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Radiation Hardened Electronics Market by Component (Mixed Signal ICs, Processors & Controllers, Memory, Power Management), Manufacturing Techniques (RHBD, RHBP), Product Type, Application and Geography - Global Forecast to 2029

March 2024 | 253 pages | ID: RC0C290A5C4EN
MarketsandMarkets

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The radiation-hardened electronics market is expected to grow from USD 1.7 billion in 2024 to USD 2.1 billion by 2029, at a CAGR of 4.8% during the forecast period. The demand for radiation-hardened electronics is increasing due to space applications, government initiatives, and technological advancements.

“Memory component is expected to grow at higher CAGR from 2024 to 2029”.

Memory in the component segment is expected to grow at the fastest CAGR during the forecast period. A memory device is a hardware component that retains data, enabling communication or functionality. The memory products used for critical applications such as spacecraft and nuclear weapons need to be radiation-hardened to reduce the total ionizing dose (TID) received by the semiconductor components. Compute-intensive applications in the aerospace and space sector are increasingly demanding radiation-hardened memory solutions with high density and performance to handle large quantities of data obtained from various processor nodes and sensors.

“Space application is expected to grow with the largest market share during the forecast period”

Radiation-hardened electronics are specifically designed to weather the storm and ensure reliable operation across diverse space applications. From the beating heart of onboard computers managing satellites to the guidance systems steering rockets, these robust components power a remarkable range of tasks. They handle communication, fuel efficiency, scientific data collection, and even complex robotic maneuvers on distant planetary surfaces.

“Radiation hardened electronics market in North American region to register largest market size from 2024 to 2029.”

North America accounted for the largest share of the radiation-hardened electronics market in 2023. Factors such as continuous technological advancements in this field, the presence of various government-owned space organizations, and a majority of the key market players in the region are driving the growth potential for radiation-hardened electronics in the region. The US government is continuously making working on capabilities in the manufacture of radiation-hardened electronics.

Breakdown of primaries

In the process of determining and verifying the market size for several segments and subsegments gathered through secondary research, extensive primary interviews have been conducted with key industry experts in the radiation-hardened electronics market space. The break-up of primary participants for the radiation hardened electronics market has been shown below:
  • By Company Type: Tier 1 – 40%, Tier 2 – 30%, and Tier 3 – 30%
  • By Designation: C-level Executives – 40%, Directors – 40%, and Others – 20%
  • By Region: North America –40%, Europe – 30%, Asia Pacific– 20%, and Rest of the World – 10%


Key players in the radiation-hardened electronics market are Microchip Technology Inc.(US), BAE Systems (UK), Renesas Electronics Corporation (Japan), Infineon Technologies AG (Germany), STMicroelectronics (Switzerland), AMD (US), Texas Instruments Incorporated (US), Honeywell International Inc. (US), Teledyne Technologies Inc. (US), and TTM Technologies, Inc. (US). SMEs/startups covered in the study are Cobham Limited (UK), Analog Devices, Inc (US), Data Devices Corporation (US), 3D Plus (France), Mercury Systems, Inc. (US), PCB Piezotronics, Inc (US), Vorago (US), Micropac Industries, Inc (US), GSI technology, Inc (US), Everspin Technologies Inc (US), Semiconductor Components Industries, LLC (US), AiTech (US), Microelectronics Research Development Corporation (US), Space Micro, Inc (US), and Triad Semiconductor ( US).

Research Coverage:

The report describes detailed information regarding the key factors such as drivers, restraints, challenges, and opportunities influencing the growth of the radiation-hardened electronics market. It also includes informations like technology trends, trade data, and patent analysis. This research report categorizes the radiation-hardened electronics market based on components, manufacturing techniques, product type, and region. A detailed analysis of the major industry players was carried out to provide insights into their business overviews, products offered, major strategies adopted that include new product launches, deals (acquisitions, partnerships, agreements, and contracts), and others (expansions), and recession impact on the radiation-hardened electronics market.

Reasons to Buy This Report

The report will help the market leaders/new entrants in the market with information on the closest approximations of the revenue for the overall radiation-hardened electronics market and the subsegments. The report will help stakeholders understand the competitive landscape and gain more insight to position their business better and plan suitable go-to-market strategies. The report also helps stakeholders understand the market's pulse and provides information on key drivers, restraints, opportunities, and challenges.

The report will provide insights into the following pointers:
  • Analysis of key drivers (Increasing use of radiation-hardened electronics in space applications), restraints (Difficulty in creating real testing environment), opportunities (Favorable government initiatives and increasing space missions), and challenges (Customization required for high-end consumers)
  • Product development /Innovation: Detailed insights on growing technologies, research and development activities, and new product and service launches in the radiation-hardened electronics market.
  • Market Development: Comprehensive information about adjacent markets; the report analyses the radiation-hardened electronics market across various geographies.
  • Market Diversification: Exhaustive information about new products and services, untapped geographies, recent developments, and investments in the radiation-hardened electronics market.
  • Competitive Assessment: In-depth assessment of market share, growth strategies, and services, offering of leading players Microchip Technology Inc.(US), BAE Systems (UK), Renesas Electronics Corporation (Japan), Infineon Technologies AG (Germany), STMicroelectronics (Switzerland), among others in the radiation-hardened electronics market.
1 INTRODUCTION

1.1 STUDY OBJECTIVES
1.2 MARKET DEFINITION
  1.2.1 MARKETS COVERED
FIGURE 1 MARKET SEGMENTATION
1.3 REGIONAL SCOPE
  1.3.1 YEARS CONSIDERED
  1.3.2 INCLUSIONS AND EXCLUSIONS
1.4 CURRENCY
1.5 STAKEHOLDERS
1.6 SUMMARY OF CHANGES
1.7 LIMITATIONS
1.8 RECESSION IMPACT

2 RESEARCH METHODOLOGY

2.1 RESEARCH DATA
FIGURE 2 PROCESS FLOW: RADIATION-HARDENED ELECTRONICS MARKET ESTIMATION
FIGURE 3 RESEARCH DESIGN
  2.1.1 SECONDARY AND PRIMARY RESEARCH
    2.1.1.1 Key industry insights
  2.1.2 SECONDARY DATA
    2.1.2.1 List of key secondary sources
    2.1.2.2 Key data from secondary sources
  2.1.3 PRIMARY DATA
    2.1.3.1 Breakdown of primaries
    2.1.3.2 Key data from primary sources
2.2 MARKET SIZE ESTIMATION
  2.2.1 BOTTOM-UP APPROACH
    2.2.1.1 Approach to obtain market size using bottom-up analysis (demand side)
FIGURE 4 MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH
  2.2.2 TOP-DOWN APPROACH
    2.2.2.1 Approach to capture market size using top-down analysis
FIGURE 5 MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH
2.3 DATA TRIANGULATION
FIGURE 6 DATA TRIANGULATION
2.4 RESEARCH ASSUMPTIONS
2.5 LIMITATIONS
2.6 RISK ASSESSMENT
2.7 APPROACH TO ANALYZE IMPACT OF RECESSION ON RADIATION-HARDENED ELECTRONICS MARKET

3 EXECUTIVE SUMMARY

3.1 RADIATION-HARDENED ELECTRONICS MARKET: RECESSION IMPACT
FIGURE 7 RECESSION IMPACT ON RADIATION-HARDENED ELECTRONICS MARKET, 2020–2029 (USD MILLION)
FIGURE 8 POWER MANAGEMENT SEGMENT TO ACCOUNT FOR LARGEST SHARE, BY COMPONENT, DURING FORECAST PERIOD
FIGURE 9 RADIATION-HARDENED BY DESIGN – FASTEST SEGMENT DURING FORECAST PERIOD
FIGURE 10 SPACE APPLICATION TO GROW AT HIGHEST CAGR IN RADIATION-HARDENED ELECTRONICS MARKET FROM 2024 TO 2029
FIGURE 11 NORTH AMERICA ACCOUNTED FOR LARGEST MARKET SHARE IN 2023

4 PREMIUM INSIGHTS

4.1 ATTRACTIVE GROWTH OPPORTUNITIES IN RADIATION-HARDENED ELECTRONICS MARKET
FIGURE 12 INCREASING DEMAND FOR RADIATION-HARDENED ELECTRONICS IN COMMERCIAL SATELLITES EXPECTED TO PROPEL MARKET GROWTH
4.2 RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT
FIGURE 13 POWER MANAGEMENT SEGMENT TO ACCOUNT FOR LARGEST SHARE FROM 2024 TO 2029
4.3 RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE
FIGURE 14 RADIATION-HARDENED BY DESIGN SEGMENT TO DOMINATE MARKET FROM 2024 TO 2029
4.4 RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE
FIGURE 15 COTS SEGMENT TO LEAD MARKET WITH MAJOR SHARE THROUGH 2029
4.5 RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION
FIGURE 16 SPACE SEGMENT TO COMMAND LARGEST SHARE OF RADIATION-HARDENED ELECTRONICS MARKET IN 2024
4.6 RADIATION-HARDENED ELECTRONICS MARKET, BY COUNTRY AND REGION
FIGURE 17 RADIATION-HARDENED ELECTRONICS MARKET IN CHINA TO GROW AT HIGHEST CAGR FROM 2024 TO2029

5 MARKET OVERVIEW

5.1 INTRODUCTION
5.2 EVOLUTION: RADIATION-HARDENED ELECTRONICS MARKET
FIGURE 18 EVOLUTION OF RADIATION-HARDENED ELECTRONICS TECHNOLOGY
5.3 MARKET DYNAMICS
FIGURE 19 DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES: RADIATION-HARDENED ELECTRONICS MARKET
  5.3.1 DRIVERS
FIGURE 20 DRIVERS FOR RADIATION-HARDENED ELECTRONICS MARKET AND THEIR IMPACT
    5.3.1.1 Rising intelligence, surveillance, and reconnaissance (ISR) activities
    5.3.1.2 Technology advancements in multicore processors used for military and space applications
    5.3.1.3 Increasing demand for use in commercial satellites
    5.3.1.4 Proliferation of electronic systems that can withstand severe nuclear environments
  5.3.2 RESTRAINTS
FIGURE 21 RESTRAINTS IN RADIATION-HARDENED ELECTRONICS MARKET AND THEIR IMPACT
    5.3.2.1 Difficulties in creating real testing environments
    5.3.2.2 High costs associated with development of radiation-hardened products
  5.3.3 OPPORTUNITIES
FIGURE 22 OPPORTUNITIES IN RADIATION-HARDENED ELECTRONICS MARKET AND THEIR IMPACT
    5.3.3.1 Increasing space missions globally
    5.3.3.2 Demand for reconfigurable radiation-hardened electronics
    5.3.3.3 Rising demand for commercial-off-the-shelf components in space satellites
  5.3.4 CHALLENGES
FIGURE 23 CHALLENGES IN RADIATION-HARDENED ELECTRONICS MARKET AND THEIR IMPACT
    5.3.4.1 Customization requirements from high-end consumers
5.4 TRENDS/DISRUPTIONS IMPACTING CUSTOMERS
FIGURE 24 REVENUE SHIFT FOR RADIATION-HARDENED ELECTRONICS
5.5 PRICING ANALYSIS
  5.5.1 AVERAGE SELLING PRICE OF POWER MANAGEMENT PRODUCTS
FIGURE 25 AVERAGE SELLING PRICE OF POWER MANAGEMENT PRODUCTS
  5.5.2 POWER MANAGEMENT
TABLE 1 AVERAGE SELLING PRICE ANALYSIS OF KEY PLAYERS
  5.5.3 MIXED SIGNAL ICS
TABLE 2 AVERAGE SELLING PRICE OF A/D & D/A CONVERTERS
  5.5.4 PROCESSORS & CONTROLLERS
TABLE 3 AVERAGE SELLING PRICE OF PROCESSORS & CONTROLLERS
  5.5.5 MEMORY
TABLE 4 AVERAGE SELLING PRICE OF MEMORY PRODUCTS
5.6 SUPPLY/VALUE CHAIN ANALYSIS
FIGURE 26 VALUE CHAIN ANALYSIS: MAJOR VALUE ADDED DURING MANUFACTURING, FABRICATION & PACKAGING AND INTERFACING & SOFTWARE DEVELOPMENT
5.7 ECOSYSTEM/MARKET MAP
FIGURE 27 RADIATION-HARDENED ELECTRONICS MARKET: ECOSYSTEM
TABLE 5 RADIATION-HARDENED ELECTRONICS MARKET: ECOSYSTEM
5.8 INVESTMENT AND FUNDING SCENARIO
FIGURE 28 FUNDS AUTHORIZED BY COMPANIES IN RADIATION-HARDENED ELECTRONICS MARKET
5.9 TECHNOLOGY ANALYSIS
  5.9.1 DEVELOPMENT OF PLASTIC PACKAGING FOR SPACE-GRADE ELECTRONICS
  5.9.2 SMART CHIPSETS FOR SATELLITES
  5.9.3 ADVANCED PACKAGING OF SPACE ELECTRONICS
5.10 PORTER’S FIVE FORCES ANALYSIS
TABLE 6 RADIATION-HARDENED ELECTRONICS MARKET: PORTER’S FIVE FORCES ANALYSIS
  5.10.1 INTENSITY OF COMPETITIVE RIVALRY
  5.10.2 BARGAINING POWER OF SUPPLIERS
  5.10.3 BARGAINING POWER OF BUYERS
  5.10.4 THREAT OF SUBSTITUTES
  5.10.5 THREAT OF NEW ENTRANTS
5.11 KEY STAKEHOLDERS & BUYING CRITERIA
  5.11.1 KEY STAKEHOLDERS IN BUYING PROCESS
FIGURE 29 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP THREE INDUSTRIES
TABLE 7 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP THREE INDUSTRIES
  5.11.2 BUYING CRITERIA
FIGURE 30 KEY BUYING CRITERIA FOR TOP THREE INDUSTRIES
TABLE 8 KEY BUYING CRITERIA FOR TOP THREE INDUSTRIES
5.12 CASE STUDY ANALYSIS
TABLE 9 ASSESSMENT OF 90 MM PROCESS HARDENING TECHNIQUE
TABLE 10 ASSESSMENT OF 4MBIT MRAM DEVICE IN SATELLITES
TABLE 11 ASSESSMENT OF RADIATION-HARDENED BY DESIGN MICROELECTRONICS
TABLE 12 ASSESSMENT OF ARM MCUS FOR SPACE CONDITIONS
TABLE 13 ASSESSMENT OF SSDS FOR LOW EARTH ORBIT SATELLITES
5.13 TRADE ANALYSIS
  5.13.1 IMPORT SCENARIO
FIGURE 31 IMPORTS, BY KEY COUNTRY, 2019–2022 (USD THOUSAND)
  5.13.2 EXPORT SCENARIO
FIGURE 32 EXPORTS, BY KEY COUNTRY, 2019–2022 (USD THOUSAND)
5.14 PATENT ANALYSIS
FIGURE 33 TOP 10 COMPANIES WITH HIGHEST NUMBER OF PATENT APPLICATIONS IN LAST 10 YEARS
TABLE 14 TOP 20 PATENT OWNERS IN LAST 10 YEARS
FIGURE 34 NUMBER OF PATENTS GRANTED PER YEAR FROM 2013 TO 2023
TABLE 15 LIST OF MAJOR PATENTS
5.15 KEY CONFERENCES & EVENTS DURING 2024–2025
TABLE 16 RADIATION-HARDENED ELECTRONICS MARKET: CONFERENCES & EVENTS
5.16 REGULATORY LANDSCAPE
  5.16.1 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
TABLE 17 NORTH AMERICA: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
TABLE 18 EUROPE: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
TABLE 19 ASIA PACIFIC: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
TABLE 20 REST OF THE WORLD: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
  5.16.2 STANDARDS AND REGULATIONS RELATED TO MARKET
    5.16.2.1 North America
      5.16.2.1.1 US
        5.16.2.1.1.1 MIL-STD-750D
        5.16.2.1.1.2 MIL-STD-750F
        5.16.2.1.1.3 Radiation Hardness Assurance SSB1_005
        5.16.2.1.1.4 MIL-STD-975M (NASA)
      5.16.2.1.2 Canada
        5.16.2.1.2.1 Radiation Emitting Devices Regulations (C.R.C., c. 1370)
    5.16.2.2 Europe
      5.16.2.2.1 ECSS-Q-60-01A
      5.16.2.2.2 ECSS-Q-ST-60-15C
      5.16.2.2.3 ECSS-Q-HB-60-02A
    5.16.2.3 Asia Pacific
      5.16.2.3.1 India
        5.16.2.3.1.1 IS:1885
      5.16.2.3.2 Japan
        5.16.2.3.2.1 Japan Product Safety Compliance
        5.16.2.3.2.2 JMR-001

6 MATERIAL SELECTION AND PACKAGING TYPES IN RADIATION-HARDENED ELECTRONICS MARKET

6.1 INTRODUCTION
6.2 MATERIAL SELECTION
  6.2.1 SILICON
  6.2.2 SILICON CARBIDE (SIC)
  6.2.3 GALLIUM NITRIDE (GAN)
  6.2.4 GALLIUM ARSENIDE (GAAS)
6.3 PACKAGING TYPES
  6.3.1 FLIP-CHIP
  6.3.2 CERAMIC PACKAGES

7 RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT

7.1 INTRODUCTION
FIGURE 35 POWER MANAGEMENT SEGMENT TO ACCOUNT FOR LARGEST SHARE DURING FORECAST PERIOD
TABLE 21 RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2020–2023 (USD MILLION)
TABLE 22 RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2024–2029 (USD MILLION)
7.2 MIXED SIGNAL ICS
TABLE 23 MIXED SIGNAL DEVICES: RADIATION-HARDENED ELECTRONICS MARKET, BY TYPE, 2020–2023 (USD MILLION)
TABLE 24 MIXED SIGNAL DEVICES: RADIATION-HARDENED ELECTRONICS MARKET, BY TYPE, 2024–2029 (USD MILLION)
TABLE 25 MIXED SIGNAL ICS: RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE, 2020–2023 (USD MILLION)
TABLE 26 MIXED SIGNAL ICS: RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE, 2024–2029 (USD MILLION)
TABLE 27 MIXED SIGNAL ICS: RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE, 2020–2023 (USD MILLION)
TABLE 28 MIXED SIGNAL ICS: RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE, 2024–2029 (USD MILLION)
  7.2.1 RAD-HARD A/D AND D/A CONVERTERS
    7.2.1.1 Increasing usage in space applications
  7.2.2 MULTIPLEXERS & RESISTORS
    7.2.2.1 High demand for multiplexers in data acquisition systems
7.3 PROCESSORS & CONTROLLERS
TABLE 29 PROCESSORS & CONTROLLERS: RADIATION-HARDENED ELECTRONICS MARKET, BY TYPE, 2020–2023 (USD MILLION)
TABLE 30 PROCESSORS & CONTROLLERS: RADIATION-HARDENED ELECTRONICS MARKET, BY TYPE, 2024–2029 (USD MILLION)
TABLE 31 PROCESSORS & CONTROLLERS: RADIATION-HARDENED ELECTRONICS MARKET, BY TYPE, 2020–2023 (THOUSAND UNITS)
TABLE 32 PROCESSORS & CONTROLLERS: RADIATION-HARDENED ELECTRONICS MARKET, BY TYPE, 2024–2029 (THOUSAND UNITS)
TABLE 33 PROCESSORS & CONTROLLERS: RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE, 2020–2023 (USD MILLION)
TABLE 34 PROCESSORS & CONTROLLERS: RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE, 2024–2029 (USD MILLION)
TABLE 35 PROCESSORS & CONTROLLERS: RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE, 2020–2023 (USD MILLION)
TABLE 36 PROCESSORS & CONTROLLERS: RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE, 2024–2029 (USD MILLION)
  7.3.1 MICROPROCESSOR UNITS (MPUS)
    7.3.1.1 Developments in multicore processors for space & defense applications
  7.3.2 MICROCONTROLLER UNITS (MCUS)
    7.3.2.1 Development of ARM-based microcontrollers for spacecraft subsystems
  7.3.3 APPLICATION-SPECIFIC INTEGRATED CIRCUITS (ASICS)
    7.3.3.1 Increasing demand for highly customized design
  7.3.4 FPGAS
    7.3.4.1 Help eliminate costs related to re-designing or manual updating
7.4 MEMORY
TABLE 37 MEMORY: RADIATION-HARDENED ELECTRONICS MARKET, BY TYPE, 2020–2023 (USD MILLION)
TABLE 38 MEMORY: RADIATION-HARDENED ELECTRONICS MARKET, BY TYPE, 2024–2029 (USD MILLION)
TABLE 39 MEMORY: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2020–2023 (USD MILLION)
TABLE 40 MEMORY: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2024–2029 (USD MILLION)
TABLE 41 MEMORY: RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE, 2020–2023 (USD MILLION)
TABLE 42 MEMORY: RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE, 2024–2029 (USD MILLION)
TABLE 43 MEMORY: RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE, 2020–2023 (USD MILLION)
TABLE 44 MEMORY: RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE, 2024–2029 (USD MILLION)
  7.4.1 VOLATILE MEMORY
    7.4.1.1 Dynamic Random-Access Memory (DRAM)
      7.4.1.1.1 Low retention time expected to increase adoption in spacecraft
    7.4.1.2 Static random-access memory (SRAM)
      7.4.1.2.1 High adoption in image processing applications
  7.4.2 NON-VOLATILE MEMORY
    7.4.2.1 Magnetoresistive random-access memory (MRAM)
      7.4.2.1.1 Increasing developments in MRAM technologies for space environment
    7.4.2.2 Flash
      7.4.2.2.1 Increasing requirement for NOR flash memory in processing applications
    7.4.2.3 Others (ReRAM, EEPROM, NVRAM)
7.5 POWER MANAGEMENT
TABLE 45 POWER MANAGEMENT: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2020–2023 (USD MILLION)
TABLE 46 POWER MANAGEMENT: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2024–2029 (USD MILLION)
TABLE 47 POWER MANAGEMENT: RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE, 2020–2023 (USD MILLION)
TABLE 48 POWER MANAGEMENT: RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE, 2024–2029 (USD MILLION)
TABLE 49 POWER MANAGEMENT: RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE, 2020–2023 (USD MILLION)
TABLE 50 POWER MANAGEMENT: RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE, 2024–2029 (USD MILLION)
  7.5.1 MOSFETS
    7.5.1.1 Increasing adoption for outer space applications
  7.5.2 DIODES
    7.5.2.1 Integration of ceramic packaging technology to improve performance in space applications
  7.5.3 THYRISTORS
    7.5.3.1 Increasing adoption in aerospace & defense applications
  7.5.4 IGBTS
    7.5.4.1 High current density and low power dissipation drive adoption
7.6 OTHERS (QUALITATIVE)

8 RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE

8.1 INTRODUCTION
FIGURE 36 RHBD SEGMENT TO LEAD RADIATION-HARDENED ELECTRONICS MARKET DURING FORECAST PERIOD
TABLE 51 RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE, 2020–2023 (USD MILLION)
TABLE 52 RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE, 2024–2029 (USD MILLION)
8.2 RADIATION-HARDENING BY DESIGN (RHBD)
TABLE 53 RHBD: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2020–2023 (USD MILLION)
TABLE 54 RHBD: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2024–2029 (USD MILLION)
TABLE 55 RHBD: RADIATION-HARDENED ELECTRONICS MARKET, BY MIXED SIGNAL IC, 2020–2023 (USD MILLION)
TABLE 56 RHBD: RADIATION-HARDENED ELECTRONICS MARKET, BY MIXED SIGNAL IC, 2024–2029 (USD MILLION)
TABLE 57 RHBD: RADIATION-HARDENED ELECTRONICS MARKET, BY PROCESSOR & CONTROLLER, 2020–2023 (USD MILLION)
TABLE 58 RHBD: RADIATION-HARDENED ELECTRONICS MARKET, BY PROCESSOR & CONTROLLER, 2024–2029 (USD MILLION)
TABLE 59 RHBD: RADIATION-HARDENED ELECTRONICS MARKET, BY MEMORY, 2020–2023 (USD MILLION)
TABLE 60 RHBD: RADIATION-HARDENED ELECTRONICS MARKET, BY MEMORY, 2024–2029 (USD MILLION)
TABLE 61 RHBD: RADIATION-HARDENED ELECTRONICS MARKET, BY POWER MANAGEMENT, 2020–2023 (USD MILLION)
TABLE 62 RHBD: RADIATION-HARDENED ELECTRONICS MARKET, BY POWER MANAGEMENT, 2024–2029 (USD MILLION)
  8.2.1 TOTAL IONIZING DOSE
    8.2.1.1 Long-term ionizing damage could result in malfunctioning of electronic components
  8.2.2 SINGLE EVENT EFFECT (SEE)
    8.2.2.1 RHBD approach favored in space electronics
8.3 RADIATION-HARDENING BY PROCESS (RHBP)
TABLE 63 RHBP: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2020–2023 (USD MILLION)
TABLE 64 RHBP: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2024–2029 (USD MILLION)
TABLE 65 RHBP: RADIATION-HARDENED ELECTRONICS MARKET, BY MIXED SIGNAL IC, 2020–2023 (USD MILLION)
TABLE 66 RHBP: RADIATION-HARDENED ELECTRONICS MARKET, BY MIXED SIGNAL IC, 2024–2029 (USD MILLION)
TABLE 67 RHBP: RADIATION-HARDENED ELECTRONICS MARKET, BY PROCESSOR & CONTROLLER, 2020–2023 (USD MILLION)
TABLE 68 RHBP: RADIATION-HARDENED ELECTRONICS MARKET, BY PROCESSOR & CONTROLLER, 2024–2029 (USD MILLION)
TABLE 69 RHBP: RADIATION-HARDENED ELECTRONICS MARKET, BY MEMORY, 2020–2023 (USD MILLION)
TABLE 70 RHBP: RADIATION-HARDENED ELECTRONICS MARKET, BY MEMORY, 2024–2029 (USD MILLION)
TABLE 71 RHBP: RADIATION-HARDENED ELECTRONICS MARKET, BY POWER MANAGEMENT, 2020–2023 (USD MILLION)
TABLE 72 RHBP: RADIATION-HARDENED ELECTRONICS MARKET, BY POWER MANAGEMENT, 2024–2029 (USD MILLION)
  8.3.1 SILICON ON INSULATOR (SOI)
    8.3.1.1 Integration of SOI ICs in insulation layers provides benefits in high-radiation environments
  8.3.2 SILICON ON SAPPHIRE (SOS)
    8.3.2.1 High resistance to radiation increases demand in aerospace and military applications
8.4 RADIATION HARDENING BY SOFTWARE (RHBS) (QUALITATIVE)

9 RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE

9.1 INTRODUCTION
FIGURE 37 COTS SEGMENT TO HOLD LARGER SHARE AND REGISTER HIGHER CAGR DURING FORECAST PERIOD
TABLE 73 RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE, 2020–2023 (USD MILLION)
TABLE 74 RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE, 2024–2029 (USD MILLION)
9.2 COMMERCIAL-OFF-THE-SHELF (COTS)
  9.2.1 INCREASING ADOPTION IN COMMERCIAL AND MILITARY SATELLITES DUE TO LOW-COST BENEFITS
TABLE 75 COTS: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2020–2023 (USD MILLION)
TABLE 76 COTS: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2024–2029 (USD MILLION)
TABLE 77 COTS: RADIATION-HARDENED ELECTRONICS MARKET, BY MIXED SIGNAL IC, 2020–2023 (USD MILLION)
TABLE 78 COTS: RADIATION-HARDENED ELECTRONICS MARKET, BY MIXED SIGNAL IC, 2024–2029 (USD MILLION)
TABLE 79 COTS: RADIATION-HARDENED ELECTRONICS MARKET, BY PROCESSOR & CONTROLLER, 2020–2023 (USD MILLION)
TABLE 80 COTS: RADIATION-HARDENED ELECTRONICS MARKET, BY PROCESSOR & CONTROLLER, 2024–2029 (USD MILLION)
TABLE 81 COTS: RADIATION-HARDENED ELECTRONICS MARKET, BY MEMORY, 2020–2023 (USD MILLION)
TABLE 82 COTS: RADIATION-HARDENED ELECTRONICS MARKET, BY MEMORY, 2024–2029 (USD MILLION)
TABLE 83 COTS: RADIATION-HARDENED ELECTRONICS MARKET, BY POWER MANAGEMENT, 2020–2023 (USD MILLION)
TABLE 84 COTS: RADIATION-HARDENED ELECTRONICS MARKET, BY POWER MANAGEMENT, 2024–2029 (USD MILLION)
9.3 CUSTOM-MADE
  9.3.1 HIGH PREFERENCE IN DEFENSE MISSION-CRITICAL APPLICATIONS
TABLE 85 CUSTOM-MADE: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2020–2023 (USD MILLION)
TABLE 86 CUSTOM-MADE: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2024–2029 (USD MILLION)
TABLE 87 CUSTOM-MADE: RADIATION-HARDENED ELECTRONICS MARKET, BY MIXED SIGNAL IC, 2020–2023 (USD MILLION)
TABLE 88 CUSTOM-MADE: RADIATION-HARDENED ELECTRONICS MARKET, BY MIXED SIGNAL IC, 2024–2029 (USD MILLION)
TABLE 89 CUSTOM-MADE: RADIATION-HARDENED ELECTRONICS MARKET, BY PROCESSOR & CONTROLLER, 2020–2023 (USD MILLION)
TABLE 90 CUSTOM-MADE: RADIATION-HARDENED ELECTRONICS MARKET, BY PROCESSOR & CONTROLLER, 2024–2029 (USD MILLION)
TABLE 91 CUSTOM-MADE: RADIATION-HARDENED ELECTRONICS MARKET, BY MEMORY, 2020–2023 (USD MILLION)
TABLE 92 CUSTOM-MADE: RADIATION-HARDENED ELECTRONICS MARKET, BY MEMORY, 2024–2029 (USD MILLION)
TABLE 93 CUSTOM-MADE: RADIATION-HARDENED ELECTRONICS MARKET, BY POWER MANAGEMENT, 2020–2023 (USD MILLION)
TABLE 94 CUSTOM-MADE: RADIATION-HARDENED ELECTRONICS MARKET, BY POWER MANAGEMENT, 2024–2029 (USD MILLION)

10 RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION

10.1 INTRODUCTION
FIGURE 38 SPACE APPLICATION SEGMENT TO HOLD LARGEST SHARE AND REGISTER HIGHEST CAGR DURING FORECAST PERIOD
TABLE 95 RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION, 2020–2023 (USD MILLION)
TABLE 96 RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION, 2024–2029 (USD MILLION)
10.2 SPACE
  10.2.1 PROLIFERATION IN GLOBAL SPACE ECONOMY TO DRIVE GROWTH OPPORTUNITIES
TABLE 97 SPACE: RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION, 2020–2023 (USD MILLION)
TABLE 98 SPACE: RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION, 2024–2029 (USD MILLION)
TABLE 99 SPACE: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2020–2023 (USD MILLION)
TABLE 100 SPACE: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2024–2029 (USD MILLION)
  10.2.2 COMMERCIAL
    10.2.2.1 Small satellites
    10.2.2.2 New Space
    10.2.2.3 Nanosatellites
  10.2.3 MILITARY
10.3 AEROSPACE & DEFENSE
  10.3.1 INCREASING FUNDING FOR MILITARY SECTOR IN EMERGING COUNTRIES TO DRIVE MARKET GROWTH
TABLE 101 AEROSPACE & DEFENSE: RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION, 2020–2023 (USD MILLION)
TABLE 102 AEROSPACE & DEFENSE: RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION, 2024–2029 (USD MILLION)
TABLE 103 AEROSPACE & DEFENSE: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2020–2023 (USD MILLION)
TABLE 104 AEROSPACE & DEFENSE: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2024–2029 (USD MILLION)
  10.3.2 WEAPONS AND MISSILES
  10.3.3 VEHICLES/AVIONICS
10.4 NUCLEAR POWER PLANTS
  10.4.1 RISE IN CONSTRUCTION OF NUCLEAR REACTORS FOR POWER GENERATION TO DRIVE MARKET GROWTH
TABLE 105 NUCLEAR POWER PLANTS: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2020–2023 (USD MILLION)
TABLE 106 NUCLEAR POWER PLANTS: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2024–2029 (USD MILLION)
10.5 MEDICAL
  10.5.1 INTEGRATION OF EMI SHIELDING AND FILTERING IN IMPLANTABLE DEVICES TO BOOST GROWTH
  10.5.2 IMPLANTABLE MEDICAL DEVICES
TABLE 107 MEDICAL: RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION 2020–2023 (USD MILLION)
TABLE 108 MEDICAL: RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION, 2024–2029 (USD MILLION)
TABLE 109 MEDICAL: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2020–2023 (USD MILLION)
TABLE 110 MEDICAL: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2024–2029 (USD MILLION)
  10.5.3 RADIOLOGY
10.6 OTHERS
TABLE 111 OTHER APPLICATIONS: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2020–2023 (USD MILLION)
TABLE 112 OTHER APPLICATIONS: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2024–2029 (USD MILLION)

11 REGIONAL ANALYSIS

11.1 INTRODUCTION
FIGURE 39 REGIONAL SNAPSHOT: CHINA EXPECTED TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
FIGURE 40 RADIATION-HARDENED ELECTRONICS MARKET, BY REGION
TABLE 113 RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2020–2023 (USD MILLION)
TABLE 114 RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2024–2029 (USD MILLION)
11.2 NORTH AMERICA
FIGURE 41 NORTH AMERICA: RADIATION-HARDENED ELECTRONICS MARKET SNAPSHOT
TABLE 115 NORTH AMERICA: RADIATION-HARDENED ELECTRONICS MARKET, BY COUNTRY, 2020–2023 (USD MILLION)
TABLE 116 NORTH AMERICA: RADIATION-HARDENED ELECTRONICS MARKET, BY COUNTRY, 2024–2029 (USD MILLION)
  11.2.1 US
    11.2.1.1 Increase in space missions from government and private agencies to drive demand
  11.2.2 CANADA
    11.2.2.1 Ongoing developments in satellites expected to drive market
  11.2.3 MEXICO
    11.2.3.1 Growing economy and increasing urban mobility increase demand for satellites
  11.2.4 IMPACT OF RECESSION ON MARKET IN NORTH AMERICA
11.3 EUROPE
FIGURE 42 EUROPE: RADIATION-HARDENED ELECTRONICS MARKET SNAPSHOT
TABLE 117 EUROPE: RADIATION-HARDENED ELECTRONICS MARKET, BY COUNTRY, 2020–2023 (USD MILLION)
TABLE 118 EUROPE: RADIATION-HARDENED ELECTRONICS MARKET, BY COUNTRY, 2024–2029 (USD MILLION)
  11.3.1 UK
    11.3.1.1 Increasing initiatives by government and private entities in space sector to fuel market growth
  11.3.2 GERMANY
    11.3.2.1 Proliferation in national space programs to boost demand for radiation-hardened electronics
  11.3.3 FRANCE
    11.3.3.1 Increasing partnerships in space industry to increase competitiveness of France in European Union
  11.3.4 REST OF EUROPE
  11.3.5 IMPACT OF RECESSION ON MARKET IN EUROPE
11.4 ASIA PACIFIC
FIGURE 43 ASIA PACIFIC: RADIATION-HARDENED ELECTRONICS MARKET SNAPSHOT
TABLE 119 ASIA PACIFIC: RADIATION-HARDENED ELECTRONICS MARKET, BY COUNTRY, 2020–2023 (USD MILLION)
TABLE 120 ASIA PACIFIC: RADIATION-HARDENED ELECTRONICS MARKET, BY COUNTRY, 2024–2029 (USD MILLION)
  11.4.1 CHINA
    11.4.1.1 Advancements in space missions expected to drive market
  11.4.2 INDIA
    11.4.2.1 Increasing developments by ISRO to drive market
  11.4.3 JAPAN
    11.4.3.1 Involvement of private space companies in government space programs to boost market
  11.4.4 SOUTH KOREA
    11.4.4.1 Private-public investments in infrastructure, industrial, commercial, military, space, and defense projects – key driver
  11.4.5 REST OF ASIA PACIFIC
  11.4.6 IMPACT OF RECESSION ON MARKET IN ASIA PACIFIC
11.5 REST OF THE WORLD (ROW)
TABLE 121 ROW: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2020–2023 (USD MILLION)
TABLE 122 ROW: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2024–2029 (USD MILLION)
  11.5.1 GULF COOPERATION COUNCIL (GCC)
    11.5.1.1 Proliferation of satellite operations to drive market
  11.5.2 SOUTH AMERICA
    11.5.2.1 Tie-ups with foreign agencies for space missions to propel market growth
  11.5.3 REST OF MIDDLE EAST AND AFRICA
    11.5.3.1 Increasing investments by governments to boost market growth
  11.5.4 RECESSION IMPACT ON MARKET IN REST OF MIDDLE EAST AND AFRICA

12 COMPETITIVE LANDSCAPE

12.1 INTRODUCTION
12.2 KEY PLAYER STRATEGIES
TABLE 123 KEY PLAYER STRATEGIES
12.3 MARKET REVENUE ANALYSIS
FIGURE 44 RADIATION-HARDENED ELECTRONICS MARKET: REVENUE ANALYSIS OF TOP FIVE PLAYERS, 2020–2022
12.4 MARKET SHARE ANALYSIS
FIGURE 45 MARKET SHARE ANALYSIS, 2023
TABLE 124 DEGREE OF COMPETITION, RADIATION-HARDENED ELECTRONICS MARKET (2023)
TABLE 125 MARKET RANKING ANALYSIS
12.5 VALUATION AND FINANCIAL METRICS IN RADIATION-HARDENED ELECTRONICS MARKET
FIGURE 46 EV/EBITDA OF KEY VENDORS
12.6 BRAND/PRODUCT COMPARATIVE ANALYSIS
FIGURE 47 RADIATION-HARDENED ELECTRONICS MARKET: TOP TRENDING BRAND/PRODUCTS
12.7 COMPANY EVALUATION MATRIX
  12.7.1 STARS
  12.7.2 EMERGING LEADERS
  12.7.3 PERVASIVE PLAYERS
  12.7.4 PARTICIPANTS
FIGURE 48 RADIATION-HARDENED ELECTRONICS MARKET: TOP COMPANY EVALUATION QUADRANT, 2023
12.8 RADIATION-HARDENED ELECTRONICS MARKET: COMPANY FOOTPRINT (15 COMPANIES)
TABLE 126 COMPANY FOOTPRINT
TABLE 127 COMPANY COMPONENT FOOTPRINT (15 COMPANIES)
TABLE 128 COMPANY APPLICATION FOOTPRINT (15 COMPANIES)
TABLE 129 COMPANY REGION FOOTPRINT (15 COMPANIES)
TABLE 130 COMPANY PRODUCT TYPE FOOTPRINT (15 COMPANIES)
TABLE 131 COMPANY MANUFACTURING TECHNIQUE FOOTPRINT (15 COMPANIES)
12.9 STARTUP/SME EVALUATION QUADRANT, 2023
  12.9.1 PROGRESSIVE COMPANIES
  12.9.2 RESPONSIVE COMPANIES
  12.9.3 DYNAMIC COMPANIES
  12.9.4 STARTING BLOCKS
FIGURE 49 RADIATION-HARDENED ELECTRONICS MARKET, STARTUP/SME EVALUATION QUADRANT, 2023
12.10 COMPETITIVE BENCHMARKING
TABLE 132 RADIATION-HARDENED ELECTRONICS MARKET: KEY STARTUPS/SMES
TABLE 133 RADIATION-HARDENED ELECTRONICS MARKET: COMPETITIVE BENCHMARKING OF KEY STARTUPS/SMES
12.11 COMPETITIVE SCENARIOS AND TRENDS
  12.11.1 PRODUCT LAUNCHES/DEVELOPMENTS
TABLE 134 RADIATION-HARDENED ELECTRONICS MARKET: PRODUCT LAUNCHES/DEVELOPMENTS, 2021–2024
  12.11.2 DEALS
TABLE 135 RADIATION-HARDENED ELECTRONICS MARKET: DEALS, 2021–2024
  12.11.3 OTHERS
TABLE 136 RADIATION-HARDENED ELECTRONICS MARKET: OTHER DEALS, 2021–2024

13 COMPANY PROFILES

13.1 KEY PLAYERS
(Business Overview, Products/Solutions/Services Offered, Recent Developments, MnM view (Key strengths/Right to win, Strategic choices made, Weakness/competitive threats)*
  13.1.1 MICROCHIP TECHNOLOGY INC.
TABLE 137 MICROCHIP TECHNOLOGY INC.: BUSINESS OVERVIEW
FIGURE 50 MICROCHIP TECHNOLOGY INC.: COMPANY SNAPSHOT
TABLE 138 MICROCHIP TECHNOLOGY INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
TABLE 139 MICROCHIP TECHNOLOGY INC.: PRODUCT LAUNCHES
TABLE 140 MICROCHIP TECHNOLOGY INC.: DEALS
TABLE 141 MICROCHIP TECHNOLOGY INC.: OTHERS
  13.1.2 BAE SYSTEMS
TABLE 142 BAE SYSTEMS: BUSINESS OVERVIEW
FIGURE 51 BAE SYSTEMS: COMPANY SNAPSHOT
TABLE 143 BAE SYSTEMS: PRODUCTS/SOLUTIONS/SERVICES OFFERED
TABLE 144 BAE SYSTEMS: PRODUCT LAUNCHES
TABLE 145 BAE SYSTEMS: DEALS
TABLE 146 BAE SYSTEMS: OTHERS
  13.1.3 RENESAS ELECTRONICS CORPORATION
TABLE 147 RENESAS ELECTRONICS CORPORATION: BUSINESS OVERVIEW
FIGURE 52 RENESAS ELECTRONICS CORPORATION: COMPANY SNAPSHOT
TABLE 148 RENESAS ELECTRONICS CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED
TABLE 149 RENESAS ELECTRONICS CORPORATION: PRODUCT LAUNCHES
TABLE 150 RENESAS ELECTRONICS CORPORATION: DEALS
TABLE 151 RENESAS ELECTRONICS CORPORATION: OTHERS
  13.1.4 INFINEON TECHNOLOGIES AG
TABLE 152 INFINEON TECHNOLOGIES AG: BUSINESS OVERVIEW
FIGURE 53 INFINEON TECHNOLOGIES AG: COMPANY SNAPSHOT
TABLE 153 INFINEON TECHNOLOGIES AG: PRODUCTS/SOLUTIONS/SERVICES OFFERED
TABLE 154 INFINEON TECHNOLOGIES AG: PRODUCT LAUNCHES
TABLE 155 INFINEON TECHNOLOGIES AG: DEALS
TABLE 156 INFINEON TECHNOLOGIES AG: OTHERS
  13.1.5 STMICROELECTRONICS
TABLE 157 STMICROELECTRONICS: BUSINESS OVERVIEW
FIGURE 54 STMICROELECTRONICS: COMPANY SNAPSHOT
TABLE 158 STMICROELECTRONICS: PRODUCTS/SOLUTIONS/SERVICES OFFERED
TABLE 159 STMICROELECTRONICS: PRODUCT LAUNCHES
TABLE 160 STMICROELECTRONICS: DEALS
  13.1.6 ADVANCED MICRO DEVICES, INC (AMD)
TABLE 161 ADVANCED MICRO DEVICES, INC: BUSINESS OVERVIEW
FIGURE 55 ADVANCED MICRO DEVICES, INC: COMPANY SNAPSHOT
TABLE 162 ADVANCED MICRO DEVICES, INC: PRODUCTS/SOLUTIONS/SERVICES OFFERED
TABLE 163 ADVANCED MICRO DEVICES, INC: PRODUCT LAUNCHES
TABLE 164 ADVANCED MICRO DEVICES, INC: DEALS
  13.1.7 TEXAS INSTRUMENTS INCORPORATED
TABLE 165 TEXAS INSTRUMENTS INCORPORATED: BUSINESS OVERVIEW
FIGURE 56 TEXAS INSTRUMENTS INCORPORATED: COMPANY SNAPSHOT
TABLE 166 TEXAS INSTRUMENTS INCORPORATED: PRODUCTS/SOLUTIONS/SERVICES OFFERED
TABLE 167 TEXAS INSTRUMENTS INCORPORATED: PRODUCT LAUNCHES
TABLE 168 TEXAS INSTRUMENTS INCORPORATED: DEALS
TABLE 169 TEXAS INSTRUMENTS INCORPORATED: DEALS
  13.1.8 HONEYWELL INTERNATIONAL INC.
TABLE 170 HONEYWELL INTERNATIONAL INC.: BUSINESS OVERVIEW
FIGURE 57 HONEYWELL INTERNATIONAL INC.: COMPANY SNAPSHOT
TABLE 171 HONEYWELL INTERNATIONAL INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
TABLE 172 HONEYWELL INTERNATIONAL INC.: PRODUCT LAUNCHES
TABLE 173 HONEYWELL INTERNATIONAL INC.: DEALS
TABLE 174 HONEYWELL INTERNATIONAL INC.: OTHERS
  13.1.9 TELEDYNE TECHNOLOGIES INC.
TABLE 175 TELEDYNE TECHNOLOGIES INC.: BUSINESS OVERVIEW
FIGURE 58 TELEDYNE TECHNOLOGIES INC.: COMPANY SNAPSHOT
TABLE 176 TELEDYNE TECHNOLOGIES INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
TABLE 177 TELEDYNE TECHNOLOGIES INC.: PRODUCT LAUNCHES
TABLE 178 TELEDYNE TECHNOLOGIES INC.: DEALS
TABLE 179 TELEDYNE TECHNOLOGIES INC.: OTHERS
  13.1.10 TTM TECHNOLOGIES, INC.
TABLE 180 TTM TECHNOLOGIES, INC.: BUSINESS OVERVIEW
FIGURE 59 TTM TECHNOLOGIES, INC.: COMPANY SNAPSHOT
TABLE 181 TTM TECHNOLOGIES, INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
TABLE 182 TTM TECHNOLOGIES, INC.: OTHERS
13.2 OTHER PLAYERS
  13.2.1 COBHAM LIMITED
  13.2.2 ANALOG DEVICES, INC
  13.2.3 DATA DEVICE CORPORATION
  13.2.4 3D PLUS
  13.2.5 MERCURY SYSTEMS, INC.
  13.2.6 PCB PIEZOTRONICS, INC.
  13.2.7 VORAGO TECHNOLOGIES
  13.2.8 MICROPAC INDUSTRIES, INC.
  13.2.9 GSI TECHNOLOGY, INC.
  13.2.10 EVERSPIN TECHNOLOGIES INC
  13.2.11 SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (ON SEMICONDUCTOR)
  13.2.12 AITECH
  13.2.13 MICROELECTRONICS RESEARCH DEVELOPMENT CORPORATION
  13.2.14 SPACE MICRO INC
  13.2.15 TRIAD SEMICONDUCTOR
*Details on Business Overview, Products/Solutions/Services Offered, Recent Developments, MnM view (Key strengths/Right to win, Strategic choices made, Weakness/competitive threats)* might not be captured in case of unlisted companies.

14 APPENDIX

14.1 DISCUSSION GUIDE
14.2 KNOWLEDGESTORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL
14.3 CUSTOMIZATION OPTIONS
14.4 RELATED REPORTS
14.5 AUTHOR DETAILS

Radiation hardening is the development of electronic components and systems resistant to destruction or failures caused by ionizing radiation (particle radiation and high-energy electromagnetic radiation), occurring in outer space, high-altitude flights, around nuclear reactors, particle accelerators, during nuclear accidents, or nuclear warfare. Most semiconductor electronic components are susceptible to radiation damage; radiation-hardened components are based on their hardened equivalents, with some design and manufacturing variations that reduce their susceptibility to radiation damage. Due to the extensive development process required to produce a radiation-tolerant design of a microelectronic components, radiation-hardened components tend to fall behind in the race as compared to other classic semiconductor components.

The demand for radiation hardened electronic components is increasing, due to high growth in space, aerospace, and defense sectors. Radiation hardened electronic components such as processors, memory devices, power devices, communication devices, FPGAs, and ASICs have seen a lot of technological advancements, over the last few years. The radiation hardened electronics and semiconductors market can be called mature, though there is still a lot of scope for technological advancement.

Honeywell Aerospace (U.S.) and BAE (U.K.) are the two major players in the radiation hardened electronics and semiconductors market, which together share a major chunk of the radiation hardened electronics and semiconductors market.

  • This market study covers the full range of radiation hardened electronics and semiconductors components used in various applications, to detail the Radiation hardened electronics and semiconductors market for the period between 2013 and 2020.
  • In order to analyze the Radiation hardened electronics and semiconductors market worldwide; it is segmented into – Americas, Europe, APAC, and RoW (Rest of world).

Out of the various applications of the radiation hardened electronics components, the following key applications have been considered: Aerospace & Defense and Space (Satellites). The space application segment has been further divided into commercial and military sub- segments for determining the market size ($million) of radiation hardened electronics and semiconductors market.

This research study incorporates the usage of extensive secondary sources, directories, and databases such as Hoovers, BusinessWeek, OneSource, and Factiva to identify and collect information useful for the extensive technical and commercial study of the radiation hardened electronics and semiconductors market. Primary sources including experts from core and related industries, preferred suppliers, and service providers have been interviewed to obtain and verify critical qualitative and quantitative information as well as to assess the future prospects. Key players in the radiation hardened electronics and semiconductor market were identified through secondary research and their respective market size was determined through primary and secondary research. It includes the study of annual reports of top market players and interviews with key opinion leaders such as CEOs, directors, and marketing personnel.



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