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Global Ball Grid Array (BGA) Packages Market Report 2020

March 2020 | 117 pages | ID: GD21E7F1D452EN
BisReport Information Consulting CO., Ltd

US$ 2,350.00

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With the slowdown in world economic growth, the Ball Grid Array (BGA) Packages industry has also suffered a certain impact, but still maintained a relatively optimistic growth, the past four years, Ball Grid Array (BGA) Packages market size to maintain the average annual growth rate of 15 from XXX million $ in 2014 to XXX million $ in 2019, BisReport analysts believe that in the next few years, Ball Grid Array (BGA) Packages market size will be further expanded, we expect that by 2024, The market size of the Ball Grid Array (BGA) Packages will reach XXX million $.

This Report covers the manufacturers’ data, including: shipment, price, revenue, gross profit, interview record, business distribution etc., these data help the consumer know about the competitors better. This report also covers all the regions and countries of the world, which shows a regional development status, including market size, volume and value, as well as price data.

Besides, the report also covers segment data, including: type segment, industry segment, channel segment etc. cover different segment market size, both volume and value. Also cover different industries clients information, which is very important for the manufacturers. If you need more information, please contact BisReport

Section 1: Free——Definition

Section (2 3): 1200 USD——Manufacturer Detail
Amkor Technology
TriQuint Semiconductor Inc.
Jiangsu Changjiang Electronics Technology Co.
STATS ChipPAC Ltd.
ASE Group
Advanced Semiconductor Engineering, Inc.
PARPRO
Intel
Corintech Ltd
Integrated Circuit Engineering Corporation

Section 4: 900 USD——Region Segmentation
North America Country (United States, Canada)
South America
Asia Country (China, Japan, India, Korea)
Europe Country (Germany, UK, France, Italy)
Other Country (Middle East, Africa, GCC)

Section (5 6 7): 500 USD——
Product Type Segmentation
Molded Array Process BGA
Thermally Enhanced BGA
Package on Package (PoP) BGA
Micro BGA

Industry Segmentation
OEM
Aftermarket

Channel (Direct Sales, Distributor) Segmentation

Section 8: 400 USD——Trend (2019-2024)

Section 9: 300 USD——Product Type Detail

Section 10: 700 USD——Downstream Consumer

Section 11: 200 USD——Cost Structure

Section 12: 500 USD——Conclusion
SECTION 1 BALL GRID ARRAY (BGA) PACKAGES PRODUCT DEFINITION

SECTION 2 GLOBAL BALL GRID ARRAY (BGA) PACKAGES MARKET MANUFACTURER SHARE AND MARKET

Overview
2.1 Global Manufacturer Ball Grid Array (BGA) Packages Shipments
2.2 Global Manufacturer Ball Grid Array (BGA) Packages Business Revenue
2.3 Global Ball Grid Array (BGA) Packages Market Overview

SECTION 3 MANUFACTURER BALL GRID ARRAY (BGA) PACKAGES BUSINESS INTRODUCTION

3.1 Amkor Technology Ball Grid Array (BGA) Packages Business Introduction
  3.1.1 Amkor Technology Ball Grid Array (BGA) Packages Shipments, Price, Revenue and
Gross profit 2014-2019
  3.1.2 Amkor Technology Ball Grid Array (BGA) Packages Business Distribution by Region
  3.1.3 Amkor Technology Interview Record
  3.1.4 Amkor Technology Ball Grid Array (BGA) Packages Business Profile
  3.1.5 Amkor Technology Ball Grid Array (BGA) Packages Product Specification
3.2 TriQuint Semiconductor Inc. Ball Grid Array (BGA) Packages Business Introduction
  3.2.1 TriQuint Semiconductor Inc. Ball Grid Array (BGA) Packages Shipments, Price,
Revenue and Gross profit 2014-2019
  3.2.2 TriQuint Semiconductor Inc. Ball Grid Array (BGA) Packages Business Distribution by
Region
  3.2.3 Interview Record
  3.2.4 TriQuint Semiconductor Inc. Ball Grid Array (BGA) Packages Business Overview
  3.2.5 TriQuint Semiconductor Inc. Ball Grid Array (BGA) Packages Product Specification
3.3 Jiangsu Changjiang Electronics Technology Co. Ball Grid Array (BGA) Packages Business
Introduction
  3.3.1 Jiangsu Changjiang Electronics Technology Co. Ball Grid Array (BGA) Packages
Shipments, Price, Revenue and Gross profit 2014-2019
  3.3.2 Jiangsu Changjiang Electronics Technology Co. Ball Grid Array (BGA) Packages
Business Distribution by Region
  3.3.3 Interview Record
  3.3.4 Jiangsu Changjiang Electronics Technology Co. Ball Grid Array (BGA) Packages
Business Overview
  3.3.5 Jiangsu Changjiang Electronics Technology Co. Ball Grid Array (BGA) Packages Product
Specification
3.4 STATS ChipPAC Ltd. Ball Grid Array (BGA) Packages Business Introduction
3.5 ASE Group Ball Grid Array (BGA) Packages Business Introduction
3.6 Advanced Semiconductor Engineering, Inc. Ball Grid Array (BGA) Packages Business
Introduction


SECTION 4 GLOBAL BALL GRID ARRAY (BGA) PACKAGES MARKET SEGMENTATION (REGION LEVEL)

4.1 North America Country
  4.1.1 United States Ball Grid Array (BGA) Packages Market Size and Price Analysis 2014-
2019
  4.1.2 Canada Ball Grid Array (BGA) Packages Market Size and Price Analysis 2014-2019
4.2 South America Country
  4.2.1 South America Ball Grid Array (BGA) Packages Market Size and Price Analysis 2014-
2019
4.3 Asia Country
  4.3.1 China Ball Grid Array (BGA) Packages Market Size and Price Analysis 2014-2019
  4.3.2 Japan Ball Grid Array (BGA) Packages Market Size and Price Analysis 2014-2019
  4.3.3 India Ball Grid Array (BGA) Packages Market Size and Price Analysis 2014-2019
  4.3.4 Korea Ball Grid Array (BGA) Packages Market Size and Price Analysis 2014-2019
4.4 Europe Country
  4.4.1 Germany Ball Grid Array (BGA) Packages Market Size and Price Analysis 2014-2019
  4.4.2 UK Ball Grid Array (BGA) Packages Market Size and Price Analysis 2014-2019
  4.4.3 France Ball Grid Array (BGA) Packages Market Size and Price Analysis 2014-2019
  4.4.4 Italy Ball Grid Array (BGA) Packages Market Size and Price Analysis 2014-2019
  4.4.5 Europe Ball Grid Array (BGA) Packages Market Size and Price Analysis 2014-2019
4.5 Other Country and Region
  4.5.1 Middle East Ball Grid Array (BGA) Packages Market Size and Price Analysis 2014-2019
  4.5.2 Africa Ball Grid Array (BGA) Packages Market Size and Price Analysis 2014-2019
  4.5.3 GCC Ball Grid Array (BGA) Packages Market Size and Price Analysis 2014-2019
4.6 Global Ball Grid Array (BGA) Packages Market Segmentation (Region Level) Analysis
2014-2019
4.7 Global Ball Grid Array (BGA) Packages Market Segmentation (Region Level) Analysis

SECTION 5 GLOBAL BALL GRID ARRAY (BGA) PACKAGES MARKET SEGMENTATION (PRODUCT TYPE LEVEL)

5.1 Global Ball Grid Array (BGA) Packages Market Segmentation (Product Type Level)
Market Size 2014-2019
5.2 Different Ball Grid Array (BGA) Packages Product Type Price 2014-2019
5.3 Global Ball Grid Array (BGA) Packages Market Segmentation (Product Type Level)
Analysis

SECTION 6 GLOBAL BALL GRID ARRAY (BGA) PACKAGES MARKET SEGMENTATION (INDUSTRY LEVEL)

6.1 Global Ball Grid Array (BGA) Packages Market Segmentation (Industry Level) Market
Size 2014-2019
6.2 Different Industry Price 2014-2019
6.3 Global Ball Grid Array (BGA) Packages Market Segmentation (Industry Level) Analysis

SECTION 7 GLOBAL BALL GRID ARRAY (BGA) PACKAGES MARKET SEGMENTATION (CHANNEL LEVEL)

7.1 Global Ball Grid Array (BGA) Packages Market Segmentation (Channel Level) Sales
Volume and Share 2014-2019
7.2 Global Ball Grid Array (BGA) Packages Market Segmentation (Channel Level) Analysis

SECTION 8 BALL GRID ARRAY (BGA) PACKAGES MARKET FORECAST 2019-2024

8.1 Ball Grid Array (BGA) Packages Segmentation Market Forecast (Region Level)
8.2 Ball Grid Array (BGA) Packages Segmentation Market Forecast (Product Type Level)
8.3 Ball Grid Array (BGA) Packages Segmentation Market Forecast (Industry Level)
8.4 Ball Grid Array (BGA) Packages Segmentation Market Forecast (Channel Level)

SECTION 9 BALL GRID ARRAY (BGA) PACKAGES SEGMENTATION PRODUCT TYPE

9.1 Molded Array Process BGA Product Introduction
9.2 Thermally Enhanced BGA Product Introduction
9.3 Package on Package (PoP) BGA Product Introduction
9.4 Micro BGA Product Introduction

SECTION 10 BALL GRID ARRAY (BGA) PACKAGES SEGMENTATION INDUSTRY

10.1 OEM Clients
10.2 Aftermarket Clients

SECTION 11 BALL GRID ARRAY (BGA) PACKAGES COST OF PRODUCTION ANALYSIS

11.1 Raw Material Cost Analysis
11.2 Technology Cost Analysis
11.3 Labor Cost Analysis
11.4 Cost Overview

SECTION 12 CONCLUSION

CHART AND FIGURE

Figure Ball Grid Array (BGA) Packages Product Picture from Amkor Technology
Chart 2014-2019 Global Manufacturer Ball Grid Array (BGA) Packages Shipments (Units)
Chart 2014-2019 Global Manufacturer Ball Grid Array (BGA) Packages Shipments Share
Chart 2014-2019 Global Manufacturer Ball Grid Array (BGA) Packages Business Revenue
(Million USD)
Chart 2014-2019 Global Manufacturer Ball Grid Array (BGA) Packages Business Revenue
Share
Chart Amkor Technology Ball Grid Array (BGA) Packages Shipments, Price, Revenue and
Gross profit 2014-2019
Chart Amkor Technology Ball Grid Array (BGA) Packages Business Distribution
Chart Amkor Technology Interview Record (Partly)
Figure Amkor Technology Ball Grid Array (BGA) Packages Product Picture
Chart Amkor Technology Ball Grid Array (BGA) Packages Business Profile
Table Amkor Technology Ball Grid Array (BGA) Packages Product Specification
Chart TriQuint Semiconductor Inc. Ball Grid Array (BGA) Packages Shipments, Price,
Revenue and Gross profit 2014-2019
Chart TriQuint Semiconductor Inc. Ball Grid Array (BGA) Packages Business Distribution
Chart TriQuint Semiconductor Inc. Interview Record (Partly)
Figure TriQuint Semiconductor Inc. Ball Grid Array (BGA) Packages Product Picture
Chart TriQuint Semiconductor Inc. Ball Grid Array (BGA) Packages Business Overview
Table TriQuint Semiconductor Inc. Ball Grid Array (BGA) Packages Product Specification
Chart Jiangsu Changjiang Electronics Technology Co. Ball Grid Array (BGA) Packages
Shipments, Price, Revenue and Gross profit 2014-2019
Chart Jiangsu Changjiang Electronics Technology Co. Ball Grid Array (BGA) Packages
Business Distribution
Chart Jiangsu Changjiang Electronics Technology Co. Interview Record (Partly)
Figure Jiangsu Changjiang Electronics Technology Co. Ball Grid Array (BGA) Packages
Product Picture


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