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IC Advanced Packaging Equipments Market Status and Trend Analysis 2017-2026 (COVID-19 Version)

January 2020 | 90 pages | ID: I419F1D63527EN
99Strategy

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SUMMARY


Further key aspects of the report indicate that:
Chapter 1: Research Scope: Product Definition, Type, End-Use & Methodology
Chapter 2: Global Industry Summary
Chapter 3: Market Dynamics
Chapter 4: Global Market Segmentation by region, type and End-Use
Chapter 5: North America Market Segmentation by region, type and End-Use
Chapter 6: Europe Market Segmentation by region, type and End-Use
Chapter 7: Asia-Pacific Market Segmentation by region, type and End-Use
Chapter 8: South America Market Segmentation by region, type and End-Use
Chapter 9: Middle East and Africa Market Segmentation by region, type and End-Use.
Chapter 10: Market Competition by Companies
Chapter 11: Market forecast and environment forecast.
Chapter 12: Industry Summary.

The global IC Advanced Packaging Equipments market has the potential to grow with xx million USD with growing CAGR in the forecast period from 2021f to 2026f. Factors driving the market for @@@@@ are the significant development of demand and improvement of COVID-19 and geo-economics.

Based on the type of product, the global IC Advanced Packaging Equipments market segmented into
  • Die-Level Packaging Equipment
  • Wafer-Level Packaging Equipment
Based on the end-use, the global IC Advanced Packaging Equipments market classified into
  • IDM
  • OSAT
Based on geography, the global IC Advanced Packaging Equipments market segmented into
  • North America [U.S., Canada, Mexico]
  • Europe [Germany, UK, France, Italy, Rest of Europe]
  • Asia-Pacific [China, India, Japan, South Korea, Southeast Asia, Australia, Rest of Asia Pacific]
  • South America [Brazil, Argentina, Rest of Latin America]
  • Middle East & Africa [GCC, North Africa, South Africa, Rest of Middle East and Africa]
And the major players included in the report are
  • ASM Pacific
  • Applied Materials
  • Kulicke & Soffa
  • BESI, Inc
  • Advantest
  • Hitachi High-Technologies
  • Teradyne
  • Disco
  • Towa
  • Hanmi
  • PFSA
  • Suss Microtec
  • Shinkawa
  • Tokyo Seimitsu
  • Ultratech
1 RESEARCH SCOPE

1.1 Research Product Definition
1.2 Research Segmentation
  1.2.1 Product Type
  1.2.2 Main product Type of Major Players
1.3 Demand Overview
1.4 Research Methodology

2 GLOBAL IC ADVANCED PACKAGING EQUIPMENTS INDUSTRY

2.1 Summary about IC Advanced Packaging Equipments Industry
2.2 IC Advanced Packaging Equipments Market Trends
  2.2.1 IC Advanced Packaging Equipments Production & Consumption Trends
  2.2.2 IC Advanced Packaging Equipments Demand Structure Trends
2.3 IC Advanced Packaging Equipments Cost & Price

3 MARKET DYNAMICS

3.1 Manufacturing & Purchasing Behavior in 2020
3.2 Market Development under the Impact of COVID-19
  3.2.1 Drivers
  3.2.2 Restraints
  3.2.3 Opportunity
  3.2.4 Risk

4 GLOBAL MARKET SEGMENTATION

4.1 Region Segmentation (2017 to 2021f)
  4.1.1 North America (U.S., Canada and Mexico)
  4.1.2 Europe (Germany, UK, France, Italy, Rest of Europe)
  4.1.3 Asia-Pacific (China, India, Japan, South Korea, Southeast Asia, Australia, Rest of Asia Pacific)
  4.1.4 South America (Brazil,, Argentina, Rest of Latin America)
  4.1.5 Middle East and Africa (GCC, North Africa, South Africa, Rest of Middle East and Africa)
4.2 Product Type Segmentation (2017 to 2021f)
  4.2.1 Die-Level Packaging Equipment
  4.2.2 Wafer-Level Packaging Equipment
4.3 Consumption Segmentation (2017 to 2021f)
  4.3.1 IDM
  4.3.2 OSAT

5 NORTH AMERICA MARKET SEGMENT

5.1 Region Segmentation (2017 to 2021f)
  5.1.1 U.S.
  5.1.2 Canada
  5.1.3 Mexico
5.2 Product Type Segmentation (2017 to 2021f)
  5.2.1 Die-Level Packaging Equipment
  5.2.2 Wafer-Level Packaging Equipment
5.3 Consumption Segmentation (2017 to 2021f)
  5.3.1 IDM
  5.3.2 OSAT
5.4 Impact of COVID-19 in North America

6 EUROPE MARKET SEGMENTATION

6.1 Region Segmentation (2017 to 2021f)
  6.1.1 Germany
  6.1.2 UK
  6.1.3 France
  6.1.4 Italy
  6.1.5 Rest of Europe
6.2 Product Type Segmentation (2017 to 2021f)
  6.2.1 Die-Level Packaging Equipment
  6.2.2 Wafer-Level Packaging Equipment
6.3 Consumption Segmentation (2017 to 2021f)
  6.3.1 IDM
  6.3.2 OSAT
6.4 Impact of COVID-19 in Europe

7 ASIA-PACIFIC MARKET SEGMENTATION

7.1 Region Segmentation (2017 to 2021f)
  7.1.1 China
  7.1.2 India
  7.1.3 Japan
  7.1.4 South Korea
  7.1.5 Southeast Asia
  7.1.6 Australia
  7.1.7 Rest of Asia Pacific
7.2 Product Type Segmentation (2017 to 2021f)
  7.2.1 Die-Level Packaging Equipment
  7.2.2 Wafer-Level Packaging Equipment
7.3 Consumption Segmentation (2017 to 2021f)
  7.3.1 IDM
  7.3.2 OSAT
7.4 Impact of COVID-19 in Europe

8 SOUTH AMERICA MARKET SEGMENTATION

8.1 Region Segmentation (2017 to 2021f)
  8.1.1 Brazil
  8.1.2 Argentina
  8.1.3 Rest of Latin America
8.2 Product Type Segmentation (2017 to 2021f)
  8.2.1 Die-Level Packaging Equipment
  8.2.2 Wafer-Level Packaging Equipment
8.3 Consumption Segmentation (2017 to 2021f)
  8.3.1 IDM
  8.3.2 OSAT
8.4 Impact of COVID-19 in Europe

9 MIDDLE EAST AND AFRICA MARKET SEGMENTATION

9.1 Region Segmentation (2017 to 2021f)
  9.1.1 GCC
  9.1.2 North Africa
  9.1.3 South Africa
  9.1.4 Rest of Middle East and Africa
9.2 Product Type Segmentation (2017 to 2021f)
  9.2.1 Die-Level Packaging Equipment
  9.2.2 Wafer-Level Packaging Equipment
9.3 Consumption Segmentation (2017 to 2021f)
  9.3.1 IDM
  9.3.2 OSAT
9.4 Impact of COVID-19 in Europe

10 COMPETITION OF MAJOR PLAYERS

10.1 Brief Introduction of Major Players
  10.1.1 ASM Pacific
  10.1.2 Applied Materials
  10.1.3 Kulicke & Soffa
  10.1.4 BESI, Inc
  10.1.5 Advantest
  10.1.6 Hitachi High-Technologies
  10.1.7 Teradyne
  10.1.8 Disco
  10.1.9 Towa
  10.1.10 Hanmi
  10.1.11 PFSA
  10.1.12 Suss Microtec
  10.1.13 Shinkawa
  10.1.14 Tokyo Seimitsu
  10.1.15 Ultratech
10.2 IC Advanced Packaging Equipments Sales Date of Major Players (2017-2020e)
  10.2.1 ASM Pacific
  10.2.2 Applied Materials
  10.2.3 Kulicke & Soffa
  10.2.4 BESI, Inc
  10.2.5 Advantest
  10.2.6 Hitachi High-Technologies
  10.2.7 Teradyne
  10.2.8 Disco
  10.2.9 Towa
  10.2.10 Hanmi
  10.2.11 PFSA
  10.2.12 Suss Microtec
  10.2.13 Shinkawa
  10.2.14 Tokyo Seimitsu
  10.2.15 Ultratech
10.3 Market Distribution of Major Players
10.4 Global Competition Segmentation

11 MARKET FORECAST

11.1 Forecast by Region
11.2 Forecast by Demand
11.3 Environment Forecast
  11.3.1 Impact of COVID-19
  11.3.2 Geopolitics Overview
  11.3.3 Economic Overview of Major Countries

12 REPORT SUMMARY STATEMENT
LIST OF TABLES
1.Table IC Advanced Packaging Equipments Product Type Overview
2.Table IC Advanced Packaging Equipments Product Type Market Share List
3.Table IC Advanced Packaging Equipments Product Type of Major Players
4.Table Brief Introduction of ASM Pacific 
5.Table Brief Introduction of Applied Materials 
6.Table Brief Introduction of Kulicke & Soffa 
7.Table Brief Introduction of BESI, Inc 
8.Table Brief Introduction of Advantest 
9.Table Brief Introduction of Hitachi High-Technologies 
10.Table Brief Introduction of Teradyne 
11.Table Brief Introduction of Disco 
12.Table Brief Introduction of Towa 
13.Table Brief Introduction of Hanmi 
14.Table Brief Introduction of PFSA 
15.Table Brief Introduction of Suss Microtec 
16.Table Brief Introduction of Shinkawa 
17.Table Brief Introduction of Tokyo Seimitsu 
18.Table Brief Introduction of Ultratech 
19.Table Products & Services of ASM Pacific 
20.Table Products & Services of Applied Materials 
21.Table Products & Services of Kulicke & Soffa 
22.Table Products & Services of BESI, Inc 
23.Table Products & Services of Advantest 
24.Table Products & Services of Hitachi High-Technologies 
25.Table Products & Services of Teradyne 
26.Table Products & Services of Disco 
27.Table Products & Services of Towa 
28.Table Products & Services of Hanmi 
29.Table Products & Services of PFSA 
30.Table Products & Services of Suss Microtec 
31.Table Products & Services of Shinkawa 
32.Table Products & Services of Tokyo Seimitsu 
33.Table Products & Services of Ultratech 
34.Table Market Distribution of Major Players
35.Table Global Major Players Sales Revenue (Million USD) 2017-2020e
36.Table Global Major Players Sales Revenue (Million USD) Share 2017-2020e
37.Table Global IC Advanced Packaging Equipments Market Forecast (Million USD) by Region 2021f-2026f
38.Table Global IC Advanced Packaging Equipments Market Forecast (Million USD) Share by Region 2021f-2026f
39.Table Global IC Advanced Packaging Equipments Market Forecast (Million USD) by Demand 2021f-2026f
40.Table Global IC Advanced Packaging Equipments Market Forecast (Million USD) Share by Demand 2021f-2026f
LIST OF FIGURES
1.Figure Global IC Advanced Packaging Equipments Market Size under the Impact of COVID-19, 2017-2021f (USD Million)
2.Figure Global IC Advanced Packaging Equipments Market by Region under the Impact of COVID-19, 2017-2021f (USD Million)
3.Figure Global IC Advanced Packaging Equipments Market by Product Type under the Impact of COVID-19, 2017-2021f (USD Million)
4.Figure Global IC Advanced Packaging Equipments Market by Demand under the Impact of COVID-19, 2017-2021f (USD Million)
5.Figure Global IC Advanced Packaging Equipments Production by Region under the Impact of COVID-19, 2021-2026 (USD Million)
6.Figure Global IC Advanced Packaging Equipments Consumption by Region under the Impact of COVID-19, 2021-2026 (USD Million)
7.Figure Global IC Advanced Packaging Equipments Consumption by Type under the Impact of COVID-19, 2021-2026 (USD Million)
8.Figure North America Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
9.Figure Europe Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
10.Figure Asia-Pacific Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
11.Figure South America Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
12.Figure Middle East and Africa Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
13.Figure Die-Level Packaging Equipment  Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
14.Figure Wafer-Level Packaging Equipment  Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
15.Figure IDM  Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
16.Figure OSAT Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
17.Figure U.S. Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
18.Figure Canada Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
19.Figure Mexico Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
20.Figure Die-Level Packaging Equipment  Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
21.Figure Wafer-Level Packaging Equipment  Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
22.Figure IDM  Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
23.Figure OSAT Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
24.Figure Germany Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
25.Figure UK Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
26.Figure France Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
27.Figure Italy Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
28.Figure Rest of Europe Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
29.Figure Die-Level Packaging Equipment  Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
30.Figure Wafer-Level Packaging Equipment  Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
31.Figure IDM  Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
32.Figure OSAT Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
33.Figure China Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
34.Figure India Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
35.Figure Japan Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
36.Figure South Korea Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
37.Figure Southeast Asia Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
38.Figure Australia Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
39.Figure Rest of Asia Pacific Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
40.Figure Die-Level Packaging Equipment  Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
41.Figure Wafer-Level Packaging Equipment  Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
42.Figure IDM  Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
43.Figure OSAT Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
44.Figure Brazil Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
45.Figure Argentina Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
46.Figure Rest of Latin America Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
47.Figure Die-Level Packaging Equipment  Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
48.Figure Wafer-Level Packaging Equipment  Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
49.Figure IDM  Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
50.Figure OSAT Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
51.Figure GCC Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
52.Figure North Africa Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
53.Figure South Africa Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
54.Figure Rest of Middle East and Africa Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
55.Figure Die-Level Packaging Equipment  Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
56.Figure Wafer-Level Packaging Equipment  Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
57.Figure IDM  Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
58.Figure OSAT Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
59.Figure IC Advanced Packaging Equipments Sales Revenue (Million USD) of ASM Pacific  2017-2020e
60.Figure IC Advanced Packaging Equipments Sales Revenue (Million USD) of Applied Materials  2017-2020e
61.Figure IC Advanced Packaging Equipments Sales Revenue (Million USD) of Kulicke & Soffa  2017-2020e
62.Figure IC Advanced Packaging Equipments Sales Revenue (Million USD) of BESI, Inc  2017-2020e
63.Figure IC Advanced Packaging Equipments Sales Revenue (Million USD) of Advantest  2017-2020e
64.Figure IC Advanced Packaging Equipments Sales Revenue (Million USD) of Hitachi High-Technologies  2017-2020e
65.Figure IC Advanced Packaging Equipments Sales Revenue (Million USD) of Teradyne  2017-2020e
66.Figure IC Advanced Packaging Equipments Sales Revenue (Million USD) of Disco  2017-2020e
67.Figure IC Advanced Packaging Equipments Sales Revenue (Million USD) of Towa  2017-2020e
68.Figure IC Advanced Packaging Equipments Sales Revenue (Million USD) of Hanmi  2017-2020e
69.Figure IC Advanced Packaging Equipments Sales Revenue (Million USD) of PFSA  2017-2020e
70.Figure IC Advanced Packaging Equipments Sales Revenue (Million USD) of Suss Microtec  2017-2020e
71.Figure IC Advanced Packaging Equipments Sales Revenue (Million USD) of Shinkawa  2017-2020e
72.Figure IC Advanced Packaging Equipments Sales Revenue (Million USD) of Tokyo Seimitsu  2017-2020e
73.Figure IC Advanced Packaging Equipments Sales Revenue (Million USD) of Ultratech  2017-2020e
74.


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