Flip-Chip Trends: Market Research Report

December 2013 | 15 pages | ID: F4E9CBF505CEN
Global Industry Analysts, Inc

Abstracts

'Flip-chip is one of the key packaging techniques for microelectronic circuits. The technique is finding rapid adoption in consumer and high-end applications. The adoption of flip-chip technique is primarily fueled by its benefits in terms of performance, size, reliability, flexibility and cost in comparison to other packaging methods.'

The report analyzes and presents an overview of Flip-Chip market worldwide. Supported with 2 market data tables, the report provides a review of market trends, applications, advantages of Flip-Chip technique, and further highlights on various strategic industry activities of major companies witnessed by the industry over the last few years. In addition, 28 companies operating in the Flip-Clip arena worldwide including Amkor Technology Inc., FlipChip International LLC, Kyocera America Inc., NTK Technologies Inc., Philips Lumileds Lighting Company, Signetics Corporation, STATS ChipPAC Ltd., STMicroelectronics NV, Tessera Technologies Inc., Toshiba Electronics Europe GmbH, and other are profiled.

Contents

1. FLIP-CHIP – AN OVERVIEW

A Prelude
Flip-Chip - Enabling Compact, Smart Devices
Flip-Chip - Applications
Advantages of Flip-Chip Technique
High Packaging Density
High Performance
Ruggedness
Cost-efficiency
Flip-Chips Package Design
Manufacturing of Flip-Chip Assemblies

2. MARKET TRENDS

Flip-Chip Technique Extends to New Applications

Table 1. Global Flip Chip Market (2012-2017) in US$ Million

Table 2. Global Flip Chip Market by Application (2012-2017) in Million Units for Aerospace and Defense, Automotive, Industrial and Medical, Consumer, Computing, and Telecommunications

Latest Chip Interconnection Techniques Drive Flip-Chip Adoption
WLP Gradually Replaces Flip-Chips in Compact Products

3. RECENT INDUSTRY ACTIVITY

FlipChip International Inks Partnership Agreement with EZconn Czech
Philips Lumileds Introduces LUXEON Flip Chip LEDs
Altera Selects FCmBGA Packaging Solution of Amkor Technology
FlipChip International Takes Over Millennium Microtech Holdings
FlipChip International Forms Joint Venture with Millennium Microtech
Kyocera America Sets Up New Clean Room
Shinkawa Unveils LFB-1102 Flip-Chip Bonder for TCB Substrate Process
Signetics to Expand Flip-Chip Package Assembly Capacity
STATS ChipPAC Introduces fcCuBE Flip-Chip Packaging Technology
Philips Lumileds Unveils LUXEON Rebel LEDs
STATS ChipPAC Launches LCFC Technology with Copper Column Bump
Tessera Inks Licensing Agreement with Nanium
Zicom Group Purchases Controlling Stake in Orion Systems Integration

4. MARKET PARTICIPANTS

Amkor Technology, Inc. (USA)
ASE Group (Taiwan)
ASE Kaohsiung (Taiwan)
Belton Technology Group (China)
Faraday Technology Corporation (Taiwan)
FlipChip International LLC (USA)
GigOptix, Inc. (USA)
Ibiden Co. , Ltd. (Japan)
Kyocera America, Inc. (USA)
LSI Corporation (USA)
Nanium (Portugal)
NTK Technologies, Inc. (USA)
Philips Lumileds Lighting Company (USA)
Reflex Photonics, Inc. (Canada)
Renesas Electronics America, Inc. (USA)
Shinko Electric Industries Co. , Ltd. (Japan)
Signetics Corporation (South Korea)
Siliconware Precision Industries Co. , Ltd. (Taiwan)
STATS ChipPAC Ltd. (Singapore)
STMicroelectronics NV (Switzerland)
Tektronix Component Solutions (USA)
Tessera Technologies, Inc. (USA)
Tokyo Electron Ltd. (Japan)
Toshiba Electronics Europe GmbH (Germany)
Toshiba Semiconductor & Storage Products (Japan)
Unisem Advanced Technologies Sdn. Bhd. (UAT) (Malaysia)
UTAC Holdings Ltd. (UTAC Group) (Singapore)
Valtronic Technologies (Suisse) SA (Switzerland)

5. APPENDIX