China 3D IC and 2.5D IC Packaging Market Research Report 2017

January 2017 | 95 pages | ID: CAFEDE269DAEN
QYResearch

Abstracts

Notes:

Sales, means the sales volume of 3D IC and 2.5D IC Packaging

Revenue, means the sales value of 3D IC and 2.5D IC Packaging

This report studies 3D IC and 2.5D IC Packaging in China market, focuses on the top players in China market, with capacity, production, price, revenue and market share for each manufacturer, covering

• Tezzaron
• ASE Group
• Amkor Technology
• STATS ChipPAC Ltd.

Market Segment by Regions (provinces), covering

• South China
• East China
• Southwest China
• Northeast China
• North China
• Central China
• Northwest China

Split by product Type, with production, revenue, price, market share and growth rate of each type, can be divided into

• 3D wafer-level chip-scale packaging
• 3D TSV
• 2.5D

Split by Application, this report focuses on consumption, market share and growth rate of 3D IC and 2.5D IC Packaging in each application, can be divided into

• Consumer electronics
• Telecommunication
• Industrial sector
• Automotive
• Military and aerospace
• Smart technologies
• Medical devices

Contents

China 3D IC and 2.5D IC Packaging Market Research Report 2017

1 3D IC AND 2.5D IC PACKAGING MARKET OVERVIEW

1.1 Product Overview and Scope of 3D IC and 2.5D IC Packaging
1.2 3D IC and 2.5D IC Packaging Segment by Type
  1.2.1 China Production Market Share of 3D IC and 2.5D IC Packaging Type in 2015
  1.2.2 3D wafer-level chip-scale packaging
  1.2.3 3D TSV
  1.2.4 2.5D
1.3 Applications of 3D IC and 2.5D IC Packaging
  1.3.1 3D IC and 2.5D IC Packaging Consumption Market Share by Application in 2015
  1.3.2 Consumer electronics
  1.3.3 Telecommunication
  1.3.4 Industrial sector
  1.3.5 Automotive
  1.3.6 Military and aerospace
  1.3.7 Smart technologies
  1.3.8 Medical devices
1.4 China Market Size (Value) of 3D IC and 2.5D IC Packaging (2011-2021)
1.5 China 3D IC and 2.5D IC Packaging Status and Outlook
1.6 Government Policies

2 CHINA 3D IC AND 2.5D IC PACKAGING MARKET COMPETITION BY MANUFACTURERS

2.1 China 3D IC and 2.5D IC Packaging Capacity, Production and Share by Manufacturers (2015 and 2016)
2.2 China 3D IC and 2.5D IC Packaging Revenue and Share by Manufacturers (2015 and 2016)
2.3 China 3D IC and 2.5D IC Packaging Average Price by Manufacturers (2015 and 2016)
2.4 Manufacturers 3D IC and 2.5D IC Packaging Manufacturing Base Distribution, Sales Area, Product Type
2.5 3D IC and 2.5D IC Packaging Market Competitive Situation and Trends
  2.5.1 3D IC and 2.5D IC Packaging Market Concentration Rate
  2.5.2 3D IC and 2.5D IC Packaging Market Share of Top 3 and Top 5 Manufacturers

3 CHINA 3D IC AND 2.5D IC PACKAGING MANUFACTURERS PROFILES/ANALYSIS

3.1 Tezzaron
  3.1.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
  3.1.2 3D IC and 2.5D IC Packaging Product Type, Application and Specification
    3.1.2.1 3D wafer-level chip-scale packaging
    3.1.2.2 3D TSV
  3.1.3 Tezzaron 3D IC and 2.5D IC Packaging Capacity, Production, Revenue, Price and Gross Margin (2015 and 2016)
  3.1.4 Main Business/Business Overview
3.2 ASE Group
  3.2.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
  3.2.2 3D IC and 2.5D IC Packaging Product Type, Application and Specification
    3.2.2.1 3D wafer-level chip-scale packaging
    3.2.2.2 3D TSV
  3.2.3 ASE Group 95 Capacity, Production, Revenue, Price and Gross Margin (2015 and 2016)
  3.2.4 Main Business/Business Overview
3.3 Amkor Technology
  3.3.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
  3.3.2 3D IC and 2.5D IC Packaging Product Type, Application and Specification
    3.3.2.1 3D wafer-level chip-scale packaging
    3.3.2.2 3D TSV
  3.3.3 Amkor Technology 110 Capacity, Production, Revenue, Price and Gross Margin (2015 and 2016)
  3.3.4 Main Business/Business Overview
3.4 STATS ChipPAC Ltd.
  3.4.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
  3.4.2 3D IC and 2.5D IC Packaging Product Type, Application and Specification
    3.4.2.1 3D wafer-level chip-scale packaging
    3.4.2.2 3D TSV
  3.4.3 STATS ChipPAC Ltd. Jan Capacity, Production, Revenue, Price and Gross Margin (2015 and 2016)
  3.4.4 Main Business/Business Overview

4 CHINA 3D IC AND 2.5D IC PACKAGING CAPACITY, PRODUCTION, REVENUE, CONSUMPTION, EXPORT AND IMPORT (2011-2016)

4.1 China 3D IC and 2.5D IC Packaging Capacity, Production and Growth (2011-2016)
4.2 China 3D IC and 2.5D IC Packaging Revenue and Growth (2011-2016)
4.3 China 3D IC and 2.5D IC Packaging Production, Consumption, Export and Import (2011-2016)

5 CHINA 3D IC AND 2.5D IC PACKAGING PRODUCTION, REVENUE (VALUE), PRICE TREND BY TYPE

5.1 China 3D IC and 2.5D IC Packaging Production and Market Share by Type (2011-2016)
5.2 China 3D IC and 2.5D IC Packaging Revenue and Market Share by Type (2011-2016)
5.3 China 3D IC and 2.5D IC Packaging Price by Type (2011-2016)
5.4 China 3D IC and 2.5D IC Packaging Production Growth by Type (2011-2016)

6 CHINA 3D IC AND 2.5D IC PACKAGING MARKET ANALYSIS BY APPLICATION

6.1 China 3D IC and 2.5D IC Packaging Consumption and Market Share by Application (2011-2016)
6.2 China 3D IC and 2.5D IC Packaging Consumption Growth Rate by Application (2011-2016)
6.3 Market Drivers and Opportunities
  6.3.1 Potential Application
  6.3.2 Emerging Markets/Countries

7 CHINA3D IC AND 2.5D IC PACKAGING MARKET ANALYSIS BY REGIONS (PROVINCES)

7.1 China 3D IC and 2.5D IC Packaging Production, Production Value and Price by Regions (Provinces)(2011-2016)
  7.1.1 China 3D IC and 2.5D IC Packaging Production and Market Share by Regions (Provinces)(2011-2016)
  7.1.2 China 3D IC and 2.5D IC Packaging Production Value and Market Share by Regions (Provinces)(2011-2016)
  7.1.3 China 3D IC and 2.5D IC Packaging Sales Price by Regions (Provinces)(2011-2016)
7.2 China 3D IC and 2.5D IC Packaging Consumption by Regions (Provinces)(2011-2016)
7.3 China 3D IC and 2.5D IC Packaging Production, Consumption, Export and Import (2011-2016)

8 3D IC AND 2.5D IC PACKAGING MANUFACTURING COST ANALYSIS

8.1 3D IC and 2.5D IC Packaging Key Raw Materials Analysis
  8.1.1 Key Raw Materials
  8.1.2 Price Trend of Key Raw Materials
  8.1.3 Key Suppliers of Raw Materials
  8.1.4 Market Concentration Rate of Raw Materials
8.2 Proportion of Manufacturing Cost Structure
  8.2.1 Raw Materials
  8.2.2 Labor Cost
  8.2.3 Manufacturing Expenses
8.3 Manufacturing Process Analysis of 3D IC and 2.5D IC Packaging

9 INDUSTRIAL CHAIN, SOURCING STRATEGY AND DOWNSTREAM BUYERS

9.1 3D IC and 2.5D IC Packaging Industrial Chain Analysis
9.2 Upstream Raw Materials Sourcing
9.3 Raw Materials Sources of 3D IC and 2.5D IC Packaging Major Manufacturers in 2015
9.4 Downstream Buyers

10 MARKETING STRATEGY ANALYSIS, DISTRIBUTORS/TRADERS

10.1 Marketing Channel
  10.1.1 Direct Marketing
  10.1.2 Indirect Marketing
  10.1.3 Marketing Channel Development Trend
10.2 Market Positioning
  10.2.1 Pricing Strategy
  10.2.2 Brand Strategy
  10.2.3 Target Client
10.3 Distributors/Traders List

11 MARKET EFFECT FACTORS ANALYSIS

11.1 Technology Progress/Risk
  11.1.1 Substitutes Threat
  11.1.2 Technology Progress in Related Industry
11.2 Consumer Needs/Customer Preference Change
11.3 Economic/Political Environmental Change

12 CHINA 3D IC AND 2.5D IC PACKAGING MARKET FORECAST (2016-2021)

12.1 China 3D IC and 2.5D IC Packaging Capacity, Production, Revenue Forecast (2016-2021)
12.2 China 3D IC and 2.5D IC Packaging Production, Import, Export and Consumption Forecast (2016-2021)
12.3 China 3D IC and 2.5D IC Packaging Production Forecast by Type (2016-2021)
12.4 China 3D IC and 2.5D IC Packaging Consumption Forecast by Application (2016-2021)
12.5 China 3D IC and 2.5D IC Packaging Production, Consumption, Import and Export Forecast by Regions (Provinces)(2016-2021)
  12.5.1 China 3D IC and 2.5D IC Packaging Production Forecast by Regions (Provinces)(2016-2021)
  12.5.2 China 3D IC and 2.5D IC Packaging Consumption Forecast by Regions (Provinces)(2016-2021)
  12.5.3 China 3D IC and 2.5D IC Packaging Production, Consumption, Import and Export Forecast by Regions (Provinces)(2016-2021)
12.6 3D IC and 2.5D IC Packaging Price Forecast (2016-2021)

13 RESEARCH FINDINGS AND CONCLUSION

14 APPENDIX

Methodology
Analyst Introduction
Data Source

The report requires updating with new data and is sent in 2-3 business days after order is placed.

List Of Tables

LIST OF TABLES AND FIGURES

Figure Picture of 3D IC and 2.5D IC Packaging
Figure China Production Market Share of 3D IC and 2.5D IC Packaging by Type in 2015
Figure Product Picture of 3D wafer-level chip-scale packaging
Table Major Manufacturers of 3D wafer-level chip-scale packaging
Figure Product Picture of 3D TSV
Table Major Manufacturers of 3D TSV
Figure Product Picture of 2.5D
Table Major Manufacturers of 2.5D
Table 3D IC and 2.5D IC Packaging Consumption Market Share by Application in 2015
Figure Consumer electronics Examples
Figure Telecommunication Examples
Figure Industrial sector Examples
Figure Automotive Examples
Figure Military and aerospace Examples
Figure Smart technologies Examples
Figure Medical devices Examples
Figure China 3D IC and 2.5D IC Packaging Revenue (Million USD) and Growth Rate (2011-2021)
Table China 3D IC and 2.5D IC Packaging Capacity of Key Manufacturers (2015 and 2016)
Table China 3D IC and 2.5D IC Packaging Capacity Market Share of Key Manufacturers (2015 and 2016)
Figure China 3D IC and 2.5D IC Packaging Capacity of Key Manufacturers in 2015
Figure China 3D IC and 2.5D IC Packaging Capacity of Key Manufacturers in 2016
Table China 3D IC and 2.5D IC Packaging Production of Key Manufacturers (2015 and 2016)
Table China 3D IC and 2.5D IC Packaging Production Share by Manufacturers (2015 and 2016)
Figure 2015 3D IC and 2.5D IC Packaging Production Share by Manufacturers
Figure 2016 3D IC and 2.5D IC Packaging Production Share by Manufacturers
Table China 3D IC and 2.5D IC Packaging Revenue (Million USD) by Manufacturers (2015 and 2016)
Table China 3D IC and 2.5D IC Packaging Revenue Share by Manufacturers (2015 and 2016)
Table 2015 China 3D IC and 2.5D IC Packaging Revenue Share by Manufacturers
Table 2016 China 3D IC and 2.5D IC Packaging Revenue Share by Manufacturers
Table China Market 3D IC and 2.5D IC Packaging Average Price of Key Manufacturers (2015 and 2016)
Figure China Market 3D IC and 2.5D IC Packaging Average Price of Key Manufacturers in 2015
Table Manufacturers 3D IC and 2.5D IC Packaging Manufacturing Base Distribution and Sales Area
Table Manufacturers 3D IC and 2.5D IC Packaging Product Type
Figure 3D IC and 2.5D IC Packaging Market Share of Top 3 Manufacturers
Figure 3D IC and 2.5D IC Packaging Market Share of Top 5 Manufacturers
Table Tezzaron Basic Information, Manufacturing Base, Sales Area and Its Competitors
Table Tezzaron 3D IC and 2.5D IC Packaging Capacity, Production, Revenue, Price and Gross Margin (2011-2016)
Figure Tezzaron 3D IC and 2.5D IC Packaging Market Share (2011-2016)
Table ASE Group Basic Information, Manufacturing Base, Sales Area and Its Competitors
Table ASE Group 3D IC and 2.5D IC Packaging Capacity, Production, Revenue, Price and Gross Margin (2011-2016)
Figure ASE Group 3D IC and 2.5D IC Packaging Market Share (2011-2016)
Table Amkor Technology Basic Information, Manufacturing Base, Sales Area and Its Competitors
Table Amkor Technology 3D IC and 2.5D IC Packaging Capacity, Production, Revenue, Price and Gross Margin (2011-2016)
Figure Amkor Technology 3D IC and 2.5D IC Packaging Market Share (2011-2016)
Table STATS ChipPAC Ltd. Basic Information, Manufacturing Base, Sales Area and Its Competitors
Table STATS ChipPAC Ltd. 3D IC and 2.5D IC Packaging Capacity, Production, Revenue, Price and Gross Margin (2011-2016)
Figure STATS ChipPAC Ltd. 3D IC and 2.5D IC Packaging Market Share (2011-2016)
Figure China 3D IC and 2.5D IC Packaging Capacity, Production and Growth (2011-2016)
Figure China 3D IC and 2.5D IC Packaging Revenue (Million USD) and Growth (2011-2016)
Table China 3D IC and 2.5D IC Packaging Production, Consumption, Export and Import (2011-2016)
Table China 3D IC and 2.5D IC Packaging Production by Type (2011-2016)
Table China 3D IC and 2.5D IC Packaging Production Share by Type (2011-2016)
Figure Production Market Share of 3D IC and 2.5D IC Packaging by Type (2011-2016)
Figure 2015 Production Market Share of 3D IC and 2.5D IC Packaging by Type
Table China 3D IC and 2.5D IC Packaging Revenue by Type (2011-2016)
Table China 3D IC and 2.5D IC Packaging Revenue Share by Type (2011-2016)
Figure Production Revenue Share of 3D IC and 2.5D IC Packaging by Type (2011-2016)
Figure 2015 Revenue Market Share of 3D IC and 2.5D IC Packaging by Type
Table China 3D IC and 2.5D IC Packaging Price by Type (2011-2016)
Figure China 3D IC and 2.5D IC Packaging Production Growth by Type (2011-2016)
Table China 3D IC and 2.5D IC Packaging Consumption by Application (2011-2016)
Table China 3D IC and 2.5D IC Packaging Consumption Market Share by Application (2011-2016)
Figure China 3D IC and 2.5D IC Packaging Consumption Market Share by Application in 2015
Table China 3D IC and 2.5D IC Packaging Consumption Growth Rate by Application (2011-2016)
Figure China 3D IC and 2.5D IC Packaging Consumption Growth Rate by Application (2011-2016)
Table China 3D IC and 2.5D IC Packaging Production by Regions (Provinces)(2011-2016)
Table China 3D IC and 2.5D IC Packaging Production Market Share by Regions (Provinces)(2011-2016)
Table China 3D IC and 2.5D IC Packaging Production Value by Regions (Provinces)(2011-2016)
Table China 3D IC and 2.5D IC Packaging Production Value Market Share by Regions (Provinces)(2011-2016)
Table China 3D IC and 2.5D IC Packaging Sales Price by Regions (Provinces)(2011-2016)
Table China 3D IC and 2.5D IC Packaging Consumption by Regions (Provinces)(2011-2016)
Table China 3D IC and 2.5D IC Packaging Consumption Market Share by Regions (Provinces)(2011-2016)
Table China 3D IC and 2.5D IC Packaging Production, Consumption, Export and Import (2011-2016)
Table Production Base and Market Concentration Rate of Raw Material
Figure Price Trend of Key Raw Materials
Table Key Suppliers of Raw Materials
Figure Manufacturing Cost Structure of 3D IC and 2.5D IC Packaging
Figure Manufacturing Process Analysis of 3D IC and 2.5D IC Packaging
Figure 3D IC and 2.5D IC Packaging Industrial Chain Analysis
Table Raw Materials Sources of 3D IC and 2.5D IC Packaging Major Manufacturers in 2015
Table Major Buyers of 3D IC and 2.5D IC Packaging
Table Distributors/Traders List
Figure China 3D IC and 2.5D IC Packaging Capacity, Production and Growth Rate Forecast (2016-2021)
Figure China 3D IC and 2.5D IC Packaging Revenue and Growth Rate Forecast (2016-2021)
Table China 3D IC and 2.5D IC Packaging Production, Import, Export and Consumption Forecast (2016-2021)
Table China 3D IC and 2.5D IC Packaging Production Forecast by Type (2016-2021)
Table China 3D IC and 2.5D IC Packaging Consumption Forecast by Application (2016-2021)
Table China 3D IC and 2.5D IC Packaging Production Forecast by Regions (Provinces)(2016-2021)
Table China 3D IC and 2.5D IC Packaging Consumption Forecast by Regions (Provinces)(2016-2021)
Table China 3D IC and 2.5D IC Packaging Production, Consumption, Import and Export Forecast by Regions (Provinces)(2016-2021)