Thermal Interface Pad Market - Forecasts from 2017 to 2022
Thermal interface pad market is valued at US$0.933 billion in 2017 and is projected to expand at a CAGR of 7.54% over the forecast period to reach US$1.343 billion by 2022. This research study examines the Thermal interface pad market on the basis of various segments – by product, type, application, and geography. Major drivers, restraints, and opportunities have been mentioned to provide an exhaustive picture of the market. Furthermore, the current market trends related to the demand, supply, and sales, in addition to the recent developments, have been provided in this report. The report also analyzes key players in the Thermal interface pad market. The report provides comprehensive forecast up to the period 2022 for various key segments, with 2016 as the base year.
The analysis presents in-depth information regarding the development, trends, and industry policies and regulations implemented in each of the geographical segments. Moreover, the research study analyzes the overall regulatory framework of Thermal interface pad market, offering stakeholders a better understanding of the key factors affecting the overall market environment.
The first step towards determining the Thermal interface pad market size involves identifying key players and the revenue contribution of the overall business or relevant segment aligned to the study in consideration through extensive secondary research. This also includes various studies and data published by industry associations, analyst reports, investor presentations, press releases and journals among others. Both bottom-up and top-down approaches are utilized to determine the market size of the overall market and key segments. The values obtained are correlated with the primary inputs of the key stakeholders in the Thermal interface pad value chain, such as C-Level Executives, Directors, and Managers among others across key enterprises operating as manufacturers, suppliers, and distributors. The last phase is providing intelligence in the form of presentation, charts, graphics and other different formats helping the clients in faster and efficient understanding of the market. Under this phase complete market engineering is involved which includes analyzing the gathered data from different sources and existing proprietary datasets while using various data triangulation methods for market breakdown and forecasting.
Segments covered under the Thermal interface pad market report are as below:
Product
IGBT
MOSFET
Thyristors
Power Transistor
Type
Thermal Grease
Thermal Pads
Phase Changing Material
Application
Consumer Electronic
Telecom
Power Supply Units
Others
Geography
Americas
North America
South America
Europe Middle East and Africa
Europe
Middle East and Africa
Asia Pacific
Key industry players profiled as part of this section are 3M, Parker Chomerics, Dow Corning, and Liard technologies among few others.
The analysis presents in-depth information regarding the development, trends, and industry policies and regulations implemented in each of the geographical segments. Moreover, the research study analyzes the overall regulatory framework of Thermal interface pad market, offering stakeholders a better understanding of the key factors affecting the overall market environment.
The first step towards determining the Thermal interface pad market size involves identifying key players and the revenue contribution of the overall business or relevant segment aligned to the study in consideration through extensive secondary research. This also includes various studies and data published by industry associations, analyst reports, investor presentations, press releases and journals among others. Both bottom-up and top-down approaches are utilized to determine the market size of the overall market and key segments. The values obtained are correlated with the primary inputs of the key stakeholders in the Thermal interface pad value chain, such as C-Level Executives, Directors, and Managers among others across key enterprises operating as manufacturers, suppliers, and distributors. The last phase is providing intelligence in the form of presentation, charts, graphics and other different formats helping the clients in faster and efficient understanding of the market. Under this phase complete market engineering is involved which includes analyzing the gathered data from different sources and existing proprietary datasets while using various data triangulation methods for market breakdown and forecasting.
Segments covered under the Thermal interface pad market report are as below:
Product
IGBT
MOSFET
Thyristors
Power Transistor
Type
Thermal Grease
Thermal Pads
Phase Changing Material
Application
Consumer Electronic
Telecom
Power Supply Units
Others
Geography
Americas
North America
South America
Europe Middle East and Africa
Europe
Middle East and Africa
Asia Pacific
Key industry players profiled as part of this section are 3M, Parker Chomerics, Dow Corning, and Liard technologies among few others.
1. INTRODUCTION
2. RESEARCH METHODOLOGY
3. EXECUTIVE SUMMARY
4. MARKET DYNAMICS
4.1. Market Overview and Segmentations
4.2. Drivers
4.3. Restraints
4.4. Opportunities
4.5. Porter's Five Forces
4.6. Supplier Outlook
4.7. Industry Outlook
4.8. Industry Value Chain Analysis
4.9. Scenario Analysis
5. THERMAL INTERFACE PAD MARKET FORECAST BY PRODUCT (US$ BILLION)
5.1. IGBT
5.2. MOSFET
5.3. Thyristors
5.4. Power Transistor
6. THERMAL INTERFACE PAD MARKET FORECAST BY TYPE (US$ BILLION)
6.1. Thermal Grease
6.2. Thermal Pads
6.3. Phase Changing Material
7. THERMAL INTERFACE PAD MARKET FORECAST BY APPLICATION (US$ BILLION)
7.1. Consumer Electronic
7.2. Telecom
7.3. Power Supply Units
7.4. Others
8. THERMAL INTERFACE PAD MARKET FORECAST BY GEOGRAPHY (US$ BILLION)
8.1. Americas
8.1.1. North America
8.1.2. South America
8.2. Europe Middle East and Africa
8.2.1. Europe
8.2.2. Middle East and Africa
8.3. Asia Pacific
9. COMPETITIVE INTELLIGENCE
9.1. Market Share of Key Players
9.2. Investment Analysis
9.3. Recent Deals
9.4. Strategies of Key Players
10. COMPANY PROFILES
10.1. 3M
10.2. Parker Chomerics
10.3. Dow Corning
10.4. Liard technologies
10.5. Henkel AG
10.6. Jones Tech PLC
10.7. Honeywell International Inc.
10.8. The Bergquist Company GmbH
2. RESEARCH METHODOLOGY
3. EXECUTIVE SUMMARY
4. MARKET DYNAMICS
4.1. Market Overview and Segmentations
4.2. Drivers
4.3. Restraints
4.4. Opportunities
4.5. Porter's Five Forces
4.6. Supplier Outlook
4.7. Industry Outlook
4.8. Industry Value Chain Analysis
4.9. Scenario Analysis
5. THERMAL INTERFACE PAD MARKET FORECAST BY PRODUCT (US$ BILLION)
5.1. IGBT
5.2. MOSFET
5.3. Thyristors
5.4. Power Transistor
6. THERMAL INTERFACE PAD MARKET FORECAST BY TYPE (US$ BILLION)
6.1. Thermal Grease
6.2. Thermal Pads
6.3. Phase Changing Material
7. THERMAL INTERFACE PAD MARKET FORECAST BY APPLICATION (US$ BILLION)
7.1. Consumer Electronic
7.2. Telecom
7.3. Power Supply Units
7.4. Others
8. THERMAL INTERFACE PAD MARKET FORECAST BY GEOGRAPHY (US$ BILLION)
8.1. Americas
8.1.1. North America
8.1.2. South America
8.2. Europe Middle East and Africa
8.2.1. Europe
8.2.2. Middle East and Africa
8.3. Asia Pacific
9. COMPETITIVE INTELLIGENCE
9.1. Market Share of Key Players
9.2. Investment Analysis
9.3. Recent Deals
9.4. Strategies of Key Players
10. COMPANY PROFILES
10.1. 3M
10.2. Parker Chomerics
10.3. Dow Corning
10.4. Liard technologies
10.5. Henkel AG
10.6. Jones Tech PLC
10.7. Honeywell International Inc.
10.8. The Bergquist Company GmbH
