IC Substrate Trends: Market Research Report

December 2013 | 17 pages | ID: I34EE1F8604EN
Global Industry Analysts, Inc

Abstracts

IC substrates, also referred to as IC carriers, are extremely miniaturized circuits used as packaging for ICs, assembled into electronic devices such as digital cameras, mobile phones, engine controls, memory modules, and global positioning systems. In electronic devices including PCs, the mother board comprises a number of components such as GPU, MPU, or memory; which contain a network of IC chips.

The report analyzes and presents an overview of IC Substrates market worldwide. Supported with 3 market data tables, the report provides a review of market trends, growth drivers, and strategic industry activities of major companies worldwide. The report further discusses about various types, and applications of IC Substrates. In addition, 32 companies operating in the IC Substrates arena worldwide including AT & S Austria Technologie & Systemtechnik AG, Camtek Ltd., Compeq Manufacturing Co. Ltd., Founder PCB, Genesem Inc., IBIDEN Co. Ltd., Laird Technologies Inc., QDOS Holdings Bhd., Samsung Electro-Mechanics Co. Ltd., and others are profiled.

Contents

1. IC SUBSTRATES – A TECHNOLOGY PERSPECTIVE

IC Substrates – An Introduction
IC Substrates – Characteristics
IC Substrates – Manufacturing Process
IC Substrates – Types
IC Substrates – Applications
Substrate-Specific Applications

2. MARKET TRENDS

Global IC Substrate Market to Witness Growth

Table 1. Global IC Substrate Market (2012-2017) in US$ Million

Table 2. Global IC Substrates Market by Company (2012) - Percentage Share Breakdown by Value Sales for IBIDEN, SEMCO, Shinko, NANYA PCB, Unimicron, Kinsus and Others

Technology Innovations in the IC Packaging Industry
Chemical Bonding-based NEAP vsMechanical Bonding-based NEAP
Role of Japan in the Global IC Substrate Market
Overview of the PCB Assembly Industry in China
Major Production Centers in China
Strategies adopted by Manufacturers
Significant Government Support
IC Substrate Industry in Taiwan

Table 3. Global IC Substrates Packaging Market by Country (2012) - Percentage Share Breakdown for Taiwan and Others

Increasing Adoption of Flip-chip Connection Technology
Emergence of Coreless IC Substrates
Major IC Substrate Manufacturers in South Korea
BT Resin Production Shifts from Japan to China, Taiwan and South Korea

3. RECENT INDUSTRY ACTIVITY

Atotech Expands TechCenters in Asia
Austria Technologie & Systemtechnik Aktiengesellschaft Commences Production of IC Substrates
Orbotech Introduces Ultra PerFix 120 Automated Optical Repair System
Orbotech Pacific Showcases PCB Innovations
Atotech Develops Ecoganth MV Manufacturing Process for PCBs and IC Substrates
Atotech Offers Cupra Etch DE Process
Orbotech Releases Ultra Fusion 300 AOI System
Unimicron Technology and Nan Ya PCB Corporation Develop Coreless IC Substrates
Advanced Semiconductor Engineering to Expand Operations in Taiwan and China
Camtek Unveils Phoenix Range of Automatic Optical Inspection Systems

4. MARKET PARTICIPANTS

AT & S Austria Technologie & Systemtechnik AG (AT&S) (Austria)
Atotech Deutschland GmbH (Germany)
BoardTek Electronics Corporation (Taiwan)
Camtek Ltd. (Israel)
Compeq Manufacturing Co. , Ltd. (Taiwan)
Daeduck Electronics Company (Korea)
DYCONEX AG an MST Company (Switzerland)
Eastern Co. , Ltd. (Japan)
Elec & Eltek International Holdings Ltd. (Singapore)
Founder PCB (China)
Fujitsu Interconnect Technologies Ltd. (Japan)
Genesem, Inc. (Korea)
Hoya Corporation (Japan)
IBIDEN Co. , Ltd. (Japan)
Kinsus Interconnect Technology Corporation (Taiwan)
Kyocera SLC Technologies Corporation (Japan)
Laird Technologies, Inc. (USA)
LG Innotek Co. , Ltd. (Korea)
Linxens (France)
Nan Ya PCB Corporation (Taiwan)
NGK Spark Plug Co. , Ltd. (Japan)
QDOS Holdings Bhd. (Malaysia)
Samsung Electro-Mechanics Co. , Ltd. (South Korea)
SEP Co. , Ltd. (Korea)
Shennan Circuit Co. , Ltd. (China)
Shinko Electric Industries Co. , Ltd. (Japan)
Simmtech Co. , Ltd. (Korea)
Tong Hsing Electronic Industries Ltd. (Taiwan)
Toppan Printing Co. , Ltd. - Material Solutions Division (Japan)
TTM Technologies, Inc. (USA)
Unimicron Technology Corporation (Taiwan)
Zhen Ding Technology Holding Ltd. (China)

5. APPENDIX