have also highlighted the key factors that will help create opportunities for players and stabilize the overall industry in the years to come.

Reasons to Buy This Report

This report will help the readers to understand the competition within the industries and strategies for the competitive environment to enhance the potential profit. The report also focuses on the competitive landscape of the global Chip Packaging market, and introduces in detail the market share, industry ranking, competitor ecosystem, market performance, new product development, operation situation, expansion, and acquisition. etc. of the main players, which helps the readers to identify the main competitors and deeply understand the competition pattern of the market.

This report will help stakeholders to understand the global industry status and trends of Chip Packaging and provides them with information on key market drivers, restraints, challenges, and opportunities.

This report will help stakeholders to understand competitors better and gain more insights to strengthen their position in their businesses. The competitive landscape section includes the market share and rank (in volume and value), competitor ecosystem, new product development, expansion, and acquisition.

This report stays updated with novel technology integration, features, and the latest developments in the market

This report helps stakeholders to understand the COVID-19 and Russia-Ukraine War Influence on the Chip Packaging industry.

This report helps stakeholders to gain insights into which regions to target globally

This report helps stakeholders to gain insights into the end-user perception concerning the adoption of Chip Packaging.

This report helps stakeholders to identify some of the key players in the market and understand their valuable contribution.

Core Chapters

Chapter 1: Research objectives, research methods, data sources, data cross-validation;

Chapter 2: Introduces the report scope of the report, executive summary of different market segments (product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.

Chapter 3: Provides the analysis of various market segments product types, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 4: Provides the analysis of various market segments application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 5: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.

Chapter 6: Detailed analysis of Chip Packaging companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 7, 8, 9, 10, 11: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.

Chapter 12: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.

Chapter 13: The main points and conclusions of the report.

Contents

1 PREFACE

1.1 Scope of Report
1.2 Reasons for Doing This Study
1.3 Research Methodology
1.4 Research Process
1.5 Data Source
  1.5.1 Secondary Sources
  1.5.2 Primary Sources

2 MARKET OVERVIEW

2.1 Product Definition
2.2 Chip Packaging by Type
  2.2.1 Market Value Comparison by Type (2018 VS 2022 VS 2029)
  1.2.2 Traditional Packaging
  1.2.3 Advanced Packaging
2.3 Chip Packaging by Application
  2.3.1 Market Value Comparison by Application (2018 VS 2022 VS 2029)
  2.3.2 Automotive and Traffic
  2.3.3 Consumer Electronics
  2.3.4 Communication
  2.3.5 Other
2.4 Assumptions and Limitations

3 CHIP PACKAGING BREAKDOWN DATA BY TYPE

3.1 Global Chip Packaging Historic Market Size by Type (2018-2023)
3.2 Global Chip Packaging Forecasted Market Size by Type (2023-2028)

4 CHIP PACKAGING BREAKDOWN DATA BY APPLICATION

4.1 Global Chip Packaging Historic Market Size by Application (2018-2023)
4.2 Global Chip Packaging Forecasted Market Size by Application (2018-2023)

5 GLOBAL GROWTH TRENDS

5.1 Global Chip Packaging Market Perspective (2018-2029)
5.2 Global Chip Packaging Growth Trends by Region
  5.2.1 Global Chip Packaging Market Size by Region: 2018 VS 2022 VS 2029
  5.2.2 Chip Packaging Historic Market Size by Region (2018-2023)
  5.2.3 Chip Packaging Forecasted Market Size by Region (2024-2029)
5.3 Chip Packaging Market Dynamics
  5.3.1 Chip Packaging Industry Trends
  5.3.2 Chip Packaging Market Drivers
  5.3.3 Chip Packaging Market Challenges
  5.3.4 Chip Packaging Market Restraints

6 MARKET COMPETITIVE LANDSCAPE BY PLAYERS

6.1 Global Top Chip Packaging Players by Revenue
  6.1.1 Global Top Chip Packaging Players by Revenue (2018-2023)
  6.1.2 Global Chip Packaging Revenue Market Share by Players (2018-2023)
6.2 Global Chip Packaging Industry Players Ranking, 2021 VS 2022 VS 2023
6.3 Global Key Players of Chip Packaging Head office and Area Served
6.4 Global Chip Packaging Players, Product Type & Application
6.5 Global Chip Packaging Players, Date of Enter into This Industry
6.6 Global Chip Packaging Market CR5 and HHI
6.7 Global Players Mergers & Acquisition

7 NORTH AMERICA

7.1 North America Chip Packaging Market Size (2018-2029)
7.2 North America Chip Packaging Market Growth Rate by Country: 2018 VS 2022 VS 2029
7.3 North America Chip Packaging Market Size by Country (2018-2023)
7.4 North America Chip Packaging Market Size by Country (2024-2029)
7.5 United States
7.6 Canada

8 EUROPE

8.1 Europe Chip Packaging Market Size (2018-2029)
8.2 Europe Chip Packaging Market Growth Rate by Country: 2018 VS 2022 VS 2029
8.3 Europe Chip Packaging Market Size by Country (2018-2023)
8.4 Europe Chip Packaging Market Size by Country (2024-2029)
7.4 Germany
7.5 France
7.6 U.K.
7.7 Italy
7.8 Russia
7.9 Nordic Countries

9 ASIA-PACIFIC

9.1 Asia-Pacific Chip Packaging Market Size (2018-2029)
9.2 Asia-Pacific Chip Packaging Market Growth Rate by Country: 2018 VS 2022 VS 2029
9.3 Asia-Pacific Chip Packaging Market Size by Country (2018-2023)
9.4 Asia-Pacific Chip Packaging Market Size by Country (2024-2029)
8.4 China
8.5 Japan
8.6 South Korea
8.7 Southeast Asia
8.8 India
8.9 Australia

10 LATIN AMERICA

10.1 Latin America Chip Packaging Market Size (2018-2029)
10.2 Latin America Chip Packaging Market Growth Rate by Country: 2018 VS 2022 VS 2029
10.3 Latin America Chip Packaging Market Size by Country (2018-2023)
10.4 Latin America Chip Packaging Market Size by Country (2024-2029)
9.4 Mexico
9.5 Brazil

11 MIDDLE EAST & AFRICA

11.1 Middle East & Africa Chip Packaging Market Size (2018-2029)
11.2 Middle East & Africa Chip Packaging Market Growth Rate by Country: 2018 VS 2022 VS 2029
11.3 Middle East & Africa Chip Packaging Market Size by Country (2018-2023)
11.4 Middle East & Africa Chip Packaging Market Size by Country (2024-2029)
10.4 Turkey
10.5 Saudi Arabia
10.6 UAE

12 PLAYERS PROFILED

11.1 ASE Group
  11.1.1 ASE Group Company Detail
  11.1.2 ASE Group Business Overview
  11.1.3 ASE Group Chip Packaging Introduction
  11.1.4 ASE Group Revenue in Chip Packaging Business (2017-2022)
  11.1.5 ASE Group Recent Development
11.2 Amkor Technology
  11.2.1 Amkor Technology Company Detail
  11.2.2 Amkor Technology Business Overview
  11.2.3 Amkor Technology Chip Packaging Introduction
  11.2.4 Amkor Technology Revenue in Chip Packaging Business (2017-2022)
  11.2.5 Amkor Technology Recent Development
11.3 JCET
  11.3.1 JCET Company Detail
  11.3.2 JCET Business Overview
  11.3.3 JCET Chip Packaging Introduction
  11.3.4 JCET Revenue in Chip Packaging Business (2017-2022)
  11.3.5 JCET Recent Development
11.4 Siliconware Precision Industries
  11.4.1 Siliconware Precision Industries Company Detail
  11.4.2 Siliconware Precision Industries Business Overview
  11.4.3 Siliconware Precision Industries Chip Packaging Introduction
  11.4.4 Siliconware Precision Industries Revenue in Chip Packaging Business (2017-2022)
  11.4.5 Siliconware Precision Industries Recent Development
11.5 Powertech Technology
  11.5.1 Powertech Technology Company Detail
  11.5.2 Powertech Technology Business Overview
  11.5.3 Powertech Technology Chip Packaging Introduction
  11.5.4 Powertech Technology Revenue in Chip Packaging Business (2017-2022)
  11.5.5 Powertech Technology Recent Development
11.6 TongFu Microelectronics
  11.6.1 TongFu Microelectronics Company Detail
  11.6.2 TongFu Microelectronics Business Overview
  11.6.3 TongFu Microelectronics Chip Packaging Introduction
  11.6.4 TongFu Microelectronics Revenue in Chip Packaging Business (2017-2022)
  11.6.5 TongFu Microelectronics Recent Development
11.7 Tianshui Huatian Technology
  11.7.1 Tianshui Huatian Technology Company Detail
  11.7.2 Tianshui Huatian Technology Business Overview
  11.7.3 Tianshui Huatian Technology Chip Packaging Introduction
  11.7.4 Tianshui Huatian Technology Revenue in Chip Packaging Business (2017-2022)
  11.7.5 Tianshui Huatian Technology Recent Development
11.8 UTAC
  11.8.1 UTAC Company Detail
  11.8.2 UTAC Business Overview
  11.8.3 UTAC Chip Packaging Introduction
  11.8.4 UTAC Revenue in Chip Packaging Business (2017-2022)
  11.8.5 UTAC Recent Development
11.9 Chipbond Technology
  11.9.1 Chipbond Technology Company Detail
  11.9.2 Chipbond Technology Business Overview
  11.9.3 Chipbond Technology Chip Packaging Introduction
  11.9.4 Chipbond Technology Revenue in Chip Packaging Business (2017-2022)
  11.9.5 Chipbond Technology Recent Development
11.10 Hana Micron
  11.10.1 Hana Micron Company Detail
  11.10.2 Hana Micron Business Overview
  11.10.3 Hana Micron Chip Packaging Introduction
  11.10.4 Hana Micron Revenue in Chip Packaging Business (2017-2022)
  11.10.5 Hana Micron Recent Development
11.11 OSE
  11.11.1 OSE Company Detail
  11.11.2 OSE Business Overview
  11.11.3 OSE Chip Packaging Introduction
  11.11.4 OSE Revenue in Chip Packaging Business (2017-2022)
  11.11.5 OSE Recent Development
11.12 Walton Advanced Engineering
  11.12.1 Walton Advanced Engineering Company Detail
  11.12.2 Walton Advanced Engineering Business Overview
  11.12.3 Walton Advanced Engineering Chip Packaging Introduction
  11.12.4 Walton Advanced Engineering Revenue in Chip Packaging Business (2017-2022)
  11.12.5 Walton Advanced Engineering Recent Development
11.13 NEPES
  11.13.1 NEPES Company Detail
  11.13.2 NEPES Business Overview
  11.13.3 NEPES Chip Packaging Introduction
  11.13.4 NEPES Revenue in Chip Packaging Business (2017-2022)
  11.13.5 NEPES Recent Development
11.14 Unisem
  11.14.1 Unisem Company Detail
  11.14.2 Unisem Business Overview
  11.14.3 Unisem Chip Packaging Introduction
  11.14.4 Unisem Revenue in Chip Packaging Business (2017-2022)
  11.14.5 Unisem Recent Development
11.15 ChipMOS
  11.15.1 ChipMOS Company Detail
  11.15.2 ChipMOS Business Overview
  11.15.3 ChipMOS Chip Packaging Introduction
  11.15.4 ChipMOS Revenue in Chip Packaging Business (2017-2022)
  11.15.5 ChipMOS Recent Development
11.16 Signetics
  11.16.1 Signetics Company Detail
  11.16.2 Signetics Business Overview
  11.16.3 Signetics Chip Packaging Introduction
  11.16.4 Signetics Revenue in Chip Packaging Business (2017-2022)
  11.16.5 Signetics Recent Development
11.17 Carsem
  11.17.1 Carsem Company Detail
  11.17.2 Carsem Business Overview
  11.17.3 Carsem Chip Packaging Introduction
  11.17.4 Carsem Revenue in Chip Packaging Business (2017-2022)
  11.17.5 Carsem Recent Development
11.18 King Yuan ELECTRONICS
  11.18.1 King Yuan ELECTRONICS Company Detail
  11.18.2 King Yuan ELECTRONICS Business Overview
  11.18.3 King Yuan ELECTRONICS Chip Packaging Introduction
  11.18.4 King Yuan ELECTRONICS Revenue in Chip Packaging Business (2017-2022)
  11.18.5 King Yuan ELECTRONICS Recent Development

13 REPORT CONCLUSION

14 DISCLAIMER