3D Transistor Trends: Market Research Report
The report projects that 3D Transistors is set to become the norm as a 3D transistor is an advanced transistor that is manufactured by using nano wires in comparison to traditional usage of silicon. The development of 3D Transistors is likely to change the dynamics of semiconductor manufacturing industry. The manufacturing process of 3D transistors involves a top-down method, wherein components of the transistor are etched on the transistor’s base. The nano wires, made of iridium, gallium as well as arsenide semiconductors, are layered with a thinner dielectric made of lanthanum aluminate for performing the gate operation efficiently with reduced voltage requirements.
1. 3D TRANSISTORS – AN OVERVIEW
Transistors – An Introduction
3D TRANSISTORS – THE NEXT-GENERATION TRANSISTORS
3D TRANSISTORS VS. 2D TRANSISTORS
3D TRANSISTORS – ADVANTAGES
Future Developments
3D CHIPS – APPLYING 3D TRANSISTORS TO IMPROVE PERFORMANCE OF FUTURE ELECTRONIC DEVICES
Stacking Techniques
3D CHIPS-MAJOR CHALLENGES TO OVERCOME
Recent 3D Chip-based Developmental Activities
TSMC to Challenge Intel's Leadership in Advanced Semiconductor Manufacturing Technology
2. END-USE APPLICATIONS
3D-ENABLED SMARTPHONES
Media Tablets
Ultrabooks
Netbooks
3. RECENT INDUSTRY ACTIVITY
Altera and Intel Enter into Partnership
Synopsys and Samsung Announce Tapeout of First 14-nanometer FinFET-based Test Chip
TSMC Partners with ASML
United Microelectronics and IBM Technology Ink Agreement
Soitec and SEMATECH Enter into Partnership
4. PRODUCT LAUNCHES/INNOVATIONS
IEMN and LAAS-CNRS Develop 3D Nanometric Transistor
Synopsys Unveils Comprehensive Solution of EDA IP and Tools
Intel Unveils Range of Quad-Core 3rd Generation Processors
Globalfoundries Unveils 14-nanometer eXtreme Mobility Process
Intel Unveils Xeon Server Processors
Intel Introduces Tri-Gate 3D Transistor
Intel Unveils Silvermont Atom Chip Architecture
5. MARKET PARTICIPANTS
Globalfoundries, Inc. (USA)
Intel Corporation (USA)
Laboratoire D'analyse ET D'architecture Des Systèmes (LAAS-CNRS) (France)
National Institute of Advanced Industrial Science and Technology (AIST) (Japan)
Samsung Semiconductor, Inc. (USA)
Soitec SA (France)
Taiwan Semiconductor Manufacturing Co. , Ltd. (TSMC) (Taiwan)
Unisantis Electronics (Japan) Ltd. (Japan)
6. APPENDIX
Transistors – An Introduction
3D TRANSISTORS – THE NEXT-GENERATION TRANSISTORS
3D TRANSISTORS VS. 2D TRANSISTORS
3D TRANSISTORS – ADVANTAGES
Future Developments
3D CHIPS – APPLYING 3D TRANSISTORS TO IMPROVE PERFORMANCE OF FUTURE ELECTRONIC DEVICES
Stacking Techniques
3D CHIPS-MAJOR CHALLENGES TO OVERCOME
Recent 3D Chip-based Developmental Activities
TSMC to Challenge Intel's Leadership in Advanced Semiconductor Manufacturing Technology
2. END-USE APPLICATIONS
3D-ENABLED SMARTPHONES
Table 1. Global Market for 3D-Enabled Smartphones by Region/Country (2014P): Percentage Market Share Breakdown for US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rest of World
Media Tablets
Table 2. Global Market for Media Tablets by Region/Country (2014P): Percentage Market Share Breakdown for US, Canada, Japan, Europe, Asia-Pacific, Middle East & Africa and Latin America
Ultrabooks
Table 3. Global Market for Ultrabooks by Region/Country (2014P): Percentage Market Share Breakdown for US, Canada, Japan, Europe, Asia-Pacific, Middle East & Africa, and Latin America
Netbooks
Table 4. Global Market for Netbooks by Region/Country (2014P): Percentage Market Share Breakdown for North America, Japan, EMEA, Asia-Pacific, and Latin America
3. RECENT INDUSTRY ACTIVITY
Altera and Intel Enter into Partnership
Synopsys and Samsung Announce Tapeout of First 14-nanometer FinFET-based Test Chip
TSMC Partners with ASML
United Microelectronics and IBM Technology Ink Agreement
Soitec and SEMATECH Enter into Partnership
4. PRODUCT LAUNCHES/INNOVATIONS
IEMN and LAAS-CNRS Develop 3D Nanometric Transistor
Synopsys Unveils Comprehensive Solution of EDA IP and Tools
Intel Unveils Range of Quad-Core 3rd Generation Processors
Globalfoundries Unveils 14-nanometer eXtreme Mobility Process
Intel Unveils Xeon Server Processors
Intel Introduces Tri-Gate 3D Transistor
Intel Unveils Silvermont Atom Chip Architecture
5. MARKET PARTICIPANTS
Globalfoundries, Inc. (USA)
Intel Corporation (USA)
Laboratoire D'analyse ET D'architecture Des Systèmes (LAAS-CNRS) (France)
National Institute of Advanced Industrial Science and Technology (AIST) (Japan)
Samsung Semiconductor, Inc. (USA)
Soitec SA (France)
Taiwan Semiconductor Manufacturing Co. , Ltd. (TSMC) (Taiwan)
Unisantis Electronics (Japan) Ltd. (Japan)
6. APPENDIX