Substrate-Like PCB Market Size and Forecast (2021 - 2031), Global and Regional Share, Trend, and Growth Opportunity Analysis Report Coverage: By Line/Space (25/25 and 30/30 µm and Less than 25/25 µm), Fabrication Process (MSAP and UV LDI), Application (Consumer Electronics, Automotive, Industrial, Medical, and Others), and Geography
The Substrate-Like PCB market size is expected to reach US$ 7.16 billion by 2031 from 2.97 billion in 2024, at an estimated CAGR of 13.4% from 2023 to 2031.
By Geography the Substrate-Like PCB market is segmented into North America, Europe, Asia Pacific, Middle East and Africa, and South and Central America. In 2023, the Asia Pacific regions is growing with a significant growth rate. The development of 5G network infrastructure and demand for multi-layer PCBs from industries encourages market players to increase their production and develop customized PCBs to fulfill their customers’ dynamic needs. Government initiatives and focus on creating awareness related to the benefits of substrate-like PCBs are fueling the market growth. For instance, in April 2022, the China Intellectual Property Office awarded Shenzhen Kinwong Electronic Co., Ltd. with the China Patent Excellence Award for developing a multi-layer PCB production method and multi-layer PCB board. These multi-layer PCB boards are commonly used in 5G base stations, data storage, servers, switching routers, satellite systems, industrial control, and medical equipment. Moreover, the growing industrial demand for multi-layer PCBs encourages Shenzhen Kinwong Electronic Co., Ltd. to produce and manufacture a variety of multi-layer products with significant industrialization benefits. The substrate-like PCB market in South Korea is anticipated to expand during the forecast period owing to the increased focus by the government and market players to enhance the electronics manufacturing industry. For instance, IPC International, Inc. conducted a PC K-FEST 2024, the second annual IPC Korea Festival of Electronics Standards and Technology seminar in Seoul, on October 29, 2024. The seminar was organized to address challenges in the electronics manufacturing industry, demonstrating the way IPC standards enhance manufacturing performance and quality. Moreover, market players are focusing on expanding their business in South Korea to attract new customers, which is likely to create opportunities in the market during the forecast period. For instance, on January 06, 2024, Xiaomi launched a new subsidiary and a range of smart devices, including smartphones, wearables, TVs, power banks, and robot vacuum cleaners, to expand its presence in South Korea. These products support Xiaomi to cater to various consumer needs of budget-friendly to premium devices. As electronic devices become more compact and miniature, the demand for smaller and more efficient circuit boards also increases. Smartphones, tablets, wearables, and IoT gadgets all use substrate-like PCBs for their high-density packing.
The Substrate-Like PCB market analysis has been carried out by considering the following segments: Line/Space, Fabrication Process, Application.
On the basis of line/space, the substrate-like PCB market is segmented into 25/25 and 30/30 µm and less than 25/25 µm. SLP technology demands line width/line spacing equal to or less than 30/30 µm, reducing the size of the main board and allowing more space for extra components. The growing demand from end users for thinner/compact but more functioning smartphones necessitates a steady reduction in board area. A reduction in board area enables the implementation of a larger battery; as a result, various smartphone manufacturers are adopting substrate-like PCBs of 25/25 and 30/30 µm line/space. For example, Samsung and Apple recently used substrate-like PCBs with linewidth/spacing of 25/25 ?m and 30/30 ?m in their smartphones. Because of their reduced linewidth, substrate-like PCBs for smartphones might hold twice as many electronic components as HDI boards. Further, this SLP is also finding applications in computing and communications, automotive, and medical devices. Apple has used SLPs in its watch series.
Moreover, factor such as high demand from consumer electronics industry and surge in demand for thermal management propel the Substrate-Like PCB market growth. Also, miniaturization of PCBs is expected to bring new Substrate-Like PCB market trends in the coming years.
On the basis of fabrication process, the substrate-like PCB market is segmented into MSAP and UV LDI. Modified semi-additive processing (MSAP) processes involve a thin laminated copper foil greater than 1.5 µm. In this technology, the conducting paths used to conduct signals on a printed circuit board (PCB) or substrate are not etched out of a copper layer in the traditional way. Instead, the conductive material is only applied to the PCB in places where it is actually needed. Unlike the conventional method, this method allows for much tighter signal lines and smaller distances between the conducting paths, unlike the conventional approach. It offers various benefits, such as saving space by enabling denser layouts of conducting paths, paving the way for the miniaturization of PCBs and devices; reducing the size of PCBs; and creating more space for sensors, cameras, and larger batteries. Further, it lowers the risk of short circuits on densely packed circuit boards, as MSAP conducting paths (unlike their chemically created counterparts) do not require triangular cross-sections. This ensures that even with smaller distances between the lines, there is no risk of signal interference. MSAP is rapidly gaining popularity due to its ability to meet the demands of downsizing, high-density interconnects, and deliver optimum performance in electronics.
Compeq Manufacturing Co., Ltd.; Kinsus Interconnect Technology; Samsung Electro-Mechanics Co Ltd; AT & S Austria Technologie & Systemtechnik Aktiengesellschaft; Zhen Ding Tech. Group Technology Holding Limited; TTM Technologies Inc.; Korea Circuit; Shenzhen Kinwong Electronic Co., Ltd.; ICAPE Holding SA; and LG Innotek Co Ltd are among the key players profiled in the Substrate-Like PCB market report.
The Substrate-Like PCB market forecast is estimated on the basis of various secondary and primary research findings such as key company publications, association data, and databases. Exhaustive secondary research has been conducted using internal and external sources to obtain qualitative and quantitative information related to the Substrate-Like PCB market growth. The process also helps obtain an overview and forecast of the market with respect to all the market segments. Also, multiple primary interviews have been conducted with industry participants to validate the data and gain analytical insights. This process includes industry experts such as VPs, business development managers, market intelligence managers, and national sales managers, along with external consultants such as valuation experts, research analysts, and key opinion leaders, specializing in the Substrate-Like PCB market.
By Geography the Substrate-Like PCB market is segmented into North America, Europe, Asia Pacific, Middle East and Africa, and South and Central America. In 2023, the Asia Pacific regions is growing with a significant growth rate. The development of 5G network infrastructure and demand for multi-layer PCBs from industries encourages market players to increase their production and develop customized PCBs to fulfill their customers’ dynamic needs. Government initiatives and focus on creating awareness related to the benefits of substrate-like PCBs are fueling the market growth. For instance, in April 2022, the China Intellectual Property Office awarded Shenzhen Kinwong Electronic Co., Ltd. with the China Patent Excellence Award for developing a multi-layer PCB production method and multi-layer PCB board. These multi-layer PCB boards are commonly used in 5G base stations, data storage, servers, switching routers, satellite systems, industrial control, and medical equipment. Moreover, the growing industrial demand for multi-layer PCBs encourages Shenzhen Kinwong Electronic Co., Ltd. to produce and manufacture a variety of multi-layer products with significant industrialization benefits. The substrate-like PCB market in South Korea is anticipated to expand during the forecast period owing to the increased focus by the government and market players to enhance the electronics manufacturing industry. For instance, IPC International, Inc. conducted a PC K-FEST 2024, the second annual IPC Korea Festival of Electronics Standards and Technology seminar in Seoul, on October 29, 2024. The seminar was organized to address challenges in the electronics manufacturing industry, demonstrating the way IPC standards enhance manufacturing performance and quality. Moreover, market players are focusing on expanding their business in South Korea to attract new customers, which is likely to create opportunities in the market during the forecast period. For instance, on January 06, 2024, Xiaomi launched a new subsidiary and a range of smart devices, including smartphones, wearables, TVs, power banks, and robot vacuum cleaners, to expand its presence in South Korea. These products support Xiaomi to cater to various consumer needs of budget-friendly to premium devices. As electronic devices become more compact and miniature, the demand for smaller and more efficient circuit boards also increases. Smartphones, tablets, wearables, and IoT gadgets all use substrate-like PCBs for their high-density packing.
The Substrate-Like PCB market analysis has been carried out by considering the following segments: Line/Space, Fabrication Process, Application.
On the basis of line/space, the substrate-like PCB market is segmented into 25/25 and 30/30 µm and less than 25/25 µm. SLP technology demands line width/line spacing equal to or less than 30/30 µm, reducing the size of the main board and allowing more space for extra components. The growing demand from end users for thinner/compact but more functioning smartphones necessitates a steady reduction in board area. A reduction in board area enables the implementation of a larger battery; as a result, various smartphone manufacturers are adopting substrate-like PCBs of 25/25 and 30/30 µm line/space. For example, Samsung and Apple recently used substrate-like PCBs with linewidth/spacing of 25/25 ?m and 30/30 ?m in their smartphones. Because of their reduced linewidth, substrate-like PCBs for smartphones might hold twice as many electronic components as HDI boards. Further, this SLP is also finding applications in computing and communications, automotive, and medical devices. Apple has used SLPs in its watch series.
Moreover, factor such as high demand from consumer electronics industry and surge in demand for thermal management propel the Substrate-Like PCB market growth. Also, miniaturization of PCBs is expected to bring new Substrate-Like PCB market trends in the coming years.
On the basis of fabrication process, the substrate-like PCB market is segmented into MSAP and UV LDI. Modified semi-additive processing (MSAP) processes involve a thin laminated copper foil greater than 1.5 µm. In this technology, the conducting paths used to conduct signals on a printed circuit board (PCB) or substrate are not etched out of a copper layer in the traditional way. Instead, the conductive material is only applied to the PCB in places where it is actually needed. Unlike the conventional method, this method allows for much tighter signal lines and smaller distances between the conducting paths, unlike the conventional approach. It offers various benefits, such as saving space by enabling denser layouts of conducting paths, paving the way for the miniaturization of PCBs and devices; reducing the size of PCBs; and creating more space for sensors, cameras, and larger batteries. Further, it lowers the risk of short circuits on densely packed circuit boards, as MSAP conducting paths (unlike their chemically created counterparts) do not require triangular cross-sections. This ensures that even with smaller distances between the lines, there is no risk of signal interference. MSAP is rapidly gaining popularity due to its ability to meet the demands of downsizing, high-density interconnects, and deliver optimum performance in electronics.
Compeq Manufacturing Co., Ltd.; Kinsus Interconnect Technology; Samsung Electro-Mechanics Co Ltd; AT & S Austria Technologie & Systemtechnik Aktiengesellschaft; Zhen Ding Tech. Group Technology Holding Limited; TTM Technologies Inc.; Korea Circuit; Shenzhen Kinwong Electronic Co., Ltd.; ICAPE Holding SA; and LG Innotek Co Ltd are among the key players profiled in the Substrate-Like PCB market report.
The Substrate-Like PCB market forecast is estimated on the basis of various secondary and primary research findings such as key company publications, association data, and databases. Exhaustive secondary research has been conducted using internal and external sources to obtain qualitative and quantitative information related to the Substrate-Like PCB market growth. The process also helps obtain an overview and forecast of the market with respect to all the market segments. Also, multiple primary interviews have been conducted with industry participants to validate the data and gain analytical insights. This process includes industry experts such as VPs, business development managers, market intelligence managers, and national sales managers, along with external consultants such as valuation experts, research analysts, and key opinion leaders, specializing in the Substrate-Like PCB market.
1. INTRODUCTION
1.1 The Insight Partners Research Report Guidance
1.2 Market Segmentation
2. EXECUTIVE SUMMARY
2.1 Key Insights
2.2 Market Attractiveness
3. RESEARCH METHODOLOGY
3.1 Secondary Research
3.2 Primary Research
3.2.1 Hypothesis formulation:
3.2.2 Macro-economic factor analysis:
3.2.3 Developing base number:
3.2.4 Data Triangulation:
3.2.5 Country level data:
4. SUBSTRATE-LIKE PCB MARKET LANDSCAPE
4.1 Overview
4.2 PEST Analysis
4.3 Ecosystem Analysis
4.3.1 List of Vendors in Value Chain
5. SUBSTRATE-LIKE PCB MARKET – KEY MARKET DYNAMICS
5.1 Substrate-Like PCB Market – Key Market Dynamics
5.2 Market Drivers
5.2.1 High Demand from Consumer Electronics Industry
5.2.2 Surge in Demand for Thermal Management
5.3 Market Restraints
5.3.1 High Cost of Manufacturing Substrate-Like PCBs
5.4 Market Opportunities
5.4.1 Innovation in PCB Substrate Materials
5.4.2 Integration of 5G Communication Technology
5.5 Future Trends
5.5.1 Miniaturization of PCBs
5.6 Impact of Drivers and Restraints:
6. SUBSTRATE-LIKE PCB MARKET – GLOBAL MARKET ANALYSIS
6.1 Substrate-Like PCB Market Revenue (US$ Million), 2021–2031
6.2 Substrate-Like PCB Market Forecast Analysis
7. SUBSTRATE-LIKE PCB MARKET ANALYSIS – BY LINE/SPACE
7.1/25 and 30/30 µm
7.1.1 Overview
7.1.2/25 and 30/30 µm: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
7.2 Less than 25/25 µm
7.2.1 Overview
7.2.2 Less than 25/25 µm: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
8. SUBSTRATE-LIKE PCB MARKET ANALYSIS – BY FABRICATION PROCESS
8.1 MSAP
8.1.1 Overview
8.1.2 MSAP: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
8.2 UV LDI
8.2.1 Overview
8.2.2 UV LDI: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
9. SUBSTRATE-LIKE PCB MARKET ANALYSIS – BY APPLICATION
9.1 Consumer Electronics
9.1.1 Overview
9.1.2 Consumer Electronics: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
9.2 Automotive
9.2.1 Overview
9.2.2 Automotive: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
9.3 Industrial
9.3.1 Overview
9.3.2 Industrial: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
9.4 Medical
9.4.1 Overview
9.4.2 Medical: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
9.5 Others
9.5.1 Overview
9.5.2 Others: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10. SUBSTRATE-LIKE PCB MARKET – GEOGRAPHICAL ANALYSIS
10.1 Overview
10.2 North America
10.2.1 North America Substrate-Like PCB Market Overview
10.2.2 North America: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.2.3 North America: Substrate-Like PCB Market Breakdown, by Line/Space
10.2.3.1 North America: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Line/Space
10.2.4 North America: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.2.4.1 North America: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Fabrication Process
10.2.5 North America: Substrate-Like PCB Market Breakdown, by Application
10.2.5.1 North America: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Application
10.2.6 North America: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Country
10.2.6.1 North America: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Country
10.2.6.2 United States: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.2.6.2.1 United States: Substrate-Like PCB Market Breakdown, by Line/Space
10.2.6.2.2 United States: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.2.6.2.3 United States: Substrate-Like PCB Market Breakdown, by Application
10.2.6.3 Canada: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.2.6.3.1 Canada: Substrate-Like PCB Market Breakdown, by Line/Space
10.2.6.3.2 Canada: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.2.6.3.3 Canada: Substrate-Like PCB Market Breakdown, by Application
10.2.6.4 Mexico: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.2.6.4.1 Mexico: Substrate-Like PCB Market Breakdown, by Line/Space
10.2.6.4.2 Mexico: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.2.6.4.3 Mexico: Substrate-Like PCB Market Breakdown, by Application
10.3 Europe
10.3.1 Europe Substrate-Like PCB Market Overview
10.3.2 Europe: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.3.3 Europe: Substrate-Like PCB Market Breakdown, by Line/Space
10.3.3.1 Europe: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Line/Space
10.3.4 Europe: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.3.4.1 Europe: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Fabrication Process
10.3.5 Europe: Substrate-Like PCB Market Breakdown, by Application
10.3.5.1 Europe: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Application
10.3.6 Europe: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Country
10.3.6.1 Europe: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Country
10.3.6.2 Germany: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.3.6.2.1 Germany: Substrate-Like PCB Market Breakdown, by Line/Space
10.3.6.2.2 Germany: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.3.6.2.3 Germany: Substrate-Like PCB Market Breakdown, by Application
10.3.6.3 France: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.3.6.3.1 France: Substrate-Like PCB Market Breakdown, by Line/Space
10.3.6.3.2 France: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.3.6.3.3 France: Substrate-Like PCB Market Breakdown, by Application
10.3.6.4 Italy: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.3.6.4.1 Italy: Substrate-Like PCB Market Breakdown, by Line/Space
10.3.6.4.2 Italy: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.3.6.4.3 Italy: Substrate-Like PCB Market Breakdown, by Application
10.3.6.5 United Kingdom: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.3.6.5.1 United Kingdom: Substrate-Like PCB Market Breakdown, by Line/Space
10.3.6.5.2 United Kingdom: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.3.6.5.3 United Kingdom: Substrate-Like PCB Market Breakdown, by Application
10.3.6.6 Russia: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.3.6.6.1 Russia: Substrate-Like PCB Market Breakdown, by Line/Space
10.3.6.6.2 Russia: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.3.6.6.3 Russia: Substrate-Like PCB Market Breakdown, by Application
10.3.6.7 Rest of Europe: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.3.6.7.1 Rest of Europe: Substrate-Like PCB Market Breakdown, by Line/Space
10.3.6.7.2 Rest of Europe: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.3.6.7.3 Rest of Europe: Substrate-Like PCB Market Breakdown, by Application
10.4 Asia Pacific
10.4.1 Asia Pacific Substrate-Like PCB Market Overview
10.4.2 Asia Pacific: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.4.3 Asia Pacific: Substrate-Like PCB Market Breakdown, by Line/Space
10.4.3.1 Asia Pacific: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Line/Space
10.4.4 Asia Pacific: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.4.4.1 Asia Pacific: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Fabrication Process
10.4.5 Asia Pacific: Substrate-Like PCB Market Breakdown, by Application
10.4.5.1 Asia Pacific: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Application
10.4.6 Asia Pacific: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Country
10.4.6.1 Asia Pacific: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Country
10.4.6.2 China: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.4.6.2.1 China: Substrate-Like PCB Market Breakdown, by Line/Space
10.4.6.2.2 China: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.4.6.2.3 China: Substrate-Like PCB Market Breakdown, by Application
10.4.6.3 South Korea: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.4.6.3.1 South Korea: Substrate-Like PCB Market Breakdown, by Line/Space
10.4.6.3.2 South Korea: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.4.6.3.3 South Korea: Substrate-Like PCB Market Breakdown, by Application
10.4.6.4 Japan: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.4.6.4.1 Japan: Substrate-Like PCB Market Breakdown, by Line/Space
10.4.6.4.2 Japan: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.4.6.4.3 Japan: Substrate-Like PCB Market Breakdown, by Application
10.4.6.5 India: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.4.6.5.1 India: Substrate-Like PCB Market Breakdown, by Line/Space
10.4.6.5.2 India: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.4.6.5.3 India: Substrate-Like PCB Market Breakdown, by Application
10.4.6.6 Australia: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.4.6.6.1 Australia: Substrate-Like PCB Market Breakdown, by Line/Space
10.4.6.6.2 Australia: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.4.6.6.3 Australia: Substrate-Like PCB Market Breakdown, by Application
10.4.6.7 Rest of APAC: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.4.6.7.1 Rest of APAC: Substrate-Like PCB Market Breakdown, by Line/Space
10.4.6.7.2 Rest of APAC: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.4.6.7.3 Rest of APAC: Substrate-Like PCB Market Breakdown, by Application
10.5 Middle East and Africa
10.5.1 Middle East and Africa Substrate-Like PCB Market Overview
10.5.2 Middle East and Africa: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.5.3 Middle East and Africa: Substrate-Like PCB Market Breakdown, by Line/Space
10.5.3.1 Middle East and Africa: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Line/Space
10.5.4 Middle East and Africa: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.5.4.1 Middle East and Africa: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Fabrication Process
10.5.5 Middle East and Africa: Substrate-Like PCB Market Breakdown, by Application
10.5.5.1 Middle East and Africa: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Application
10.5.6 Middle East and Africa: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Country
10.5.6.1 Middle East and Africa: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Country
10.5.6.2 United Arab Emirates: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.5.6.2.1 United Arab Emirates: Substrate-Like PCB Market Breakdown, by Line/Space
10.5.6.2.2 United Arab Emirates: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.5.6.2.3 United Arab Emirates: Substrate-Like PCB Market Breakdown, by Application
10.5.6.3 Saudi Arabia: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.5.6.3.1 Saudi Arabia: Substrate-Like PCB Market Breakdown, by Line/Space
10.5.6.3.2 Saudi Arabia: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.5.6.3.3 Saudi Arabia: Substrate-Like PCB Market Breakdown, by Application
10.5.6.4 South Africa: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.5.6.4.1 South Africa: Substrate-Like PCB Market Breakdown, by Line/Space
10.5.6.4.2 South Africa: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.5.6.4.3 South Africa: Substrate-Like PCB Market Breakdown, by Application
10.5.6.5 Rest of Middle East and Africa: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.5.6.5.1 Rest of Middle East and Africa: Substrate-Like PCB Market Breakdown, by Line/Space
10.5.6.5.2 Rest of Middle East and Africa: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.5.6.5.3 Rest of Middle East and Africa: Substrate-Like PCB Market Breakdown, by Application
10.6 South and Central America
10.6.1 South and Central America Substrate-Like PCB Market Overview
10.6.2 South and Central America: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.6.3 South and Central America: Substrate-Like PCB Market Breakdown, by Line/Space
10.6.3.1 South and Central America: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Line/Space
10.6.4 South and Central America: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.6.4.1 South and Central America: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Fabrication Process
10.6.5 South and Central America: Substrate-Like PCB Market Breakdown, by Application
10.6.5.1 South and Central America: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Application
10.6.6 South and Central America: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Country
10.6.6.1 South and Central America: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Country
10.6.6.2 Brazil: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.6.6.2.1 Brazil: Substrate-Like PCB Market Breakdown, by Line/Space
10.6.6.2.2 Brazil: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.6.6.2.3 Brazil: Substrate-Like PCB Market Breakdown, by Application
10.6.6.3 Argentina: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.6.6.3.1 Argentina: Substrate-Like PCB Market Breakdown, by Line/Space
10.6.6.3.2 Argentina: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.6.6.3.3 Argentina: Substrate-Like PCB Market Breakdown, by Application
10.6.6.4 Rest of South and Central America: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.6.6.4.1 Rest of South and Central America: Substrate-Like PCB Market Breakdown, by Line/Space
10.6.6.4.2 Rest of South and Central America: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.6.6.4.3 Rest of South and Central America: Substrate-Like PCB Market Breakdown, by Application
11. COMPETITIVE LANDSCAPE
11.1 Heat Map Analysis by Key Players
11.2 Company Positioning & Concentration
12. INDUSTRY LANDSCAPE
12.1 Overview
12.2 Market Initiative
12.3 Merger and Acquisition
13. COMPANY PROFILES
13.1 Compeq Manufacturing Co., Ltd.
13.1.1 Key Facts
13.1.2 Business Description
13.1.3 Products and Services
13.1.4 Financial Overview
13.1.5 SWOT Analysis
13.1.6 Key Developments
13.2 Kinsus Interconnect Technology
13.2.1 Key Facts
13.2.2 Business Description
13.2.3 Products and Services
13.2.4 Financial Overview
13.2.5 SWOT Analysis
13.2.6 Key Developments
13.3 Samsung Electro-Mechanics Co Ltd
13.3.1 Key Facts
13.3.2 Business Description
13.3.3 Products and Services
13.3.4 Financial Overview
13.3.5 SWOT Analysis
13.3.6 Key Developments
13.4 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
13.4.1 Key Facts
13.4.2 Business Description
13.4.3 Products and Services
13.4.4 Financial Overview
13.4.5 SWOT Analysis
13.4.6 Key Developments
13.5 Zhen Ding Tech. Group Technology Holding Limited
13.5.1 Key Facts
13.5.2 Business Description
13.5.3 Products and Services
13.5.4 Financial Overview
13.5.5 SWOT Analysis
13.5.6 Key Developments
13.6 TTM Technologies Inc.
13.6.1 Key Facts
13.6.2 Business Description
13.6.3 Products and Services
13.6.4 Financial Overview
13.6.5 SWOT Analysis
13.6.6 Key Developments
13.7 Korea Circuit
13.7.1 Key Facts
13.7.2 Business Description
13.7.3 Products and Services
13.7.4 Financial Overview
13.7.5 SWOT Analysis
13.7.6 Key Developments
13.8 Shenzhen Kinwong Electronic Co., Ltd.
13.8.1 Key Facts
13.8.2 Business Description
13.8.3 Products and Services
13.8.4 Financial Overview
13.8.5 SWOT Analysis
13.8.6 Key Developments
13.9 ICAPE Holding SA
13.9.1 Key Facts
13.9.2 Business Description
13.9.3 Products and Services
13.9.4 Financial Overview
13.9.5 SWOT Analysis
13.9.6 Key Developments
13.10 LG Innotek Co Ltd
13.10.1 Key Facts
13.10.2 Business Description
13.10.3 Products and Services
13.10.4 Financial Overview
13.10.5 SWOT Analysis
13.10.6 Key Developments
14. APPENDIX
14.1 About The Insight Partners
14.2 Word Index
1.1 The Insight Partners Research Report Guidance
1.2 Market Segmentation
2. EXECUTIVE SUMMARY
2.1 Key Insights
2.2 Market Attractiveness
3. RESEARCH METHODOLOGY
3.1 Secondary Research
3.2 Primary Research
3.2.1 Hypothesis formulation:
3.2.2 Macro-economic factor analysis:
3.2.3 Developing base number:
3.2.4 Data Triangulation:
3.2.5 Country level data:
4. SUBSTRATE-LIKE PCB MARKET LANDSCAPE
4.1 Overview
4.2 PEST Analysis
4.3 Ecosystem Analysis
4.3.1 List of Vendors in Value Chain
5. SUBSTRATE-LIKE PCB MARKET – KEY MARKET DYNAMICS
5.1 Substrate-Like PCB Market – Key Market Dynamics
5.2 Market Drivers
5.2.1 High Demand from Consumer Electronics Industry
5.2.2 Surge in Demand for Thermal Management
5.3 Market Restraints
5.3.1 High Cost of Manufacturing Substrate-Like PCBs
5.4 Market Opportunities
5.4.1 Innovation in PCB Substrate Materials
5.4.2 Integration of 5G Communication Technology
5.5 Future Trends
5.5.1 Miniaturization of PCBs
5.6 Impact of Drivers and Restraints:
6. SUBSTRATE-LIKE PCB MARKET – GLOBAL MARKET ANALYSIS
6.1 Substrate-Like PCB Market Revenue (US$ Million), 2021–2031
6.2 Substrate-Like PCB Market Forecast Analysis
7. SUBSTRATE-LIKE PCB MARKET ANALYSIS – BY LINE/SPACE
7.1/25 and 30/30 µm
7.1.1 Overview
7.1.2/25 and 30/30 µm: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
7.2 Less than 25/25 µm
7.2.1 Overview
7.2.2 Less than 25/25 µm: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
8. SUBSTRATE-LIKE PCB MARKET ANALYSIS – BY FABRICATION PROCESS
8.1 MSAP
8.1.1 Overview
8.1.2 MSAP: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
8.2 UV LDI
8.2.1 Overview
8.2.2 UV LDI: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
9. SUBSTRATE-LIKE PCB MARKET ANALYSIS – BY APPLICATION
9.1 Consumer Electronics
9.1.1 Overview
9.1.2 Consumer Electronics: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
9.2 Automotive
9.2.1 Overview
9.2.2 Automotive: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
9.3 Industrial
9.3.1 Overview
9.3.2 Industrial: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
9.4 Medical
9.4.1 Overview
9.4.2 Medical: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
9.5 Others
9.5.1 Overview
9.5.2 Others: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10. SUBSTRATE-LIKE PCB MARKET – GEOGRAPHICAL ANALYSIS
10.1 Overview
10.2 North America
10.2.1 North America Substrate-Like PCB Market Overview
10.2.2 North America: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.2.3 North America: Substrate-Like PCB Market Breakdown, by Line/Space
10.2.3.1 North America: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Line/Space
10.2.4 North America: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.2.4.1 North America: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Fabrication Process
10.2.5 North America: Substrate-Like PCB Market Breakdown, by Application
10.2.5.1 North America: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Application
10.2.6 North America: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Country
10.2.6.1 North America: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Country
10.2.6.2 United States: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.2.6.2.1 United States: Substrate-Like PCB Market Breakdown, by Line/Space
10.2.6.2.2 United States: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.2.6.2.3 United States: Substrate-Like PCB Market Breakdown, by Application
10.2.6.3 Canada: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.2.6.3.1 Canada: Substrate-Like PCB Market Breakdown, by Line/Space
10.2.6.3.2 Canada: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.2.6.3.3 Canada: Substrate-Like PCB Market Breakdown, by Application
10.2.6.4 Mexico: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.2.6.4.1 Mexico: Substrate-Like PCB Market Breakdown, by Line/Space
10.2.6.4.2 Mexico: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.2.6.4.3 Mexico: Substrate-Like PCB Market Breakdown, by Application
10.3 Europe
10.3.1 Europe Substrate-Like PCB Market Overview
10.3.2 Europe: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.3.3 Europe: Substrate-Like PCB Market Breakdown, by Line/Space
10.3.3.1 Europe: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Line/Space
10.3.4 Europe: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.3.4.1 Europe: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Fabrication Process
10.3.5 Europe: Substrate-Like PCB Market Breakdown, by Application
10.3.5.1 Europe: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Application
10.3.6 Europe: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Country
10.3.6.1 Europe: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Country
10.3.6.2 Germany: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.3.6.2.1 Germany: Substrate-Like PCB Market Breakdown, by Line/Space
10.3.6.2.2 Germany: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.3.6.2.3 Germany: Substrate-Like PCB Market Breakdown, by Application
10.3.6.3 France: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.3.6.3.1 France: Substrate-Like PCB Market Breakdown, by Line/Space
10.3.6.3.2 France: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.3.6.3.3 France: Substrate-Like PCB Market Breakdown, by Application
10.3.6.4 Italy: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.3.6.4.1 Italy: Substrate-Like PCB Market Breakdown, by Line/Space
10.3.6.4.2 Italy: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.3.6.4.3 Italy: Substrate-Like PCB Market Breakdown, by Application
10.3.6.5 United Kingdom: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.3.6.5.1 United Kingdom: Substrate-Like PCB Market Breakdown, by Line/Space
10.3.6.5.2 United Kingdom: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.3.6.5.3 United Kingdom: Substrate-Like PCB Market Breakdown, by Application
10.3.6.6 Russia: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.3.6.6.1 Russia: Substrate-Like PCB Market Breakdown, by Line/Space
10.3.6.6.2 Russia: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.3.6.6.3 Russia: Substrate-Like PCB Market Breakdown, by Application
10.3.6.7 Rest of Europe: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.3.6.7.1 Rest of Europe: Substrate-Like PCB Market Breakdown, by Line/Space
10.3.6.7.2 Rest of Europe: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.3.6.7.3 Rest of Europe: Substrate-Like PCB Market Breakdown, by Application
10.4 Asia Pacific
10.4.1 Asia Pacific Substrate-Like PCB Market Overview
10.4.2 Asia Pacific: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.4.3 Asia Pacific: Substrate-Like PCB Market Breakdown, by Line/Space
10.4.3.1 Asia Pacific: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Line/Space
10.4.4 Asia Pacific: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.4.4.1 Asia Pacific: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Fabrication Process
10.4.5 Asia Pacific: Substrate-Like PCB Market Breakdown, by Application
10.4.5.1 Asia Pacific: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Application
10.4.6 Asia Pacific: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Country
10.4.6.1 Asia Pacific: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Country
10.4.6.2 China: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.4.6.2.1 China: Substrate-Like PCB Market Breakdown, by Line/Space
10.4.6.2.2 China: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.4.6.2.3 China: Substrate-Like PCB Market Breakdown, by Application
10.4.6.3 South Korea: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.4.6.3.1 South Korea: Substrate-Like PCB Market Breakdown, by Line/Space
10.4.6.3.2 South Korea: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.4.6.3.3 South Korea: Substrate-Like PCB Market Breakdown, by Application
10.4.6.4 Japan: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.4.6.4.1 Japan: Substrate-Like PCB Market Breakdown, by Line/Space
10.4.6.4.2 Japan: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.4.6.4.3 Japan: Substrate-Like PCB Market Breakdown, by Application
10.4.6.5 India: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.4.6.5.1 India: Substrate-Like PCB Market Breakdown, by Line/Space
10.4.6.5.2 India: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.4.6.5.3 India: Substrate-Like PCB Market Breakdown, by Application
10.4.6.6 Australia: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.4.6.6.1 Australia: Substrate-Like PCB Market Breakdown, by Line/Space
10.4.6.6.2 Australia: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.4.6.6.3 Australia: Substrate-Like PCB Market Breakdown, by Application
10.4.6.7 Rest of APAC: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.4.6.7.1 Rest of APAC: Substrate-Like PCB Market Breakdown, by Line/Space
10.4.6.7.2 Rest of APAC: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.4.6.7.3 Rest of APAC: Substrate-Like PCB Market Breakdown, by Application
10.5 Middle East and Africa
10.5.1 Middle East and Africa Substrate-Like PCB Market Overview
10.5.2 Middle East and Africa: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.5.3 Middle East and Africa: Substrate-Like PCB Market Breakdown, by Line/Space
10.5.3.1 Middle East and Africa: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Line/Space
10.5.4 Middle East and Africa: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.5.4.1 Middle East and Africa: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Fabrication Process
10.5.5 Middle East and Africa: Substrate-Like PCB Market Breakdown, by Application
10.5.5.1 Middle East and Africa: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Application
10.5.6 Middle East and Africa: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Country
10.5.6.1 Middle East and Africa: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Country
10.5.6.2 United Arab Emirates: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.5.6.2.1 United Arab Emirates: Substrate-Like PCB Market Breakdown, by Line/Space
10.5.6.2.2 United Arab Emirates: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.5.6.2.3 United Arab Emirates: Substrate-Like PCB Market Breakdown, by Application
10.5.6.3 Saudi Arabia: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.5.6.3.1 Saudi Arabia: Substrate-Like PCB Market Breakdown, by Line/Space
10.5.6.3.2 Saudi Arabia: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.5.6.3.3 Saudi Arabia: Substrate-Like PCB Market Breakdown, by Application
10.5.6.4 South Africa: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.5.6.4.1 South Africa: Substrate-Like PCB Market Breakdown, by Line/Space
10.5.6.4.2 South Africa: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.5.6.4.3 South Africa: Substrate-Like PCB Market Breakdown, by Application
10.5.6.5 Rest of Middle East and Africa: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.5.6.5.1 Rest of Middle East and Africa: Substrate-Like PCB Market Breakdown, by Line/Space
10.5.6.5.2 Rest of Middle East and Africa: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.5.6.5.3 Rest of Middle East and Africa: Substrate-Like PCB Market Breakdown, by Application
10.6 South and Central America
10.6.1 South and Central America Substrate-Like PCB Market Overview
10.6.2 South and Central America: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.6.3 South and Central America: Substrate-Like PCB Market Breakdown, by Line/Space
10.6.3.1 South and Central America: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Line/Space
10.6.4 South and Central America: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.6.4.1 South and Central America: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Fabrication Process
10.6.5 South and Central America: Substrate-Like PCB Market Breakdown, by Application
10.6.5.1 South and Central America: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Application
10.6.6 South and Central America: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Country
10.6.6.1 South and Central America: Substrate-Like PCB Market – Revenue and Forecast Analysis – by Country
10.6.6.2 Brazil: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.6.6.2.1 Brazil: Substrate-Like PCB Market Breakdown, by Line/Space
10.6.6.2.2 Brazil: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.6.6.2.3 Brazil: Substrate-Like PCB Market Breakdown, by Application
10.6.6.3 Argentina: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.6.6.3.1 Argentina: Substrate-Like PCB Market Breakdown, by Line/Space
10.6.6.3.2 Argentina: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.6.6.3.3 Argentina: Substrate-Like PCB Market Breakdown, by Application
10.6.6.4 Rest of South and Central America: Substrate-Like PCB Market – Revenue and Forecast to 2031 (US$ Million)
10.6.6.4.1 Rest of South and Central America: Substrate-Like PCB Market Breakdown, by Line/Space
10.6.6.4.2 Rest of South and Central America: Substrate-Like PCB Market Breakdown, by Fabrication Process
10.6.6.4.3 Rest of South and Central America: Substrate-Like PCB Market Breakdown, by Application
11. COMPETITIVE LANDSCAPE
11.1 Heat Map Analysis by Key Players
11.2 Company Positioning & Concentration
12. INDUSTRY LANDSCAPE
12.1 Overview
12.2 Market Initiative
12.3 Merger and Acquisition
13. COMPANY PROFILES
13.1 Compeq Manufacturing Co., Ltd.
13.1.1 Key Facts
13.1.2 Business Description
13.1.3 Products and Services
13.1.4 Financial Overview
13.1.5 SWOT Analysis
13.1.6 Key Developments
13.2 Kinsus Interconnect Technology
13.2.1 Key Facts
13.2.2 Business Description
13.2.3 Products and Services
13.2.4 Financial Overview
13.2.5 SWOT Analysis
13.2.6 Key Developments
13.3 Samsung Electro-Mechanics Co Ltd
13.3.1 Key Facts
13.3.2 Business Description
13.3.3 Products and Services
13.3.4 Financial Overview
13.3.5 SWOT Analysis
13.3.6 Key Developments
13.4 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
13.4.1 Key Facts
13.4.2 Business Description
13.4.3 Products and Services
13.4.4 Financial Overview
13.4.5 SWOT Analysis
13.4.6 Key Developments
13.5 Zhen Ding Tech. Group Technology Holding Limited
13.5.1 Key Facts
13.5.2 Business Description
13.5.3 Products and Services
13.5.4 Financial Overview
13.5.5 SWOT Analysis
13.5.6 Key Developments
13.6 TTM Technologies Inc.
13.6.1 Key Facts
13.6.2 Business Description
13.6.3 Products and Services
13.6.4 Financial Overview
13.6.5 SWOT Analysis
13.6.6 Key Developments
13.7 Korea Circuit
13.7.1 Key Facts
13.7.2 Business Description
13.7.3 Products and Services
13.7.4 Financial Overview
13.7.5 SWOT Analysis
13.7.6 Key Developments
13.8 Shenzhen Kinwong Electronic Co., Ltd.
13.8.1 Key Facts
13.8.2 Business Description
13.8.3 Products and Services
13.8.4 Financial Overview
13.8.5 SWOT Analysis
13.8.6 Key Developments
13.9 ICAPE Holding SA
13.9.1 Key Facts
13.9.2 Business Description
13.9.3 Products and Services
13.9.4 Financial Overview
13.9.5 SWOT Analysis
13.9.6 Key Developments
13.10 LG Innotek Co Ltd
13.10.1 Key Facts
13.10.2 Business Description
13.10.3 Products and Services
13.10.4 Financial Overview
13.10.5 SWOT Analysis
13.10.6 Key Developments
14. APPENDIX
14.1 About The Insight Partners
14.2 Word Index
