Memory Packaging Market Forecasts to 2028 – Global Analysis By Platform (Wire-Bond, Flip Chip and Others), Application (TSV Packaging, DRAM Packaging and Others), End User (Automotive, Medical Devices and Others) and By Geography

August 2021 | 150 pages | ID: MF88DFA4845CEN
Stratistics Market Research Consulting

Abstracts

According to Stratistics MRC, the Global Memory Packaging Market is accounted for $32.43 billion in 2020 and is expected to reach $57.84 billion by 2028 growing at a CAGR of 7.5% during the forecast period. Growth in packaging and assembly infrastructure, rising demand for smartphones and growing popularity of autonomous driving are driving the market growth. However, thermal issues due to the miniaturization of memory are hampering the growth of the market.

Memory is made of small semiconductor chips similar to processors and should be packaged into less fragile and tiny chips to be integrated with the rest of the system. There are many different memory device packaging options available, used in a wide range of packaging technologies, depending on product requirements, like performance, density, and cost.

Based on the end user, the automotive segment is going to have lucrative growth during the forecast period owing to increase in acceptance of DRAM memory. Furthermore, the growth is led by the trend of autonomous driving and in vehicle infotainment. By geography, Asia Pacific is going to have high growth during the forecast period which can be attributed to a wide range of applications in several consumer electronics, especially in tablets and smartphones.

Some of the key players profiled in the Memory Packaging Market include Apple Inc., ASE Group, Cisco Systems Inc., Dell EMC, Fujitsu Semiconductor Limited, Hana Micron Inc., IBM Corporation, Intel Corporation, Micron Technology Inc., Nanya Technology Corporation, Qualcomm Technologies Inc., Samsung Electronics Co. Ltd, SK Hynix Inc., STMicroelectronics and Toshiba Electronic Devices & Storage Corporation.

Platforms Covered:

• Wafer-Level Chip-Scale Packaging(WLCSP)
• Wire-Bond
• Flip-Chip
• Lead-Frame
• Through-Silicon Via (TSV)

Applications Covered:

• 3D Through-Silicon Via (TSV) Packaging
• Dynamic Random Access Memory (DRAM) Packaging
• Not AND (NAND) Flash Packaging
• Not OR (NOR) Flash Packaging

End Users Covered:

• Automotive
• Consumer Electronics
• Embedded Systems
• Information Technology (IT) & Telecom
• Medical Devices
• Military and Aerospace

Regions Covered:

• North America
• US
• Canada
• Mexico
• Europe
• Germany
• UK
• Italy
• France
• Spain
• Rest of Europe
• Asia Pacific
• Japan
• China
• India
• Australia
• New Zealand
• South Korea
• Rest of Asia Pacific
• South America
• Argentina
• Brazil
• Chile
• Rest of South America
• Middle East & Africa
• Saudi Arabia
• UAE
• Qatar
• South Africa
• Rest of Middle East & Africa

What our report offers:

• Market share assessments for the regional and country-level segments
• Strategic recommendations for the new entrants
• Covers Market data for the years 2018, 2019, 2020, 2024 and 2027
• Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
• Strategic recommendations in key business segments based on the market estimations
• Competitive landscaping mapping the key common trends
• Company profiling with detailed strategies, financials, and recent developments
• Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

• Company Profiling
• Comprehensive profiling of additional market players (up to 3)
• SWOT Analysis of key players (up to 3)
• Regional Segmentation
• Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
• Competitive Benchmarking
• Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Contents

1 EXECUTIVE SUMMARY

2 PREFACE

2.1 Abstract
2.2 Stake Holders
2.3 Research Scope
2.4 Research Methodology
  2.4.1 Data Mining
  2.4.2 Data Analysis
  2.4.3 Data Validation
  2.4.4 Research Approach
2.5 Research Sources
  2.5.1 Primary Research Sources
  2.5.2 Secondary Research Sources
  2.5.3 Assumptions

3 MARKET TREND ANALYSIS

3.1 Introduction
3.2 Drivers
3.3 Restraints
3.4 Opportunities
3.5 Threats
3.6 Application Analysis
3.7 End User Analysis
3.8 Emerging Markets
3.9 Impact of Covid-19

4 PORTERS FIVE FORCE ANALYSIS

4.1 Bargaining power of suppliers
4.2 Bargaining power of buyers
4.3 Threat of substitutes
4.4 Threat of new entrants
4.5 Competitive rivalry

5 GLOBAL MEMORY PACKAGING MARKET, BY PLATFORM

5.1 Introduction
5.2 Wafer-Level Chip-Scale Packaging(WLCSP)
5.3 Wire-Bond
5.4 Flip-Chip
5.5 Lead-Frame
5.6 Through-Silicon Via (TSV)

6 GLOBAL MEMORY PACKAGING MARKET, BY APPLICATION

6.1 Introduction
6.2 3D Through-Silicon Via (TSV) Packaging
6.3 Dynamic Random Access Memory (DRAM) Packaging
6.4 Not AND (NAND) Flash Packaging
6.5 Not OR (NOR) Flash Packaging

7 GLOBAL MEMORY PACKAGING MARKET, BY END USER

7.1 Introduction
7.2 Automotive
7.3 Consumer Electronics
7.4 Embedded Systems
7.5 Information Technology (IT) & Telecom
7.6 Medical Devices
7.7 Military and Aerospace

8 GLOBAL MEMORY PACKAGING MARKET, BY GEOGRAPHY

8.1 Introduction
8.2 North America
  8.2.1 US
  8.2.2 Canada
  8.2.3 Mexico
8.3 Europe
  8.3.1 Germany
  8.3.2 UK
  8.3.3 Italy
  8.3.4 France
  8.3.5 Spain
  8.3.6 Rest of Europe
8.4 Asia Pacific
  8.4.1 Japan
  8.4.2 China
  8.4.3 India
  8.4.4 Australia
  8.4.5 New Zealand
  8.4.6 South Korea
  8.4.7 Rest of Asia Pacific
8.5 South America
  8.5.1 Argentina
  8.5.2 Brazil
  8.5.3 Chile
  8.5.4 Rest of South America
8.6 Middle East & Africa
  8.6.1 Saudi Arabia
  8.6.2 UAE
  8.6.3 Qatar
  8.6.4 South Africa
  8.6.5 Rest of Middle East & Africa

9 KEY DEVELOPMENTS

9.1 Agreements, Partnerships, Collaborations and Joint Ventures
9.2 Acquisitions & Mergers
9.3 New Product Launch
9.4 Expansions
9.5 Other Key Strategies

10 COMPANY PROFILING

10.1 Apple Inc.
10.2 ASE Group
10.3 Cisco Systems Inc.
10.4 Dell EMC
10.5 Fujitsu Semiconductor Limited
10.6 Hana Micron Inc.
10.7 IBM Corporation
10.8 Intel Corporation
10.9 Micron Technology Inc.
10.10 Nanya Technology Corporation
10.11 Qualcomm Technologies Inc.
10.12 Samsung Electronics Co. Ltd
10.13 SK Hynix Inc.
10.14 STMicroelectronics
10.15 Toshiba Electronic Devices & Storage Corporation

List Of Tables

LIST OF TABLES

Table 1 Global Memory Packaging Market Outlook, By Region (2019-2028) (US $MN)
Table 2 Global Memory Packaging Market Outlook, By Platform (2019-2028) (US $MN)
Table 3 Global Memory Packaging Market Outlook, By Wafer-Level Chip-Scale Packaging(WLCSP) (2019-2028) (US $MN)
Table 4 Global Memory Packaging Market Outlook, By Wire-Bond (2019-2028) (US $MN)
Table 5 Global Memory Packaging Market Outlook, By Flip-Chip (2019-2028) (US $MN)
Table 6 Global Memory Packaging Market Outlook, By Lead-Frame (2019-2028) (US $MN)
Table 7 Global Memory Packaging Market Outlook, By Through-Silicon Via (TSV) (2019-2028) (US $MN)
Table 8 Global Memory Packaging Market Outlook, By Application (2019-2028) (US $MN)
Table 9 Global Memory Packaging Market Outlook, By 3D Through-Silicon Via (TSV) Packaging (2019-2028) (US $MN)
Table 10 Global Memory Packaging Market Outlook, By Dynamic Random Access Memory (DRAM) Packaging (2019-2028) (US $MN)
Table 11 Global Memory Packaging Market Outlook, By Not AND (NAND) Flash Packaging (2019-2028) (US $MN)
Table 12 Global Memory Packaging Market Outlook, By Not OR (NOR) Flash Packaging (2019-2028) (US $MN)
Table 13 Global Memory Packaging Market Outlook, By End User (2019-2028) (US $MN)
Table 14 Global Memory Packaging Market Outlook, By Automotive (2019-2028) (US $MN)
Table 15 Global Memory Packaging Market Outlook, By Consumer Electronics (2019-2028) (US $MN)
Table 16 Global Memory Packaging Market Outlook, By Embedded Systems (2019-2028) (US $MN)
Table 17 Global Memory Packaging Market Outlook, By Information Technology (IT) & Telecom (2019-2028) (US $MN)
Table 18 Global Memory Packaging Market Outlook, By Medical Devices (2019-2028) (US $MN)
Table 19 Global Memory Packaging Market Outlook, By Military and Aerospace (2019-2028) (US $MN)
Table 20 North America Memory Packaging Market Outlook, By Country (2019-2028) (US $MN)
Table 21 North America Memory Packaging Market Outlook, By Platform (2019-2028) (US $MN)
Table 22 North America Memory Packaging Market Outlook, By Wafer-Level Chip-Scale Packaging(WLCSP) (2019-2028) (US $MN)
Table 23 North America Memory Packaging Market Outlook, By Wire-Bond (2019-2028) (US $MN)
Table 24 North America Memory Packaging Market Outlook, By Flip-Chip (2019-2028) (US $MN)
Table 25 North America Memory Packaging Market Outlook, By Lead-Frame (2019-2028) (US $MN)
Table 26 North America Memory Packaging Market Outlook, By Through-Silicon Via (TSV) (2019-2028) (US $MN)
Table 27 North America Memory Packaging Market Outlook, By Application (2019-2028) (US $MN)
Table 28 North America Memory Packaging Market Outlook, By 3D Through-Silicon Via (TSV) Packaging (2019-2028) (US $MN)
Table 29 North America Memory Packaging Market Outlook, By Dynamic Random Access Memory (DRAM) Packaging (2019-2028) (US $MN)
Table 30 North America Memory Packaging Market Outlook, By Not AND (NAND) Flash Packaging (2019-2028) (US $MN)
Table 31 North America Memory Packaging Market Outlook, By Not OR (NOR) Flash Packaging (2019-2028) (US $MN)
Table 32 North America Memory Packaging Market Outlook, By End User (2019-2028) (US $MN)
Table 33 North America Memory Packaging Market Outlook, By Automotive (2019-2028) (US $MN)
Table 34 North America Memory Packaging Market Outlook, By Consumer Electronics (2019-2028) (US $MN)
Table 35 North America Memory Packaging Market Outlook, By Embedded Systems (2019-2028) (US $MN)
Table 36 North America Memory Packaging Market Outlook, By Information Technology (IT) & Telecom (2019-2028) (US $MN)
Table 37 North America Memory Packaging Market Outlook, By Medical Devices (2019-2028) (US $MN)
Table 38 North America Memory Packaging Market Outlook, By Military and Aerospace (2019-2028) (US $MN)
Table 39 Europe Memory Packaging Market Outlook, By Country (2019-2028) (US $MN)
Table 40 Europe Memory Packaging Market Outlook, By Platform (2019-2028) (US $MN)
Table 41 Europe Memory Packaging Market Outlook, By Wafer-Level Chip-Scale Packaging(WLCSP) (2019-2028) (US $MN)
Table 42 Europe Memory Packaging Market Outlook, By Wire-Bond (2019-2028) (US $MN)
Table 43 Europe Memory Packaging Market Outlook, By Flip-Chip (2019-2028) (US $MN)
Table 44 Europe Memory Packaging Market Outlook, By Lead-Frame (2019-2028) (US $MN)
Table 45 Europe Memory Packaging Market Outlook, By Through-Silicon Via (TSV) (2019-2028) (US $MN)
Table 46 Europe Memory Packaging Market Outlook, By Application (2019-2028) (US $MN)
Table 47 Europe Memory Packaging Market Outlook, By 3D Through-Silicon Via (TSV) Packaging (2019-2028) (US $MN)
Table 48 Europe Memory Packaging Market Outlook, By Dynamic Random Access Memory (DRAM) Packaging (2019-2028) (US $MN)
Table 49 Europe Memory Packaging Market Outlook, By Not AND (NAND) Flash Packaging (2019-2028) (US $MN)
Table 50 Europe Memory Packaging Market Outlook, By Not OR (NOR) Flash Packaging (2019-2028) (US $MN)
Table 51 Europe Memory Packaging Market Outlook, By End User (2019-2028) (US $MN)
Table 52 Europe Memory Packaging Market Outlook, By Automotive (2019-2028) (US $MN)
Table 53 Europe Memory Packaging Market Outlook, By Consumer Electronics (2019-2028) (US $MN)
Table 54 Europe Memory Packaging Market Outlook, By Embedded Systems (2019-2028) (US $MN)
Table 55 Europe Memory Packaging Market Outlook, By Information Technology (IT) & Telecom (2019-2028) (US $MN)
Table 56 Europe Memory Packaging Market Outlook, By Medical Devices (2019-2028) (US $MN)
Table 57 Europe Memory Packaging Market Outlook, By Military and Aerospace (2019-2028) (US $MN)
Table 58 Asia Pacific Memory Packaging Market Outlook, By Country (2019-2028) (US $MN)
Table 59 Asia Pacific Memory Packaging Market Outlook, By Platform (2019-2028) (US $MN)
Table 60 Asia Pacific Memory Packaging Market Outlook, By Wafer-Level Chip-Scale Packaging(WLCSP) (2019-2028) (US $MN)
Table 61 Asia Pacific Memory Packaging Market Outlook, By Wire-Bond (2019-2028) (US $MN)
Table 62 Asia Pacific Memory Packaging Market Outlook, By Flip-Chip (2019-2028) (US $MN)
Table 63 Asia Pacific Memory Packaging Market Outlook, By Lead-Frame (2019-2028) (US $MN)
Table 64 Asia Pacific Memory Packaging Market Outlook, By Through-Silicon Via (TSV) (2019-2028) (US $MN)
Table 65 Asia Pacific Memory Packaging Market Outlook, By Application (2019-2028) (US $MN)
Table 66 Asia Pacific Memory Packaging Market Outlook, By 3D Through-Silicon Via (TSV) Packaging (2019-2028) (US $MN)
Table 67 Asia Pacific Memory Packaging Market Outlook, By Dynamic Random Access Memory (DRAM) Packaging (2019-2028) (US $MN)
Table 68 Asia Pacific Memory Packaging Market Outlook, By Not AND (NAND) Flash Packaging (2019-2028) (US $MN)
Table 69 Asia Pacific Memory Packaging Market Outlook, By Not OR (NOR) Flash Packaging (2019-2028) (US $MN)
Table 70 Asia Pacific Memory Packaging Market Outlook, By End User (2019-2028) (US $MN)
Table 71 Asia Pacific Memory Packaging Market Outlook, By Automotive (2019-2028) (US $MN)
Table 72 Asia Pacific Memory Packaging Market Outlook, By Consumer Electronics (2019-2028) (US $MN)
Table 73 Asia Pacific Memory Packaging Market Outlook, By Embedded Systems (2019-2028) (US $MN)
Table 74 Asia Pacific Memory Packaging Market Outlook, By Information Technology (IT) & Telecom (2019-2028) (US $MN)
Table 75 Asia Pacific Memory Packaging Market Outlook, By Medical Devices (2019-2028) (US $MN)
Table 76 Asia Pacific Memory Packaging Market Outlook, By Military and Aerospace (2019-2028) (US $MN)
Table 77 South America Memory Packaging Market Outlook, By Country (2019-2028) (US $MN)
Table 78 South America Memory Packaging Market Outlook, By Platform (2019-2028) (US $MN)
Table 79 South America Memory Packaging Market Outlook, By Wafer-Level Chip-Scale Packaging(WLCSP) (2019-2028) (US $MN)
Table 80 South America Memory Packaging Market Outlook, By Wire-Bond (2019-2028) (US $MN)
Table 81 South America Memory Packaging Market Outlook, By Flip-Chip (2019-2028) (US $MN)
Table 82 South America Memory Packaging Market Outlook, By Lead-Frame (2019-2028) (US $MN)
Table 83 South America Memory Packaging Market Outlook, By Through-Silicon Via (TSV) (2019-2028) (US $MN)
Table 84 South America Memory Packaging Market Outlook, By Application (2019-2028) (US $MN)
Table 85 South America Memory Packaging Market Outlook, By 3D Through-Silicon Via (TSV) Packaging (2019-2028) (US $MN)
Table 86 South America Memory Packaging Market Outlook, By Dynamic Random Access Memory (DRAM) Packaging (2019-2028) (US $MN)
Table 87 South America Memory Packaging Market Outlook, By Not AND (NAND) Flash Packaging (2019-2028) (US $MN)
Table 88 South America Memory Packaging Market Outlook, By Not OR (NOR) Flash Packaging (2019-2028) (US $MN)
Table 89 South America Memory Packaging Market Outlook, By End User (2019-2028) (US $MN)
Table 90 South America Memory Packaging Market Outlook, By Automotive (2019-2028) (US $MN)
Table 91 South America Memory Packaging Market Outlook, By Consumer Electronics (2019-2028) (US $MN)
Table 92 South America Memory Packaging Market Outlook, By Embedded Systems (2019-2028) (US $MN)
Table 93 South America Memory Packaging Market Outlook, By Information Technology (IT) & Telecom (2019-2028) (US $MN)
Table 94 South America Memory Packaging Market Outlook, By Medical Devices (2019-2028) (US $MN)
Table 95 South America Memory Packaging Market Outlook, By Military and Aerospace (2019-2028) (US $MN)
Table 96 Middle East & Africa Memory Packaging Market Outlook, By Country (2019-2028) (US $MN)
Table 97 Middle East & Africa Memory Packaging Market Outlook, By Platform (2019-2028) (US $MN)
Table 98 Middle East & Africa Memory Packaging Market Outlook, By Wafer-Level Chip-Scale Packaging(WLCSP) (2019-2028) (US $MN)
Table 99 Middle East & Africa Memory Packaging Market Outlook, By Wire-Bond (2019-2028) (US $MN)
Table 100 Middle East & Africa Memory Packaging Market Outlook, By Flip-Chip (2019-2028) (US $MN)
Table 101 Middle East & Africa Memory Packaging Market Outlook, By Lead-Frame (2019-2028) (US $MN)
Table 102 Middle East & Africa Memory Packaging Market Outlook, By Through-Silicon Via (TSV) (2019-2028) (US $MN)
Table 103 Middle East & Africa Memory Packaging Market Outlook, By Application (2019-2028) (US $MN)
Table 104 Middle East & Africa Memory Packaging Market Outlook, By 3D Through-Silicon Via (TSV) Packaging (2019-2028) (US $MN)
Table 105 Middle East & Africa Memory Packaging Market Outlook, By Dynamic Random Access Memory (DRAM) Packaging (2019-2028) (US $MN)
Table 106 Middle East & Africa Memory Packaging Market Outlook, By Not AND (NAND) Flash Packaging (2019-2028) (US $MN)
Table 107 Middle East & Africa Memory Packaging Market Outlook, By Not OR (NOR) Flash Packaging (2019-2028) (US $MN)
Table 108 Middle East & Africa Memory Packaging Market Outlook, By End User (2019-2028) (US $MN)
Table 109 Middle East & Africa Memory Packaging Market Outlook, By Automotive (2019-2028) (US $MN)
Table 110 Middle East & Africa Memory Packaging Market Outlook, By Consumer Electronics (2019-2028) (US $MN)
Table 111 Middle East & Africa Memory Packaging Market Outlook, By Embedded Systems (2019-2028) (US $MN)
Table 112 Middle East & Africa Memory Packaging Market Outlook, By Information Technology (IT) & Telecom (2019-2028) (US $MN)
Table 113 Middle East & Africa Memory Packaging Market Outlook, By Medical Devices (2019-2028) (US $MN)
Table 114 Middle East & Africa Memory Packaging Market Outlook, By Military and Aerospace (2019-2028) (US $MN)