United States 3D IC and 2.5D IC Packaging Market Report 2017

January 2017 | 103 pages | ID: U84FD23001AEN
QYResearch

Abstracts

Notes:

Sales, means the sales volume of 3D IC and 2.5D IC Packaging

Revenue, means the sales value of 3D IC and 2.5D IC Packaging

This report studies sales (consumption) of 3D IC and 2.5D IC Packaging in United States market, focuses on the top players, with sales, price, revenue and market share for each player, covering

• Tezzaron
• ASE Group
• Amkor Technology
• STATS ChipPAC Ltd.

Market Segment by States, covering

• California
• Texas
• New York
• Florida
• Illinois

Split by product types, with sales, revenue, price, market share and growth rate of each type, can be divided into

• 3D wafer-level chip-scale packaging
• 3D TSV
• 2.5D

Split by applications, this report focuses on sales, market share and growth rate of 3D IC and 2.5D IC Packaging in each application, can be divided into

• Consumer electronics
• Telecommunication
• Industrial sector
• Automotive
• Military and aerospace
• Smart technologies
• Medical devices

Contents

United States 3D IC and 2.5D IC Packaging Market Report 2017

1 3D IC AND 2.5D IC PACKAGING OVERVIEW

1.1 Product Overview and Scope of 3D IC and 2.5D IC Packaging
1.2 Classification of 3D IC and 2.5D IC Packaging
  1.2.1 3D wafer-level chip-scale packaging
  1.2.2 3D TSV
  1.2.3 2.5D
1.3 Application of 3D IC and 2.5D IC Packaging
  1.3.1 Consumer electronics
  1.3.2 Telecommunication
  1.3.3 Industrial sector
  1.3.4 Automotive
  1.3.5 Military and aerospace
  1.3.6 Smart technologies
  1.3.7 Medical devices
1.4 United States Market Size Sales (Volume) and Revenue (Value) of 3D IC and 2.5D IC Packaging (2011-2021)
  1.4.1 United States 3D IC and 2.5D IC Packaging Sales and Growth Rate (2011-2021)
  1.4.2 United States 3D IC and 2.5D IC Packaging Revenue and Growth Rate (2011-2021)

2 UNITED STATES 3D IC AND 2.5D IC PACKAGING COMPETITION BY MANUFACTURERS

2.1 United States 3D IC and 2.5D IC Packaging Sales and Market Share of Key Manufacturers (2015 and 2016)
2.2 United States 3D IC and 2.5D IC Packaging Revenue and Share by Manufactures (2015 and 2016)
2.3 United States 3D IC and 2.5D IC Packaging Average Price by Manufactures (2015 and 2016)
2.4 3D IC and 2.5D IC Packaging Market Competitive Situation and Trends
  2.4.1 3D IC and 2.5D IC Packaging Market Concentration Rate
  2.4.2 3D IC and 2.5D IC Packaging Market Share of Top 3 and Top 5 Manufacturers
  2.4.3 Mergers & Acquisitions, Expansion

3 UNITED STATES 3D IC AND 2.5D IC PACKAGING SALES (VOLUME) AND REVENUE (VALUE) BY STATES (2011-2016)

3.1 United States 3D IC and 2.5D IC Packaging Sales and Market Share by States (2011-2016)
3.2 United States 3D IC and 2.5D IC Packaging Revenue and Market Share by States (2011-2016)
3.3 United States 3D IC and 2.5D IC Packaging Price by States (2011-2016)

4 UNITED STATES 3D IC AND 2.5D IC PACKAGING SALES (VOLUME) AND REVENUE (VALUE) BY TYPE (2011-2016)

4.1 United States 3D IC and 2.5D IC Packaging Sales and Market Share by Type (2011-2016)
4.2 United States 3D IC and 2.5D IC Packaging Revenue and Market Share by Type (2011-2016)
4.3 United States 3D IC and 2.5D IC Packaging Price by Type (2011-2016)
4.4 United States 3D IC and 2.5D IC Packaging Sales Growth Rate by Type (2011-2016)

5 UNITED STATES 3D IC AND 2.5D IC PACKAGING SALES (VOLUME) BY APPLICATION (2011-2016)

5.1 United States 3D IC and 2.5D IC Packaging Sales and Market Share by Application (2011-2016)
5.2 United States 3D IC and 2.5D IC Packaging Sales Growth Rate by Application (2011-2016)
5.3 Market Drivers and Opportunities

6 UNITED STATES 3D IC AND 2.5D IC PACKAGING MANUFACTURERS PROFILES/ANALYSIS

6.1 Tezzaron
  6.1.1 Company Basic Information, Manufacturing Base and Competitors
  6.1.2 3D IC and 2.5D IC Packaging Product Type, Application and Specification
    6.1.2.1 3D wafer-level chip-scale packaging
    6.1.2.2 3D TSV
  6.1.3 Tezzaron 3D IC and 2.5D IC Packaging Sales, Revenue, Price and Gross Margin (2011-2016)
  6.1.4 Main Business/Business Overview
6.2 ASE Group
  6.2.2 3D IC and 2.5D IC Packaging Product Type, Application and Specification
    6.2.2.1 3D wafer-level chip-scale packaging
    6.2.2.2 3D TSV
  6.2.3 ASE Group 3D IC and 2.5D IC Packaging Sales, Revenue, Price and Gross Margin (2011-2016)
  6.2.4 Main Business/Business Overview
6.3 Amkor Technology
  6.3.2 3D IC and 2.5D IC Packaging Product Type, Application and Specification
    6.3.2.1 3D wafer-level chip-scale packaging
    6.3.2.2 3D TSV
  6.3.3 Amkor Technology 3D IC and 2.5D IC Packaging Sales, Revenue, Price and Gross Margin (2011-2016)
  6.3.4 Main Business/Business Overview
6.4 STATS ChipPAC Ltd.
  6.4.2 3D IC and 2.5D IC Packaging Product Type, Application and Specification
    6.4.2.1 3D wafer-level chip-scale packaging
    6.4.2.2 3D TSV
  6.4.3 STATS ChipPAC Ltd. 3D IC and 2.5D IC Packaging Sales, Revenue, Price and Gross Margin (2011-2016)
  6.4.4 Main Business/Business Overview

7 3D IC AND 2.5D IC PACKAGING MANUFACTURING COST ANALYSIS

7.1 3D IC and 2.5D IC Packaging Key Raw Materials Analysis
  7.1.1 Key Raw Materials
  7.1.2 Price Trend of Key Raw Materials
  7.1.3 Key Suppliers of Raw Materials
  7.1.4 Market Concentration Rate of Raw Materials
7.2 Proportion of Manufacturing Cost Structure
  7.2.1 Raw Materials
  7.2.2 Labor Cost
  7.2.3 Manufacturing Expenses
7.3 Manufacturing Process Analysis of 3D IC and 2.5D IC Packaging

8 INDUSTRIAL CHAIN, SOURCING STRATEGY AND DOWNSTREAM BUYERS

8.1 3D IC and 2.5D IC Packaging Industrial Chain Analysis
8.2 Upstream Raw Materials Sourcing
8.3 Raw Materials Sources of 3D IC and 2.5D IC Packaging Major Manufacturers in 2015
8.4 Downstream Buyers

9 MARKETING STRATEGY ANALYSIS, DISTRIBUTORS/TRADERS

9.1 Marketing Channel
  9.1.1 Direct Marketing
  9.1.2 Indirect Marketing
  9.1.3 Marketing Channel Development Trend
9.2 Market Positioning
  9.2.1 Pricing Strategy
  9.2.2 Brand Strategy
  9.2.3 Target Client
9.3 Distributors/Traders List

10 MARKET EFFECT FACTORS ANALYSIS

10.1 Technology Progress/Risk
  10.1.1 Substitutes Threat
  10.1.2 Technology Progress in Related Industry
10.2 Consumer Needs/Customer Preference Change
10.3 Economic/Political Environmental Change

11 UNITED STATES 3D IC AND 2.5D IC PACKAGING MARKET FORECAST (2016-2021)

11.1 United States 3D IC and 2.5D IC Packaging Sales, Revenue Forecast (2016-2021)
11.2 United States 3D IC and 2.5D IC Packaging Sales Forecast by Type (2016-2021)
11.3 United States 3D IC and 2.5D IC Packaging Sales Forecast by Application (2016-2021)
11.4 3D IC and 2.5D IC Packaging Price Forecast (2016-2021)

12 RESEARCH FINDINGS AND CONCLUSION

13 APPENDIX

Methodology
Analyst Introduction
Data Source

The report requires updating with new data and is sent in 2-3 business days after order is placed.

List Of Tables

LIST OF TABLES AND FIGURES

Figure Picture of 3D IC and 2.5D IC Packaging
Table Classification of 3D IC and 2.5D IC Packaging
Figure United States Sales Market Share of 3D IC and 2.5D IC Packaging by Type in 2015
Figure 3D wafer-level chip-scale packaging Picture
Figure 3D TSV Picture
Figure 2.5D Picture
Table Application of 3D IC and 2.5D IC Packaging
Figure United States Sales Market Share of 3D IC and 2.5D IC Packaging by Application in 2015
Figure Consumer electronics Examples
Figure Telecommunication Examples
Figure Industrial sector Examples
Figure Automotive Examples
Figure Military and aerospace Examples
Figure Smart technologies Examples
Figure Medical devices Examples
Figure United States 3D IC and 2.5D IC Packaging Sales and Growth Rate (2011-2021)
Figure United States 3D IC and 2.5D IC Packaging Revenue and Growth Rate (2011-2021)
Table United States 3D IC and 2.5D IC Packaging Sales of Key Manufacturers (2015 and 2016)
Table United States 3D IC and 2.5D IC Packaging Sales Share by Manufacturers (2015 and 2016)
Figure 2015 3D IC and 2.5D IC Packaging Sales Share by Manufacturers
Figure 2016 3D IC and 2.5D IC Packaging Sales Share by Manufacturers
Table United States 3D IC and 2.5D IC Packaging Revenue by Manufacturers (2015 and 2016)
Table United States 3D IC and 2.5D IC Packaging Revenue Share by Manufacturers (2015 and 2016)
Table 2015 United States 3D IC and 2.5D IC Packaging Revenue Share by Manufacturers
Table 2016 United States 3D IC and 2.5D IC Packaging Revenue Share by Manufacturers
Table United States Market 3D IC and 2.5D IC Packaging Average Price of Key Manufacturers (2015 and 2016)
Figure United States Market 3D IC and 2.5D IC Packaging Average Price of Key Manufacturers in 2015
Figure 3D IC and 2.5D IC Packaging Market Share of Top 3 Manufacturers
Figure 3D IC and 2.5D IC Packaging Market Share of Top 5 Manufacturers
Table United States 3D IC and 2.5D IC Packaging Sales by States (2011-2016)
Table United States 3D IC and 2.5D IC Packaging Sales Share by States (2011-2016)
Figure United States 3D IC and 2.5D IC Packaging Sales Market Share by States in 2015
Table United States 3D IC and 2.5D IC Packaging Revenue and Market Share by States (2011-2016)
Table United States 3D IC and 2.5D IC Packaging Revenue Share by States (2011-2016)
Figure Revenue Market Share of 3D IC and 2.5D IC Packaging by States (2011-2016)
Table United States 3D IC and 2.5D IC Packaging Price by States (2011-2016)
Table United States 3D IC and 2.5D IC Packaging Sales by Type (2011-2016)
Table United States 3D IC and 2.5D IC Packaging Sales Share by Type (2011-2016)
Figure United States 3D IC and 2.5D IC Packaging Sales Market Share by Type in 2015
Table United States 3D IC and 2.5D IC Packaging Revenue and Market Share by Type (2011-2016)
Table United States 3D IC and 2.5D IC Packaging Revenue Share by Type (2011-2016)
Figure Revenue Market Share of 3D IC and 2.5D IC Packaging by Type (2011-2016)
Table United States 3D IC and 2.5D IC Packaging Price by Type (2011-2016)
Figure United States 3D IC and 2.5D IC Packaging Sales Growth Rate by Type (2011-2016)
Table United States 3D IC and 2.5D IC Packaging Sales by Application (2011-2016)
Table United States 3D IC and 2.5D IC Packaging Sales Market Share by Application (2011-2016)
Figure United States 3D IC and 2.5D IC Packaging Sales Market Share by Application in 2015
Table United States 3D IC and 2.5D IC Packaging Sales Growth Rate by Application (2011-2016)
Figure United States 3D IC and 2.5D IC Packaging Sales Growth Rate by Application (2011-2016)
Table Tezzaron Basic Information List
Table Tezzaron 3D IC and 2.5D IC Packaging Sales, Revenue, Price and Gross Margin (2011-2016)
Figure Tezzaron 3D IC and 2.5D IC Packaging Sales Market Share (2011-2016)
Table ASE Group Basic Information List
Table ASE Group 3D IC and 2.5D IC Packaging Sales, Revenue, Price and Gross Margin (2011-2016)
Table ASE Group 3D IC and 2.5D IC Packaging Sales Market Share (2011-2016)
Table Amkor Technology Basic Information List
Table Amkor Technology 3D IC and 2.5D IC Packaging Sales, Revenue, Price and Gross Margin (2011-2016)
Table Amkor Technology 3D IC and 2.5D IC Packaging Sales Market Share (2011-2016)
Table STATS ChipPAC Ltd. Basic Information List
Table STATS ChipPAC Ltd. 3D IC and 2.5D IC Packaging Sales, Revenue, Price and Gross Margin (2011-2016)
Table STATS ChipPAC Ltd. 3D IC and 2.5D IC Packaging Sales Market Share (2011-2016)
Table Production Base and Market Concentration Rate of Raw Material
Figure Price Trend of Key Raw Materials
Table Key Suppliers of Raw Materials
Figure Manufacturing Cost Structure of 3D IC and 2.5D IC Packaging
Figure Manufacturing Process Analysis of 3D IC and 2.5D IC Packaging
Figure 3D IC and 2.5D IC Packaging Industrial Chain Analysis
Table Raw Materials Sources of 3D IC and 2.5D IC Packaging Major Manufacturers in 2015
Table Major Buyers of 3D IC and 2.5D IC Packaging
Table Distributors/Traders List
Figure United States 3D IC and 2.5D IC Packaging Production and Growth Rate Forecast (2016-2021)
Figure United States 3D IC and 2.5D IC Packaging Revenue and Growth Rate Forecast (2016-2021)
Table United States 3D IC and 2.5D IC Packaging Production Forecast by Type (2016-2021)
Table United States 3D IC and 2.5D IC Packaging Consumption Forecast by Application (2016-2021)
Table United States 3D IC and 2.5D IC Packaging Sales Forecast by States (2016-2021)
Table United States 3D IC and 2.5D IC Packaging Sales Share Forecast by States (2016-2021)