3D IC and 2.5D IC Packaging Market by Packaging Technology (3D Wafer-Level Chip Scale Packaging, 3D TSV and 2.5D), Application (Logic, Memory, MEMS/Sensors, Imaging & Optoelectronics, LED), End User and Region - Global Forecast to 2028
The 3D IC and 2.5D IC packaging market is projected to reach USD 82.0 billion by 2028 from USD 49.3 billion in 2023, at a CAGR of 10.7% from 2023 to 2028. The major factors driving the market growth of the 3D IC and 2.5D IC packaging market include rising trend of increased integration density and miniaturization of electronic devices and growing demand for consumer electronics and gaming devices.
Highest interconnect density offered by 3d tsv to fuel market demand
TSVs are vertical interconnects that join the various layers of the 3D IC by slicing through the whole thickness of the silicon wafer. They enable more effective signal transmission across IC layers and shorten the distance that signals must travel, which lowers power consumption and boosts performance.
Use of IC packaging in ADAS and autonomous driving to fuel market growth
Automobiles today are integrated with various technology devices, such as ECUs, sensors, power modules, microprocessors, DSPs, and advanced driver assistance systems, among many others, which enables the usage of memories such as DRAM, NAND flash, NOR flash, and SSD storage, driven by advanced packaging of 3D IC and 2.5D IC. Low power consumption and dense packaging of 3D ICs are driving its growth in the automobile industry for memory applications.
Adoption of mems/sensors by automotive industry to drive market growth
The automotive industry has adopted MEMS sensors to boost performance, save costs, and increase reliability. For instance, inertial MEMS sensors in the automobile industry are crash-sensing for airbag control. Several advanced features of automobiles, such as crash sensing for airbag control, dynamic vehicle control, rollover detection, antitheft systems, and many more, demand MEMS with advanced packaging to ensure high performance, quick response, low power consumption, and greater compactness.
North America is expected to account for the second largest market share during the forecast period
The 3D IC and 2.5D IC packaging market in North America has been further segmented into the US., Canada, and Mexico. Being home to some of the leading semiconductor companies, such as Intel Corporation (US), Texas Instruments Inc. (US), Qualcomm Incorporated (US), and Advanced Micro Devices, Inc. (US), makes the region technologically advanced.
The break-up of profile of primary participants in the 3D IC and 2.5D IC packaging market
Research Coverage
The report segments the 3D IC and 2.5D IC packaging market and forecasts its size based on packaging technology, application, end user and region. The report also provides a comprehensive review of drivers, restraints, opportunities, and challenges influencing the market growth. The report also covers qualitative aspects in addition to the quantitative aspects of the market.
Reasons to buy the report:
The report will help the market leaders/new entrants in this market with information on the closest approximate revenues for the overall 3D IC and 2.5D IC packaging market and related segments. This report will help stakeholders understand the competitive landscape and gain more insights to strengthen their position in the market and plan suitable go-to-market strategies. The report also helps stakeholders understand the pulse of the market and provides them with information on key market drivers, restraints, opportunities, and challenges.
The report provides insights on the following pointers:
Highest interconnect density offered by 3d tsv to fuel market demand
TSVs are vertical interconnects that join the various layers of the 3D IC by slicing through the whole thickness of the silicon wafer. They enable more effective signal transmission across IC layers and shorten the distance that signals must travel, which lowers power consumption and boosts performance.
Use of IC packaging in ADAS and autonomous driving to fuel market growth
Automobiles today are integrated with various technology devices, such as ECUs, sensors, power modules, microprocessors, DSPs, and advanced driver assistance systems, among many others, which enables the usage of memories such as DRAM, NAND flash, NOR flash, and SSD storage, driven by advanced packaging of 3D IC and 2.5D IC. Low power consumption and dense packaging of 3D ICs are driving its growth in the automobile industry for memory applications.
Adoption of mems/sensors by automotive industry to drive market growth
The automotive industry has adopted MEMS sensors to boost performance, save costs, and increase reliability. For instance, inertial MEMS sensors in the automobile industry are crash-sensing for airbag control. Several advanced features of automobiles, such as crash sensing for airbag control, dynamic vehicle control, rollover detection, antitheft systems, and many more, demand MEMS with advanced packaging to ensure high performance, quick response, low power consumption, and greater compactness.
North America is expected to account for the second largest market share during the forecast period
The 3D IC and 2.5D IC packaging market in North America has been further segmented into the US., Canada, and Mexico. Being home to some of the leading semiconductor companies, such as Intel Corporation (US), Texas Instruments Inc. (US), Qualcomm Incorporated (US), and Advanced Micro Devices, Inc. (US), makes the region technologically advanced.
The break-up of profile of primary participants in the 3D IC and 2.5D IC packaging market
- By Company Type: Tier 1 – 38%, Tier 2 – 28%, Tier 3 – 34%
- By Designation Type: C Level – 40%, Director Level – 30%, Others – 30%
- By Region Type: North America – 35%, Europe – 35%, Asia Pacific – 20%, Rest of the World – 10%
Research Coverage
The report segments the 3D IC and 2.5D IC packaging market and forecasts its size based on packaging technology, application, end user and region. The report also provides a comprehensive review of drivers, restraints, opportunities, and challenges influencing the market growth. The report also covers qualitative aspects in addition to the quantitative aspects of the market.
Reasons to buy the report:
The report will help the market leaders/new entrants in this market with information on the closest approximate revenues for the overall 3D IC and 2.5D IC packaging market and related segments. This report will help stakeholders understand the competitive landscape and gain more insights to strengthen their position in the market and plan suitable go-to-market strategies. The report also helps stakeholders understand the pulse of the market and provides them with information on key market drivers, restraints, opportunities, and challenges.
The report provides insights on the following pointers:
- Analysis of key drivers (Increasing need for advanced architecture in electronic products; Rising trend of increased integration density and miniaturization of electronic devices; Growing demand for consumer electronics and gaming devices), restraints (Thermal issues resulting from higher level of integration; High unit cost of 3D IC packages), opportunities (Growing adoption of high-end computing, servers, and data centers; Miniaturization of IoT Devices; Rising number of smart infrastructure and smart city projects), and challenges (Effective supply chain management; Reliability challenges with 3D IC packaging)
- Product Development/Innovation: Detailed insights on upcoming technologies, research & development activities, and new product launches in the 3D IC and 2.5D IC packaging market
- Market Development: Comprehensive information about lucrative markets – the report analyses the 3D IC and 2.5D IC packaging market across varied regions
- Market Diversification: Exhaustive information about new products, untapped geographies, recent developments, and investments in the 3D IC and 2.5D IC packaging market
1 INTRODUCTION
1.1 STUDY OBJECTIVES
1.2 MARKET DEFINITION
1.2.1 INCLUSIONS AND EXCLUSIONS
1.3 STUDY SCOPE
FIGURE 1 3D IC AND 2.5D IC PACKAGING MARKET: SEGMENTATION
1.3.1 REGIONAL SCOPE
1.3.2 YEARS CONSIDERED
1.4 CURRENCY CONSIDERED
1.5 LIMITATIONS
1.6 STAKEHOLDERS
1.7 SUMMARY OF CHANGES
1.7.1 RECESSION IMPACT
2 RESEARCH METHODOLOGY
2.1 RESEARCH DATA
FIGURE 2 3D IC AND 2.5D IC PACKAGING MARKET: RESEARCH DESIGN
2.1.1 SECONDARY AND PRIMARY RESEARCH
2.1.2 SECONDARY DATA
2.1.2.1 Major secondary sources
2.1.2.2 Secondary sources
2.1.3 PRIMARY DATA
2.1.3.1 Breakdown of primaries
2.1.3.2 Key data from primary sources
2.1.3.3 Key industry insights
2.2 MARKET SIZE ESTIMATION
FIGURE 3 PROCESS FLOW OF MARKET SIZE ESTIMATION
2.2.1 BOTTOM-UP APPROACH
2.2.1.1 Estimating market size by bottom-up approach (demand side)
FIGURE 4 MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH
2.2.2 TOP-DOWN APPROACH
2.2.2.1 Estimating market size by top-down approach (supply side)
FIGURE 5 MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH
FIGURE 6 MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH (SUPPLY SIDE)—REVENUE GENERATED FROM 3D IC AND 2.5D IC PACKAGING SOLUTIONS AND SERVICES
2.3 DATA TRIANGULATION
FIGURE 7 DATA TRIANGULATION
2.4 RESEARCH ASSUMPTIONS
TABLE 1 ASSUMPTIONS FOR RESEARCH STUDY
2.4.1 RESEARCH LIMITATIONS
2.5 RISK ASSESSMENT
2.6 PARAMETERS CONSIDERED TO ANALYZE IMPACT OF RECESSION ON 3D IC AND 2.5D IC PACKAGING MARKET
3 EXECUTIVE SUMMARY
3.1 3D IC AND 2.5D IC PACKAGING MARKET: RECESSION IMPACT
FIGURE 8 RECESSION IMPACT: GDP GROWTH PROJECTION UNTIL 2023 FOR MAJOR ECONOMIES
FIGURE 9 RECESSION IMPACT ON 3D IC AND 2.5D IC PACKAGING MARKET, 2019–2028 (USD MILLION)
FIGURE 10 CONSUMER ELECTRONICS TO HOLD LARGEST MARKET SHARE AMONG END USERS IN 3D IC AND 2.5D IC PACKAGING MARKET
FIGURE 11 MEMORY TO HOLD LARGEST MARKET SHARE AMONG APPLICATIONS IN 3D IC AND 2.5D IC PACKAGING MARKET
FIGURE 12 2.5D PACKAGING TECHNOLOGY TO CONTINUE TO HOLD LARGEST MARKET SHARE IN 3D IC AND 2.5D IC PACKAGING MARKET DURING FORECAST PERIOD
FIGURE 13 3D IC AND 2.5D IC PACKAGING MARKET IN ASIA PACIFIC TO EXHIBIT FASTEST GROWTH DURING FORECAST PERIOD
4 PREMIUM INSIGHTS
4.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN 3D IC AND 2.5D IC PACKAGING MARKET
FIGURE 14 INCREASED ADOPTION OF CONSUMER ELECTRONICS AND GAMING DEVICES TO BOOST MARKET GROWTH
4.2 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER
FIGURE 15 MILITARY & AEROSPACE TO REGISTER HIGHEST CAGR FROM 2023 TO 2028
4.3 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY
FIGURE 16 2.5D TO HOLD LARGEST SHARE OF 3D IC AND 2.5D IC PACKAGING MARKET IN 2028
4.4 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION
FIGURE 17 MEMORY TO HOLD LARGEST SHARE OF 3D IC AND 2.5D IC PACKAGING MARKET IN 2028
4.5 3D IC AND 2.5D IC PACKAGING MARKET IN ASIA PACIFIC, BY END USER AND COUNTRY
FIGURE 18 CONSUMER ELECTRONICS VERTICAL AND CHINA WERE LARGEST SHAREHOLDERS IN ASIA PACIFIC 3D IC AND 2.5D IC PACKAGING MARKET IN 2022
4.6 GEOGRAPHIC SNAPSHOT OF 3D IC AND 2.5D IC PACKAGING MARKET
FIGURE 19 3D IC AND 2.5D IC PACKAGING MARKET IN MEXICO EXPECTED TO GROW AT FASTEST RATE DURING FORECAST PERIOD
5 MARKET OVERVIEW
5.1 INTRODUCTION
5.2 MARKET DYNAMICS
FIGURE 20 DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES: 3D IC AND 2.5D IC PACKAGING MARKET
5.2.1 DRIVERS
FIGURE 21 ANALYSIS OF IMPACT OF DRIVERS ON 3D IC AND 2.5D IC PACKAGING MARKET
5.2.1.1 Increasing need for advanced architecture in electronic products
5.2.1.2 Rising trend of increased integration density and miniaturization of electronic devices
5.2.1.3 Growing demand for consumer electronics and gaming devices
FIGURE 22 NUMBER OF SMARTPHONE AND MOBILE PHONE USERS GLOBALLY, 2020–2025 (BILLION)
5.2.2 RESTRAINTS
FIGURE 23 ANALYSIS OF IMPACT OF RESTRAINTS ON 3D IC AND 2.5D IC PACKAGING MARKET
5.2.2.1 Thermal issues resulting from higher level of integration
5.2.2.2 High unit cost of 3D IC packages
5.2.3 OPPORTUNITIES
FIGURE 24 ANALYSIS OF IMPACT OF OPPORTUNITIES ON 3D IC AND 2.5D IC PACKAGING MARKET
5.2.3.1 Growing adoption of high-end computing, servers, and data centers
5.2.3.2 Miniaturization of IoT devices
5.2.3.3 Rising number of smart infrastructure and smart city projects
5.2.4 CHALLENGES
FIGURE 25 ANALYSIS OF IMPACT OF CHALLENGES ON 3D IC AND 2.5D IC PACKAGING MARKET
5.2.4.1 Effective supply chain management
5.2.4.2 Reliability challenges in 3D IC packaging
5.3 SUPPLY CHAIN ANALYSIS
FIGURE 26 SUPPLY CHAIN ANALYSIS: 3D IC AND 2.5D IC PACKAGING MARKET
5.4 3D IC AND 2.5D IC PACKAGING ECOSYSTEM
FIGURE 27 3D IC AND 2.5D IC PACKAGING ECOSYSTEM
5.5 REVENUE SHIFT AND NEW REVENUE POCKETS FOR 3D IC AND 2.5D IC PACKAGING MARKET
FIGURE 28 REVENUE SHIFT IN 3D IC AND 2.5D IC PACKAGING MARKET
5.6 AVERAGE SELLING PRICE ANALYSIS
TABLE 2 AVERAGE SELLING PRICE OF 12-INCH EQUIVALENT WAFERS, 2022 (THOUSAND UNITS)
5.6.1 AVERAGE SELLING PRICE OF 3D IC AND 2.5D IC PACKAGING PRODUCTS/SOLUTIONS, BY KEY PLAYERS
FIGURE 29 AVERAGE SELLING PRICE OF 3D IC AND 2.5D IC PACKAGING PRODUCTS/SOLUTIONS, BY KEY PLAYERS
5.6.2 AVERAGE SELLING PRICE TREND
TABLE 3 AVERAGE SELLING PRICE: 3D IC AND 2.5D IC PACKAGING MARKET, 12-INCH EQUIVALENT WAFERS, (USD/THOUSAND UNITS)
FIGURE 30 AVERAGE SELLING PRICE: 3D IC AND 2.5D IC PACKAGING MARKET, BY WAFER (USD/THOUSAND UNITS)
5.7 TECHNOLOGY TRENDS
5.7.1 FAN-OUT WAFER-LEVEL PACKAGING
5.7.2 FAN-OUT PANEL-LEVEL PACKAGING
5.8 PORTER’S FIVE FORCES ANALYSIS
TABLE 4 3D IC AND 2.5D IC PACKAGING MARKET: PORTER’S FIVE FORCES ANALYSIS
FIGURE 31 PORTER’S FIVE FORCES ANALYSIS
5.8.1 THREAT OF NEW ENTRANTS
5.8.2 THREAT OF SUBSTITUTES
5.8.3 BARGAINING POWER OF SUPPLIERS
5.8.4 BARGAINING POWER OF BUYERS
5.8.5 INTENSITY OF COMPETITIVE RIVALRY
5.9 KEY STAKEHOLDERS AND BUYING PROCESS AND/ OR BUYING CRITERIA
5.9.1 KEY STAKEHOLDERS IN BUYING PROCESS
FIGURE 32 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP 3 END USERS
TABLE 5 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP 3 VERTICALS (%)
5.9.2 BUYING CRITERIA
FIGURE 33 KEY BUYING CRITERIA FOR TOP THREE VERTICALS
TABLE 6 KEY BUYING CRITERIA FOR TOP THREE VERTICALS
5.10 CASE STUDY ANALYSIS
5.10.1 CLOSED-LOOP MONITORING AND CONTROL BASED ON THERMAL BEHAVIOR REDUCED WAFER REJECTION
5.10.2 SPTS’S DRIE TECHNOLOGY STRENGTHENED IMEC’S SILICON ETCH PLATFORM
5.11 TRADE ANALYSIS
5.11.1 IMPORT SCENARIO
TABLE 7 IMPORT DATA, BY COUNTRY, 2018–2022 (USD MILLION)
5.11.2 EXPORT SCENARIO
TABLE 8 EXPORT DATA, BY COUNTRY, 2018–2022 (USD MILLION)
5.12 PATENT ANALYSIS
TABLE 9 NOTABLE PATENTS RELATED TO 3D IC AND 2.5D IC PACKAGING MARKET, 2020–2023
FIGURE 34 NUMBER OF PATENTS GRANTED PER YEAR, 2013–2022
TABLE 10 NUMBER OF PATENTS REGISTERED RELATED TO 3D IC AND 2.5D IC PACKAGING MARKET IN LAST 10 YEARS
FIGURE 35 TOP 10 COMPANIES WITH HIGHEST NUMBER OF PATENT APPLICATIONS IN LAST 10 YEARS
5.13 KEY CONFERENCES AND EVENTS, 2023–2024
TABLE 11 3D IC AND 2.5D IC PACKAGING MARKET: KEY CONFERENCES AND EVENTS
5.14 STANDARDS AND REGULATORY LANDSCAPE
5.14.1 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
TABLE 12 NORTH AMERICA: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
TABLE 13 EUROPE: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
TABLE 14 ASIA PACIFIC: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
5.14.2 KEY REGULATIONS AND STANDARDS
5.14.2.1 North America
5.14.2.2 Europe
5.14.2.3 Asia Pacific
5.14.2.4 Regulations
5.14.2.5 Standards
6 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY
6.1 INTRODUCTION
FIGURE 36 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY
TABLE 15 COMPARISON BETWEEN 2.5D AND 3D IC TECHNOLOGIES
FIGURE 37 MARKET FOR 3D WLCSP TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
TABLE 16 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2019–2022 (USD MILLION)
TABLE 17 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2023–2028 (USD MILLION)
6.2 3D WAFER-LEVEL CHIP-SCALE PACKAGING (WLCSP)
6.2.1 USE OF 3D WLCSP IN CONSUMER ELECTRONICS TO DRIVE MARKET
TABLE 18 3D WLCSP: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 19 3D WLCSP: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
6.3 3D THROUGH-SILICON VIA (TSV)
6.3.1 HIGHEST INTERCONNECT DENSITY OFFERED BY 3D TSV TO FUEL DEMAND
TABLE 20 3D TSV: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 21 3D TSV: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
6.4 2.5D
6.4.1 REDUCED COST BENEFIT OFFERED BY 2.5D IC PACKAGING TO DRIVE MARKET
TABLE 22 2.5D: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 23 2.5D WLCSP: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
7 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION
7.1 INTRODUCTION
FIGURE 38 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION
FIGURE 39 MEMS/SENSORS TO RECORD HIGHEST CAGR DURING FORECAST PERIOD
TABLE 24 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2019–2022 (USD MILLION)
TABLE 25 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2023–2028 (USD MILLION)
7.2 LOGIC
7.2.1 GROWING PENETRATION OF IOT TO DRIVE MARKET
TABLE 26 LOGIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 27 LOGIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
7.3 IMAGING & OPTOELECTRONICS
7.3.1 RISING DEMAND FOR SECURITY AND REAL-TIME MONITORING IN AUTOMOBILES TO DRIVE MARKET
FIGURE 40 MILITARY & AEROSPACE MARKET TO GROW AT HIGHEST CAGR FROM 2023 TO 2028
TABLE 28 IMAGING & OPTOELECTRONICS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 29 IMAGING & OPTOELECTRONICS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
7.4 MEMORY
7.4.1 INCREASED USE OF ARTIFICIAL INTELLIGENCE AND MACHINE LEARNING TO DRIVE MARKET
TABLE 30 MEMORY: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 31 MEMORY: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
7.5 MEMS/SENSORS
7.5.1 ADOPTION OF MEMS/SENSORS BY AUTOMOTIVE INDUSTRY TO DRIVE MARKET
TABLE 32 MEMS/SENSORS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 33 MEMS/SENSORS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
7.6 LEDS
7.6.1 USE OF LEDS IN FIBER OPTICS TO DRIVE MARKET
TABLE 34 LEDS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 35 LEDS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
7.7 OTHERS
TABLE 36 OTHERS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 37 OTHERS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
8 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER
8.1 INTRODUCTION
FIGURE 41 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER
FIGURE 42 MILITARY & AEROSPACE MARKET TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
TABLE 38 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 39 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
8.2 CONSUMER ELECTRONICS
8.2.1 INCREASING MEMORY REQUIREMENTS IN CONSUMER ELECTRONICS TO FUEL MARKET
TABLE 40 CONSUMER ELECTRONICS: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2019–2022 (USD MILLION)
TABLE 41 CONSUMER ELECTRONICS: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2023–2028 (USD MILLION)
TABLE 42 CONSUMER ELECTRONICS: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2019–2022 (USD MILLION)
TABLE 43 CONSUMER ELECTRONICS: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2023–2028 (USD MILLION)
8.3 INDUSTRIAL
8.3.1 RISING ADOPTION OF INDUSTRY 4.0 TO DRIVE MARKET
TABLE 44 INDUSTRIAL: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2019–2022 (USD MILLION)
TABLE 45 INDUSTRIAL: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2023–2028 (USD MILLION)
TABLE 46 INDUSTRIAL: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2019–2022 (USD MILLION)
TABLE 47 INDUSTRIAL: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2023–2028 (USD MILLION)
8.4 TELECOMMUNICATIONS
8.4.1 GROWING USE CASES OF 5G TECHNOLOGY TO FUEL MARKET
TABLE 48 TELECOMMUNICATIONS: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2019–2022 (USD MILLION)
TABLE 49 TELECOMMUNICATIONS: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2023–2028 (USD MILLION)
TABLE 50 TELECOMMUNICATIONS: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2019–2022 (USD MILLION)
TABLE 51 TELECOMMUNICATIONS: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2023–2028 (USD MILLION)
8.5 AUTOMOTIVE
8.5.1 USE OF IC PACKAGING IN ADAS AND AUTONOMOUS DRIVING TO FUEL MARKET
TABLE 52 AUTOMOTIVE: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2019–2022 (USD MILLION)
TABLE 53 AUTOMOTIVE: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2023–2028 (USD MILLION)
TABLE 54 AUTOMOTIVE: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2019–2022 (USD MILLION)
TABLE 55 AUTOMOTIVE: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2023–2028 (USD MILLION)
8.6 MILITARY & AEROSPACE
8.6.1 NEED FOR RELIABLE AND SECURE COMMUNICATION TO FUEL MARKET
TABLE 56 MILITARY & AEROSPACE: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2019–2022 (USD MILLION)
TABLE 57 MILITARY & AEROSPACE: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2023–2028 (USD MILLION)
TABLE 58 MILITARY & AEROSPACE: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2019–2022 (USD MILLION)
TABLE 59 MILITARY & AEROSPACE: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2023–2028 (USD MILLION)
8.7 MEDICAL DEVICES
8.7.1 CAPABILITY TO INCORPORATE MANY SENSORS INTO SINGLE PACKAGE TO FUEL MARKET DEMAND FOR IC PACKAGING
TABLE 60 MEDICAL DEVICES: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2019–2022 (USD MILLION)
TABLE 61 MEDICAL DEVICES: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2023–2028 (USD MILLION)
TABLE 62 MEDICAL DEVICES: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2019–2022 (USD MILLION)
TABLE 63 MEDICAL DEVICES: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2023–2028 (USD MILLION)
9 3D IC AND 2.5D IC PACKAGING MARKET, BY REGION
9.1 INTRODUCTION
FIGURE 43 ASIA PACIFIC TO WITNESS HIGHEST CAGR IN 3D IC AND 2.5D IC PACKAGING MARKET DURING FORECAST PERIOD
TABLE 64 3D IC AND 2.5D IC PACKAGING MARKET, BY REGION, 2019–2022 (USD MILLION)
TABLE 65 3D IC AND 2.5D IC PACKAGING MARKET, BY REGION, 2023–2028 (USD MILLION)
9.2 NORTH AMERICA
FIGURE 44 NORTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET SNAPSHOT
TABLE 66 NORTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY COUNTRY, 2019–2022 (USD MILLION)
TABLE 67 NORTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY COUNTRY, 2023–2028 (USD MILLION)
TABLE 68 NORTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 69 NORTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
FIGURE 45 CONSUMER ELECTRONICS TO HOLD LARGEST MARKET SHARE IN NORTH AMERICAN 3D IC AND 2.5D IC PACKAGING MARKET DURING FORECAST PERIOD
9.2.1 US
9.2.1.1 US to lead 3D IC and 2.5D IC packaging market in North America
TABLE 70 US: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 71 US: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
9.2.2 CANADA
9.2.2.1 Establishment of Canada’s Semiconductor Council to drive regional market
TABLE 72 CANADA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 73 CANADA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
9.2.3 MEXICO
9.2.3.1 Automotive industry in Mexico to fuel market
TABLE 74 MEXICO: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 75 MEXICO: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
9.3 EUROPE
FIGURE 46 EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET SNAPSHOT
TABLE 76 EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET, BY COUNTRY, 2019–2022 (USD MILLION)
TABLE 77 EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET, BY COUNTRY, 2023–2028 (USD MILLION)
TABLE 78 EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 79 EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
9.3.1 UK
9.3.1.1 Increased use of 5G networks to fuel market
TABLE 80 UK: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 81 UK: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
9.3.2 GERMANY
9.3.2.1 Automotive industry to drive market
TABLE 82 GERMANY: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 83 GERMANY: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
9.3.3 FRANCE
9.3.3.1 Highly developed transportation and communication networks to drive market
TABLE 84 FRANCE: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 85 FRANCE: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
9.3.4 REST OF EUROPE
TABLE 86 REST OF EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 87 REST OF EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
9.4 ASIA PACIFIC
FIGURE 47 ASIA PACIFIC: 3D IC AND 2.5D IC PACKAGING MARKET SNAPSHOT
TABLE 88 ASIA PACIFIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY COUNTRY, 2019–2022 (USD MILLION)
TABLE 89 ASIA PACIFIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY COUNTRY, 2023–2028 (USD MILLION)
TABLE 90 ASIA PACIFIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 91 ASIA PACIFIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
FIGURE 48 MILITARY & AEROSPACE SEGMENT IN ASIA PACIFIC MARKET TO RECORD HIGHEST CAGR DURING FORECAST PERIOD
9.4.1 CHINA
9.4.1.1 Increased semiconductor manufacturing to drive market
TABLE 92 CHINA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 93 CHINA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
9.4.2 JAPAN
9.4.2.1.1 Increased production of consumer electronics and automobiles to drive market
TABLE 94 JAPAN: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 95 JAPAN: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
9.4.3 TAIWAN
9.4.3.1 Presence of many key OSAT companies to fuel market
TABLE 96 TAIWAN: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 97 TAIWAN: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
9.4.4 SOUTH KOREA
9.4.4.1 High manufacturing capacity to drive market
TABLE 98 SOUTH KOREA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 99 SOUTH KOREA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
9.4.5 REST OF ASIA PACIFIC
TABLE 100 REST OF ASIA PACIFIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 101 REST OF ASIA PACIFIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
9.5 ROW
TABLE 102 ROW: 3D IC AND 2.5D IC PACKAGING MARKET, BY REGION, 2019–2022 (USD MILLION)
TABLE 103 ROW: 3D IC AND 2.5D IC PACKAGING MARKET, BY REGION, 2023–2028 (USD MILLION)
TABLE 104 ROW: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 105 ROW: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
9.5.1 MIDDLE EAST & AFRICA
TABLE 106 MIDDLE EAST & AFRICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 107 MIDDLE EAST & AFRICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
9.5.2 SOUTH AMERICA
TABLE 108 SOUTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 109 SOUTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
10 COMPETITIVE LANDSCAPE
10.1 INTRODUCTION
10.2 KEY PLAYER STRATEGIES/RIGHT TO WIN
TABLE 110 OVERVIEW OF STRATEGIES DEPLOYED BY KEY PLAYERS IN 3D IC AND 2.5D IC PACKAGING MARKET
10.2.1 PRODUCT PORTFOLIO
10.2.2 REGIONAL FOCUS
10.2.3 ORGANIC/INORGANIC GROWTH STRATEGIES
10.3 MARKET SHARE ANALYSIS, 2022
TABLE 111 3D IC AND 2.5D IC PACKAGING MARKET SHARE ANALYSIS (2022)
10.4 REVENUE ANALYSIS OF TOP PLAYERS IN 3D IC AND 2.5D IC PACKAGING MARKET
FIGURE 49 FIVE-YEAR REVENUE ANALYSIS OF TOP PLAYERS IN 3D IC AND 2.5D IC PACKAGING MARKET
10.5 KEY COMPANY EVALUATION QUADRANT, 2022
10.5.1 STARS
10.5.2 PERVASIVE PLAYERS
10.5.3 EMERGING LEADERS
10.5.4 PARTICIPANTS
FIGURE 50 3D IC AND 2.5D IC PACKAGING MARKET (GLOBAL): KEY COMPANY EVALUATION QUADRANT, 2022
10.6 COMPETITIVE BENCHMARKING
10.6.1 COMPANY FOOTPRINT, BY PACKAGING TECHNOLOGY
10.6.2 COMPANY FOOTPRINT, BY REGION
10.6.3 OVERALL COMPANY FOOTPRINT
10.7 STARTUP/SMALL AND MEDIUM-SIZED ENTERPRISES (SMES) EVALUATION QUADRANT, 2022
TABLE 112 3D IC AND 2.5D IC PACKAGING MARKET: LIST OF KEY STARTUPS/SMES
10.7.1 COMPETITIVE BENCHMARKING OF KEY STARTUPS/SMES
10.7.1.1 Company footprint, by packaging technology
10.7.1.2 Company footprint, by region
10.7.2 PROGRESSIVE COMPANIES
10.7.3 RESPONSIVE COMPANIES
10.7.4 DYNAMIC COMPANIES
10.7.5 STARTING BLOCKS
FIGURE 51 3D IC AND 2.5D IC PACKAGING MARKET (GLOBAL): STARTUPS/SMES EVALUATION QUADRANT, 2022
10.8 COMPETITIVE SITUATION AND TRENDS
10.8.1 PRODUCT LAUNCHES AND DEVELOPMENTS
TABLE 113 3D IC AND 2.5D IC PACKAGING MARKET: PRODUCT LAUNCHES/DEVELOPMENTS, 2019–2023
10.8.2 DEALS
TABLE 114 3D IC AND 2.5D IC PACKAGING MARKET: DEALS, 2019–2023
11 COMPANY PROFILES
11.1 INTRODUCTION
11.2 KEY PLAYERS
(Business overview, Products/Services/Solutions offered, Recent Developments, MNM view)*
11.2.1 SAMSUNG
TABLE 115 SAMSUNG: BUSINESS OVERVIEW
FIGURE 52 SAMSUNG: COMPANY SNAPSHOT
11.2.2 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
TABLE 116 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: BUSINESS OVERVIEW
FIGURE 53 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.: COMPANY SNAPSHOT
11.2.3 INTEL CORPORATION
TABLE 117 INTEL CORPORATION: BUSINESS OVERVIEW
FIGURE 54 INTEL CORPORATION: COMPANY SNAPSHOT
11.2.4 ASE TECHNOLOGY HOLDING CO., LTD.
TABLE 118 ASE TECHNOLOGY HOLDING CO., LTD: BUSINESS OVERVIEW
FIGURE 55 ASE TECHNOLOGY HOLDING CO., LTD.: COMPANY SNAPSHOT
11.2.5 AMKOR TECHNOLOGY
TABLE 119 AMKOR TECHNOLOGY: BUSINESS OVERVIEW
FIGURE 56 AMKOR TECHNOLOGY: COMPANY SNAPSHOT
11.2.6 BROADCOM
TABLE 120 BROADCOM: BUSINESS OVERVIEW
FIGURE 57 BROADCOM: COMPANY SNAPSHOT
11.2.7 TEXAS INSTRUMENTS INC.
TABLE 121 TEXAS INSTRUMENTS INC.: BUSINESS OVERVIEW
FIGURE 58 TEXAS INSTRUMENTS INC.: COMPANY SNAPSHOT
11.2.8 UNITED MICROELECTRONICS CORPORATION
TABLE 122 UNITED MICROELECTRONICS CORPORATION: BUSINESS OVERVIEW
FIGURE 59 UNITED MICROELECTRONICS CORPORATION: COMPANY SNAPSHOT
11.2.9 JCET GROUP CO., LTD.
TABLE 123 JCET GROUP CO., LTD.: BUSINESS OVERVIEW
FIGURE 60 JCET GROUP CO., LTD.: COMPANY SNAPSHOT
11.2.10 POWERTECH TECHNOLOGY INC.
TABLE 124 POWERTECH TECHNOLOGY INC.: BUSINESS OVERVIEW
FIGURE 61 POWERTECH TECHNOLOGY INC.: COMPANY SNAPSHOT
*Details on Business overview, Products/Services/Solutions offered, Recent Developments, MNM view might not be captured in case of unlisted companies.
11.3 OTHER PLAYERS
11.3.1 CADENCE DESIGN SYSTEMS, INC.
11.3.2 SILICONWARE PRECISION INDUSTRIES CO., LTD.
11.3.3 ADVANCED MICRO DEVICES, INC.
11.3.4 TEZZARON
11.3.5 TELEDYNE TECHNOLOGIES INCORPORATED
11.3.6 FUJITSU
11.3.7 XPERI INC.
11.3.8 MONOLITHIC 3D INC.
11.3.9 DECA TECHNOLOGIES
11.3.10 3M
11.3.11 GLOBALFOUNDRIES INC.
11.3.12 NHANCED SEMICONDUCTORS
11.3.13 MOLDEX3D
11.3.14 CEREBRAS
11.3.15 AYAR LABS, INC.
12 APPENDIX
12.1 DISCUSSION GUIDE
12.2 KNOWLEDGESTORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL
12.3 CUSTOMIZATION OPTIONS
12.4 RELATED REPORTS
12.5 AUTHOR DETAILS
1.1 STUDY OBJECTIVES
1.2 MARKET DEFINITION
1.2.1 INCLUSIONS AND EXCLUSIONS
1.3 STUDY SCOPE
FIGURE 1 3D IC AND 2.5D IC PACKAGING MARKET: SEGMENTATION
1.3.1 REGIONAL SCOPE
1.3.2 YEARS CONSIDERED
1.4 CURRENCY CONSIDERED
1.5 LIMITATIONS
1.6 STAKEHOLDERS
1.7 SUMMARY OF CHANGES
1.7.1 RECESSION IMPACT
2 RESEARCH METHODOLOGY
2.1 RESEARCH DATA
FIGURE 2 3D IC AND 2.5D IC PACKAGING MARKET: RESEARCH DESIGN
2.1.1 SECONDARY AND PRIMARY RESEARCH
2.1.2 SECONDARY DATA
2.1.2.1 Major secondary sources
2.1.2.2 Secondary sources
2.1.3 PRIMARY DATA
2.1.3.1 Breakdown of primaries
2.1.3.2 Key data from primary sources
2.1.3.3 Key industry insights
2.2 MARKET SIZE ESTIMATION
FIGURE 3 PROCESS FLOW OF MARKET SIZE ESTIMATION
2.2.1 BOTTOM-UP APPROACH
2.2.1.1 Estimating market size by bottom-up approach (demand side)
FIGURE 4 MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH
2.2.2 TOP-DOWN APPROACH
2.2.2.1 Estimating market size by top-down approach (supply side)
FIGURE 5 MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH
FIGURE 6 MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH (SUPPLY SIDE)—REVENUE GENERATED FROM 3D IC AND 2.5D IC PACKAGING SOLUTIONS AND SERVICES
2.3 DATA TRIANGULATION
FIGURE 7 DATA TRIANGULATION
2.4 RESEARCH ASSUMPTIONS
TABLE 1 ASSUMPTIONS FOR RESEARCH STUDY
2.4.1 RESEARCH LIMITATIONS
2.5 RISK ASSESSMENT
2.6 PARAMETERS CONSIDERED TO ANALYZE IMPACT OF RECESSION ON 3D IC AND 2.5D IC PACKAGING MARKET
3 EXECUTIVE SUMMARY
3.1 3D IC AND 2.5D IC PACKAGING MARKET: RECESSION IMPACT
FIGURE 8 RECESSION IMPACT: GDP GROWTH PROJECTION UNTIL 2023 FOR MAJOR ECONOMIES
FIGURE 9 RECESSION IMPACT ON 3D IC AND 2.5D IC PACKAGING MARKET, 2019–2028 (USD MILLION)
FIGURE 10 CONSUMER ELECTRONICS TO HOLD LARGEST MARKET SHARE AMONG END USERS IN 3D IC AND 2.5D IC PACKAGING MARKET
FIGURE 11 MEMORY TO HOLD LARGEST MARKET SHARE AMONG APPLICATIONS IN 3D IC AND 2.5D IC PACKAGING MARKET
FIGURE 12 2.5D PACKAGING TECHNOLOGY TO CONTINUE TO HOLD LARGEST MARKET SHARE IN 3D IC AND 2.5D IC PACKAGING MARKET DURING FORECAST PERIOD
FIGURE 13 3D IC AND 2.5D IC PACKAGING MARKET IN ASIA PACIFIC TO EXHIBIT FASTEST GROWTH DURING FORECAST PERIOD
4 PREMIUM INSIGHTS
4.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN 3D IC AND 2.5D IC PACKAGING MARKET
FIGURE 14 INCREASED ADOPTION OF CONSUMER ELECTRONICS AND GAMING DEVICES TO BOOST MARKET GROWTH
4.2 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER
FIGURE 15 MILITARY & AEROSPACE TO REGISTER HIGHEST CAGR FROM 2023 TO 2028
4.3 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY
FIGURE 16 2.5D TO HOLD LARGEST SHARE OF 3D IC AND 2.5D IC PACKAGING MARKET IN 2028
4.4 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION
FIGURE 17 MEMORY TO HOLD LARGEST SHARE OF 3D IC AND 2.5D IC PACKAGING MARKET IN 2028
4.5 3D IC AND 2.5D IC PACKAGING MARKET IN ASIA PACIFIC, BY END USER AND COUNTRY
FIGURE 18 CONSUMER ELECTRONICS VERTICAL AND CHINA WERE LARGEST SHAREHOLDERS IN ASIA PACIFIC 3D IC AND 2.5D IC PACKAGING MARKET IN 2022
4.6 GEOGRAPHIC SNAPSHOT OF 3D IC AND 2.5D IC PACKAGING MARKET
FIGURE 19 3D IC AND 2.5D IC PACKAGING MARKET IN MEXICO EXPECTED TO GROW AT FASTEST RATE DURING FORECAST PERIOD
5 MARKET OVERVIEW
5.1 INTRODUCTION
5.2 MARKET DYNAMICS
FIGURE 20 DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES: 3D IC AND 2.5D IC PACKAGING MARKET
5.2.1 DRIVERS
FIGURE 21 ANALYSIS OF IMPACT OF DRIVERS ON 3D IC AND 2.5D IC PACKAGING MARKET
5.2.1.1 Increasing need for advanced architecture in electronic products
5.2.1.2 Rising trend of increased integration density and miniaturization of electronic devices
5.2.1.3 Growing demand for consumer electronics and gaming devices
FIGURE 22 NUMBER OF SMARTPHONE AND MOBILE PHONE USERS GLOBALLY, 2020–2025 (BILLION)
5.2.2 RESTRAINTS
FIGURE 23 ANALYSIS OF IMPACT OF RESTRAINTS ON 3D IC AND 2.5D IC PACKAGING MARKET
5.2.2.1 Thermal issues resulting from higher level of integration
5.2.2.2 High unit cost of 3D IC packages
5.2.3 OPPORTUNITIES
FIGURE 24 ANALYSIS OF IMPACT OF OPPORTUNITIES ON 3D IC AND 2.5D IC PACKAGING MARKET
5.2.3.1 Growing adoption of high-end computing, servers, and data centers
5.2.3.2 Miniaturization of IoT devices
5.2.3.3 Rising number of smart infrastructure and smart city projects
5.2.4 CHALLENGES
FIGURE 25 ANALYSIS OF IMPACT OF CHALLENGES ON 3D IC AND 2.5D IC PACKAGING MARKET
5.2.4.1 Effective supply chain management
5.2.4.2 Reliability challenges in 3D IC packaging
5.3 SUPPLY CHAIN ANALYSIS
FIGURE 26 SUPPLY CHAIN ANALYSIS: 3D IC AND 2.5D IC PACKAGING MARKET
5.4 3D IC AND 2.5D IC PACKAGING ECOSYSTEM
FIGURE 27 3D IC AND 2.5D IC PACKAGING ECOSYSTEM
5.5 REVENUE SHIFT AND NEW REVENUE POCKETS FOR 3D IC AND 2.5D IC PACKAGING MARKET
FIGURE 28 REVENUE SHIFT IN 3D IC AND 2.5D IC PACKAGING MARKET
5.6 AVERAGE SELLING PRICE ANALYSIS
TABLE 2 AVERAGE SELLING PRICE OF 12-INCH EQUIVALENT WAFERS, 2022 (THOUSAND UNITS)
5.6.1 AVERAGE SELLING PRICE OF 3D IC AND 2.5D IC PACKAGING PRODUCTS/SOLUTIONS, BY KEY PLAYERS
FIGURE 29 AVERAGE SELLING PRICE OF 3D IC AND 2.5D IC PACKAGING PRODUCTS/SOLUTIONS, BY KEY PLAYERS
5.6.2 AVERAGE SELLING PRICE TREND
TABLE 3 AVERAGE SELLING PRICE: 3D IC AND 2.5D IC PACKAGING MARKET, 12-INCH EQUIVALENT WAFERS, (USD/THOUSAND UNITS)
FIGURE 30 AVERAGE SELLING PRICE: 3D IC AND 2.5D IC PACKAGING MARKET, BY WAFER (USD/THOUSAND UNITS)
5.7 TECHNOLOGY TRENDS
5.7.1 FAN-OUT WAFER-LEVEL PACKAGING
5.7.2 FAN-OUT PANEL-LEVEL PACKAGING
5.8 PORTER’S FIVE FORCES ANALYSIS
TABLE 4 3D IC AND 2.5D IC PACKAGING MARKET: PORTER’S FIVE FORCES ANALYSIS
FIGURE 31 PORTER’S FIVE FORCES ANALYSIS
5.8.1 THREAT OF NEW ENTRANTS
5.8.2 THREAT OF SUBSTITUTES
5.8.3 BARGAINING POWER OF SUPPLIERS
5.8.4 BARGAINING POWER OF BUYERS
5.8.5 INTENSITY OF COMPETITIVE RIVALRY
5.9 KEY STAKEHOLDERS AND BUYING PROCESS AND/ OR BUYING CRITERIA
5.9.1 KEY STAKEHOLDERS IN BUYING PROCESS
FIGURE 32 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP 3 END USERS
TABLE 5 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP 3 VERTICALS (%)
5.9.2 BUYING CRITERIA
FIGURE 33 KEY BUYING CRITERIA FOR TOP THREE VERTICALS
TABLE 6 KEY BUYING CRITERIA FOR TOP THREE VERTICALS
5.10 CASE STUDY ANALYSIS
5.10.1 CLOSED-LOOP MONITORING AND CONTROL BASED ON THERMAL BEHAVIOR REDUCED WAFER REJECTION
5.10.2 SPTS’S DRIE TECHNOLOGY STRENGTHENED IMEC’S SILICON ETCH PLATFORM
5.11 TRADE ANALYSIS
5.11.1 IMPORT SCENARIO
TABLE 7 IMPORT DATA, BY COUNTRY, 2018–2022 (USD MILLION)
5.11.2 EXPORT SCENARIO
TABLE 8 EXPORT DATA, BY COUNTRY, 2018–2022 (USD MILLION)
5.12 PATENT ANALYSIS
TABLE 9 NOTABLE PATENTS RELATED TO 3D IC AND 2.5D IC PACKAGING MARKET, 2020–2023
FIGURE 34 NUMBER OF PATENTS GRANTED PER YEAR, 2013–2022
TABLE 10 NUMBER OF PATENTS REGISTERED RELATED TO 3D IC AND 2.5D IC PACKAGING MARKET IN LAST 10 YEARS
FIGURE 35 TOP 10 COMPANIES WITH HIGHEST NUMBER OF PATENT APPLICATIONS IN LAST 10 YEARS
5.13 KEY CONFERENCES AND EVENTS, 2023–2024
TABLE 11 3D IC AND 2.5D IC PACKAGING MARKET: KEY CONFERENCES AND EVENTS
5.14 STANDARDS AND REGULATORY LANDSCAPE
5.14.1 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
TABLE 12 NORTH AMERICA: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
TABLE 13 EUROPE: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
TABLE 14 ASIA PACIFIC: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
5.14.2 KEY REGULATIONS AND STANDARDS
5.14.2.1 North America
5.14.2.2 Europe
5.14.2.3 Asia Pacific
5.14.2.4 Regulations
5.14.2.5 Standards
6 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY
6.1 INTRODUCTION
FIGURE 36 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY
TABLE 15 COMPARISON BETWEEN 2.5D AND 3D IC TECHNOLOGIES
FIGURE 37 MARKET FOR 3D WLCSP TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
TABLE 16 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2019–2022 (USD MILLION)
TABLE 17 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2023–2028 (USD MILLION)
6.2 3D WAFER-LEVEL CHIP-SCALE PACKAGING (WLCSP)
6.2.1 USE OF 3D WLCSP IN CONSUMER ELECTRONICS TO DRIVE MARKET
TABLE 18 3D WLCSP: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 19 3D WLCSP: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
6.3 3D THROUGH-SILICON VIA (TSV)
6.3.1 HIGHEST INTERCONNECT DENSITY OFFERED BY 3D TSV TO FUEL DEMAND
TABLE 20 3D TSV: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 21 3D TSV: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
6.4 2.5D
6.4.1 REDUCED COST BENEFIT OFFERED BY 2.5D IC PACKAGING TO DRIVE MARKET
TABLE 22 2.5D: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 23 2.5D WLCSP: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
7 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION
7.1 INTRODUCTION
FIGURE 38 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION
FIGURE 39 MEMS/SENSORS TO RECORD HIGHEST CAGR DURING FORECAST PERIOD
TABLE 24 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2019–2022 (USD MILLION)
TABLE 25 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2023–2028 (USD MILLION)
7.2 LOGIC
7.2.1 GROWING PENETRATION OF IOT TO DRIVE MARKET
TABLE 26 LOGIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 27 LOGIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
7.3 IMAGING & OPTOELECTRONICS
7.3.1 RISING DEMAND FOR SECURITY AND REAL-TIME MONITORING IN AUTOMOBILES TO DRIVE MARKET
FIGURE 40 MILITARY & AEROSPACE MARKET TO GROW AT HIGHEST CAGR FROM 2023 TO 2028
TABLE 28 IMAGING & OPTOELECTRONICS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 29 IMAGING & OPTOELECTRONICS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
7.4 MEMORY
7.4.1 INCREASED USE OF ARTIFICIAL INTELLIGENCE AND MACHINE LEARNING TO DRIVE MARKET
TABLE 30 MEMORY: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 31 MEMORY: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
7.5 MEMS/SENSORS
7.5.1 ADOPTION OF MEMS/SENSORS BY AUTOMOTIVE INDUSTRY TO DRIVE MARKET
TABLE 32 MEMS/SENSORS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 33 MEMS/SENSORS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
7.6 LEDS
7.6.1 USE OF LEDS IN FIBER OPTICS TO DRIVE MARKET
TABLE 34 LEDS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 35 LEDS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
7.7 OTHERS
TABLE 36 OTHERS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 37 OTHERS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
8 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER
8.1 INTRODUCTION
FIGURE 41 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER
FIGURE 42 MILITARY & AEROSPACE MARKET TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
TABLE 38 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 39 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
8.2 CONSUMER ELECTRONICS
8.2.1 INCREASING MEMORY REQUIREMENTS IN CONSUMER ELECTRONICS TO FUEL MARKET
TABLE 40 CONSUMER ELECTRONICS: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2019–2022 (USD MILLION)
TABLE 41 CONSUMER ELECTRONICS: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2023–2028 (USD MILLION)
TABLE 42 CONSUMER ELECTRONICS: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2019–2022 (USD MILLION)
TABLE 43 CONSUMER ELECTRONICS: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2023–2028 (USD MILLION)
8.3 INDUSTRIAL
8.3.1 RISING ADOPTION OF INDUSTRY 4.0 TO DRIVE MARKET
TABLE 44 INDUSTRIAL: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2019–2022 (USD MILLION)
TABLE 45 INDUSTRIAL: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2023–2028 (USD MILLION)
TABLE 46 INDUSTRIAL: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2019–2022 (USD MILLION)
TABLE 47 INDUSTRIAL: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2023–2028 (USD MILLION)
8.4 TELECOMMUNICATIONS
8.4.1 GROWING USE CASES OF 5G TECHNOLOGY TO FUEL MARKET
TABLE 48 TELECOMMUNICATIONS: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2019–2022 (USD MILLION)
TABLE 49 TELECOMMUNICATIONS: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2023–2028 (USD MILLION)
TABLE 50 TELECOMMUNICATIONS: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2019–2022 (USD MILLION)
TABLE 51 TELECOMMUNICATIONS: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2023–2028 (USD MILLION)
8.5 AUTOMOTIVE
8.5.1 USE OF IC PACKAGING IN ADAS AND AUTONOMOUS DRIVING TO FUEL MARKET
TABLE 52 AUTOMOTIVE: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2019–2022 (USD MILLION)
TABLE 53 AUTOMOTIVE: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2023–2028 (USD MILLION)
TABLE 54 AUTOMOTIVE: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2019–2022 (USD MILLION)
TABLE 55 AUTOMOTIVE: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2023–2028 (USD MILLION)
8.6 MILITARY & AEROSPACE
8.6.1 NEED FOR RELIABLE AND SECURE COMMUNICATION TO FUEL MARKET
TABLE 56 MILITARY & AEROSPACE: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2019–2022 (USD MILLION)
TABLE 57 MILITARY & AEROSPACE: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2023–2028 (USD MILLION)
TABLE 58 MILITARY & AEROSPACE: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2019–2022 (USD MILLION)
TABLE 59 MILITARY & AEROSPACE: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2023–2028 (USD MILLION)
8.7 MEDICAL DEVICES
8.7.1 CAPABILITY TO INCORPORATE MANY SENSORS INTO SINGLE PACKAGE TO FUEL MARKET DEMAND FOR IC PACKAGING
TABLE 60 MEDICAL DEVICES: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2019–2022 (USD MILLION)
TABLE 61 MEDICAL DEVICES: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2023–2028 (USD MILLION)
TABLE 62 MEDICAL DEVICES: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2019–2022 (USD MILLION)
TABLE 63 MEDICAL DEVICES: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2023–2028 (USD MILLION)
9 3D IC AND 2.5D IC PACKAGING MARKET, BY REGION
9.1 INTRODUCTION
FIGURE 43 ASIA PACIFIC TO WITNESS HIGHEST CAGR IN 3D IC AND 2.5D IC PACKAGING MARKET DURING FORECAST PERIOD
TABLE 64 3D IC AND 2.5D IC PACKAGING MARKET, BY REGION, 2019–2022 (USD MILLION)
TABLE 65 3D IC AND 2.5D IC PACKAGING MARKET, BY REGION, 2023–2028 (USD MILLION)
9.2 NORTH AMERICA
FIGURE 44 NORTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET SNAPSHOT
TABLE 66 NORTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY COUNTRY, 2019–2022 (USD MILLION)
TABLE 67 NORTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY COUNTRY, 2023–2028 (USD MILLION)
TABLE 68 NORTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 69 NORTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
FIGURE 45 CONSUMER ELECTRONICS TO HOLD LARGEST MARKET SHARE IN NORTH AMERICAN 3D IC AND 2.5D IC PACKAGING MARKET DURING FORECAST PERIOD
9.2.1 US
9.2.1.1 US to lead 3D IC and 2.5D IC packaging market in North America
TABLE 70 US: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 71 US: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
9.2.2 CANADA
9.2.2.1 Establishment of Canada’s Semiconductor Council to drive regional market
TABLE 72 CANADA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 73 CANADA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
9.2.3 MEXICO
9.2.3.1 Automotive industry in Mexico to fuel market
TABLE 74 MEXICO: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 75 MEXICO: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
9.3 EUROPE
FIGURE 46 EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET SNAPSHOT
TABLE 76 EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET, BY COUNTRY, 2019–2022 (USD MILLION)
TABLE 77 EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET, BY COUNTRY, 2023–2028 (USD MILLION)
TABLE 78 EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 79 EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
9.3.1 UK
9.3.1.1 Increased use of 5G networks to fuel market
TABLE 80 UK: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 81 UK: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
9.3.2 GERMANY
9.3.2.1 Automotive industry to drive market
TABLE 82 GERMANY: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 83 GERMANY: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
9.3.3 FRANCE
9.3.3.1 Highly developed transportation and communication networks to drive market
TABLE 84 FRANCE: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 85 FRANCE: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
9.3.4 REST OF EUROPE
TABLE 86 REST OF EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 87 REST OF EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
9.4 ASIA PACIFIC
FIGURE 47 ASIA PACIFIC: 3D IC AND 2.5D IC PACKAGING MARKET SNAPSHOT
TABLE 88 ASIA PACIFIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY COUNTRY, 2019–2022 (USD MILLION)
TABLE 89 ASIA PACIFIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY COUNTRY, 2023–2028 (USD MILLION)
TABLE 90 ASIA PACIFIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 91 ASIA PACIFIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
FIGURE 48 MILITARY & AEROSPACE SEGMENT IN ASIA PACIFIC MARKET TO RECORD HIGHEST CAGR DURING FORECAST PERIOD
9.4.1 CHINA
9.4.1.1 Increased semiconductor manufacturing to drive market
TABLE 92 CHINA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 93 CHINA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
9.4.2 JAPAN
9.4.2.1.1 Increased production of consumer electronics and automobiles to drive market
TABLE 94 JAPAN: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 95 JAPAN: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
9.4.3 TAIWAN
9.4.3.1 Presence of many key OSAT companies to fuel market
TABLE 96 TAIWAN: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 97 TAIWAN: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
9.4.4 SOUTH KOREA
9.4.4.1 High manufacturing capacity to drive market
TABLE 98 SOUTH KOREA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 99 SOUTH KOREA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
9.4.5 REST OF ASIA PACIFIC
TABLE 100 REST OF ASIA PACIFIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 101 REST OF ASIA PACIFIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
9.5 ROW
TABLE 102 ROW: 3D IC AND 2.5D IC PACKAGING MARKET, BY REGION, 2019–2022 (USD MILLION)
TABLE 103 ROW: 3D IC AND 2.5D IC PACKAGING MARKET, BY REGION, 2023–2028 (USD MILLION)
TABLE 104 ROW: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 105 ROW: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
9.5.1 MIDDLE EAST & AFRICA
TABLE 106 MIDDLE EAST & AFRICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 107 MIDDLE EAST & AFRICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
9.5.2 SOUTH AMERICA
TABLE 108 SOUTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
TABLE 109 SOUTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
10 COMPETITIVE LANDSCAPE
10.1 INTRODUCTION
10.2 KEY PLAYER STRATEGIES/RIGHT TO WIN
TABLE 110 OVERVIEW OF STRATEGIES DEPLOYED BY KEY PLAYERS IN 3D IC AND 2.5D IC PACKAGING MARKET
10.2.1 PRODUCT PORTFOLIO
10.2.2 REGIONAL FOCUS
10.2.3 ORGANIC/INORGANIC GROWTH STRATEGIES
10.3 MARKET SHARE ANALYSIS, 2022
TABLE 111 3D IC AND 2.5D IC PACKAGING MARKET SHARE ANALYSIS (2022)
10.4 REVENUE ANALYSIS OF TOP PLAYERS IN 3D IC AND 2.5D IC PACKAGING MARKET
FIGURE 49 FIVE-YEAR REVENUE ANALYSIS OF TOP PLAYERS IN 3D IC AND 2.5D IC PACKAGING MARKET
10.5 KEY COMPANY EVALUATION QUADRANT, 2022
10.5.1 STARS
10.5.2 PERVASIVE PLAYERS
10.5.3 EMERGING LEADERS
10.5.4 PARTICIPANTS
FIGURE 50 3D IC AND 2.5D IC PACKAGING MARKET (GLOBAL): KEY COMPANY EVALUATION QUADRANT, 2022
10.6 COMPETITIVE BENCHMARKING
10.6.1 COMPANY FOOTPRINT, BY PACKAGING TECHNOLOGY
10.6.2 COMPANY FOOTPRINT, BY REGION
10.6.3 OVERALL COMPANY FOOTPRINT
10.7 STARTUP/SMALL AND MEDIUM-SIZED ENTERPRISES (SMES) EVALUATION QUADRANT, 2022
TABLE 112 3D IC AND 2.5D IC PACKAGING MARKET: LIST OF KEY STARTUPS/SMES
10.7.1 COMPETITIVE BENCHMARKING OF KEY STARTUPS/SMES
10.7.1.1 Company footprint, by packaging technology
10.7.1.2 Company footprint, by region
10.7.2 PROGRESSIVE COMPANIES
10.7.3 RESPONSIVE COMPANIES
10.7.4 DYNAMIC COMPANIES
10.7.5 STARTING BLOCKS
FIGURE 51 3D IC AND 2.5D IC PACKAGING MARKET (GLOBAL): STARTUPS/SMES EVALUATION QUADRANT, 2022
10.8 COMPETITIVE SITUATION AND TRENDS
10.8.1 PRODUCT LAUNCHES AND DEVELOPMENTS
TABLE 113 3D IC AND 2.5D IC PACKAGING MARKET: PRODUCT LAUNCHES/DEVELOPMENTS, 2019–2023
10.8.2 DEALS
TABLE 114 3D IC AND 2.5D IC PACKAGING MARKET: DEALS, 2019–2023
11 COMPANY PROFILES
11.1 INTRODUCTION
11.2 KEY PLAYERS
(Business overview, Products/Services/Solutions offered, Recent Developments, MNM view)*
11.2.1 SAMSUNG
TABLE 115 SAMSUNG: BUSINESS OVERVIEW
FIGURE 52 SAMSUNG: COMPANY SNAPSHOT
11.2.2 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
TABLE 116 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: BUSINESS OVERVIEW
FIGURE 53 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.: COMPANY SNAPSHOT
11.2.3 INTEL CORPORATION
TABLE 117 INTEL CORPORATION: BUSINESS OVERVIEW
FIGURE 54 INTEL CORPORATION: COMPANY SNAPSHOT
11.2.4 ASE TECHNOLOGY HOLDING CO., LTD.
TABLE 118 ASE TECHNOLOGY HOLDING CO., LTD: BUSINESS OVERVIEW
FIGURE 55 ASE TECHNOLOGY HOLDING CO., LTD.: COMPANY SNAPSHOT
11.2.5 AMKOR TECHNOLOGY
TABLE 119 AMKOR TECHNOLOGY: BUSINESS OVERVIEW
FIGURE 56 AMKOR TECHNOLOGY: COMPANY SNAPSHOT
11.2.6 BROADCOM
TABLE 120 BROADCOM: BUSINESS OVERVIEW
FIGURE 57 BROADCOM: COMPANY SNAPSHOT
11.2.7 TEXAS INSTRUMENTS INC.
TABLE 121 TEXAS INSTRUMENTS INC.: BUSINESS OVERVIEW
FIGURE 58 TEXAS INSTRUMENTS INC.: COMPANY SNAPSHOT
11.2.8 UNITED MICROELECTRONICS CORPORATION
TABLE 122 UNITED MICROELECTRONICS CORPORATION: BUSINESS OVERVIEW
FIGURE 59 UNITED MICROELECTRONICS CORPORATION: COMPANY SNAPSHOT
11.2.9 JCET GROUP CO., LTD.
TABLE 123 JCET GROUP CO., LTD.: BUSINESS OVERVIEW
FIGURE 60 JCET GROUP CO., LTD.: COMPANY SNAPSHOT
11.2.10 POWERTECH TECHNOLOGY INC.
TABLE 124 POWERTECH TECHNOLOGY INC.: BUSINESS OVERVIEW
FIGURE 61 POWERTECH TECHNOLOGY INC.: COMPANY SNAPSHOT
*Details on Business overview, Products/Services/Solutions offered, Recent Developments, MNM view might not be captured in case of unlisted companies.
11.3 OTHER PLAYERS
11.3.1 CADENCE DESIGN SYSTEMS, INC.
11.3.2 SILICONWARE PRECISION INDUSTRIES CO., LTD.
11.3.3 ADVANCED MICRO DEVICES, INC.
11.3.4 TEZZARON
11.3.5 TELEDYNE TECHNOLOGIES INCORPORATED
11.3.6 FUJITSU
11.3.7 XPERI INC.
11.3.8 MONOLITHIC 3D INC.
11.3.9 DECA TECHNOLOGIES
11.3.10 3M
11.3.11 GLOBALFOUNDRIES INC.
11.3.12 NHANCED SEMICONDUCTORS
11.3.13 MOLDEX3D
11.3.14 CEREBRAS
11.3.15 AYAR LABS, INC.
12 APPENDIX
12.1 DISCUSSION GUIDE
12.2 KNOWLEDGESTORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL
12.3 CUSTOMIZATION OPTIONS
12.4 RELATED REPORTS
12.5 AUTHOR DETAILS
