Wired Interface Market - Forecasts From 2018 to 2023

December 2018 | 105 pages | ID: W47C6D726DFEN
Knowledge Sourcing Intelligence LLP

Abstracts

The Wired Interface Market is projected to grow at a CAGR of 12.50% to reach US$33.268 billion by 2023, from US$16.406 billion in 2017. The wired interface technology deals with the transfer of data, power, audio and video with the use of cables. Different types of cables are manufactured based on purpose and security. The wired interface technology market will grow on account of increasing worldwide dependence on electronics such as smartphones, computers, projectors and more. The demand for wired interface technology will also rise because of rising security concerns and higher data transferability advantages that it provides. However, the trend towards the adoption of wireless technology will be a restraining factor for the growth of the wired interface market. The North American region is at a mature stage due to the early adoption of technology. The Asia Pacific region will grow significantly with the improvement in the standard of living resulting in increased demand for smartphones, PCs and other consumer electronics.

This research study examines the current market trends related to the demand, supply, and sales, in addition to the recent developments. Major drivers, restraints, and opportunities have been covered to provide an exhaustive picture of the market. The analysis presents in-depth information regarding the development, trends, and industry policies and regulations implemented in each of the geographical regions. Further, the overall regulatory framework of the market has been exhaustively covered to offer stakeholders a better understanding of the key factors affecting the overall market environment.

Identification of key industry players in the industry and their revenue contribution to the overall business or relevant segment aligned to the study have been covered as a part of competitive intelligence done through extensive secondary research. Various studies and data published by industry associations, analyst reports, investor presentations, press releases and journals among others have been taken into consideration while conducting the secondary research. Both bottom-up and top down approaches have been utilized to determine the market size of the overall market and key segments. The values obtained are correlated with the primary inputs of the key stakeholders in the wired interface value chain. The last step involves complete market engineering which includes analyzing the data from different sources and existing proprietary datasets while using various data triangulation methods for market breakdown and forecasting.

Market intelligence is presented in the form of analysis, charts, and graphics to help the clients in gaining faster and efficient understanding of the Wired Interface market.

Major industry players profiled as part of the report Molex, LLC., Amphenol Corporation, Japan Aviation Electronics Industry, Ltd., TE Connectivity, STMicroelectronics N.V., among others.

Segmentation

The Wired Interface market has been analyzed through following segments:
By Component
Data Transfer Interface
Power Transfer Interface
Audio and Display Interface
Others
By Device
Smartphones and Tablets
Personal Computers and Laptops
Entertainment Devices
Audio and Video Output Devices
External Data Storage Devices
Others
By Geography
North America
USA
Canada
Mexico
Others
South America
Brazil
Argentina
Others
Europe
Germany
France
United Kingdom
Spain
Others
Middle East and Africa
Saudi Arabia
Israel
Others
Asia Pacific
China
Japan
South Korea
India
Others

Contents

1. INTRODUCTION

1.1. MARKET OVERVIEW
1.2. MARKET DEFINITION
1.3. SCOPE OF THE STUDY
1.4. CURRENCY
1.5. ASSUMPTIONS
1.6. BASE, AND FORECAST YEARS TIMELINE

2. RESEARCH METHODOLOGY

2.1. RESEARCH DESIGN
2.2. SECONDARY SOURCES

3. EXECUTIVE SUMMARY

4. MARKET DYNAMICS

4.1. MARKET SEGMENTATION
4.2. MARKET DRIVERS
4.3. MARKET RESTRAINTS
4.4. MARKET OPPORTUNITIES
4.5. PORTER’S FIVE FORCE ANALYSIS
  4.5.1. BARGAINING POWER OF SUPPLIERS
  4.5.2. BARGAINING POWER OF BUYERS
  4.5.3. THREAT OF NEW ENTRANTS
  4.5.4. THREAT OF SUBSTITUTES
  4.5.5. COMPETITIVE RIVALRY IN THE INDUSTRY
4.6. LIFE CYCLE ANALYSIS - REGIONAL SNAPSHOT
4.7. MARKET ATTRACTIVENESS

5. WIRED INTERFACE MARKET BY COMPONENT

5.1. DATA TRANSFER INTERFACE
5.2. POWER TRANSFER INTERFACE
5.3. AUDIO AND DISPLAY INTERFACE
5.4. OTHERS

6. WIRED INTERFACE MARKET BY DEVICE

6.1. SMARTPHONES AND TABLETS
6.2. PERSONAL COMPUTERS AND LAPTOPS
6.3. ENTERTAINMENT DEVICES
6.4. AUDIO AND VIDEO OUTPUT DEVICES
6.5. EXTERNAL DATA STORAGE DEVICES
6.6. OTHERS

7. WIRED INTERFACE MARKET BY GEOGRAPHY

7.1. NORTH AMERICA
  7.1.1. USA
  7.1.2. CANADA
  7.1.3. MEXICO
  7.1.4. OTHERS
7.2. SOUTH AMERICA
  7.2.1. BRAZIL
  7.2.2. ARGENTINA
  7.2.3. OTHERS
7.3. EUROPE
  7.3.1. GERMANY
  7.3.2. FRANCE
  7.3.3. UNITED KINGDOM
  7.3.4. SPAIN
  7.3.5. OTHERS
7.4. MIDDLE EAST AND AFRICA
  7.4.1. SAUDI ARABIA
  7.4.2. ISRAEL
  7.4.3. OTHERS
7.5. ASIA PACIFIC
  7.5.1. CHINA
  7.5.2. JAPAN
  7.5.3. SOUTH KOREA
  7.5.4. INDIA
  7.5.5. OTHERS

8. COMPETITIVE INTELLIGENCE

8.1. Market Share Analysis
8.2. RECENT INVESTMENT AND DEALS
8.3. STRATEGIES OF KEY PLAYERS

9. COMPANY PROFILES

9.1. MOLEX, LLC.
  9.1.1. COMPANY OVERVIEW
  9.1.2. FINANCIALS
  9.1.3. PRODUCTS AND SERVICES
  9.1.4. RECENT DEVELOPMENTS
9.2. AMPHENOL CORPORATION
  9.2.1. COMPANY OVERVIEW
  9.2.2. FINANCIALS
  9.2.3. PRODUCTS AND SERVICES
  9.2.4. RECENT DEVELOPMENTS
9.3. JAPAN AVIATION ELECTRONICS INDUSTRY, LTD.
  9.3.1. COMPANY OVERVIEW
  9.3.2. FINANCIALS
  9.3.3. PRODUCTS AND SERVICES
  9.3.4. RECENT DEVELOPMENTS
9.4. TE CONNECTIVITY
  9.4.1. COMPANY OVERVIEW
  9.4.2. FINANCIALS
  9.4.3. PRODUCTS AND SERVICES
  9.4.4. RECENT DEVELOPMENTS
9.5. STMICROELECTRONICS N.V.
  9.5.1. COMPANY OVERVIEW
  9.5.2. FINANCIALS
  9.5.3. PRODUCTS AND SERVICES
  9.5.4. RECENT DEVELOPMENTS
9.6. NXP Semiconductors N.V.
  9.6.1. COMPANY OVERVIEW
  9.6.2. FINANCIALS
  9.6.3. PRODUCTS AND SERVICES
  9.6.4. RECENT DEVELOPMENTS
9.7. MICROCHIP TECHNOLOGY INC.
  9.7.1. COMPANY OVERVIEW
  9.7.2. FINANCIALS
  9.7.3. PRODUCTS AND SERVICES
  9.7.4. RECENT DEVELOPMENTS
9.8. TEXAS INSTRUMENTS INC.
  9.8.1. COMPANY OVERVIEW
  9.8.2. FINANCIALS
  9.8.3. PRODUCTS AND SERVICES
  9.8.4. RECENT DEVELOPMENTS
9.9. CYPRESS SEMICONDUCTOR CORPORATION
  9.9.1. COMPANY OVERVIEW
  9.9.2. FINANCIALS
  9.9.3. PRODUCTS AND SERVICES
  9.9.4. RECENT DEVELOPMENTS
9.10. ON SEMICONDUCTOR CORPORATION
  9.10.1. COMPANY OVERVIEW
  9.10.2. FINANCIALS
  9.10.3. PRODUCTS AND SERVICES
  9.10.4. RECENT DEVELOPMENTS
LIST OF FIGURES
LIST OF TABLES
DISCLAIMER