Semiconductor Manufacturing Equipment Market - Forecasts from 2019 to 2024

June 2019 | 112 pages | ID: S3D155B2D0FBEN
Knowledge Sourcing Intelligence LLP

Abstracts

The global semiconductor manufacturing equipment market is expected to witness a compound annual growth rate of 4.88% to reach a market size of US$91.856 billion in 2024 from US$69.008 billion in 2018. Semiconductor manufacturing equipment is used for varied purposes across the production process of semiconductor materials. Growing semiconductor industry owing to technological advancements and surging demand for consumer electronics is the major factors driving the semiconductor manufacturing equipment market growth. Moreover, the rising adoption of connected devices and the anticipated increase in the production of electric vehicles is projected to stimulate the growth of the semiconductor manufacturing equipment market. However, the oversupply of NAND and DRAM devices is expected to slow down the growth potential of the market.

• DRIVERS
• Growing miniaturization of devices.
• Development of connected infrastructure.
• RESTRAINTS
• Oversupply of NAND and Memory products.

INDUSTRY UPDATE

• SK Hynix Inc. has recently installed a deep ultraviolet (DUV) photolithography equipment at its memory semiconductor plant in Wuxi, China.
• In March 2019, ON Semiconductor announced that it has completed first of at least two expansions in its facility in the Czech Republic, that will enable the company to meet the growing demand for silicon wafer from different industry verticals.

The major players profiled in the semiconductor manufacturing equipment market are Kokusai Electric Corporation, ASML Holdings N.V, Hitachi High-Technologies Corporation, and Tokyo Electron Limited among others.

Segmentation

The semiconductor manufacturing equipment market has been analyzed through the following segments:

• By Front-End Equipment
• Lithography
• Water Surface Conditioning Equipment
• Cleaning Process
• Others
• By Back-End Equipment
• Assembling and Packaging
• Bonding Equipment
• Dicing Equipment
• Testing Equipment
• Metrology Equipment
• By Dimension
• 2D
• 2.5D
• 3D
• By Fab Facility
• Automation
• Chemical Control Equipment
• Gas Control Equipment
• Others
• By Geography
• North America
• USA
• Canada
• Mexico
• South America
• Brazil
• Others
• Europe
• United Kingdom
• Germany
• France
• Others
• Middle East and Africa
• Israel
• Others
• Asia Pacific
• Japan
• China
• Taiwan
• South Korea
• Others

Contents

1. INTRODUCTION

1.1. Market Overview
1.2. Market Definition
1.3. Scope of the Study
1.4. Currency
1.5. Assumptions
1.6. Base, and Forecast Years Timeline

2. RESEARCH METHODOLOGY

2.1. Research Design
2.2. Secondary Sources

3. KEY FINDINGS

4. MARKET DYNAMICS

4.1. Market Segmentation
4.2. Market Drivers
4.3. Market Restraints
4.4. Market Opportunities
4.5. Porter’s Five Forces Analysis
  4.5.1. Bargaining Power of Suppliers
  4.5.2. Bargaining Power of Buyers
  4.5.3. Threat of New Entrants
  4.5.4. Threat of Substitutes
  4.5.5. Competitive Rivalry in the Industry
4.6. Life Cycle Analysis - Regional Snapshot
4.7. Market Attractiveness

5. SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET BY FRONT-END EQUIPMENT

5.1. Lithography
5.2. Water Surface Conditioning Equipment
5.3. Cleaning Process
5.4. Others

6. SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET BY BACK-END EQUIPMENT

6.1. Assembling and Packaging
6.2. Bonding Equipment
6.3. Dicing Equipment
6.4. Testing Equipment
6.5. Metrology Equipment

7. SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET BY DIMENSION

7.1. 2D
7.2. 2.5D
7.3. 3D

8. SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET BY FAB FACILITY

8.1. Automation
8.2. Chemical Control Equipment
8.3. Gas Control Equipment
8.4. Others

9. SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET BY GEOGRAPHY

9.1. North America
  9.1.1. USA
  9.1.2. Canada
  9.1.3. Mexico
9.2. South America
  9.2.1. Brazil
  9.2.2. Others
9.3. Europe
  9.3.1. United Kingdom
  9.3.2. Germany
  9.3.3. France
  9.3.4. Others
9.4. Middle East and Africa
  9.4.1. Israel
  9.4.2. Others
9.5. Asia Pacific
  9.5.1. Japan
  9.5.2. China
  9.5.3. Taiwan
  9.5.4. South Korea
  9.5.5. Others

10. COMPETITIVE INTELLIGENCE

10.1. Competitive Benchmarking and Analysis
10.2. Recent Investments and Deals
10.3. Strategies of Key Players

11. COMPANY PROFILES

11.1. Tokyo Seimitsu Co., Ltd.
11.2. Kokusai Electric Corporation
11.3. Terra Universal
11.4. Modutek Corporation
11.5. Hitachi High-Technologies Corporation
11.6. LAM Research Corporation
11.7. Applied Materials, Inc.
11.8. ASML Holdings N.V
11.9. Tokyo Electron Limited
11.10. Teradyne, Inc.
LIST OF FIGURES
LIST OF TABLES