Strained Silicon: Market Research Report

Date: February 22, 2010
Pages: 739
US$ 3,450.00
Publisher: Global Industry Analysts, Inc
Report type: Strategic Report
Delivery: E-mail Delivery (PDF)

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Strained Silicon: Market Research Report
This report analyzes the Global market for Strained Silicon in US$ Million.

Annual forecasts are provided for the period 2006 through 2015.

The report profiles 66 companies including many key and niche players such as Advanced Micro Devices, Inc., Applied Materials, Inc., ASM International NV, Atmel Corporation, AmberWave Systems Corporation, Canon, Inc., CEVA, Inc., Chartered Semiconductor Manufacturing Ltd., Honeywell International, Inc., International Business Machines Corp., Isonics Corporation, Infineon Technologies, AG, Intel Corp., International Rectifier Corp., KLA Tencor Corporation, Maxim Integrated Products, Inc., MEMC Electronic Materials, Inc., Micron Technology Inc., Mitsubishi Materials Corporation, NEC Electronics Corporation, Oki Semiconductor Company Ltd., Peregrine Semiconductor Corp., Renesas Technology Corporation, Sandia National Laboratories, Soitec S. A., STMicroelectronics N.V., Shanghai Simgui Technology Co., Ltd, Shin-Etsu Handotai Co., Ltd., Silicon Genesis Corporation, Siltronic AG, Texas Instruments Incorporated, Toshiba Corporation, Taiwan Semiconductor Manufacturing Company Limited, United Microelectronic Corporation, and Vitesse Semiconductor Corporation.

Market data and analytics are derived from primary and secondary research.

Company profiles are mostly extracted from URL research and reported select online sources.

Study Reliability and Reporting Limitations
Data Interpretation & Reporting Level
Quantitative Techniques & Analytics
Product Definitions and Scope of Study



Moving Beyond Silicon

Table 1. World Recent Past, Current & Future Analysis for Strained Silicon - Independently Analyzed with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)

Understanding Semiconductors
The Heart of Any Electronic Device
Keeping Pace with Moore’s Law
And Going Beyond…
Key Factors Influencing the Market
The Cyclical Growth Demand Within the Industry
Industry Keeping Pace with Gordon Moore’s Predictions
End-Market Demand Characteristics
Increasing Content Within the Semiconductor
Environmental Factors
Key Market Drivers
Technology Migration: A Pre-requisite to Survive Competition
New Materials hold the Key
Copper for Superior Electrical Conductivity
Key Market Constraints
Growing Payback Periods on Invested Capital: A Prime Concern
Lack of Standards Acts Spoilsport
Need for Greater Collaboration Among the Players
Technological Innovations
The 32-nm Generation Processor is Here
Target ‘22-nm Generation Microprocessors’, by 2011
UMC Announces the Validation of High-K/Metal-Gate Technology
FEI Unveils the New TrueCrystal Package for Error-Free Strain Profiling
The Revolutionary Smart Cut™ Layer Transfer Technology From SOITEC
Smart Cut™ in the Manufacturing of Strained Silicon on Insulator (sSOI)
NGS (Next-Generation Strain): A Technology Revolution By SiGen
New Process for Epitaxial Germanium Growth on Silicon Oxide
New Technique to Evaluate the Degree of Strain
Technological Barriers
Faster Adaptation of holistic manufacturing practices: A Challenge
Controlling Threading Dislocation: A Major Barrier
Future Directions: The Shape of Things to Come
To Spearhead the Future Advances in Ultra High-Speed Computing
Put a Firm Check on Investment Requirements
Strained Silicon Technology To Spearhead the Future in High-Performance Devices
Consolidation Gets Underway
Landmark Deals Announced or Completed by Companies Engaged in Strained Silicon and Semiconductor devices, During the Year 2007 & 2008
Competition Scenario
The Historical Intel-IBM Rivalry
Intel and AMD Battle it out in the 45-nm Processor Servers Market
SiGen: The Leader in Silicon-on-Insulator (SOI) Technology


Strain Engineering: A Primer
Uni-Axial Strain and Bi-Axial Strain
Straining Methods
Strained Silicon Based Technologies
Strained Silicon-Germanium (sSiGe)
Hand in Hand with the Wireless Revolution
Simplified Manufacturing Process
Silicon on Insulator (SOI)/ Strained Silicon on Insulator (sSOI)
Strained Silicon-on-Insulator (sSOI): The New Industry Benchmark
SOI Technology Acts as a Complementary to Strained Silicon Technology
SOI Tests China Waters
Fabricating Methods of Strained Silicon Transistors
Strained Silicon Multi-layer Structures
Advantage of Strained Silicon Multi-layered structure Over Others


Maxim’s Single-Conversion Silicon Tuner Replaces Canned Tuner for Hybrid Applications
IQE Expands Manufacturing Processes Portfolio
International Rectifier Launches DirectFET® MOSFET Chipset
Jazz Semiconductor Introduces SiGe BiCMOS Tech for Next-Generation Green Analog ICs
AWR and austriamicrosystems Launch Process Design Kit for SiGe BiCMOS Process Technology
StrataLight Develops Silicon Germanium (SiGe) Chipset for 100GbE Transponders
Tokyo Instruments Develops Basic Technology for Non-Destructive Strain-Measuring Instrument
Silicon Genesis Unveils the First 20 mm Solar Cell Foils
Silicon Genesis Unveils the New PolyMax™ Process Technology
Fujitsu Unveils New Power-Saving CMOS Technology
UMC Announces the Launch of 65nm Customer Silicon, Using the Proprietary URAM Technology
Renesas Launches New Affordable Fabrication Technology
Renesas Unveils New Technology for SRAM Implementation in 45nm Generation Devices
Epson Commences Large-Scale Production of 0.7inch Full HD HTPS Panels
Intel and UC Santa Barbara Develops the First Hybrid Silicon Laser
Maxim Integrated Products Launches DS1091L Silicon EconOscillator™
Oki Electric Creates Extremely Low Cost-Effective µBOSA Chips for FTTH Modules
Texas Instruments Launches SiGe Process Based Op-Amps
Sony, Toshiba and NEC Electronics Releases High Performance System LSI
Epson and JSR Pioneers Micro-Liquid Processes
SiGen Presents Single Crystal Silicon Film Transfer on Substrate


Silicon Genesis Enters into Agreement with REC
Silicon Genesis and NorSun Enter into Agreement
Soitec Inaugurates New Fab Facility in Singapore
AMCC Enters into Strategic Alliance with Silicon Image
CopperGate Communication Acquires the HomePlug AV Business from Conexant
AMG Invest Acquires Stakes in Graphit Kropfmuhl
Globe Specialty Metals Acquires Stakes in Solsil
Intrinsiq Materials Takes Over pSiNutria from pSiVida
Permatex Acquires Anaerobicos
AmberWave Acquires Aonex Technologies
IBM Adopts the QuickCap NX Parasitic Extraction Software from Magma
IMEC Selects SOI MEMS Technology From Tronics Microsytems
Silex System to Acquire Minority Stake in Translucent Photonics
LSI Corp Takes Over Tarari
E-Ton Solar Tech Takes Over ADEMA Technologies
Gintech and MEMC Completes Agreement for Solar Wafer Supply
MEMC, Suntech Signs Letter of Intent for Solar Wafer Supply
AmberWave Signs License Agreement with LG Siltron on Strained Silicon IP
ARM Acquires Soisic
Sumco to Takeover KEM
Samsung and Siltronic to Construct New Fab Facility
ARM Collaborates with Soitec (France)


Advanced Micro Devices, Inc. (USA)
Applied Materials, Inc. (USA)
ASM International NV (Netherlands)
Atmel Corporation (USA)
AmberWave Systems Corporation (USA)
Canon, Inc. (Japan)
CEVA, Inc. (USA)
Chartered Semiconductor Manufacturing Ltd (Singapore)
Honeywell International, Inc. (USA)
International Business Machines Corp. (USA)
Isonics Corporation (USA)
Infineon Technologies, AG (Germany)
Intel Corp. (USA)
International Rectifier Corp. (USA)
KLA Tencor Corporation (USA)
Maxim Integrated Products, Inc. (USA)
MEMC Electronic Materials, Inc. (USA)
Micron Technology Inc. (USA)
Mitsubishi Materials Corporation. (Japan)
NEC Electronics Corporation (Japan)
Oki Semiconductor Company Co. Ltd. (Japan)
Peregrine Semiconductor Corp. (USA)
Renesas Technology Corporation (Japan)
Sandia National Laboratories (USA)
Soitec S. A. (France)
STMicroelectronics N.V. (Switzerland)
Shanghai Simgui Technology Co., Ltd (China)
Shin-Etsu Handotai Co., Ltd (Japan)
Silicon Genesis Corporation (USA)
Siltronic AG (Germany)
Texas Instruments Incorporated (USA)
Toshiba Corporation (Japan)
Taiwan Semiconductor Manufacturing Company Limited (Taiwan)
United Microelectronic Corporation (Taiwan)
Vitesse Semiconductor Corporation (USA)


Total Companies Profiled: 66 (including Divisions/Subsidiaries - 70)
The United States
The United Kingdom
Rest of Europe
Asia-Pacific (Excluding Japan)
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