Europe Flip Chip Market By Packaging Technology (2.5D IC, 3D IC, and 2D IC), By Bumping Technology (Copper Pillar, Gold Bumping, Solder Bumping and Others), By End User (Electronics, Industrial, IT & Telecom, Automotive, Healthcare & Life Sciences, Aerospace & Defense and Others), By Country, Industry Analysis and Forecast, 2020 - 2026
The Europe Flip Chip Market would witness market growth of 8% CAGR during the forecast period (2020-2026).
Flip chips deliver a wide variety of benefits relative to wire bond packaging, such as substrate durability, superior physical and thermal and electrical efficiency, fast speed and reliability. Recent advanced flip-chip prototypes are in development with as many as 5,908 bumps/chip at a pitch of 200-?m and 1,500 bumps / chip at a pitch of 170-?m in the area array configurations.
One of the reasons that has a significant effect on demand for flip technology is the strong availability of devices such as smartphones, smart warbles, laptops and other portable products. Flip chip technology is being used to develop current products, and flip chip market manufacturers are already investing in R&D to implement form factors in different ranges. For example, manufacturers such as Intel and Samsung electronics have made a series of promotions to reduce the form factor for portable devices.
Nevertheless, the high costs associated with the introduction of flip-chip technology and the existence of low customization options compared to wire bonding are expected to impede market growth to a large extent. The continuously declining size of digital devices and the growing demand for mobile sensors are anticipated to be key trends in the flip-chip market during the forecast period.
Based on Packaging Technology, the market is segmented into 2.5D IC, 3D IC and 2D IC. Based on Bumping Technology, the market is segmented into Copper Pillar, Gold Bumping, Solder Bumping and Others. Based on End User, the market is segmented into Electronics, Industrial, IT & Telecom, Automotive, Healthcare & Life Sciences, Aerospace & Defense and Others. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include 3M Company, Advanced Micro Devices, Inc., Amkor Technology, Inc., Apple, Inc., Fujitsu Limited, Intel Corporation, IBM Corporation, Samsung Electronics Co., Ltd., Texas Instruments, Inc., and Taiwan Semiconductor Manufacturing Company.
Scope of the Study
Market Segmentation:
By Packaging Technology
Flip chips deliver a wide variety of benefits relative to wire bond packaging, such as substrate durability, superior physical and thermal and electrical efficiency, fast speed and reliability. Recent advanced flip-chip prototypes are in development with as many as 5,908 bumps/chip at a pitch of 200-?m and 1,500 bumps / chip at a pitch of 170-?m in the area array configurations.
One of the reasons that has a significant effect on demand for flip technology is the strong availability of devices such as smartphones, smart warbles, laptops and other portable products. Flip chip technology is being used to develop current products, and flip chip market manufacturers are already investing in R&D to implement form factors in different ranges. For example, manufacturers such as Intel and Samsung electronics have made a series of promotions to reduce the form factor for portable devices.
Nevertheless, the high costs associated with the introduction of flip-chip technology and the existence of low customization options compared to wire bonding are expected to impede market growth to a large extent. The continuously declining size of digital devices and the growing demand for mobile sensors are anticipated to be key trends in the flip-chip market during the forecast period.
Based on Packaging Technology, the market is segmented into 2.5D IC, 3D IC and 2D IC. Based on Bumping Technology, the market is segmented into Copper Pillar, Gold Bumping, Solder Bumping and Others. Based on End User, the market is segmented into Electronics, Industrial, IT & Telecom, Automotive, Healthcare & Life Sciences, Aerospace & Defense and Others. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include 3M Company, Advanced Micro Devices, Inc., Amkor Technology, Inc., Apple, Inc., Fujitsu Limited, Intel Corporation, IBM Corporation, Samsung Electronics Co., Ltd., Texas Instruments, Inc., and Taiwan Semiconductor Manufacturing Company.
Scope of the Study
Market Segmentation:
By Packaging Technology
- 2.5D IC
- 3D IC
- 2D IC
- Copper Pillar
- Gold Bumping
- Solder Bumping
- Others
- Electronics
- Industrial
- IT & Telecom
- Automotive
- Healthcare & Life Sciences
- Aerospace & Defense
- Others
- Germany
- UK
- France
- Russia
- Spain
- Italy
- Rest of Europe
- 3M Company
- Advanced Micro Devices, Inc.
- Amkor Technology, Inc.
- Apple, Inc.
- Fujitsu Limited
- Intel Corporation
- IBM Corporation
- Samsung Electronics Co., Ltd.
- Texas Instruments, Inc.
- Taiwan Semiconductor Manufacturing Company
- Exhaustive coverage
- Highest number of market tables and figures
- Subscription based model available
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- Assured post sales research support with 10% customization free
CHAPTER 1. MARKET SCOPE & METHODOLOGY
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Europe Flip Chip Market, by Packaging Technology
1.4.2 Europe Flip Chip Market, by Bumping Technology
1.4.3 Europe Flip Chip Market, by End User
1.4.4 Europe Flip Chip Market, by Country
1.5 Methodology for the research
CHAPTER 2. MARKET OVERVIEW
2.1 Introduction
2.1.1 Overview
2.1.2 Executive Summary
2.1.3 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
CHAPTER 3. EUROPE FLIP CHIP MARKET BY PACKAGING TECHNOLOGY
3.1 Europe Flip Chip 2.5D IC Market by Country
3.2 Europe Flip Chip 3D IC Market by Country
3.3 Europe Flip Chip 2D IC Market by Country
CHAPTER 4. EUROPE FLIP CHIP MARKET BY BUMPING TECHNOLOGY
4.1 Europe Copper Pillar Flip Chip Market by Country
4.2 Europe Gold Bumping Flip Chip Market by Country
4.3 Europe Solder Bumping Flip Chip Market by Country
4.4 Europe Other Bumping Technology Flip Chip Market by Country
CHAPTER 5. EUROPE FLIP CHIP MARKET BY END USER
5.1 Europe Electronics Flip Chip Market by Country
5.2 Europe Industrial Flip Chip Market by Country
5.3 Europe IT & Telecom Flip Chip Market by Country
5.4 Europe Automotive Flip Chip Market by Country
5.5 Europe Healthcare & Life Sciences Flip Chip Market by Country
5.6 Europe Aerospace & Defense Flip Chip Market by Country
5.7 Europe Others Flip Chip Market by Country
CHAPTER 6. EUROPE FLIP CHIP MARKET BY COUNTRY
6.1 Germany Flip Chip Market
6.1.1 Germany Flip Chip Market by Packaging Technology
6.1.2 Germany Flip Chip Market by Bumping Technology
6.1.3 Germany Flip Chip Market by End User
6.2 UK Flip Chip Market
6.2.1 UK Flip Chip Market by Packaging Technology
6.2.2 UK Flip Chip Market by Bumping Technology
6.2.3 UK Flip Chip Market by End User
6.3 France Flip Chip Market
6.3.1 France Flip Chip Market by Packaging Technology
6.3.2 France Flip Chip Market by Bumping Technology
6.3.3 France Flip Chip Market by End User
6.4 Russia Flip Chip Market
6.4.1 Russia Flip Chip Market by Packaging Technology
6.4.2 Russia Flip Chip Market by Bumping Technology
6.4.3 Russia Flip Chip Market by End User
6.5 Spain Flip Chip Market
6.5.1 Spain Flip Chip Market by Packaging Technology
6.5.2 Spain Flip Chip Market by Bumping Technology
6.5.3 Spain Flip Chip Market by End User
6.6 Italy Flip Chip Market
6.6.1 Italy Flip Chip Market by Packaging Technology
6.6.2 Italy Flip Chip Market by Bumping Technology
6.6.3 Italy Flip Chip Market by End User
6.7 Rest of Europe Flip Chip Market
6.7.1 Rest of Europe Flip Chip Market by Packaging Technology
6.7.2 Rest of Europe Flip Chip Market by Bumping Technology
6.7.3 Rest of Europe Flip Chip Market by End User
CHAPTER 7. COMPANY PROFILES
7.1 3M Company
7.1.1 Company Overview
7.1.2 Financial Analysis
7.1.3 Segmental and Regional Analysis
7.1.4 Research & Development Expense
7.1.5 SWOT Analysis
7.2 Advanced Micro Devices, Inc.
7.2.1 Company Overview
7.2.2 Financial Analysis
7.2.3 Segmental and Regional Analysis
7.2.4 Research & Development Expenses
7.3 Amkor Technology, Inc.
7.3.1 Company Overview
7.3.2 Financial Analysis
7.3.3 Regional Analysis
7.3.4 Research & Development Expense
7.3.5 Recent strategies and developments:
7.3.5.1 Partnerships, Collaborations, and Agreements:
7.4 Apple, Inc.
7.4.1 Company Overview
7.4.2 Financial Analysis
7.4.3 Product and Regional Analysis
7.4.4 Research & Development Expense
7.4.5 SWOT Analysis
7.5 Fujitsu Limited
7.5.1 Company Overview
7.5.2 Financial Analysis
7.5.3 SWOT Analysis
7.6 Intel Corporation
7.6.1 Company Overview
7.6.2 Financial Analysis
7.6.3 Segmental and Regional Analysis
7.6.4 Research & Development Expenses
7.6.5 Recent strategies and developments:
7.6.5.1 Acquisition and Mergers:
7.6.6 SWOT Analysis
7.7 IBM Corporation
7.7.1 Company Overview
7.7.2 Financial Analysis
7.7.3 Regional & Segmental Analysis
7.7.4 Research & Development Expenses
7.7.5 SWOT Analysis
7.8 Samsung Electronics Co., Ltd. (Samsung Group)
7.8.1 Company Overview
7.8.2 Financial Analysis
7.8.3 Segmental and Regional Analysis
7.8.4 Research & Development Expense
7.8.5 Recent strategies and developments:
7.8.5.1 Product Launches and Product Expansions:
7.8.6 SWOT Analysis
7.9 Texas Instruments, Inc.
7.9.1 Company Overview
7.9.2 Financial Analysis
7.9.3 Segmental and Regional Analysis
7.9.4 Research & Development Expense
7.9.5 SWOT Analysis
7.1 Taiwan Semiconductor Manufacturing Company
7.10.1 Company overview
7.10.2 Financial Analysis
7.10.3 Regional Analysis
7.10.4 Research & Development Expense
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Europe Flip Chip Market, by Packaging Technology
1.4.2 Europe Flip Chip Market, by Bumping Technology
1.4.3 Europe Flip Chip Market, by End User
1.4.4 Europe Flip Chip Market, by Country
1.5 Methodology for the research
CHAPTER 2. MARKET OVERVIEW
2.1 Introduction
2.1.1 Overview
2.1.2 Executive Summary
2.1.3 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
CHAPTER 3. EUROPE FLIP CHIP MARKET BY PACKAGING TECHNOLOGY
3.1 Europe Flip Chip 2.5D IC Market by Country
3.2 Europe Flip Chip 3D IC Market by Country
3.3 Europe Flip Chip 2D IC Market by Country
CHAPTER 4. EUROPE FLIP CHIP MARKET BY BUMPING TECHNOLOGY
4.1 Europe Copper Pillar Flip Chip Market by Country
4.2 Europe Gold Bumping Flip Chip Market by Country
4.3 Europe Solder Bumping Flip Chip Market by Country
4.4 Europe Other Bumping Technology Flip Chip Market by Country
CHAPTER 5. EUROPE FLIP CHIP MARKET BY END USER
5.1 Europe Electronics Flip Chip Market by Country
5.2 Europe Industrial Flip Chip Market by Country
5.3 Europe IT & Telecom Flip Chip Market by Country
5.4 Europe Automotive Flip Chip Market by Country
5.5 Europe Healthcare & Life Sciences Flip Chip Market by Country
5.6 Europe Aerospace & Defense Flip Chip Market by Country
5.7 Europe Others Flip Chip Market by Country
CHAPTER 6. EUROPE FLIP CHIP MARKET BY COUNTRY
6.1 Germany Flip Chip Market
6.1.1 Germany Flip Chip Market by Packaging Technology
6.1.2 Germany Flip Chip Market by Bumping Technology
6.1.3 Germany Flip Chip Market by End User
6.2 UK Flip Chip Market
6.2.1 UK Flip Chip Market by Packaging Technology
6.2.2 UK Flip Chip Market by Bumping Technology
6.2.3 UK Flip Chip Market by End User
6.3 France Flip Chip Market
6.3.1 France Flip Chip Market by Packaging Technology
6.3.2 France Flip Chip Market by Bumping Technology
6.3.3 France Flip Chip Market by End User
6.4 Russia Flip Chip Market
6.4.1 Russia Flip Chip Market by Packaging Technology
6.4.2 Russia Flip Chip Market by Bumping Technology
6.4.3 Russia Flip Chip Market by End User
6.5 Spain Flip Chip Market
6.5.1 Spain Flip Chip Market by Packaging Technology
6.5.2 Spain Flip Chip Market by Bumping Technology
6.5.3 Spain Flip Chip Market by End User
6.6 Italy Flip Chip Market
6.6.1 Italy Flip Chip Market by Packaging Technology
6.6.2 Italy Flip Chip Market by Bumping Technology
6.6.3 Italy Flip Chip Market by End User
6.7 Rest of Europe Flip Chip Market
6.7.1 Rest of Europe Flip Chip Market by Packaging Technology
6.7.2 Rest of Europe Flip Chip Market by Bumping Technology
6.7.3 Rest of Europe Flip Chip Market by End User
CHAPTER 7. COMPANY PROFILES
7.1 3M Company
7.1.1 Company Overview
7.1.2 Financial Analysis
7.1.3 Segmental and Regional Analysis
7.1.4 Research & Development Expense
7.1.5 SWOT Analysis
7.2 Advanced Micro Devices, Inc.
7.2.1 Company Overview
7.2.2 Financial Analysis
7.2.3 Segmental and Regional Analysis
7.2.4 Research & Development Expenses
7.3 Amkor Technology, Inc.
7.3.1 Company Overview
7.3.2 Financial Analysis
7.3.3 Regional Analysis
7.3.4 Research & Development Expense
7.3.5 Recent strategies and developments:
7.3.5.1 Partnerships, Collaborations, and Agreements:
7.4 Apple, Inc.
7.4.1 Company Overview
7.4.2 Financial Analysis
7.4.3 Product and Regional Analysis
7.4.4 Research & Development Expense
7.4.5 SWOT Analysis
7.5 Fujitsu Limited
7.5.1 Company Overview
7.5.2 Financial Analysis
7.5.3 SWOT Analysis
7.6 Intel Corporation
7.6.1 Company Overview
7.6.2 Financial Analysis
7.6.3 Segmental and Regional Analysis
7.6.4 Research & Development Expenses
7.6.5 Recent strategies and developments:
7.6.5.1 Acquisition and Mergers:
7.6.6 SWOT Analysis
7.7 IBM Corporation
7.7.1 Company Overview
7.7.2 Financial Analysis
7.7.3 Regional & Segmental Analysis
7.7.4 Research & Development Expenses
7.7.5 SWOT Analysis
7.8 Samsung Electronics Co., Ltd. (Samsung Group)
7.8.1 Company Overview
7.8.2 Financial Analysis
7.8.3 Segmental and Regional Analysis
7.8.4 Research & Development Expense
7.8.5 Recent strategies and developments:
7.8.5.1 Product Launches and Product Expansions:
7.8.6 SWOT Analysis
7.9 Texas Instruments, Inc.
7.9.1 Company Overview
7.9.2 Financial Analysis
7.9.3 Segmental and Regional Analysis
7.9.4 Research & Development Expense
7.9.5 SWOT Analysis
7.1 Taiwan Semiconductor Manufacturing Company
7.10.1 Company overview
7.10.2 Financial Analysis
7.10.3 Regional Analysis
7.10.4 Research & Development Expense
LIST OF TABLES
TABLE 1 EUROPE FLIP CHIP MARKET, 2016 - 2019, USD MILLION
TABLE 2 EUROPE FLIP CHIP MARKET, 2020 - 2026, USD MILLION
TABLE 3 EUROPE FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 4 EUROPE FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 5 EUROPE FLIP CHIP 2.5D IC MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 6 EUROPE FLIP CHIP 2.5D IC MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 7 EUROPE FLIP CHIP 3D IC MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 8 EUROPE FLIP CHIP 3D IC MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 9 EUROPE FLIP CHIP 2D IC MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 10 EUROPE FLIP CHIP 2D IC MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 11 EUROPE FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 12 EUROPE FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 13 EUROPE COPPER PILLAR FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 14 EUROPE COPPER PILLAR FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 15 EUROPE GOLD BUMPING FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 16 EUROPE GOLD BUMPING FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 17 EUROPE SOLDER BUMPING FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 18 EUROPE SOLDER BUMPING FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 19 EUROPE OTHER BUMPING TECHNOLOGY FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 20 EUROPE OTHER BUMPING TECHNOLOGY FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 21 EUROPE FLIP CHIP MARKET BY END USER, 2016 - 2019, USD MILLION
TABLE 22 EUROPE FLIP CHIP MARKET BY END USER, 2020 - 2026, USD MILLION
TABLE 23 EUROPE ELECTRONICS FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 24 EUROPE ELECTRONICS FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 25 EUROPE INDUSTRIAL FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 26 EUROPE INDUSTRIAL FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 27 EUROPE IT & TELECOM FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 28 EUROPE IT & TELECOM FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 29 EUROPE AUTOMOTIVE FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 30 EUROPE AUTOMOTIVE FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 31 EUROPE HEALTHCARE & LIFE SCIENCES FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 32 EUROPE HEALTHCARE & LIFE SCIENCES FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 33 EUROPE AEROSPACE & DEFENSE FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 34 EUROPE AEROSPACE & DEFENSE FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 35 EUROPE OTHERS FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 36 EUROPE OTHERS FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 37 EUROPE FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 38 EUROPE FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 39 GERMANY FLIP CHIP MARKET, 2016 - 2019, USD MILLION
TABLE 40 GERMANY FLIP CHIP MARKET, 2020 - 2026, USD MILLION
TABLE 41 GERMANY FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 42 GERMANY FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 43 GERMANY FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 44 GERMANY FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 45 GERMANY FLIP CHIP MARKET BY END USER, 2016 - 2019, USD MILLION
TABLE 46 GERMANY FLIP CHIP MARKET BY END USER, 2020 - 2026, USD MILLION
TABLE 47 UK FLIP CHIP MARKET, 2016 - 2019, USD MILLION
TABLE 48 UK FLIP CHIP MARKET, 2020 - 2026, USD MILLION
TABLE 49 UK FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 50 UK FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 51 UK FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 52 UK FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 53 UK FLIP CHIP MARKET BY END USER, 2016 - 2019, USD MILLION
TABLE 54 UK FLIP CHIP MARKET BY END USER, 2020 - 2026, USD MILLION
TABLE 55 FRANCE FLIP CHIP MARKET, 2016 - 2019, USD MILLION
TABLE 56 FRANCE FLIP CHIP MARKET, 2020 - 2026, USD MILLION
TABLE 57 FRANCE FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 58 FRANCE FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 59 FRANCE FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 60 FRANCE FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 61 FRANCE FLIP CHIP MARKET BY END USER, 2016 - 2019, USD MILLION
TABLE 62 FRANCE FLIP CHIP MARKET BY END USER, 2020 - 2026, USD MILLION
TABLE 63 RUSSIA FLIP CHIP MARKET, 2016 - 2019, USD MILLION
TABLE 64 RUSSIA FLIP CHIP MARKET, 2020 - 2026, USD MILLION
TABLE 65 RUSSIA FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 66 RUSSIA FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 67 RUSSIA FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 68 RUSSIA FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 69 RUSSIA FLIP CHIP MARKET BY END USER, 2016 - 2019, USD MILLION
TABLE 70 RUSSIA FLIP CHIP MARKET BY END USER, 2020 - 2026, USD MILLION
TABLE 71 SPAIN FLIP CHIP MARKET, 2016 - 2019, USD MILLION
TABLE 72 SPAIN FLIP CHIP MARKET, 2020 - 2026, USD MILLION
TABLE 73 SPAIN FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 74 SPAIN FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 75 SPAIN FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 76 SPAIN FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 77 SPAIN FLIP CHIP MARKET BY END USER, 2016 - 2019, USD MILLION
TABLE 78 SPAIN FLIP CHIP MARKET BY END USER, 2020 - 2026, USD MILLION
TABLE 79 ITALY FLIP CHIP MARKET, 2016 - 2019, USD MILLION
TABLE 80 ITALY FLIP CHIP MARKET, 2020 - 2026, USD MILLION
TABLE 81 ITALY FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 82 ITALY FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 83 ITALY FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 84 ITALY FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 85 ITALY FLIP CHIP MARKET BY END USER, 2016 - 2019, USD MILLION
TABLE 86 ITALY FLIP CHIP MARKET BY END USER, 2020 - 2026, USD MILLION
TABLE 87 REST OF EUROPE FLIP CHIP MARKET, 2016 - 2019, USD MILLION
TABLE 88 REST OF EUROPE FLIP CHIP MARKET, 2020 - 2026, USD MILLION
TABLE 89 REST OF EUROPE FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 90 REST OF EUROPE FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 91 REST OF EUROPE FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 92 REST OF EUROPE FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 93 REST OF EUROPE FLIP CHIP MARKET BY END USER, 2016 - 2019, USD MILLION
TABLE 94 REST OF EUROPE FLIP CHIP MARKET BY END USER, 2020 - 2026, USD MILLION
TABLE 95 KEY INFORMATION – 3M COMPANY
TABLE 96 KEY INFORMATION – ADVANCED MICRO DEVICES, INC.
TABLE 97 KEY INFORMATION – AMKOR TECHNOLOGY, INC.
TABLE 98 KEY INFORMATION – APPLE, INC.
TABLE 99 KEY INFORMATION – FUJITSU LIMITED
TABLE 100 KEY INFORMATION – INTEL CORPORATION
TABLE 101 KEY INFORMATION – IBM CORPORATION
TABLE 102 KEY INFORMATION –SAMSUNG ELECTRONICS CO., LTD.
TABLE 103 KEY INFORMATION – TEXAS INSTRUMENTS, INC.
TABLE 104 KEY INFORMATION–TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
TABLE 1 EUROPE FLIP CHIP MARKET, 2016 - 2019, USD MILLION
TABLE 2 EUROPE FLIP CHIP MARKET, 2020 - 2026, USD MILLION
TABLE 3 EUROPE FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 4 EUROPE FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 5 EUROPE FLIP CHIP 2.5D IC MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 6 EUROPE FLIP CHIP 2.5D IC MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 7 EUROPE FLIP CHIP 3D IC MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 8 EUROPE FLIP CHIP 3D IC MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 9 EUROPE FLIP CHIP 2D IC MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 10 EUROPE FLIP CHIP 2D IC MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 11 EUROPE FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 12 EUROPE FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 13 EUROPE COPPER PILLAR FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 14 EUROPE COPPER PILLAR FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 15 EUROPE GOLD BUMPING FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 16 EUROPE GOLD BUMPING FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 17 EUROPE SOLDER BUMPING FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 18 EUROPE SOLDER BUMPING FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 19 EUROPE OTHER BUMPING TECHNOLOGY FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 20 EUROPE OTHER BUMPING TECHNOLOGY FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 21 EUROPE FLIP CHIP MARKET BY END USER, 2016 - 2019, USD MILLION
TABLE 22 EUROPE FLIP CHIP MARKET BY END USER, 2020 - 2026, USD MILLION
TABLE 23 EUROPE ELECTRONICS FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 24 EUROPE ELECTRONICS FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 25 EUROPE INDUSTRIAL FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 26 EUROPE INDUSTRIAL FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 27 EUROPE IT & TELECOM FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 28 EUROPE IT & TELECOM FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 29 EUROPE AUTOMOTIVE FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 30 EUROPE AUTOMOTIVE FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 31 EUROPE HEALTHCARE & LIFE SCIENCES FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 32 EUROPE HEALTHCARE & LIFE SCIENCES FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 33 EUROPE AEROSPACE & DEFENSE FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 34 EUROPE AEROSPACE & DEFENSE FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 35 EUROPE OTHERS FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 36 EUROPE OTHERS FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 37 EUROPE FLIP CHIP MARKET BY COUNTRY, 2016 - 2019, USD MILLION
TABLE 38 EUROPE FLIP CHIP MARKET BY COUNTRY, 2020 - 2026, USD MILLION
TABLE 39 GERMANY FLIP CHIP MARKET, 2016 - 2019, USD MILLION
TABLE 40 GERMANY FLIP CHIP MARKET, 2020 - 2026, USD MILLION
TABLE 41 GERMANY FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 42 GERMANY FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 43 GERMANY FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 44 GERMANY FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 45 GERMANY FLIP CHIP MARKET BY END USER, 2016 - 2019, USD MILLION
TABLE 46 GERMANY FLIP CHIP MARKET BY END USER, 2020 - 2026, USD MILLION
TABLE 47 UK FLIP CHIP MARKET, 2016 - 2019, USD MILLION
TABLE 48 UK FLIP CHIP MARKET, 2020 - 2026, USD MILLION
TABLE 49 UK FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 50 UK FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 51 UK FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 52 UK FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 53 UK FLIP CHIP MARKET BY END USER, 2016 - 2019, USD MILLION
TABLE 54 UK FLIP CHIP MARKET BY END USER, 2020 - 2026, USD MILLION
TABLE 55 FRANCE FLIP CHIP MARKET, 2016 - 2019, USD MILLION
TABLE 56 FRANCE FLIP CHIP MARKET, 2020 - 2026, USD MILLION
TABLE 57 FRANCE FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 58 FRANCE FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 59 FRANCE FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 60 FRANCE FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 61 FRANCE FLIP CHIP MARKET BY END USER, 2016 - 2019, USD MILLION
TABLE 62 FRANCE FLIP CHIP MARKET BY END USER, 2020 - 2026, USD MILLION
TABLE 63 RUSSIA FLIP CHIP MARKET, 2016 - 2019, USD MILLION
TABLE 64 RUSSIA FLIP CHIP MARKET, 2020 - 2026, USD MILLION
TABLE 65 RUSSIA FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 66 RUSSIA FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 67 RUSSIA FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 68 RUSSIA FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 69 RUSSIA FLIP CHIP MARKET BY END USER, 2016 - 2019, USD MILLION
TABLE 70 RUSSIA FLIP CHIP MARKET BY END USER, 2020 - 2026, USD MILLION
TABLE 71 SPAIN FLIP CHIP MARKET, 2016 - 2019, USD MILLION
TABLE 72 SPAIN FLIP CHIP MARKET, 2020 - 2026, USD MILLION
TABLE 73 SPAIN FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 74 SPAIN FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 75 SPAIN FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 76 SPAIN FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 77 SPAIN FLIP CHIP MARKET BY END USER, 2016 - 2019, USD MILLION
TABLE 78 SPAIN FLIP CHIP MARKET BY END USER, 2020 - 2026, USD MILLION
TABLE 79 ITALY FLIP CHIP MARKET, 2016 - 2019, USD MILLION
TABLE 80 ITALY FLIP CHIP MARKET, 2020 - 2026, USD MILLION
TABLE 81 ITALY FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 82 ITALY FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 83 ITALY FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 84 ITALY FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 85 ITALY FLIP CHIP MARKET BY END USER, 2016 - 2019, USD MILLION
TABLE 86 ITALY FLIP CHIP MARKET BY END USER, 2020 - 2026, USD MILLION
TABLE 87 REST OF EUROPE FLIP CHIP MARKET, 2016 - 2019, USD MILLION
TABLE 88 REST OF EUROPE FLIP CHIP MARKET, 2020 - 2026, USD MILLION
TABLE 89 REST OF EUROPE FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 90 REST OF EUROPE FLIP CHIP MARKET BY PACKAGING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 91 REST OF EUROPE FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2016 - 2019, USD MILLION
TABLE 92 REST OF EUROPE FLIP CHIP MARKET BY BUMPING TECHNOLOGY, 2020 - 2026, USD MILLION
TABLE 93 REST OF EUROPE FLIP CHIP MARKET BY END USER, 2016 - 2019, USD MILLION
TABLE 94 REST OF EUROPE FLIP CHIP MARKET BY END USER, 2020 - 2026, USD MILLION
TABLE 95 KEY INFORMATION – 3M COMPANY
TABLE 96 KEY INFORMATION – ADVANCED MICRO DEVICES, INC.
TABLE 97 KEY INFORMATION – AMKOR TECHNOLOGY, INC.
TABLE 98 KEY INFORMATION – APPLE, INC.
TABLE 99 KEY INFORMATION – FUJITSU LIMITED
TABLE 100 KEY INFORMATION – INTEL CORPORATION
TABLE 101 KEY INFORMATION – IBM CORPORATION
TABLE 102 KEY INFORMATION –SAMSUNG ELECTRONICS CO., LTD.
TABLE 103 KEY INFORMATION – TEXAS INSTRUMENTS, INC.
TABLE 104 KEY INFORMATION–TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
LIST OF FIGURES
FIG 1 METHODOLOGY FOR THE RESEARCH
FIG 2 SWOT ANALYSIS: 3M COMPANY
FIG 3 SWOT ANALYSIS: APPLE, INC.
FIG 4 SWOT ANALYSIS: FUJITSU LIMITED
FIG 5 SWOT ANALYSIS: INTEL CORPORATION
FIG 6 SWOT ANALYSIS: IBM CORPORATION
FIG 7 SWOT ANALYSIS: SAMSUNG ELECTRONICS CO. LTD.
FIG 8 SWOT ANALYSIS: TEXAS INSTRUMENTS, INC.
FIG 1 METHODOLOGY FOR THE RESEARCH
FIG 2 SWOT ANALYSIS: 3M COMPANY
FIG 3 SWOT ANALYSIS: APPLE, INC.
FIG 4 SWOT ANALYSIS: FUJITSU LIMITED
FIG 5 SWOT ANALYSIS: INTEL CORPORATION
FIG 6 SWOT ANALYSIS: IBM CORPORATION
FIG 7 SWOT ANALYSIS: SAMSUNG ELECTRONICS CO. LTD.
FIG 8 SWOT ANALYSIS: TEXAS INSTRUMENTS, INC.
