Interposer and Fan-out Wafer Level Packaging Market by Packaging Component & Design (Silicon, Organic, Glass, Ceramic), Packaging (2.5D, 3D), Device (Logic ICs, LEDs, Memory Devices, MEMS, Imaging & Optoelectronics), Industry - Global Forecast to 2029
The global interposer and FOWLP market is expected to be valued at USD 35.6 billion in 2024 and is projected to reach USD 63.5 billion by 2029; it is expected to grow at a CAGR of 12.3% from 2024 to 2029. Increasing demand for advanced packaging in AI and high-performance computing serves as a significant driver for the Interposer and FOWLP market.
“3D packaging by packaging type segment to account higher CAGR in Interposer and FOWLP market during the forecast period”
The semiconductor packaging industry is witnessing a surge in 3D packaging due to its ability to enhance performance, reduce form factor, and address challenges associated with traditional 2D packaging. As demand for compact and powerful electronic devices increases, 3D packaging technologies, such as stacked integrated circuits and through-silicon vias, are gaining prominence for their efficiency in meeting these evolving market needs.
“Consumer Electronics to hold the largest share in Interposer and FOWLP market in 2029”
Semiconductor packaging plays a crucial role in consumer electronics by enabling miniaturization, improved performance, and energy efficiency. The demand for smaller, more powerful, and energy-efficient devices, such as smartphones and wearables, is driving continuous innovation in semiconductor packaging technologies to meet the evolving requirements of the consumer electronics market.
“Asia Pacific region growing at highest CAGR in Interposer and FOWLP market”
The growth of semiconductor packaging in Asia Pacific can be attributed to the region's strong presence in electronics manufacturing, the availability of skilled labor, and the establishment of advanced packaging facilities by major semiconductor companies seeking cost-effective production and proximity to key markets. Additionally, supportive government policies and investment in research and development contribute to the region's prominence in semiconductor packaging.
The study contains insights from various industry experts, ranging from component suppliers to Tier 1 companies and OEMs. The break-up of the primaries is as follows:
Research Coverage:
The research reports the Interposer and FOWLP Market, by Packaging Component & Design (Interposer, FOWLP); Packaging Type (2.5D,3D); Device Type (Logic ICs, Imaging & Optoelectronics, LEDs, MEMS/Sensors, Memory Devices and Other Device Types), End-user Industry (Consumer Electronics, Communications, Manufacturing, Automotive, Medical Devices, Aerospace); Region (North America, Europe, Asia Pacific, RoW)
The scope of the report covers detailed information regarding the major factors, such as drivers, restraints, challenges, and opportunities, influencing the growth of the interposer and FOWLP market. A detailed analysis of the key industry players has been done to provide insights into their business overviews, products, key strategies, contracts, partnerships, and agreements. New product & service launches, mergers and acquisitions, and recent developments associated with the Interposer and FOWLP market. Competitive analysis of upcoming startups in the Interposer and FOWLP market ecosystem is covered in this report.
Key Benefits of Buying the Report
“3D packaging by packaging type segment to account higher CAGR in Interposer and FOWLP market during the forecast period”
The semiconductor packaging industry is witnessing a surge in 3D packaging due to its ability to enhance performance, reduce form factor, and address challenges associated with traditional 2D packaging. As demand for compact and powerful electronic devices increases, 3D packaging technologies, such as stacked integrated circuits and through-silicon vias, are gaining prominence for their efficiency in meeting these evolving market needs.
“Consumer Electronics to hold the largest share in Interposer and FOWLP market in 2029”
Semiconductor packaging plays a crucial role in consumer electronics by enabling miniaturization, improved performance, and energy efficiency. The demand for smaller, more powerful, and energy-efficient devices, such as smartphones and wearables, is driving continuous innovation in semiconductor packaging technologies to meet the evolving requirements of the consumer electronics market.
“Asia Pacific region growing at highest CAGR in Interposer and FOWLP market”
The growth of semiconductor packaging in Asia Pacific can be attributed to the region's strong presence in electronics manufacturing, the availability of skilled labor, and the establishment of advanced packaging facilities by major semiconductor companies seeking cost-effective production and proximity to key markets. Additionally, supportive government policies and investment in research and development contribute to the region's prominence in semiconductor packaging.
The study contains insights from various industry experts, ranging from component suppliers to Tier 1 companies and OEMs. The break-up of the primaries is as follows:
- By Company Type: Tier 1 – 38%, Tier 2 – 28%, and Tier 3 – 34%
- By Designation: C-level Executives – 40%, Directors – 30%, and Others – 30%
- By Region: North America – 35%, Europe – 20%, Asia Pacific – 35%, and RoW – 10%
Research Coverage:
The research reports the Interposer and FOWLP Market, by Packaging Component & Design (Interposer, FOWLP); Packaging Type (2.5D,3D); Device Type (Logic ICs, Imaging & Optoelectronics, LEDs, MEMS/Sensors, Memory Devices and Other Device Types), End-user Industry (Consumer Electronics, Communications, Manufacturing, Automotive, Medical Devices, Aerospace); Region (North America, Europe, Asia Pacific, RoW)
The scope of the report covers detailed information regarding the major factors, such as drivers, restraints, challenges, and opportunities, influencing the growth of the interposer and FOWLP market. A detailed analysis of the key industry players has been done to provide insights into their business overviews, products, key strategies, contracts, partnerships, and agreements. New product & service launches, mergers and acquisitions, and recent developments associated with the Interposer and FOWLP market. Competitive analysis of upcoming startups in the Interposer and FOWLP market ecosystem is covered in this report.
Key Benefits of Buying the Report
- Analysis of key drivers (Rising trend of miniaturization and form factor requirements; Increasing demand for advanced packaging in AI and high-performance computing; Growing demand for consumer electronics and gaming devices; Cost advantages offered by advanced packaging), restraints (Environmental concerns due to the usage of certain materials and chemicals; Complex manufacturing process), opportunities (Growing demand for IoT devices and wearables; Integration of advanced electronics in automobiles), and challenges (Thermal issues in wafer level packaging; Complexities in supply chain) influencing the growth of the Interposer and FOWLP market.
- Product Development/Innovation: Detailed insights on upcoming technologies, research and development activities, and new product launches in the Interposer and FOWLP market
- Market Development: Comprehensive information about lucrative markets – the report analyses the Interposer and FOWLP market across varied regions.
- Market Diversification: Exhaustive information about new products/services, untapped geographies, recent developments, and investments in the Interposer and FOWLP market
- Competitive Assessment: In-depth assessment of market shares, growth strategies, and service offerings of leading players like Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), SK HYNIX INC. (South Korea), ASE Technology Holding Co., Ltd. (Taiwan), Amkor Technology (US), among others in the interposers and FOWLP market.
1 INTRODUCTION
1.1 STUDY OBJECTIVES
1.2 MARKET DEFINITION
1.3 INCLUSIONS AND EXCLUSIONS
1.4 STUDY SCOPE
FIGURE 1 INTERPOSER AND FOWLP MARKET SEGMENTATION
1.4.1 REGIONAL SCOPE
1.4.2 YEARS CONSIDERED
1.4.3 CURRENCY CONSIDERED
1.4.4 UNITS CONSIDERED
1.5 LIMITATIONS
1.6 STAKEHOLDERS
1.7 SUMMARY OF CHANGES
1.8 IMPACT OF RECESSION
2 RESEARCH METHODOLOGY
2.1 RESEARCH DATA
FIGURE 2 INTERPOSER AND FOWLP MARKET: RESEARCH DESIGN
2.1.1 SECONDARY AND PRIMARY RESEARCH
2.1.2 SECONDARY DATA
2.1.2.1 List of major secondary sources
2.1.2.2 Key data from secondary sources
2.1.3 PRIMARY DATA
2.1.3.1 Breakdown of primaries
2.1.3.2 Key data from primary sources
2.1.3.3 Key industry insights
2.1.3.4 List of primary interview participants
2.2 MARKET SIZE ESTIMATION METHODOLOGY
FIGURE 3 INTERPOSER AND FOWLP MARKET: MARKET SIZE ESTIMATION METHODOLOGY
2.2.1 BOTTOM-UP APPROACH
2.2.1.1 Approach to arrive at market size using bottom-up analysis (demand side)
FIGURE 4 INTERPOSER AND FOWLP MARKET: BOTTOM-UP APPROACH
2.2.2 TOP-DOWN APPROACH
2.2.2.1 Approach to arrive at market size using top-down analysis (supply side)
FIGURE 5 INTERPOSER AND FOWLP MARKET: TOP-DOWN APPROACH
FIGURE 6 INTERPOSER AND FOWLP MARKET: SUPPLY-SIDE ANALYSIS
2.3 MARKET BREAKDOWN AND DATA TRIANGULATION
FIGURE 7 INTERPOSER AND FOWLP MARKET: DATA TRIANGULATION
2.4 RESEARCH ASSUMPTIONS
TABLE 1 INTERPOSER AND FOWLP MARKET: RESEARCH ASSUMPTIONS
2.5 RESEARCH LIMITATIONS
FIGURE 8 INTERPOSER AND FOWLP MARKET: RESEARCH LIMITATIONS
2.6 RISK ASSESSMENT
TABLE 2 INTERPOSER AND FOWLP MARKET: RISK ASSESSMENT
2.7 PARAMETERS CONSIDERED TO ANALYZE RECESSION IMPACT ON INTERPOSER AND FOWLP MARKET
TABLE 3 INTERPOSER AND FOWLP MARKET: PARAMETERS CONSIDERED TO ANALYZE RECESSION IMPACT ON INTERPOSER AND FOWLP MARKET
3 EXECUTIVE SUMMARY
FIGURE 9 CONSUMER ELECTRONICS TO HOLD LARGEST SHARE OF INTERPOSER AND FOWLP MARKET IN 2029
FIGURE 10 MEMS/SENSORS TO EXHIBIT HIGHEST CAGR IN INTERPOSER AND FOWLP MARKET DURING FORECAST PERIOD
FIGURE 11 2.5D PACKAGING TYPE TO ACCOUNT FOR LARGER MARKET SHARE IN 2024
FIGURE 12 INTERPOSER AND FOWLP PACKAGING MARKET IN ASIA PACIFIC TO RECORD HIGHEST CAGR FROM 2024 TO 2029
4 PREMIUM INSIGHTS
4.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN INTERPOSER AND FOWLP MARKET
FIGURE 13 GROWING DEMAND FOR CONSUMER ELECTRONICS AND GAMING DEVICES TO BOOST MARKET GROWTH
4.2 INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN
FIGURE 14 INTERPOSERS TO ACCOUNT FOR LARGER MARKET SHARE IN 2029
4.3 INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY
FIGURE 15 MEMORY DEVICES TO DOMINATE INTERPOSER AND FOWLP MARKET DURING FORECAST PERIOD
4.4 INTERPOSER AND FOWLP MARKET IN ASIA PACIFIC, BY END-USER INDUSTRY AND COUNTRY
FIGURE 16 CONSUMER ELECTRONICS END-USER INDUSTRY AND CHINA HELD LARGEST SHARES OF INTERPOSER AND FOWLP MARKET IN ASIA PACIFIC IN 2023
4.5 INTERPOSER AND FOWLP MARKET, BY COUNTRY
FIGURE 17 CHINA TO REGISTER HIGHEST CAGR IN INTERPOSER AND FOWLP MARKET DURING FORECAST PERIOD
5 MARKET OVERVIEW
5.1 INTRODUCTION
5.2 MARKET DYNAMICS
FIGURE 18 INTERPOSER AND FOWLP MARKET: DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES
5.2.1 DRIVERS
5.2.1.1 Surging demand for miniaturized electronic devices
5.2.1.2 Growing reliance on AI and high-performance computing technologies
5.2.1.3 Rising popularity of esports and game streaming platforms
FIGURE 19 NUMBER OF GLOBAL SMARTPHONE AND MOBILE PHONE USERS, 2020–2025
5.2.1.4 Increasing focus on developing advanced chip packaging techniques
FIGURE 20 IMPACT ANALYSIS: DRIVERS
5.2.2 RESTRAINTS
5.2.2.1 Environmental concerns associated with use of chemicals in interposer production facilities
5.2.2.2 Requirement for advanced and high-cost manufacturing techniques
FIGURE 21 IMPACT ANALYSIS: RESTRAINTS
5.2.3 OPPORTUNITIES
5.2.3.1 Growing demand for wearable IoT devices
5.2.3.2 Integration of advanced electronics into automobiles
FIGURE 22 IMPACT ANALYSIS: OPPORTUNITIES
5.2.4 CHALLENGES
5.2.4.1 Thermal issues in interposer and wafer-level packaging
5.2.4.2 Managing complex semiconductor supply chain
FIGURE 23 IMPACT ANALYSIS: CHALLENGES
5.3 SUPPLY CHAIN ANALYSIS
FIGURE 24 INTERPOSER AND FOWLP MARKET: SUPPLY CHAIN ANALYSIS
5.4 ECOSYSTEM/MARKET MAP
FIGURE 25 KEY PLAYERS IN INTERPOSER AND FOWLP ECOSYSTEM
TABLE 4 COMPANIES AND THEIR ROLES IN INTERPOSER AND FOWLP ECOSYSTEM
5.5 PRICING ANALYSIS
5.5.1 AVERAGE SELLING PRICE OF 12-INCH WAFERS OFFERED BY TWO KEY PLAYERS
FIGURE 26 AVERAGE SELLING PRICE OF 12-INCH WAFERS OFFERED BY TWO KEY PLAYERS (USD/THOUSAND UNITS)
5.5.2 AVERAGE SELLING PRICE OF 12-INCH WAFERS
TABLE 5 AVERAGE SELLING PRICE OF 12-INCH WAFERS, 2019–2023 (USD/THOUSAND UNITS)
FIGURE 27 AVERAGE SELLING PRICE OF 12-INCH WAFERS, 2019–2023
5.5.3 AVERAGE SELLING PRICE OF 12-INCH WAFERS, BY REGION
FIGURE 28 AVERAGE SELLING PRICE OF 12-INCH WAFERS, BY REGION, 2019–2023
5.6 TRENDS/DISRUPTIONS IMPACTING CUSTOMERS’ BUSINESSES
FIGURE 29 INTERPOSER AND FOWLP MARKET: TRENDS/DISRUPTIONS IMPACTING CUSTOMERS’ BUSINESSES
5.7 TECHNOLOGY ANALYSIS
5.7.1 3D STACKING
5.7.2 FAN-OUT PANEL-LEVEL PACKAGING
5.7.3 MONOLITHIC 3D
5.7.4 3D IC
5.8 PORTER’S FIVE FORCES ANALYSIS
FIGURE 30 INTERPOSER AND FOWLP MARKET: PORTER’S FIVE FORCES ANALYSIS
TABLE 6 INTERPOSER AND FOWLP MARKET: PORTER’S FIVE FORCES ANALYSIS
5.8.1 INTENSITY OF COMPETITIVE RIVALRY
5.8.2 BARGAINING POWER OF SUPPLIERS
5.8.3 BARGAINING POWER OF BUYERS
5.8.4 THREAT OF SUBSTITUTES
5.8.5 THREAT OF NEW ENTRANTS
5.9 KEY STAKEHOLDERS AND BUYING CRITERIA
5.9.1 KEY STAKEHOLDERS IN BUYING PROCESS
FIGURE 31 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP 3 END-USER INDUSTRIES
TABLE 7 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP 3 END-USER INDUSTRIES (%)
5.9.2 BUYING CRITERIA
FIGURE 32 KEY BUYING CRITERIA FOR TOP 3 END-USER INDUSTRIES
TABLE 8 KEY BUYING CRITERIA FOR TOP 3 END-USER INDUSTRIES
5.10 CASE STUDY ANALYSIS
5.10.1 SPTS TECHNOLOGIES PARTNERS WITH IMEC TO REDUCE WAFER THINNING COSTS
5.10.2 SEMICONDUCTOR FOUNDRY USES SPTS OMEGA RAPIER XE TO ENHANCE PRODUCTIVITY OF WAFER BACKSIDE VIA REVEAL PROCESS
5.10.3 CHROMALOX, INC. DEVELOPS KAPTON HEATERS TO GAIN CONTROL OVER TEMPERATURE-SENSITIVE ETCHING CHEMICALS
5.11 TRADE ANALYSIS
5.11.1 IMPORT SCENARIO
FIGURE 33 IMPORT DATA FOR HS CODE 381800-COMPLIANT PRODUCTS, BY KEY COUNTRY, 2018–2022 (USD MILLION)
5.11.2 EXPORT SCENARIO
FIGURE 34 EXPORT DATA FOR HS CODE 381800-COMPLIANT PRODUCTS, BY KEY COUNTRY, 2018–2022 (USD MILLION)
5.12 PATENT ANALYSIS
FIGURE 35 INTERPOSER AND FOWLP MARKET: PATENTS APPLIED AND GRANTED, 2013–2023
TABLE 9 LIST OF PATENTS IN INTERPOSER AND FOWLP MARKET
5.13 KEY CONFERENCES AND EVENTS, 2024–2025
TABLE 10 INTERPOSER AND FOWLP MARKET: LIST OF CONFERENCES AND EVENTS, 2024–2025
5.14 TARIFF, REGULATORY LANDSCAPE, AND STANDARDS
5.14.1 COUNTRY-WISE TARIFF FOR HS CODE 381800-COMPLIANT PRODUCTS
TABLE 11 MFN TARIFF FOR PRODUCTS UNDER HS CODE 381800 EXPORTED BY BRAZIL
5.14.2 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
TABLE 12 NORTH AMERICA: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
TABLE 13 EUROPE: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
TABLE 14 ASIA PACIFIC: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
TABLE 15 ROW: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
5.14.3 REGULATIONS
5.14.3.1 North America
5.14.3.2 Europe
5.14.3.3 Asia Pacific
5.14.3.4 RoW
5.14.4 STANDARDS
6 INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN
6.1 INTRODUCTION
FIGURE 36 INTERPOSERS TO REGISTER HIGHER CAGR BETWEEN 2024 AND 2029
TABLE 16 INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020–2023 (USD BILLION)
TABLE 17 INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024–2029 (USD BILLION)
6.2 INTERPOSERS
TABLE 18 INTERPOSERS: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020–2023 (USD BILLION)
TABLE 19 INTERPOSERS: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024–2029 (USD BILLION)
TABLE 20 INTERPOSERS: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT, 2020–2023 (USD MILLION)
TABLE 21 INTERPOSERS: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT, 2024–2029 (USD MILLION)
TABLE 22 INTERPOSERS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION)
TABLE 23 INTERPOSERS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION)
6.2.1 SILICON
6.2.1.1 Implementation of silicon interposers to stack multiple semiconductor dies in single package to foster segmental growth
6.2.2 ORGANIC
6.2.2.1 Adoption of organic interposers to facilitate effective thermal management to accelerate segmental growth
6.2.3 GLASS
6.2.3.1 Use of glass interposers to ensure high-speed electrical data transfer to fuel segmental growth
6.2.4 CERAMIC
6.2.4.1 Trend of electronic device miniaturization to augment demand for ceramic interposers
6.2.5 OTHER INTERPOSERS
6.3 FOWLP
6.3.1 VERSATILITY AND FLEXIBLE DESIGN TO BOOST ADOPTION OF FOWLP TECHNOLOGY
TABLE 24 FOWLP: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020–2023 (USD BILLION)
TABLE 25 FOWLP: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024–2029 (USD BILLION)
TABLE 26 FOWLP: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION)
TABLE 27 FOWLP: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION)
6.3.2 SINGLE-DIE
6.3.3 MULTI-DIE
7 INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE
7.1 INTRODUCTION
FIGURE 37 INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE
FIGURE 38 3D PACKAGING TYPE TO DEPICT HIGHER CAGR FROM 2024 TO 2029
TABLE 28 INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020–2023 (USD BILLION)
TABLE 29 INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024–2029 (USD BILLION)
7.2 2.5D
7.2.1 ADOPTION OF 2.5D PACKAGING TECHNOLOGY TO ENHANCE PERFORMANCE OF COMPUTING SOLUTIONS TO DRIVE MARKET
TABLE 30 2.5D: INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD MILLION)
TABLE 31 2.5D: INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD MILLION)
7.3 3D
7.3.1 USE OF 3D PACKAGING SOLUTIONS IN ADVANCED SEMICONDUCTOR MANUFACTURING FACILITIES TO FUEL SEGMENTAL GROWTH
TABLE 32 3D: INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD MILLION)
TABLE 33 3D: INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD MILLION)
8 INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE
8.1 INTRODUCTION
FIGURE 39 MEMORY DEVICES TO DOMINATE INTERPOSER AND FOWLP MARKET DURING FORECAST PERIOD
TABLE 34 INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020–2023 (USD BILLION)
TABLE 35 INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2024–2029 (USD BILLION)
8.2 LOGIC ICS
8.2.1 GROWING DEMAND FOR SMART HOME APPLIANCES TO CONTRIBUTE TO SEGMENTAL GROWTH
TABLE 36 LOGIC ICS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION)
TABLE 37 LOGIC ICS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION)
8.3 IMAGING & OPTOELECTRONICS
8.3.1 RISING POPULARITY OF AUTONOMOUS VEHICLES TO ACCELERATE SEGMENTAL GROWTH
TABLE 38 IMAGING & OPTOELECTRONICS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION)
TABLE 39 IMAGING & OPTOELECTRONICS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION)
8.4 MEMORY DEVICES
8.4.1 INCREASING DEMAND FOR SPECIALIZED AI AND ML HARDWARE COMPONENTS TO DRIVE MARKET
TABLE 40 MEMORY DEVICES: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION)
TABLE 41 MEMORY DEVICES: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION)
8.5 MEMS/SENSORS
8.5.1 ESCALATING ADOPTION OF ADVANCED CONSUMER ELECTRONICS TO FOSTER SEGMENTAL GROWTH
TABLE 42 MEMS/SENSORS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION)
TABLE 43 MEMS/SENSORS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION)
8.6 LEDS
8.6.1 INCREASING USE OF LEDS IN TELECOMMUNICATION DEVICES TO PROPEL MARKET
TABLE 44 LEDS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION)
TABLE 45 LEDS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION)
8.7 OTHER DEVICE TYPES
TABLE 46 OTHER DEVICE TYPES: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION)
TABLE 47 OTHER DEVICE TYPES: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION)
9 INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY
9.1 INTRODUCTION
FIGURE 40 AUTOMOTIVE END-USER INDUSTRY TO EXHIBIT HIGHEST CAGR IN INTERPOSER AND FOWLP MARKET FROM 2024 TO 2029
TABLE 48 INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD BILLION)
TABLE 49 INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD BILLION)
9.2 CONSUMER ELECTRONICS
9.2.1 SURGING DEMAND FOR SLEEK AND MULTIFUNCTIONAL ELECTRONIC GADGETS TO DRIVE MARKET
TABLE 50 CONSUMER ELECTRONICS: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020–2023 (USD MILLION)
TABLE 51 CONSUMER ELECTRONICS: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024–2029 (USD MILLION)
TABLE 52 CONSUMER ELECTRONICS: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020–2023 (USD MILLION)
TABLE 53 CONSUMER ELECTRONICS: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2024–2029 (USD MILLION)
TABLE 54 CONSUMER ELECTRONICS: INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD MILLION)
TABLE 55 CONSUMER ELECTRONICS: INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD MILLION)
9.3 MANUFACTURING
9.3.1 ESCALATING ADOPTION OF SMART MANUFACTURING AND INDUSTRY 4.0 TECHNOLOGIES TO FUEL SEGMENTAL GROWTH
TABLE 56 MANUFACTURING: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020–2023 (USD MILLION)
TABLE 57 MANUFACTURING: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024–2029 (USD MILLION)
TABLE 58 MANUFACTURING: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020–2023 (USD MILLION)
TABLE 59 MANUFACTURING: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2024–2029 (USD MILLION)
TABLE 60 MANUFACTURING: INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD MILLION)
TABLE 61 MANUFACTURING: INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD MILLION)
9.4 COMMUNICATIONS
9.4.1 INCREASING DEVELOPMENT OF DATA CENTERS TO CONTRIBUTE TO SEGMENTAL GROWTH
TABLE 62 COMMUNICATIONS: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020–2023 (USD MILLION)
TABLE 63 COMMUNICATIONS: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024–2029 (USD MILLION)
TABLE 64 COMMUNICATIONS: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020–2023 (USD MILLION)
TABLE 65 COMMUNICATIONS: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2024–2029 (USD MILLION)
TABLE 66 COMMUNICATIONS: INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD MILLION)
TABLE 67 COMMUNICATIONS: INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD MILLION)
9.5 AUTOMOTIVE
9.5.1 RISING POPULARITY OF ELECTRIC VEHICLES TO ACCELERATE SEGMENTAL GROWTH
TABLE 68 AUTOMOTIVE: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020–2023 (USD MILLION)
TABLE 69 AUTOMOTIVE: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024–2029 (USD MILLION)
TABLE 70 AUTOMOTIVE: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020–2023 (USD MILLION)
TABLE 71 AUTOMOTIVE: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2024–2029 (USD MILLION)
TABLE 72 AUTOMOTIVE: INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD MILLION)
TABLE 73 AUTOMOTIVE: INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD MILLION)
9.6 HEALTHCARE
9.6.1 RAPID ADVANCEMENTS IN WEARABLE HEALTHCARE DEVICES TO FOSTER SEGMENTAL GROWTH
TABLE 74 HEALTHCARE: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020–2023 (USD MILLION)
TABLE 75 HEALTHCARE: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024–2029 (USD MILLION)
TABLE 76 HEALTHCARE: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020–2023 (USD MILLION)
TABLE 77 HEALTHCARE: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2024–2029 (USD MILLION)
TABLE 78 HEALTHCARE: INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD MILLION)
TABLE 79 HEALTHCARE: INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD MILLION)
9.7 AEROSPACE
9.7.1 INCREASING INTEGRATION OF COMPLEX SYSTEMS AND SENSORS INTO AIRCRAFT TO BOOST SEGMENTAL GROWTH
TABLE 80 AEROSPACE: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020–2023 (USD MILLION)
TABLE 81 AEROSPACE: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024–2029 (USD MILLION)
TABLE 82 AEROSPACE: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020–2023 (USD MILLION)
TABLE 83 AEROSPACE: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2024–2029 (USD MILLION)
TABLE 84 AEROSPACE: INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD MILLION)
TABLE 85 AEROSPACE: INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD MILLION)
10 INTERPOSER AND FOWLP MARKET, BY REGION
10.1 INTRODUCTION
FIGURE 41 ASIA PACIFIC TO EXHIBIT HIGHEST CAGR IN INTERPOSER AND FOWLP MARKET BETWEEN 2024 AND 2029
TABLE 86 INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD BILLION)
TABLE 87 INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD BILLION)
10.2 NORTH AMERICA
FIGURE 42 NORTH AMERICA: INTERPOSER AND FOWLP MARKET SNAPSHOT
TABLE 88 NORTH AMERICA: INTERPOSER AND FOWLP MARKET, BY COUNTRY, 2020–2023 (USD MILLION)
TABLE 89 NORTH AMERICA: INTERPOSER AND FOWLP MARKET, BY COUNTRY, 2024–2029 (USD MILLION)
TABLE 90 NORTH AMERICA: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION)
TABLE 91 NORTH AMERICA: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION)
TABLE 92 NORTH AMERICA: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020–2023 (USD MILLION)
TABLE 93 NORTH AMERICA: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024–2029 (USD MILLION)
10.2.1 RECESSION IMPACT ON MARKET IN NORTH AMERICA
10.2.2 US
10.2.2.1 Rising focus on enhancing performance and functionality of electronic devices to drive market
10.2.3 CANADA
10.2.3.1 Growing emphasis on enhancing semiconductor design and manufacturing to contribute to market growth
10.2.4 MEXICO
10.2.4.1 Increasing investment in semiconductor R&D projects to fuel market growth
10.3 EUROPE
FIGURE 43 EUROPE: INTERPOSER AND FOWLP MARKET SNAPSHOT
TABLE 94 EUROPE: INTERPOSER AND FOWLP MARKET, BY COUNTRY, 2020–2023 (USD MILLION)
TABLE 95 EUROPE: INTERPOSER AND FOWLP MARKET, BY COUNTRY, 2024–2029 (USD MILLION)
TABLE 96 EUROPE: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION)
TABLE 97 EUROPE: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION)
TABLE 98 EUROPE: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020–2023 (USD MILLION)
TABLE 99 EUROPE: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024–2029 (USD MILLION)
10.3.1 RECESSION IMPACT ON MARKET IN EUROPE
10.3.2 UK
10.3.2.1 Rapid advancement in 5G technology to foster market growth
10.3.3 GERMANY
10.3.3.1 Increased adoption of connected cars and smart home devices to accelerate market growth
10.3.4 FRANCE
10.3.4.1 Highly developed transport and communication networks to contribute to market growth
10.3.5 REST OF EUROPE
10.4 ASIA PACIFIC
FIGURE 44 ASIA PACIFIC: INTERPOSER AND FOWLP MARKET SNAPSHOT
TABLE 100 ASIA PACIFIC: INTERPOSER AND FOWLP MARKET, BY COUNTRY, 2020–2023 (USD MILLION)
TABLE 101 ASIA PACIFIC: INTERPOSER AND FOWLP MARKET, BY COUNTRY, 2024–2029 (USD MILLION)
TABLE 102 ASIA PACIFIC: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION)
TABLE 103 ASIA PACIFIC: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION)
TABLE 104 ASIA PACIFIC: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020–2023 (USD MILLION)
TABLE 105 ASIA PACIFIC: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024–2029 (USD MILLION)
10.4.1 RECESSION IMPACT ON MARKET IN ASIA PACIFIC
10.4.2 CHINA
10.4.2.1 Increasing expansion of automobile and semiconductor manufacturing facilities to propel market
10.4.3 JAPAN
10.4.3.1 Rising production of advanced consumer electronics to boost market growth
10.4.4 SOUTH KOREA
10.4.4.1 Growing number of semiconductor fabrication plants to augment market growth
10.4.5 REST OF ASIA PACIFIC
10.5 ROW
TABLE 106 ROW: INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD MILLION)
TABLE 107 ROW: INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD MILLION)
TABLE 108 ROW: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION)
TABLE 109 ROW: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION)
TABLE 110 ROW: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020–2023 (USD MILLION)
TABLE 111 ROW: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024–2029 (USD MILLION)
10.5.1 RECESSION IMPACT ON MARKET IN ROW
10.5.2 MIDDLE EAST & AFRICA
10.5.2.1 High commitment to technological innovation to contribute to market growth
10.5.3 SOUTH AMERICA
10.5.3.1 Increased R&D of advanced packaging technologies to propel market
11 COMPETITIVE LANDSCAPE
11.1 INTRODUCTION
11.2 STRATEGIES ADOPTED BY KEY PLAYERS, 2020–2023
TABLE 112 INTERPOSER AND FOWLP MARKET: OVERVIEW OF STRATEGIES ADOPTED BY KEY PLAYERS, 2020–2023
11.2.1 PRODUCT PORTFOLIO EXPANSION
11.2.2 REGIONAL FOOTPRINT EXPANSION
11.2.3 ORGANIC/INORGANIC GROWTH
11.3 MARKET SHARE ANALYSIS, 2023
TABLE 113 INTERPOSER AND FOWLP MARKET: DEGREE OF COMPETITION
11.4 REVENUE ANALYSIS OF KEY PLAYERS IN INTERPOSER AND FOWLP MARKET, 2018–2022
FIGURE 45 REVENUE ANALYSIS OF KEY PLAYERS IN INTERPOSER AND FOWLP MARKET, 2018–2022
11.5 COMPANY EVALUATION MATRIX, 2023
11.5.1 STARS
11.5.2 EMERGING LEADERS
11.5.3 PERVASIVE PLAYERS
11.5.4 PARTICIPANTS
FIGURE 46 INTERPOSER AND FOWLP MARKET: COMPANY EVALUATION MATRIX, 2023
11.5.5 COMPANY FOOTPRINT
TABLE 114 COMPANY PACKAGING TYPE FOOTPRINT (10 KEY COMPANIES)
TABLE 115 COMPANY PACKAGING COMPONENT AND DESIGN FOOTPRINT (10 KEY COMPANIES)
TABLE 116 COMPANY REGION FOOTPRINT (10 KEY COMPANIES)
TABLE 117 OVERALL COMPANY FOOTPRINT (10 KEY COMPANIES)
11.6 START-UP/SME EVALUATION MATRIX, 2023
TABLE 118 INTERPOSER AND FOWLP MARKET: LIST OF KEY START-UPS/SMES
11.6.1 PROGRESSIVE COMPANIES
11.6.2 RESPONSIVE COMPANIES
11.6.3 DYNAMIC COMPANIES
11.6.4 STARTING BLOCKS
FIGURE 47 INTERPOSER AND FOWLP MARKET: START-UP/SME EVALUATION MATRIX, 2023
11.6.5 COMPETITIVE BENCHMARKING
TABLE 119 INTERPOSER AND FOWLP MARKET: COMPETITIVE BENCHMARKING OF KEY START-UPS/SMES
11.7 COMPETITIVE SITUATION AND TRENDS
11.7.1 PRODUCT LAUNCHES
TABLE 120 INTERPOSER AND FOWLP MARKET: PRODUCT LAUNCHES, AUGUST 2020–NOVEMBER 2023
11.7.2 DEALS
TABLE 121 INTERPOSER AND FOWLP MARKET: DEALS, FEBRUARY 2021–JANUARY 2024
12 COMPANY PROFILES
12.1 INTRODUCTION
12.2 KEY PLAYERS
(Business overview, Products/Solutions/Services offered, Recent developments, MnM view, Key strengths/Right to win, Strategic choices, and Weaknesses and Competitive threats)*
12.2.1 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
TABLE 122 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: COMPANY OVERVIEW
FIGURE 48 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: COMPANY SNAPSHOT
TABLE 123 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: PRODUCTS/SOLUTIONS/SERVICES OFFERED
TABLE 124 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: PRODUCT LAUNCHES
TABLE 125 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: DEALS
12.2.2 SAMSUNG
TABLE 126 SAMSUNG: COMPANY OVERVIEW
FIGURE 49 SAMSUNG: COMPANY SNAPSHOT
TABLE 127 SAMSUNG: PRODUCTS/SOLUTIONS/SERVICES OFFERED
TABLE 128 SAMSUNG: PRODUCT LAUNCHES
TABLE 129 SAMSUNG: DEALS
12.2.3 ASE TECHNOLOGY HOLDING CO., LTD.
TABLE 130 ASE TECHNOLOGY HOLDING CO., LTD.: COMPANY OVERVIEW
FIGURE 50 ASE TECHNOLOGY HOLDING CO. LTD.: COMPANY SNAPSHOT
TABLE 131 ASE TECHNOLOGY HOLDING CO., LTD.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
TABLE 132 ASE TECHNOLOGY HOLDING CO., LTD.: PRODUCT LAUNCHES
TABLE 133 ASE TECHNOLOGY HOLDING CO., LTD.: DEALS
12.2.4 AMKOR TECHNOLOGY
TABLE 134 AMKOR TECHNOLOGY: COMPANY OVERVIEW
FIGURE 51 AMKOR TECHNOLOGY: COMPANY SNAPSHOT
TABLE 135 AMKOR TECHNOLOGY: PRODUCTS/SOLUTIONS/SERVICES OFFERED
TABLE 136 AMKOR TECHNOLOGY: DEALS
TABLE 137 AMKOR TECHNOLOGY: OTHERS
12.2.5 SK HYNIX INC.
TABLE 138 SK HYNIX INC.: COMPANY OVERVIEW
FIGURE 52 SK HYNIX INC.: COMPANY SNAPSHOT
TABLE 139 SK HYNIX INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
TABLE 140 SK HYNIX INC.: PRODUCT LAUNCHES
12.2.6 GLOBAL FOUNDRIES INC.
TABLE 141 GLOBAL FOUNDRIES INC.: COMPANY OVERVIEW
FIGURE 53 GLOBAL FOUNDRIES INC.: COMPANY SNAPSHOT
TABLE 142 GLOBAL FOUNDRIES INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
TABLE 143 GLOBAL FOUNDRIES INC.: DEALS
TABLE 144 GLOBAL FOUNDRIES INC.: OTHERS
12.2.7 DECA TECHNOLOGIES
TABLE 145 DECA TECHNOLOGIES: COMPANY OVERVIEW
TABLE 146 DECA TECHNOLOGIES: PRODUCTS/SOLUTIONS/SERVICES OFFERED
TABLE 147 DECA TECHNOLOGIES: DEALS
12.2.8 JCET GROUP LTD.
TABLE 148 JCET GROUP LTD.: COMPANY OVERVIEW
FIGURE 54 JCET GROUP LTD.: COMPANY SNAPSHOT
TABLE 149 JCET GROUP LTD.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
TABLE 150 JCET GROUP LTD.: PRODUCT LAUNCHES
TABLE 151 JCET GROUP LTD.: OTHERS
12.2.9 POWERTECH TECHNOLOGY INC.
TABLE 152 POWERTECH TECHNOLOGY INC.: COMPANY OVERVIEW
FIGURE 55 POWERTECH TECHNOLOGY INC.: COMPANY SNAPSHOT
TABLE 153 POWERTECH TECHNOLOGY INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
TABLE 154 POWERTECH TECHNOLOGY INC.: DEALS
12.2.10 ADVANCED MICRO DEVICES, INC.
TABLE 155 ADVANCED MICRO DEVICES, INC.: COMPANY OVERVIEW
FIGURE 56 ADVANCED MICRO DEVICES, INC.: COMPANY SNAPSHOT
TABLE 156 ADVANCED MICRO DEVICES, INC.: PRODUCTS/SOLUTIONS/SERVICES
TABLE 157 ADVANCED MICRO DEVICES, INC.: PRODUCT LAUNCHES
12.3 OTHER PLAYERS
12.3.1 NEXLOGIC TECHNOLOGIES INC.
12.3.2 SPTS TECHNOLOGIES LTD.
12.3.3 TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
12.3.4 SAMTEC
12.3.5 TELEDYNE DIGITAL IMAGING INC.
12.3.6 OKMETIC
12.3.7 AMS-OSRAM AG
12.3.8 NEPES
12.3.9 NHANCED SEMICONDUCTORS
12.3.10 DUPONT
12.3.11 ALLVIA INC.
12.3.12 UNITED MICROELECTRONICS CORPORATION
12.3.13 DAI NIPPON PRINTING CO., LTD.
12.3.14 RENA TECHNOLOGIES GMBH
12.3.15 MURATA MANUFACTURING CO., LTD
*Details on Business overview, Products/Solutions/Services offered, Recent developments, MnM view, Key strengths/Right to win, Strategic choices, and Weaknesses and Competitive threats might not be captured in case of unlisted companies.
13 APPENDIX
13.1 INSIGHTS FROM INDUSTRY EXPERTS
13.2 DISCUSSION GUIDE
13.3 KNOWLEDGESTORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL
13.4 CUSTOMIZATION OPTIONS
13.5 RELATED REPORTS
13.6 AUTHOR DETAILS
1.1 STUDY OBJECTIVES
1.2 MARKET DEFINITION
1.3 INCLUSIONS AND EXCLUSIONS
1.4 STUDY SCOPE
FIGURE 1 INTERPOSER AND FOWLP MARKET SEGMENTATION
1.4.1 REGIONAL SCOPE
1.4.2 YEARS CONSIDERED
1.4.3 CURRENCY CONSIDERED
1.4.4 UNITS CONSIDERED
1.5 LIMITATIONS
1.6 STAKEHOLDERS
1.7 SUMMARY OF CHANGES
1.8 IMPACT OF RECESSION
2 RESEARCH METHODOLOGY
2.1 RESEARCH DATA
FIGURE 2 INTERPOSER AND FOWLP MARKET: RESEARCH DESIGN
2.1.1 SECONDARY AND PRIMARY RESEARCH
2.1.2 SECONDARY DATA
2.1.2.1 List of major secondary sources
2.1.2.2 Key data from secondary sources
2.1.3 PRIMARY DATA
2.1.3.1 Breakdown of primaries
2.1.3.2 Key data from primary sources
2.1.3.3 Key industry insights
2.1.3.4 List of primary interview participants
2.2 MARKET SIZE ESTIMATION METHODOLOGY
FIGURE 3 INTERPOSER AND FOWLP MARKET: MARKET SIZE ESTIMATION METHODOLOGY
2.2.1 BOTTOM-UP APPROACH
2.2.1.1 Approach to arrive at market size using bottom-up analysis (demand side)
FIGURE 4 INTERPOSER AND FOWLP MARKET: BOTTOM-UP APPROACH
2.2.2 TOP-DOWN APPROACH
2.2.2.1 Approach to arrive at market size using top-down analysis (supply side)
FIGURE 5 INTERPOSER AND FOWLP MARKET: TOP-DOWN APPROACH
FIGURE 6 INTERPOSER AND FOWLP MARKET: SUPPLY-SIDE ANALYSIS
2.3 MARKET BREAKDOWN AND DATA TRIANGULATION
FIGURE 7 INTERPOSER AND FOWLP MARKET: DATA TRIANGULATION
2.4 RESEARCH ASSUMPTIONS
TABLE 1 INTERPOSER AND FOWLP MARKET: RESEARCH ASSUMPTIONS
2.5 RESEARCH LIMITATIONS
FIGURE 8 INTERPOSER AND FOWLP MARKET: RESEARCH LIMITATIONS
2.6 RISK ASSESSMENT
TABLE 2 INTERPOSER AND FOWLP MARKET: RISK ASSESSMENT
2.7 PARAMETERS CONSIDERED TO ANALYZE RECESSION IMPACT ON INTERPOSER AND FOWLP MARKET
TABLE 3 INTERPOSER AND FOWLP MARKET: PARAMETERS CONSIDERED TO ANALYZE RECESSION IMPACT ON INTERPOSER AND FOWLP MARKET
3 EXECUTIVE SUMMARY
FIGURE 9 CONSUMER ELECTRONICS TO HOLD LARGEST SHARE OF INTERPOSER AND FOWLP MARKET IN 2029
FIGURE 10 MEMS/SENSORS TO EXHIBIT HIGHEST CAGR IN INTERPOSER AND FOWLP MARKET DURING FORECAST PERIOD
FIGURE 11 2.5D PACKAGING TYPE TO ACCOUNT FOR LARGER MARKET SHARE IN 2024
FIGURE 12 INTERPOSER AND FOWLP PACKAGING MARKET IN ASIA PACIFIC TO RECORD HIGHEST CAGR FROM 2024 TO 2029
4 PREMIUM INSIGHTS
4.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN INTERPOSER AND FOWLP MARKET
FIGURE 13 GROWING DEMAND FOR CONSUMER ELECTRONICS AND GAMING DEVICES TO BOOST MARKET GROWTH
4.2 INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN
FIGURE 14 INTERPOSERS TO ACCOUNT FOR LARGER MARKET SHARE IN 2029
4.3 INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY
FIGURE 15 MEMORY DEVICES TO DOMINATE INTERPOSER AND FOWLP MARKET DURING FORECAST PERIOD
4.4 INTERPOSER AND FOWLP MARKET IN ASIA PACIFIC, BY END-USER INDUSTRY AND COUNTRY
FIGURE 16 CONSUMER ELECTRONICS END-USER INDUSTRY AND CHINA HELD LARGEST SHARES OF INTERPOSER AND FOWLP MARKET IN ASIA PACIFIC IN 2023
4.5 INTERPOSER AND FOWLP MARKET, BY COUNTRY
FIGURE 17 CHINA TO REGISTER HIGHEST CAGR IN INTERPOSER AND FOWLP MARKET DURING FORECAST PERIOD
5 MARKET OVERVIEW
5.1 INTRODUCTION
5.2 MARKET DYNAMICS
FIGURE 18 INTERPOSER AND FOWLP MARKET: DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES
5.2.1 DRIVERS
5.2.1.1 Surging demand for miniaturized electronic devices
5.2.1.2 Growing reliance on AI and high-performance computing technologies
5.2.1.3 Rising popularity of esports and game streaming platforms
FIGURE 19 NUMBER OF GLOBAL SMARTPHONE AND MOBILE PHONE USERS, 2020–2025
5.2.1.4 Increasing focus on developing advanced chip packaging techniques
FIGURE 20 IMPACT ANALYSIS: DRIVERS
5.2.2 RESTRAINTS
5.2.2.1 Environmental concerns associated with use of chemicals in interposer production facilities
5.2.2.2 Requirement for advanced and high-cost manufacturing techniques
FIGURE 21 IMPACT ANALYSIS: RESTRAINTS
5.2.3 OPPORTUNITIES
5.2.3.1 Growing demand for wearable IoT devices
5.2.3.2 Integration of advanced electronics into automobiles
FIGURE 22 IMPACT ANALYSIS: OPPORTUNITIES
5.2.4 CHALLENGES
5.2.4.1 Thermal issues in interposer and wafer-level packaging
5.2.4.2 Managing complex semiconductor supply chain
FIGURE 23 IMPACT ANALYSIS: CHALLENGES
5.3 SUPPLY CHAIN ANALYSIS
FIGURE 24 INTERPOSER AND FOWLP MARKET: SUPPLY CHAIN ANALYSIS
5.4 ECOSYSTEM/MARKET MAP
FIGURE 25 KEY PLAYERS IN INTERPOSER AND FOWLP ECOSYSTEM
TABLE 4 COMPANIES AND THEIR ROLES IN INTERPOSER AND FOWLP ECOSYSTEM
5.5 PRICING ANALYSIS
5.5.1 AVERAGE SELLING PRICE OF 12-INCH WAFERS OFFERED BY TWO KEY PLAYERS
FIGURE 26 AVERAGE SELLING PRICE OF 12-INCH WAFERS OFFERED BY TWO KEY PLAYERS (USD/THOUSAND UNITS)
5.5.2 AVERAGE SELLING PRICE OF 12-INCH WAFERS
TABLE 5 AVERAGE SELLING PRICE OF 12-INCH WAFERS, 2019–2023 (USD/THOUSAND UNITS)
FIGURE 27 AVERAGE SELLING PRICE OF 12-INCH WAFERS, 2019–2023
5.5.3 AVERAGE SELLING PRICE OF 12-INCH WAFERS, BY REGION
FIGURE 28 AVERAGE SELLING PRICE OF 12-INCH WAFERS, BY REGION, 2019–2023
5.6 TRENDS/DISRUPTIONS IMPACTING CUSTOMERS’ BUSINESSES
FIGURE 29 INTERPOSER AND FOWLP MARKET: TRENDS/DISRUPTIONS IMPACTING CUSTOMERS’ BUSINESSES
5.7 TECHNOLOGY ANALYSIS
5.7.1 3D STACKING
5.7.2 FAN-OUT PANEL-LEVEL PACKAGING
5.7.3 MONOLITHIC 3D
5.7.4 3D IC
5.8 PORTER’S FIVE FORCES ANALYSIS
FIGURE 30 INTERPOSER AND FOWLP MARKET: PORTER’S FIVE FORCES ANALYSIS
TABLE 6 INTERPOSER AND FOWLP MARKET: PORTER’S FIVE FORCES ANALYSIS
5.8.1 INTENSITY OF COMPETITIVE RIVALRY
5.8.2 BARGAINING POWER OF SUPPLIERS
5.8.3 BARGAINING POWER OF BUYERS
5.8.4 THREAT OF SUBSTITUTES
5.8.5 THREAT OF NEW ENTRANTS
5.9 KEY STAKEHOLDERS AND BUYING CRITERIA
5.9.1 KEY STAKEHOLDERS IN BUYING PROCESS
FIGURE 31 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP 3 END-USER INDUSTRIES
TABLE 7 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP 3 END-USER INDUSTRIES (%)
5.9.2 BUYING CRITERIA
FIGURE 32 KEY BUYING CRITERIA FOR TOP 3 END-USER INDUSTRIES
TABLE 8 KEY BUYING CRITERIA FOR TOP 3 END-USER INDUSTRIES
5.10 CASE STUDY ANALYSIS
5.10.1 SPTS TECHNOLOGIES PARTNERS WITH IMEC TO REDUCE WAFER THINNING COSTS
5.10.2 SEMICONDUCTOR FOUNDRY USES SPTS OMEGA RAPIER XE TO ENHANCE PRODUCTIVITY OF WAFER BACKSIDE VIA REVEAL PROCESS
5.10.3 CHROMALOX, INC. DEVELOPS KAPTON HEATERS TO GAIN CONTROL OVER TEMPERATURE-SENSITIVE ETCHING CHEMICALS
5.11 TRADE ANALYSIS
5.11.1 IMPORT SCENARIO
FIGURE 33 IMPORT DATA FOR HS CODE 381800-COMPLIANT PRODUCTS, BY KEY COUNTRY, 2018–2022 (USD MILLION)
5.11.2 EXPORT SCENARIO
FIGURE 34 EXPORT DATA FOR HS CODE 381800-COMPLIANT PRODUCTS, BY KEY COUNTRY, 2018–2022 (USD MILLION)
5.12 PATENT ANALYSIS
FIGURE 35 INTERPOSER AND FOWLP MARKET: PATENTS APPLIED AND GRANTED, 2013–2023
TABLE 9 LIST OF PATENTS IN INTERPOSER AND FOWLP MARKET
5.13 KEY CONFERENCES AND EVENTS, 2024–2025
TABLE 10 INTERPOSER AND FOWLP MARKET: LIST OF CONFERENCES AND EVENTS, 2024–2025
5.14 TARIFF, REGULATORY LANDSCAPE, AND STANDARDS
5.14.1 COUNTRY-WISE TARIFF FOR HS CODE 381800-COMPLIANT PRODUCTS
TABLE 11 MFN TARIFF FOR PRODUCTS UNDER HS CODE 381800 EXPORTED BY BRAZIL
5.14.2 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
TABLE 12 NORTH AMERICA: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
TABLE 13 EUROPE: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
TABLE 14 ASIA PACIFIC: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
TABLE 15 ROW: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
5.14.3 REGULATIONS
5.14.3.1 North America
5.14.3.2 Europe
5.14.3.3 Asia Pacific
5.14.3.4 RoW
5.14.4 STANDARDS
6 INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN
6.1 INTRODUCTION
FIGURE 36 INTERPOSERS TO REGISTER HIGHER CAGR BETWEEN 2024 AND 2029
TABLE 16 INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020–2023 (USD BILLION)
TABLE 17 INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024–2029 (USD BILLION)
6.2 INTERPOSERS
TABLE 18 INTERPOSERS: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020–2023 (USD BILLION)
TABLE 19 INTERPOSERS: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024–2029 (USD BILLION)
TABLE 20 INTERPOSERS: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT, 2020–2023 (USD MILLION)
TABLE 21 INTERPOSERS: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT, 2024–2029 (USD MILLION)
TABLE 22 INTERPOSERS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION)
TABLE 23 INTERPOSERS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION)
6.2.1 SILICON
6.2.1.1 Implementation of silicon interposers to stack multiple semiconductor dies in single package to foster segmental growth
6.2.2 ORGANIC
6.2.2.1 Adoption of organic interposers to facilitate effective thermal management to accelerate segmental growth
6.2.3 GLASS
6.2.3.1 Use of glass interposers to ensure high-speed electrical data transfer to fuel segmental growth
6.2.4 CERAMIC
6.2.4.1 Trend of electronic device miniaturization to augment demand for ceramic interposers
6.2.5 OTHER INTERPOSERS
6.3 FOWLP
6.3.1 VERSATILITY AND FLEXIBLE DESIGN TO BOOST ADOPTION OF FOWLP TECHNOLOGY
TABLE 24 FOWLP: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020–2023 (USD BILLION)
TABLE 25 FOWLP: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024–2029 (USD BILLION)
TABLE 26 FOWLP: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION)
TABLE 27 FOWLP: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION)
6.3.2 SINGLE-DIE
6.3.3 MULTI-DIE
7 INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE
7.1 INTRODUCTION
FIGURE 37 INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE
FIGURE 38 3D PACKAGING TYPE TO DEPICT HIGHER CAGR FROM 2024 TO 2029
TABLE 28 INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020–2023 (USD BILLION)
TABLE 29 INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024–2029 (USD BILLION)
7.2 2.5D
7.2.1 ADOPTION OF 2.5D PACKAGING TECHNOLOGY TO ENHANCE PERFORMANCE OF COMPUTING SOLUTIONS TO DRIVE MARKET
TABLE 30 2.5D: INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD MILLION)
TABLE 31 2.5D: INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD MILLION)
7.3 3D
7.3.1 USE OF 3D PACKAGING SOLUTIONS IN ADVANCED SEMICONDUCTOR MANUFACTURING FACILITIES TO FUEL SEGMENTAL GROWTH
TABLE 32 3D: INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD MILLION)
TABLE 33 3D: INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD MILLION)
8 INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE
8.1 INTRODUCTION
FIGURE 39 MEMORY DEVICES TO DOMINATE INTERPOSER AND FOWLP MARKET DURING FORECAST PERIOD
TABLE 34 INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020–2023 (USD BILLION)
TABLE 35 INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2024–2029 (USD BILLION)
8.2 LOGIC ICS
8.2.1 GROWING DEMAND FOR SMART HOME APPLIANCES TO CONTRIBUTE TO SEGMENTAL GROWTH
TABLE 36 LOGIC ICS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION)
TABLE 37 LOGIC ICS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION)
8.3 IMAGING & OPTOELECTRONICS
8.3.1 RISING POPULARITY OF AUTONOMOUS VEHICLES TO ACCELERATE SEGMENTAL GROWTH
TABLE 38 IMAGING & OPTOELECTRONICS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION)
TABLE 39 IMAGING & OPTOELECTRONICS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION)
8.4 MEMORY DEVICES
8.4.1 INCREASING DEMAND FOR SPECIALIZED AI AND ML HARDWARE COMPONENTS TO DRIVE MARKET
TABLE 40 MEMORY DEVICES: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION)
TABLE 41 MEMORY DEVICES: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION)
8.5 MEMS/SENSORS
8.5.1 ESCALATING ADOPTION OF ADVANCED CONSUMER ELECTRONICS TO FOSTER SEGMENTAL GROWTH
TABLE 42 MEMS/SENSORS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION)
TABLE 43 MEMS/SENSORS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION)
8.6 LEDS
8.6.1 INCREASING USE OF LEDS IN TELECOMMUNICATION DEVICES TO PROPEL MARKET
TABLE 44 LEDS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION)
TABLE 45 LEDS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION)
8.7 OTHER DEVICE TYPES
TABLE 46 OTHER DEVICE TYPES: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION)
TABLE 47 OTHER DEVICE TYPES: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION)
9 INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY
9.1 INTRODUCTION
FIGURE 40 AUTOMOTIVE END-USER INDUSTRY TO EXHIBIT HIGHEST CAGR IN INTERPOSER AND FOWLP MARKET FROM 2024 TO 2029
TABLE 48 INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD BILLION)
TABLE 49 INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD BILLION)
9.2 CONSUMER ELECTRONICS
9.2.1 SURGING DEMAND FOR SLEEK AND MULTIFUNCTIONAL ELECTRONIC GADGETS TO DRIVE MARKET
TABLE 50 CONSUMER ELECTRONICS: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020–2023 (USD MILLION)
TABLE 51 CONSUMER ELECTRONICS: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024–2029 (USD MILLION)
TABLE 52 CONSUMER ELECTRONICS: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020–2023 (USD MILLION)
TABLE 53 CONSUMER ELECTRONICS: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2024–2029 (USD MILLION)
TABLE 54 CONSUMER ELECTRONICS: INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD MILLION)
TABLE 55 CONSUMER ELECTRONICS: INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD MILLION)
9.3 MANUFACTURING
9.3.1 ESCALATING ADOPTION OF SMART MANUFACTURING AND INDUSTRY 4.0 TECHNOLOGIES TO FUEL SEGMENTAL GROWTH
TABLE 56 MANUFACTURING: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020–2023 (USD MILLION)
TABLE 57 MANUFACTURING: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024–2029 (USD MILLION)
TABLE 58 MANUFACTURING: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020–2023 (USD MILLION)
TABLE 59 MANUFACTURING: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2024–2029 (USD MILLION)
TABLE 60 MANUFACTURING: INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD MILLION)
TABLE 61 MANUFACTURING: INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD MILLION)
9.4 COMMUNICATIONS
9.4.1 INCREASING DEVELOPMENT OF DATA CENTERS TO CONTRIBUTE TO SEGMENTAL GROWTH
TABLE 62 COMMUNICATIONS: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020–2023 (USD MILLION)
TABLE 63 COMMUNICATIONS: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024–2029 (USD MILLION)
TABLE 64 COMMUNICATIONS: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020–2023 (USD MILLION)
TABLE 65 COMMUNICATIONS: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2024–2029 (USD MILLION)
TABLE 66 COMMUNICATIONS: INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD MILLION)
TABLE 67 COMMUNICATIONS: INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD MILLION)
9.5 AUTOMOTIVE
9.5.1 RISING POPULARITY OF ELECTRIC VEHICLES TO ACCELERATE SEGMENTAL GROWTH
TABLE 68 AUTOMOTIVE: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020–2023 (USD MILLION)
TABLE 69 AUTOMOTIVE: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024–2029 (USD MILLION)
TABLE 70 AUTOMOTIVE: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020–2023 (USD MILLION)
TABLE 71 AUTOMOTIVE: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2024–2029 (USD MILLION)
TABLE 72 AUTOMOTIVE: INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD MILLION)
TABLE 73 AUTOMOTIVE: INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD MILLION)
9.6 HEALTHCARE
9.6.1 RAPID ADVANCEMENTS IN WEARABLE HEALTHCARE DEVICES TO FOSTER SEGMENTAL GROWTH
TABLE 74 HEALTHCARE: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020–2023 (USD MILLION)
TABLE 75 HEALTHCARE: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024–2029 (USD MILLION)
TABLE 76 HEALTHCARE: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020–2023 (USD MILLION)
TABLE 77 HEALTHCARE: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2024–2029 (USD MILLION)
TABLE 78 HEALTHCARE: INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD MILLION)
TABLE 79 HEALTHCARE: INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD MILLION)
9.7 AEROSPACE
9.7.1 INCREASING INTEGRATION OF COMPLEX SYSTEMS AND SENSORS INTO AIRCRAFT TO BOOST SEGMENTAL GROWTH
TABLE 80 AEROSPACE: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020–2023 (USD MILLION)
TABLE 81 AEROSPACE: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024–2029 (USD MILLION)
TABLE 82 AEROSPACE: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020–2023 (USD MILLION)
TABLE 83 AEROSPACE: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2024–2029 (USD MILLION)
TABLE 84 AEROSPACE: INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD MILLION)
TABLE 85 AEROSPACE: INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD MILLION)
10 INTERPOSER AND FOWLP MARKET, BY REGION
10.1 INTRODUCTION
FIGURE 41 ASIA PACIFIC TO EXHIBIT HIGHEST CAGR IN INTERPOSER AND FOWLP MARKET BETWEEN 2024 AND 2029
TABLE 86 INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD BILLION)
TABLE 87 INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD BILLION)
10.2 NORTH AMERICA
FIGURE 42 NORTH AMERICA: INTERPOSER AND FOWLP MARKET SNAPSHOT
TABLE 88 NORTH AMERICA: INTERPOSER AND FOWLP MARKET, BY COUNTRY, 2020–2023 (USD MILLION)
TABLE 89 NORTH AMERICA: INTERPOSER AND FOWLP MARKET, BY COUNTRY, 2024–2029 (USD MILLION)
TABLE 90 NORTH AMERICA: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION)
TABLE 91 NORTH AMERICA: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION)
TABLE 92 NORTH AMERICA: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020–2023 (USD MILLION)
TABLE 93 NORTH AMERICA: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024–2029 (USD MILLION)
10.2.1 RECESSION IMPACT ON MARKET IN NORTH AMERICA
10.2.2 US
10.2.2.1 Rising focus on enhancing performance and functionality of electronic devices to drive market
10.2.3 CANADA
10.2.3.1 Growing emphasis on enhancing semiconductor design and manufacturing to contribute to market growth
10.2.4 MEXICO
10.2.4.1 Increasing investment in semiconductor R&D projects to fuel market growth
10.3 EUROPE
FIGURE 43 EUROPE: INTERPOSER AND FOWLP MARKET SNAPSHOT
TABLE 94 EUROPE: INTERPOSER AND FOWLP MARKET, BY COUNTRY, 2020–2023 (USD MILLION)
TABLE 95 EUROPE: INTERPOSER AND FOWLP MARKET, BY COUNTRY, 2024–2029 (USD MILLION)
TABLE 96 EUROPE: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION)
TABLE 97 EUROPE: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION)
TABLE 98 EUROPE: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020–2023 (USD MILLION)
TABLE 99 EUROPE: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024–2029 (USD MILLION)
10.3.1 RECESSION IMPACT ON MARKET IN EUROPE
10.3.2 UK
10.3.2.1 Rapid advancement in 5G technology to foster market growth
10.3.3 GERMANY
10.3.3.1 Increased adoption of connected cars and smart home devices to accelerate market growth
10.3.4 FRANCE
10.3.4.1 Highly developed transport and communication networks to contribute to market growth
10.3.5 REST OF EUROPE
10.4 ASIA PACIFIC
FIGURE 44 ASIA PACIFIC: INTERPOSER AND FOWLP MARKET SNAPSHOT
TABLE 100 ASIA PACIFIC: INTERPOSER AND FOWLP MARKET, BY COUNTRY, 2020–2023 (USD MILLION)
TABLE 101 ASIA PACIFIC: INTERPOSER AND FOWLP MARKET, BY COUNTRY, 2024–2029 (USD MILLION)
TABLE 102 ASIA PACIFIC: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION)
TABLE 103 ASIA PACIFIC: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION)
TABLE 104 ASIA PACIFIC: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020–2023 (USD MILLION)
TABLE 105 ASIA PACIFIC: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024–2029 (USD MILLION)
10.4.1 RECESSION IMPACT ON MARKET IN ASIA PACIFIC
10.4.2 CHINA
10.4.2.1 Increasing expansion of automobile and semiconductor manufacturing facilities to propel market
10.4.3 JAPAN
10.4.3.1 Rising production of advanced consumer electronics to boost market growth
10.4.4 SOUTH KOREA
10.4.4.1 Growing number of semiconductor fabrication plants to augment market growth
10.4.5 REST OF ASIA PACIFIC
10.5 ROW
TABLE 106 ROW: INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD MILLION)
TABLE 107 ROW: INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD MILLION)
TABLE 108 ROW: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION)
TABLE 109 ROW: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION)
TABLE 110 ROW: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020–2023 (USD MILLION)
TABLE 111 ROW: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024–2029 (USD MILLION)
10.5.1 RECESSION IMPACT ON MARKET IN ROW
10.5.2 MIDDLE EAST & AFRICA
10.5.2.1 High commitment to technological innovation to contribute to market growth
10.5.3 SOUTH AMERICA
10.5.3.1 Increased R&D of advanced packaging technologies to propel market
11 COMPETITIVE LANDSCAPE
11.1 INTRODUCTION
11.2 STRATEGIES ADOPTED BY KEY PLAYERS, 2020–2023
TABLE 112 INTERPOSER AND FOWLP MARKET: OVERVIEW OF STRATEGIES ADOPTED BY KEY PLAYERS, 2020–2023
11.2.1 PRODUCT PORTFOLIO EXPANSION
11.2.2 REGIONAL FOOTPRINT EXPANSION
11.2.3 ORGANIC/INORGANIC GROWTH
11.3 MARKET SHARE ANALYSIS, 2023
TABLE 113 INTERPOSER AND FOWLP MARKET: DEGREE OF COMPETITION
11.4 REVENUE ANALYSIS OF KEY PLAYERS IN INTERPOSER AND FOWLP MARKET, 2018–2022
FIGURE 45 REVENUE ANALYSIS OF KEY PLAYERS IN INTERPOSER AND FOWLP MARKET, 2018–2022
11.5 COMPANY EVALUATION MATRIX, 2023
11.5.1 STARS
11.5.2 EMERGING LEADERS
11.5.3 PERVASIVE PLAYERS
11.5.4 PARTICIPANTS
FIGURE 46 INTERPOSER AND FOWLP MARKET: COMPANY EVALUATION MATRIX, 2023
11.5.5 COMPANY FOOTPRINT
TABLE 114 COMPANY PACKAGING TYPE FOOTPRINT (10 KEY COMPANIES)
TABLE 115 COMPANY PACKAGING COMPONENT AND DESIGN FOOTPRINT (10 KEY COMPANIES)
TABLE 116 COMPANY REGION FOOTPRINT (10 KEY COMPANIES)
TABLE 117 OVERALL COMPANY FOOTPRINT (10 KEY COMPANIES)
11.6 START-UP/SME EVALUATION MATRIX, 2023
TABLE 118 INTERPOSER AND FOWLP MARKET: LIST OF KEY START-UPS/SMES
11.6.1 PROGRESSIVE COMPANIES
11.6.2 RESPONSIVE COMPANIES
11.6.3 DYNAMIC COMPANIES
11.6.4 STARTING BLOCKS
FIGURE 47 INTERPOSER AND FOWLP MARKET: START-UP/SME EVALUATION MATRIX, 2023
11.6.5 COMPETITIVE BENCHMARKING
TABLE 119 INTERPOSER AND FOWLP MARKET: COMPETITIVE BENCHMARKING OF KEY START-UPS/SMES
11.7 COMPETITIVE SITUATION AND TRENDS
11.7.1 PRODUCT LAUNCHES
TABLE 120 INTERPOSER AND FOWLP MARKET: PRODUCT LAUNCHES, AUGUST 2020–NOVEMBER 2023
11.7.2 DEALS
TABLE 121 INTERPOSER AND FOWLP MARKET: DEALS, FEBRUARY 2021–JANUARY 2024
12 COMPANY PROFILES
12.1 INTRODUCTION
12.2 KEY PLAYERS
(Business overview, Products/Solutions/Services offered, Recent developments, MnM view, Key strengths/Right to win, Strategic choices, and Weaknesses and Competitive threats)*
12.2.1 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
TABLE 122 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: COMPANY OVERVIEW
FIGURE 48 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: COMPANY SNAPSHOT
TABLE 123 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: PRODUCTS/SOLUTIONS/SERVICES OFFERED
TABLE 124 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: PRODUCT LAUNCHES
TABLE 125 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: DEALS
12.2.2 SAMSUNG
TABLE 126 SAMSUNG: COMPANY OVERVIEW
FIGURE 49 SAMSUNG: COMPANY SNAPSHOT
TABLE 127 SAMSUNG: PRODUCTS/SOLUTIONS/SERVICES OFFERED
TABLE 128 SAMSUNG: PRODUCT LAUNCHES
TABLE 129 SAMSUNG: DEALS
12.2.3 ASE TECHNOLOGY HOLDING CO., LTD.
TABLE 130 ASE TECHNOLOGY HOLDING CO., LTD.: COMPANY OVERVIEW
FIGURE 50 ASE TECHNOLOGY HOLDING CO. LTD.: COMPANY SNAPSHOT
TABLE 131 ASE TECHNOLOGY HOLDING CO., LTD.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
TABLE 132 ASE TECHNOLOGY HOLDING CO., LTD.: PRODUCT LAUNCHES
TABLE 133 ASE TECHNOLOGY HOLDING CO., LTD.: DEALS
12.2.4 AMKOR TECHNOLOGY
TABLE 134 AMKOR TECHNOLOGY: COMPANY OVERVIEW
FIGURE 51 AMKOR TECHNOLOGY: COMPANY SNAPSHOT
TABLE 135 AMKOR TECHNOLOGY: PRODUCTS/SOLUTIONS/SERVICES OFFERED
TABLE 136 AMKOR TECHNOLOGY: DEALS
TABLE 137 AMKOR TECHNOLOGY: OTHERS
12.2.5 SK HYNIX INC.
TABLE 138 SK HYNIX INC.: COMPANY OVERVIEW
FIGURE 52 SK HYNIX INC.: COMPANY SNAPSHOT
TABLE 139 SK HYNIX INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
TABLE 140 SK HYNIX INC.: PRODUCT LAUNCHES
12.2.6 GLOBAL FOUNDRIES INC.
TABLE 141 GLOBAL FOUNDRIES INC.: COMPANY OVERVIEW
FIGURE 53 GLOBAL FOUNDRIES INC.: COMPANY SNAPSHOT
TABLE 142 GLOBAL FOUNDRIES INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
TABLE 143 GLOBAL FOUNDRIES INC.: DEALS
TABLE 144 GLOBAL FOUNDRIES INC.: OTHERS
12.2.7 DECA TECHNOLOGIES
TABLE 145 DECA TECHNOLOGIES: COMPANY OVERVIEW
TABLE 146 DECA TECHNOLOGIES: PRODUCTS/SOLUTIONS/SERVICES OFFERED
TABLE 147 DECA TECHNOLOGIES: DEALS
12.2.8 JCET GROUP LTD.
TABLE 148 JCET GROUP LTD.: COMPANY OVERVIEW
FIGURE 54 JCET GROUP LTD.: COMPANY SNAPSHOT
TABLE 149 JCET GROUP LTD.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
TABLE 150 JCET GROUP LTD.: PRODUCT LAUNCHES
TABLE 151 JCET GROUP LTD.: OTHERS
12.2.9 POWERTECH TECHNOLOGY INC.
TABLE 152 POWERTECH TECHNOLOGY INC.: COMPANY OVERVIEW
FIGURE 55 POWERTECH TECHNOLOGY INC.: COMPANY SNAPSHOT
TABLE 153 POWERTECH TECHNOLOGY INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
TABLE 154 POWERTECH TECHNOLOGY INC.: DEALS
12.2.10 ADVANCED MICRO DEVICES, INC.
TABLE 155 ADVANCED MICRO DEVICES, INC.: COMPANY OVERVIEW
FIGURE 56 ADVANCED MICRO DEVICES, INC.: COMPANY SNAPSHOT
TABLE 156 ADVANCED MICRO DEVICES, INC.: PRODUCTS/SOLUTIONS/SERVICES
TABLE 157 ADVANCED MICRO DEVICES, INC.: PRODUCT LAUNCHES
12.3 OTHER PLAYERS
12.3.1 NEXLOGIC TECHNOLOGIES INC.
12.3.2 SPTS TECHNOLOGIES LTD.
12.3.3 TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
12.3.4 SAMTEC
12.3.5 TELEDYNE DIGITAL IMAGING INC.
12.3.6 OKMETIC
12.3.7 AMS-OSRAM AG
12.3.8 NEPES
12.3.9 NHANCED SEMICONDUCTORS
12.3.10 DUPONT
12.3.11 ALLVIA INC.
12.3.12 UNITED MICROELECTRONICS CORPORATION
12.3.13 DAI NIPPON PRINTING CO., LTD.
12.3.14 RENA TECHNOLOGIES GMBH
12.3.15 MURATA MANUFACTURING CO., LTD
*Details on Business overview, Products/Solutions/Services offered, Recent developments, MnM view, Key strengths/Right to win, Strategic choices, and Weaknesses and Competitive threats might not be captured in case of unlisted companies.
13 APPENDIX
13.1 INSIGHTS FROM INDUSTRY EXPERTS
13.2 DISCUSSION GUIDE
13.3 KNOWLEDGESTORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL
13.4 CUSTOMIZATION OPTIONS
13.5 RELATED REPORTS
13.6 AUTHOR DETAILS
