North America Flip Chip Market By Packaging Technology (2.5D IC, 3D IC, and 2D IC), By Bumping Technology (Copper Pillar, Gold Bumping, Solder Bumping and Others), By End User (Electronics, Industrial, IT & Telecom, Automotive, Healthcare & Life Sciences, Aerospace & Defense and Others), By Country, Industry Analysis and Forecast, 2020 - 2026
The North America Flip Chip Market would witness market growth of 7.5% CAGR during the forecast period (2020-2026).
Flip Chip technology is the method used to connect semiconductor devices such as Integrated Circuit Chips and Microelectromechanical Systems (MEMS) to external circuits with solder bumps that have been placed on chip pads. The device is then placed on the external circuitry with its top side down and correctly positioned such that its pads correspond with the corresponding pads on the outer circuit. Flip Chip provides reduced device size (as packaging density increases) and improved efficiency. It's better than wire bonding, as all bonds form simultaneously.
One major advantage that flip chip provides over other technology is its ability to provide higher-frequency data transfer between devices. This is attributable to the fact that the contacts are made by flip-chip bumps, which the duration and, in effect, offer improved electrical efficiency. The surge in demand for high-energy microwave, ultrasonic frequency operations and growing demand for high-speed handheld devices is projected to lead to the growth of the global flip-chip industry in the near future.
Nevertheless, the use of additional wafer bumps and a higher price substrate restricts market growth. Furthermore, the number of input output ports provided on these chips cannot be customized after production due to their extremely complex architecture and compact size. Collectively, these factors also hinder the growth of the overall market. On the contrary, technological advancements by research and development facilities and expenditure by leading players in the industry are expected to reduce the effect of the restraint factor, thereby offering remunerative opportunities for the expansion of the overall flip-chip sector.
Based on Packaging Technology, the market is segmented into 2.5D IC, 3D IC and 2D IC. Based on Bumping Technology, the market is segmented into Copper Pillar, Gold Bumping, Solder Bumping and Others. Based on End User, the market is segmented into Electronics, Industrial, IT & Telecom, Automotive, Healthcare & Life Sciences, Aerospace & Defense and Others. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include 3M Company, Advanced Micro Devices, Inc., Amkor Technology, Inc., Apple, Inc., Fujitsu Limited, Intel Corporation, IBM Corporation, Samsung Electronics Co., Ltd., Texas Instruments, Inc., and Taiwan Semiconductor Manufacturing Company.
Scope of the Study
Market Segmentation:
By Packaging Technology
Flip Chip technology is the method used to connect semiconductor devices such as Integrated Circuit Chips and Microelectromechanical Systems (MEMS) to external circuits with solder bumps that have been placed on chip pads. The device is then placed on the external circuitry with its top side down and correctly positioned such that its pads correspond with the corresponding pads on the outer circuit. Flip Chip provides reduced device size (as packaging density increases) and improved efficiency. It's better than wire bonding, as all bonds form simultaneously.
One major advantage that flip chip provides over other technology is its ability to provide higher-frequency data transfer between devices. This is attributable to the fact that the contacts are made by flip-chip bumps, which the duration and, in effect, offer improved electrical efficiency. The surge in demand for high-energy microwave, ultrasonic frequency operations and growing demand for high-speed handheld devices is projected to lead to the growth of the global flip-chip industry in the near future.
Nevertheless, the use of additional wafer bumps and a higher price substrate restricts market growth. Furthermore, the number of input output ports provided on these chips cannot be customized after production due to their extremely complex architecture and compact size. Collectively, these factors also hinder the growth of the overall market. On the contrary, technological advancements by research and development facilities and expenditure by leading players in the industry are expected to reduce the effect of the restraint factor, thereby offering remunerative opportunities for the expansion of the overall flip-chip sector.
Based on Packaging Technology, the market is segmented into 2.5D IC, 3D IC and 2D IC. Based on Bumping Technology, the market is segmented into Copper Pillar, Gold Bumping, Solder Bumping and Others. Based on End User, the market is segmented into Electronics, Industrial, IT & Telecom, Automotive, Healthcare & Life Sciences, Aerospace & Defense and Others. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include 3M Company, Advanced Micro Devices, Inc., Amkor Technology, Inc., Apple, Inc., Fujitsu Limited, Intel Corporation, IBM Corporation, Samsung Electronics Co., Ltd., Texas Instruments, Inc., and Taiwan Semiconductor Manufacturing Company.
Scope of the Study
Market Segmentation:
By Packaging Technology
- 2.5D IC
- 3D IC
- 2D IC
- Copper Pillar
- Gold Bumping
- Solder Bumping
- Others
- Electronics
- Industrial
- IT & Telecom
- Automotive
- Healthcare & Life Sciences
- Aerospace & Defense
- Others
- US
- Canada
- Mexico
- Rest of North America
- 3M Company
- Advanced Micro Devices, Inc.
- Amkor Technology, Inc.
- Apple, Inc.
- Fujitsu Limited
- Intel Corporation
- IBM Corporation
- Samsung Electronics Co., Ltd.
- Texas Instruments, Inc.
- Taiwan Semiconductor Manufacturing Company
- Exhaustive coverage
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CHAPTER 1. MARKET SCOPE & METHODOLOGY
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 North America Flip Chip Market, by Packaging Technology
1.4.2 North America Flip Chip Market, by Bumping Technology
1.4.3 North America Flip Chip Market, by End User
1.4.4 North America Flip Chip Market, by Country
1.5 Methodology for the research
CHAPTER 2. MARKET OVERVIEW
2.1 Introduction
2.1.1 Overview
2.1.2 Executive Summary
2.1.3 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
CHAPTER 3. NORTH AMERICA FLIP CHIP MARKET BY PACKAGING TECHNOLOGY
3.1 North America Flip Chip 2.5D IC Market by Country
3.2 North America Flip Chip 3D IC Market by Country
3.3 North America Flip Chip 2D IC Market by Country
CHAPTER 4. NORTH AMERICA FLIP CHIP MARKET BY BUMPING TECHNOLOGY
4.1 North America Copper Pillar Flip Chip Market by Country
4.2 North America Gold Bumping Flip Chip Market by Country
4.3 North America Solder Bumping Flip Chip Market by Country
4.4 North America Other Bumping Technology Flip Chip Market by Country
CHAPTER 5. NORTH AMERICA FLIP CHIP MARKET BY END USER
5.1 North America Electronics Flip Chip Market by Country
5.2 North America Industrial Flip Chip Market by Country
5.3 North America IT & Telecom Flip Chip Market by Country
5.4 North America Automotive Flip Chip Market by Country
5.5 North America Healthcare & Life Sciences Flip Chip Market by Country
5.6 North America Aerospace & Defense Flip Chip Market by Country
5.7 North America Others Flip Chip Market by Country
CHAPTER 6. NORTH AMERICA FLIP CHIP MARKET BY COUNTRY
6.1 US Flip Chip Market
6.1.1 US Flip Chip Market by Packaging Technology
6.1.2 US Flip Chip Market by Bumping Technology
6.1.3 US Flip Chip Market by End User
6.2 Canada Flip Chip Market
6.2.1 Canada Flip Chip Market by Packaging Technology
6.2.2 Canada Flip Chip Market by Bumping Technology
6.2.3 Canada Flip Chip Market by End User
6.3 Mexico Flip Chip Market
6.3.1 Mexico Flip Chip Market by Packaging Technology
6.3.2 Mexico Flip Chip Market by Bumping Technology
6.3.3 Mexico Flip Chip Market by End User
6.4 Rest of North America Flip Chip Market
6.4.1 Rest of North America Flip Chip Market by Packaging Technology
6.4.2 Rest of North America Flip Chip Market by Bumping Technology
6.4.3 Rest of North America Flip Chip Market by End User
CHAPTER 7. COMPANY PROFILES
7.1 3M Company
7.1.1 Company Overview
7.1.2 Financial Analysis
7.1.3 Segmental and Regional Analysis
7.1.4 Research & Development Expense
7.1.5 SWOT Analysis
7.2 Advanced Micro Devices, Inc.
7.2.1 Company Overview
7.2.2 Financial Analysis
7.2.3 Segmental and Regional Analysis
7.2.4 Research & Development Expenses
7.3 Amkor Technology, Inc.
7.3.1 Company Overview
7.3.2 Financial Analysis
7.3.3 Regional Analysis
7.3.4 Research & Development Expense
7.3.5 Recent strategies and developments:
7.3.5.1 Partnerships, Collaborations, and Agreements:
7.4 Apple, Inc.
7.4.1 Company Overview
7.4.2 Financial Analysis
7.4.3 Product and Regional Analysis
7.4.4 Research & Development Expense
7.4.5 SWOT Analysis
7.5 Fujitsu Limited
7.5.1 Company Overview
7.5.2 Financial Analysis
7.5.3 SWOT Analysis
7.6 Intel Corporation
7.6.1 Company Overview
7.6.2 Financial Analysis
7.6.3 Segmental and Regional Analysis
7.6.4 Research & Development Expenses
7.6.5 Recent strategies and developments:
7.6.5.1 Acquisition and Mergers:
7.6.6 SWOT Analysis
7.7 IBM Corporation
7.7.1 Company Overview
7.7.2 Financial Analysis
7.7.3 Regional & Segmental Analysis
7.7.4 Research & Development Expenses
7.7.5 SWOT Analysis
7.8 Samsung Electronics Co., Ltd. (Samsung Group)
7.8.1 Company Overview
7.8.2 Financial Analysis
7.8.3 Segmental and Regional Analysis
7.8.4 Research & Development Expense
7.8.5 Recent strategies and developments:
7.8.5.1 Product Launches and Product Expansions:
7.8.6 SWOT Analysis
7.9 Texas Instruments, Inc.
7.9.1 Company Overview
7.9.2 Financial Analysis
7.9.3 Segmental and Regional Analysis
7.9.4 Research & Development Expense
7.9.5 SWOT Analysis
7.1 Taiwan Semiconductor Manufacturing Company
7.10.1 Company overview
7.10.2 Financial Analysis
7.10.3 Regional Analysis
7.10.4 Research & Development Expense
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 North America Flip Chip Market, by Packaging Technology
1.4.2 North America Flip Chip Market, by Bumping Technology
1.4.3 North America Flip Chip Market, by End User
1.4.4 North America Flip Chip Market, by Country
1.5 Methodology for the research
CHAPTER 2. MARKET OVERVIEW
2.1 Introduction
2.1.1 Overview
2.1.2 Executive Summary
2.1.3 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
CHAPTER 3. NORTH AMERICA FLIP CHIP MARKET BY PACKAGING TECHNOLOGY
3.1 North America Flip Chip 2.5D IC Market by Country
3.2 North America Flip Chip 3D IC Market by Country
3.3 North America Flip Chip 2D IC Market by Country
CHAPTER 4. NORTH AMERICA FLIP CHIP MARKET BY BUMPING TECHNOLOGY
4.1 North America Copper Pillar Flip Chip Market by Country
4.2 North America Gold Bumping Flip Chip Market by Country
4.3 North America Solder Bumping Flip Chip Market by Country
4.4 North America Other Bumping Technology Flip Chip Market by Country
CHAPTER 5. NORTH AMERICA FLIP CHIP MARKET BY END USER
5.1 North America Electronics Flip Chip Market by Country
5.2 North America Industrial Flip Chip Market by Country
5.3 North America IT & Telecom Flip Chip Market by Country
5.4 North America Automotive Flip Chip Market by Country
5.5 North America Healthcare & Life Sciences Flip Chip Market by Country
5.6 North America Aerospace & Defense Flip Chip Market by Country
5.7 North America Others Flip Chip Market by Country
CHAPTER 6. NORTH AMERICA FLIP CHIP MARKET BY COUNTRY
6.1 US Flip Chip Market
6.1.1 US Flip Chip Market by Packaging Technology
6.1.2 US Flip Chip Market by Bumping Technology
6.1.3 US Flip Chip Market by End User
6.2 Canada Flip Chip Market
6.2.1 Canada Flip Chip Market by Packaging Technology
6.2.2 Canada Flip Chip Market by Bumping Technology
6.2.3 Canada Flip Chip Market by End User
6.3 Mexico Flip Chip Market
6.3.1 Mexico Flip Chip Market by Packaging Technology
6.3.2 Mexico Flip Chip Market by Bumping Technology
6.3.3 Mexico Flip Chip Market by End User
6.4 Rest of North America Flip Chip Market
6.4.1 Rest of North America Flip Chip Market by Packaging Technology
6.4.2 Rest of North America Flip Chip Market by Bumping Technology
6.4.3 Rest of North America Flip Chip Market by End User
CHAPTER 7. COMPANY PROFILES
7.1 3M Company
7.1.1 Company Overview
7.1.2 Financial Analysis
7.1.3 Segmental and Regional Analysis
7.1.4 Research & Development Expense
7.1.5 SWOT Analysis
7.2 Advanced Micro Devices, Inc.
7.2.1 Company Overview
7.2.2 Financial Analysis
7.2.3 Segmental and Regional Analysis
7.2.4 Research & Development Expenses
7.3 Amkor Technology, Inc.
7.3.1 Company Overview
7.3.2 Financial Analysis
7.3.3 Regional Analysis
7.3.4 Research & Development Expense
7.3.5 Recent strategies and developments:
7.3.5.1 Partnerships, Collaborations, and Agreements:
7.4 Apple, Inc.
7.4.1 Company Overview
7.4.2 Financial Analysis
7.4.3 Product and Regional Analysis
7.4.4 Research & Development Expense
7.4.5 SWOT Analysis
7.5 Fujitsu Limited
7.5.1 Company Overview
7.5.2 Financial Analysis
7.5.3 SWOT Analysis
7.6 Intel Corporation
7.6.1 Company Overview
7.6.2 Financial Analysis
7.6.3 Segmental and Regional Analysis
7.6.4 Research & Development Expenses
7.6.5 Recent strategies and developments:
7.6.5.1 Acquisition and Mergers:
7.6.6 SWOT Analysis
7.7 IBM Corporation
7.7.1 Company Overview
7.7.2 Financial Analysis
7.7.3 Regional & Segmental Analysis
7.7.4 Research & Development Expenses
7.7.5 SWOT Analysis
7.8 Samsung Electronics Co., Ltd. (Samsung Group)
7.8.1 Company Overview
7.8.2 Financial Analysis
7.8.3 Segmental and Regional Analysis
7.8.4 Research & Development Expense
7.8.5 Recent strategies and developments:
7.8.5.1 Product Launches and Product Expansions:
7.8.6 SWOT Analysis
7.9 Texas Instruments, Inc.
7.9.1 Company Overview
7.9.2 Financial Analysis
7.9.3 Segmental and Regional Analysis
7.9.4 Research & Development Expense
7.9.5 SWOT Analysis
7.1 Taiwan Semiconductor Manufacturing Company
7.10.1 Company overview
7.10.2 Financial Analysis
7.10.3 Regional Analysis
7.10.4 Research & Development Expense
LIST OF TABLES
TABLE 1 NORTH AMERICA FLIP CHIP MARKET, 2016 - 2019, USD MILLION
TABLE 2 NORTH AMERICA FLIP CHIP MARKET, 2020 - 2026, USD MILLION
TABLE 3 NORTH AMERICA FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 4 NORTH AMERICA FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 5 NORTH AMERICA FLIP CHIP 2.5D IC MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 6 NORTH AMERICA FLIP CHIP 2.5D IC MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 7 NORTH AMERICA FLIP CHIP 3D IC MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 8 NORTH AMERICA FLIP CHIP 3D IC MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 9 NORTH AMERICA FLIP CHIP 2D IC MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 10 NORTH AMERICA FLIP CHIP 2D IC MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 11 NORTH AMERICA FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 12 NORTH AMERICA FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 13 NORTH AMERICA COPPER PILLAR FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 14 NORTH AMERICA COPPER PILLAR FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 15 NORTH AMERICA GOLD BUMPING FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 16 NORTH AMERICA GOLD BUMPING FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 17 NORTH AMERICA SOLDER BUMPING FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 18 NORTH AMERICA SOLDER BUMPING FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 19 NORTH AMERICA OTHER BUMPING TECHNOLOGY FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 20 NORTH AMERICA OTHER BUMPING TECHNOLOGY FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 21 NORTH AMERICA FLIP CHIP MARKET BY END USER, 2016 - 2019, USD MILLION
TABLE 22 NORTH AMERICA FLIP CHIP MARKET BY END USER, 2020 - 2026, USD MILLION
TABLE 23 NORTH AMERICA ELECTRONICS FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 24 NORTH AMERICA ELECTRONICS FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 25 NORTH AMERICA INDUSTRIAL FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 26 NORTH AMERICA INDUSTRIAL FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 27 NORTH AMERICA IT & TELECOM FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 28 NORTH AMERICA IT & TELECOM FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 29 NORTH AMERICA AUTOMOTIVE FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 30 NORTH AMERICA AUTOMOTIVE FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 31 NORTH AMERICA HEALTHCARE & LIFE SCIENCES FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 32 NORTH AMERICA HEALTHCARE & LIFE SCIENCES FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 33 NORTH AMERICA AEROSPACE & DEFENSE FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 34 NORTH AMERICA AEROSPACE & DEFENSE FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 35 NORTH AMERICA OTHERS FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 36 NORTH AMERICA OTHERS FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 37 NORTH AMERICA FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 38 NORTH AMERICA FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 39 US FLIP CHIP MARKET, 2016 - 2019, USD MILLION
TABLE 40 US FLIP CHIP MARKET, 2020 - 2026, USD MILLION
TABLE 41 US FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 42 US FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 43 US FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 44 US FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 45 US FLIP CHIP MARKET BY END USER, 2016 - 2019, USD MILLION
TABLE 46 US FLIP CHIP MARKET BY END USER, 2020 - 2026, USD MILLION
TABLE 47 CANADA FLIP CHIP MARKET, 2016 - 2019, USD MILLION
TABLE 48 CANADA FLIP CHIP MARKET, 2020 - 2026, USD MILLION
TABLE 49 CANADA FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 50 CANADA FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 51 CANADA FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 52 CANADA FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 53 CANADA FLIP CHIP MARKET BY END USER, 2016 - 2019, USD MILLION
TABLE 54 CANADA FLIP CHIP MARKET BY END USER, 2020 - 2026, USD MILLION
TABLE 55 MEXICO FLIP CHIP MARKET, 2016 - 2019, USD MILLION
TABLE 56 MEXICO FLIP CHIP MARKET, 2020 - 2026, USD MILLION
TABLE 57 MEXICO FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 58 MEXICO FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 59 MEXICO FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 60 MEXICO FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 61 MEXICO FLIP CHIP MARKET BY END USER, 2016 - 2019, USD MILLION
TABLE 62 MEXICO FLIP CHIP MARKET BY END USER, 2020 - 2026, USD MILLION
TABLE 63 REST OF NORTH AMERICA FLIP CHIP MARKET, 2016 - 2019, USD MILLION
TABLE 64 REST OF NORTH AMERICA FLIP CHIP MARKET, 2020 - 2026, USD MILLION
TABLE 65 REST OF NORTH AMERICA FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 66 REST OF NORTH AMERICA FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 67 REST OF NORTH AMERICA FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 68 REST OF NORTH AMERICA FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 69 REST OF NORTH AMERICA FLIP CHIP MARKET BY END USER, 2016 - 2019, USD MILLION
TABLE 70 REST OF NORTH AMERICA FLIP CHIP MARKET BY END USER, 2020 - 2026, USD MILLION
TABLE 71 KEY INFORMATION – 3M COMPANY
TABLE 72 KEY INFORMATION – ADVANCED MICRO DEVICES, INC.
TABLE 73 KEY INFORMATION – AMKOR TECHNOLOGY, INC.
TABLE 74 KEY INFORMATION – APPLE, INC.
TABLE 75 KEY INFORMATION – FUJITSU LIMITED
TABLE 76 KEY INFORMATION – INTEL CORPORATION
TABLE 77 KEY INFORMATION – IBM CORPORATION
TABLE 78 KEY INFORMATION –SAMSUNG ELECTRONICS CO., LTD.
TABLE 79 KEY INFORMATION – TEXAS INSTRUMENTS, INC.
TABLE 80 KEY INFORMATION–TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
TABLE 1 NORTH AMERICA FLIP CHIP MARKET, 2016 - 2019, USD MILLION
TABLE 2 NORTH AMERICA FLIP CHIP MARKET, 2020 - 2026, USD MILLION
TABLE 3 NORTH AMERICA FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 4 NORTH AMERICA FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 5 NORTH AMERICA FLIP CHIP 2.5D IC MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 6 NORTH AMERICA FLIP CHIP 2.5D IC MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 7 NORTH AMERICA FLIP CHIP 3D IC MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 8 NORTH AMERICA FLIP CHIP 3D IC MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 9 NORTH AMERICA FLIP CHIP 2D IC MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 10 NORTH AMERICA FLIP CHIP 2D IC MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 11 NORTH AMERICA FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 12 NORTH AMERICA FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 13 NORTH AMERICA COPPER PILLAR FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 14 NORTH AMERICA COPPER PILLAR FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 15 NORTH AMERICA GOLD BUMPING FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 16 NORTH AMERICA GOLD BUMPING FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 17 NORTH AMERICA SOLDER BUMPING FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 18 NORTH AMERICA SOLDER BUMPING FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 19 NORTH AMERICA OTHER BUMPING TECHNOLOGY FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 20 NORTH AMERICA OTHER BUMPING TECHNOLOGY FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 21 NORTH AMERICA FLIP CHIP MARKET BY END USER, 2016 - 2019, USD MILLION
TABLE 22 NORTH AMERICA FLIP CHIP MARKET BY END USER, 2020 - 2026, USD MILLION
TABLE 23 NORTH AMERICA ELECTRONICS FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 24 NORTH AMERICA ELECTRONICS FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 25 NORTH AMERICA INDUSTRIAL FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 26 NORTH AMERICA INDUSTRIAL FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 27 NORTH AMERICA IT & TELECOM FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 28 NORTH AMERICA IT & TELECOM FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 29 NORTH AMERICA AUTOMOTIVE FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 30 NORTH AMERICA AUTOMOTIVE FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 31 NORTH AMERICA HEALTHCARE & LIFE SCIENCES FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 32 NORTH AMERICA HEALTHCARE & LIFE SCIENCES FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 33 NORTH AMERICA AEROSPACE & DEFENSE FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 34 NORTH AMERICA AEROSPACE & DEFENSE FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 35 NORTH AMERICA OTHERS FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 36 NORTH AMERICA OTHERS FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 37 NORTH AMERICA FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 38 NORTH AMERICA FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 39 US FLIP CHIP MARKET, 2016 - 2019, USD MILLION
TABLE 40 US FLIP CHIP MARKET, 2020 - 2026, USD MILLION
TABLE 41 US FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 42 US FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 43 US FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 44 US FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 45 US FLIP CHIP MARKET BY END USER, 2016 - 2019, USD MILLION
TABLE 46 US FLIP CHIP MARKET BY END USER, 2020 - 2026, USD MILLION
TABLE 47 CANADA FLIP CHIP MARKET, 2016 - 2019, USD MILLION
TABLE 48 CANADA FLIP CHIP MARKET, 2020 - 2026, USD MILLION
TABLE 49 CANADA FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 50 CANADA FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 51 CANADA FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 52 CANADA FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 53 CANADA FLIP CHIP MARKET BY END USER, 2016 - 2019, USD MILLION
TABLE 54 CANADA FLIP CHIP MARKET BY END USER, 2020 - 2026, USD MILLION
TABLE 55 MEXICO FLIP CHIP MARKET, 2016 - 2019, USD MILLION
TABLE 56 MEXICO FLIP CHIP MARKET, 2020 - 2026, USD MILLION
TABLE 57 MEXICO FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 58 MEXICO FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 59 MEXICO FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 60 MEXICO FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 61 MEXICO FLIP CHIP MARKET BY END USER, 2016 - 2019, USD MILLION
TABLE 62 MEXICO FLIP CHIP MARKET BY END USER, 2020 - 2026, USD MILLION
TABLE 63 REST OF NORTH AMERICA FLIP CHIP MARKET, 2016 - 2019, USD MILLION
TABLE 64 REST OF NORTH AMERICA FLIP CHIP MARKET, 2020 - 2026, USD MILLION
TABLE 65 REST OF NORTH AMERICA FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 66 REST OF NORTH AMERICA FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 67 REST OF NORTH AMERICA FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 68 REST OF NORTH AMERICA FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 69 REST OF NORTH AMERICA FLIP CHIP MARKET BY END USER, 2016 - 2019, USD MILLION
TABLE 70 REST OF NORTH AMERICA FLIP CHIP MARKET BY END USER, 2020 - 2026, USD MILLION
TABLE 71 KEY INFORMATION – 3M COMPANY
TABLE 72 KEY INFORMATION – ADVANCED MICRO DEVICES, INC.
TABLE 73 KEY INFORMATION – AMKOR TECHNOLOGY, INC.
TABLE 74 KEY INFORMATION – APPLE, INC.
TABLE 75 KEY INFORMATION – FUJITSU LIMITED
TABLE 76 KEY INFORMATION – INTEL CORPORATION
TABLE 77 KEY INFORMATION – IBM CORPORATION
TABLE 78 KEY INFORMATION –SAMSUNG ELECTRONICS CO., LTD.
TABLE 79 KEY INFORMATION – TEXAS INSTRUMENTS, INC.
TABLE 80 KEY INFORMATION–TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
LIST OF FIGURES
FIG 1 METHODOLOGY FOR THE RESEARCH
FIG 2 SWOT ANALYSIS: 3M COMPANY
FIG 3 SWOT ANALYSIS: APPLE, INC.
FIG 4 SWOT ANALYSIS: FUJITSU LIMITED
FIG 5 SWOT ANALYSIS: INTEL CORPORATION
FIG 6 SWOT ANALYSIS: IBM CORPORATION
FIG 7 SWOT ANALYSIS: SAMSUNG ELECTRONICS CO. LTD.
FIG 8 SWOT ANALYSIS: TEXAS INSTRUMENTS, INC.
FIG 1 METHODOLOGY FOR THE RESEARCH
FIG 2 SWOT ANALYSIS: 3M COMPANY
FIG 3 SWOT ANALYSIS: APPLE, INC.
FIG 4 SWOT ANALYSIS: FUJITSU LIMITED
FIG 5 SWOT ANALYSIS: INTEL CORPORATION
FIG 6 SWOT ANALYSIS: IBM CORPORATION
FIG 7 SWOT ANALYSIS: SAMSUNG ELECTRONICS CO. LTD.
FIG 8 SWOT ANALYSIS: TEXAS INSTRUMENTS, INC.
